CN220135413U - Semiconductor lighting lamp - Google Patents
Semiconductor lighting lamp Download PDFInfo
- Publication number
- CN220135413U CN220135413U CN202321623303.XU CN202321623303U CN220135413U CN 220135413 U CN220135413 U CN 220135413U CN 202321623303 U CN202321623303 U CN 202321623303U CN 220135413 U CN220135413 U CN 220135413U
- Authority
- CN
- China
- Prior art keywords
- plate
- lamp
- cooling
- heat dissipation
- mounting
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 24
- 238000001816 cooling Methods 0.000 claims abstract description 40
- 230000017525 heat dissipation Effects 0.000 claims abstract description 32
- 239000000110 cooling liquid Substances 0.000 claims abstract description 13
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 9
- 229910052802 copper Inorganic materials 0.000 claims description 9
- 239000010949 copper Substances 0.000 claims description 9
- 238000010438 heat treatment Methods 0.000 claims description 4
- 239000007788 liquid Substances 0.000 claims description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 4
- 238000010030 laminating Methods 0.000 claims description 2
- 238000000034 method Methods 0.000 abstract description 3
- 230000005855 radiation Effects 0.000 abstract 2
- 238000009825 accumulation Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 239000011324 bead Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Landscapes
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
The utility model discloses a semiconductor lighting lamp, which belongs to the field of lighting lamps and comprises a mounting plate, wherein a lampshade is arranged at the lower end of the mounting plate, a lamp panel is arranged in the lampshade, a cooling bag for heat dissipation is arranged in the mounting plate, a mounting groove is formed at the lower end of the mounting plate, a heat dissipation plate for heat dissipation of the lamp panel is arranged in the mounting groove, and the heat dissipation plate is attached to the upper end of the lamp panel. According to the utility model, a large amount of heat can be radiated in the use process of the lamp panel, the air in the gas cavity is heated along with the heat in the mounting groove, and the air expands after being heated, so that the bag body is attached to the upper end of the heat radiation plate, the heat radiation plate is radiated by using the cooling liquid, and the lamp panel is radiated indirectly, so that the lamp panel does not consume electric energy and generate any noise, and the practicability of the lamp panel is further improved.
Description
Technical Field
The utility model relates to the field of lighting lamps, in particular to a semiconductor lighting lamp.
Background
The semiconductor lighting lamp has the characteristic of high lighting intensity and is widely used, but the semiconductor lighting lamp can emit a large amount of heat when in use, and the service life of the semiconductor lighting lamp can be seriously influenced if the inside of the semiconductor lighting lamp is not timely cooled, so that a plurality of semiconductor lighting lamps are internally provided with cooling fans, the cooling fans consume electric quantity when in operation and also emit noise when in operation, and the semiconductor lighting lamp is very inconvenient to use. Accordingly, the present utility model provides a semiconductor lighting device to solve the above-mentioned problems.
Disclosure of Invention
The present utility model is directed to a semiconductor lighting device, which solves the above-mentioned problems.
In order to achieve the above purpose, the present utility model provides the following technical solutions:
the utility model provides a semiconductor lighting lamp, includes the mounting panel, the lamp shade is installed to the lower extreme of mounting panel, the internally mounted of lamp shade has the lamp plate, the internally mounted of mounting panel has the cooling bag that is used for radiating, the mounting groove has been seted up to the lower extreme of mounting panel, install the radiating heating panel for the lamp plate in the mounting groove, just the heating panel laminating is in the upper end of lamp plate.
As a further scheme of the utility model, the lamp panel is movably connected with the mounting plate through a plurality of positioning rods, the positioning rods penetrate through the lamp panel and the heat dissipation plate, the positioning rods are in sliding connection with the lamp panel and the heat dissipation plate, a buffer spring is sleeved outside the positioning rods, and the buffer spring is positioned at the lower end of the lamp panel.
As a still further proposal of the utility model, the outer wall of the mounting plate is provided with a plurality of heat dissipation windows which are connected with the mounting groove.
As a still further proposal of the utility model, the outer wall of the mounting plate is also provided with a plurality of cooling channels, the inside of each cooling channel is provided with a cooling box, the inside of each cooling box is provided with liquid water, and the upper end and the lower end of each cooling box are provided with heat dissipation grooves.
As a still further proposal of the utility model, the cooling bag comprises a bag body, wherein the upper end of the bag body is fixedly connected with a copper plate which is fixedly connected with the mounting plate.
As a still further proposal of the utility model, the inside of the bag body is fixedly connected with an inner diaphragm, a gas cavity is formed between the inner diaphragm and the copper plate, a cooling liquid cavity is formed between the inner diaphragm and the bag body, and cooling liquid is filled in the cooling liquid cavity.
Compared with the prior art, the utility model has the beneficial effects that:
1. when the lamp panel is used, a large amount of heat can be dissipated in the use process, the air in the gas cavity is heated along with the heat accumulation in the mounting groove, and the air expands after being heated, so that the bag body is attached to the upper end of the heat dissipation plate, the heat dissipation plate is dissipated by using cooling liquid, and the lamp panel is indirectly dissipated.
2. When the cooling box is used, the cooling box can prevent the temperature inside the cooling channel from rising when hot air passes through the cooling channel, so that the air exchange efficiency between the mounting groove and the outside is reduced, and the practicability of the cooling box is further improved.
Drawings
Fig. 1 is a schematic structural diagram of a semiconductor lighting lamp.
Fig. 2 is a split view of a semiconductor lighting fixture.
Fig. 3 is a block diagram of a cooling bag in a semiconductor lighting fixture.
In the figure: 1. a mounting plate; 2. a lamp shade; 3. a mounting groove; 4. a cooling bag; 5. a lamp panel; 6. a heat dissipation plate; 7. a positioning rod; 8. a heat dissipation window; 9. a cooling channel; 10. a cooling box; 11. a heat sink; 400. a bag body; 401. copper plate; 402. an inner diaphragm; 403. a cooling liquid chamber; 404. a gas chamber.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
Referring to fig. 1-3, in the embodiment of the utility model, a semiconductor lighting lamp comprises a mounting plate 1, a lamp shade 2 is mounted at the lower end of the mounting plate 1, a lamp panel 5 is mounted in the lamp shade 2, a plurality of semiconductor lamp beads are fixedly connected to the outer wall of the lamp panel 5, a cooling bag 4 for heat dissipation is mounted in the mounting plate 1, a mounting groove 3 is formed at the lower end of the mounting plate 1, the cooling bag 4 is positioned in the mounting groove 3, a heat dissipation plate 6 for dissipating heat of the lamp panel 5 is mounted in the mounting groove 3, the heat dissipation plate 6 is attached to the upper end of the lamp panel 5, the lamp panel 5 is movably connected with the mounting plate 1 through a plurality of positioning rods 7, the positioning rods 7 penetrate through the lamp panel 5 and the heat dissipation plate 6, the positioning rods 7 are in sliding connection with the lamp panel 5 and the heat dissipation plate 6, a buffer spring is sleeved outside the positioning rods 7 and is positioned at the lower end of the lamp panel 5;
a plurality of heat dissipation windows 8 are formed in the outer wall of the mounting plate 1, the heat dissipation windows 8 are connected with the mounting grooves 3, the heat dissipation windows 8 are formed to enable heat emitted by the lamp panel 5 to be discharged through the heat dissipation windows 8, a plurality of cooling channels 9 are also formed in the outer wall of the mounting plate 1, cooling boxes 10 are arranged in the cooling channels 9, liquid water is filled in the cooling boxes 10, heat dissipation grooves 11 are formed in the upper end and the lower end of the cooling boxes 10, and the heat exchange efficiency of the mounting grooves 3 and the outside is reduced due to the fact that the temperature in the cooling channels 9 is increased when hot air passes through the cooling channels 9 through the cooling boxes 10;
the cooling box 10 is internally provided with a solution cavity, liquid water is positioned in the solution cavity, and the outer wall of the cooling box 10 is also provided with a sealing plug which can block the solution cavity;
the cooling bag 4 comprises a bag body 400, the bag body 400 is provided with a rubber film, the upper end of the bag body 400 is fixedly connected with a copper plate 401, the copper plate 401 is fixedly connected with a mounting plate 1, an inner diaphragm 402 is fixedly connected inside the bag body 400, a gas cavity 404 is formed between the inner diaphragm 402 and the copper plate 401, a cooling liquid cavity 403 is formed between the inner diaphragm 402 and the bag body 400, and cooling liquid is filled in the cooling liquid cavity 403.
The working principle of the utility model is as follows:
when the heat dissipation device is used, a large amount of heat can be dissipated from the lamp panel 5 in the using process, the heat dissipated from the lamp panel 5 can enter the mounting groove 3, a part of the heat can be exhausted through the heat dissipation window 8 and the cooling channel 9, the rest of the heat can be accumulated in the mounting groove 3, the air in the heat accumulation gas cavity 404 in the mounting groove 3 can be heated along with the heat accumulation gas cavity, the air can be expanded after being heated, so that the bag body 400 is attached to the upper end of the heat dissipation plate 6, the heat dissipation plate 6 is dissipated by using cooling liquid, and the heat dissipation of the lamp panel 5 is indirectly carried out;
when the lamp panel 5 is in the closed state, the temperature in the installation groove is reduced, and the bag 400 is restored under the action of self elasticity.
The foregoing is only a preferred embodiment of the present utility model, but the scope of the present utility model is not limited thereto, and any person skilled in the art, who is within the scope of the present utility model, should make equivalent substitutions or modifications according to the technical scheme of the present utility model and the inventive concept thereof, and should be covered by the scope of the present utility model.
Claims (6)
1. The utility model provides a semiconductor lighting lamp, includes mounting panel (1), its characterized in that, lamp shade (2) are installed to the lower extreme of mounting panel (1), internally mounted of lamp shade (2) has lamp plate (5), internally mounted of mounting panel (1) has cooling bag (4) that are used for radiating, mounting groove (3) have been seted up to the lower extreme of mounting panel (1), install in mounting groove (3) for lamp plate (5) radiating heating panel (6), just heating panel (6) laminating is in the upper end of lamp plate (5).
2. The semiconductor lighting lamp according to claim 1, wherein the lamp panel (5) is movably connected with the mounting plate (1) through a plurality of positioning rods (7), the positioning rods (7) penetrate through the lamp panel (5) and the heat dissipation plate (6), the positioning rods (7) are slidably connected with the lamp panel (5) and the heat dissipation plate (6), and a buffer spring is sleeved outside the positioning rods (7) and is located at the lower end of the lamp panel (5).
3. The semiconductor lighting lamp according to claim 1, characterized in that a plurality of heat dissipation windows (8) are arranged on the outer wall of the mounting plate (1), and the heat dissipation windows (8) are connected with the mounting groove (3).
4. The semiconductor lighting lamp according to claim 1, wherein the outer wall of the mounting plate (1) is further provided with a plurality of cooling channels (9), the cooling channels (9) are internally provided with cooling boxes (10), the cooling boxes (10) are internally provided with liquid water, and the upper end and the lower end of the cooling boxes (10) are provided with heat dissipation grooves (11).
5. A semiconductor lighting fixture according to claim 1, characterized in that the cooling bag (4) comprises a bag body (400), the upper end of the bag body (400) is fixedly connected with a copper plate (401), and the copper plate (401) is fixedly connected with the mounting plate (1).
6. The semiconductor lighting lamp according to claim 5, wherein an inner diaphragm (402) is fixedly connected to the inside of the bag body (400), a gas chamber (404) is formed between the inner diaphragm (402) and the copper plate (401), a cooling liquid chamber (403) is formed between the inner diaphragm (402) and the bag body (400), and cooling liquid is filled in the cooling liquid chamber (403).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321623303.XU CN220135413U (en) | 2023-06-26 | 2023-06-26 | Semiconductor lighting lamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321623303.XU CN220135413U (en) | 2023-06-26 | 2023-06-26 | Semiconductor lighting lamp |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220135413U true CN220135413U (en) | 2023-12-05 |
Family
ID=88953612
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321623303.XU Active CN220135413U (en) | 2023-06-26 | 2023-06-26 | Semiconductor lighting lamp |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220135413U (en) |
-
2023
- 2023-06-26 CN CN202321623303.XU patent/CN220135413U/en active Active
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| GR01 | Patent grant | ||
| GR01 | Patent grant |