CN220124678U - Pressure and PPG composite array sensor, intelligent wearing equipment and pulse wave measuring device - Google Patents

Abstract

The utility model provides a pressure and PPG composite array sensor, intelligent wearing equipment and a pulse wave measuring device, wherein the pressure and PPG composite array sensor adopts a mode of arranging a plurality of pressure sensors and a plurality of PPG sensors in an array manner, so that at least one group of pressure sensors and PPG sensors can acquire the position with the strongest signal to be acquired (such as a human pulse wave signal), and the signal acquisition precision can be greatly improved. The pressure and PPG composite array sensor comprises: the photoelectric module is provided with more than two PPG sensors and is used for acquiring photoelectric volume signals; a pressure module with more than two pressure sensors for acquiring pressure signals; the sensor groups formed by more than two PPG sensors and more than two pressure sensors are distributed in an array mode as a whole.

Description

Pressure and PPG composite array sensor, intelligent wearing equipment and pulse wave measuring device

Technical Field

The utility model relates to a sensor, in particular to a pressure and PPG composite array sensor, and belongs to the technical field of optical sensor measurement.

Background

Currently, sensors for measuring pulse waves at the wrist band (radial artery) are in the form of:

(1) Air bar type: the principle is consistent with that of a traditional sphygmomanometer, a blood vessel is blocked by adopting an inflation mode, and the blood pressure is measured;

(2) PPG photo-array: a single PPG array for measuring photoplethysmography;

(3) MEMS pressure array: a single pressure array for measuring pressure pulse waves;

(4) Two unifications of gas stick formula and PPG: attaching a PPG sensor to the air bar;

the pulse wave signals obtained by the single PPG array or the MEMS pressure array are single. The sensor combining the air bar type and the PPG type can obtain two signals, but the PPG signal is distorted in the process of inflating and extruding the blood vessel, and the mode can not be continuously measured, and the inflation blocking blood vessel has influence on a human body.

Disclosure of Invention

In view of this, the present utility model provides a pressure and PPG composite array sensor, which adopts a manner of arranging a plurality of pressure sensors and a plurality of PPG sensors in an array manner, so that at least one group of pressure sensors and PPG sensors can collect the strongest position of the signal to be collected (such as the pulse wave signal of the human body), and can greatly improve the signal collection accuracy.

A pressure and PPG composite array sensor comprising:

the photoelectric module is provided with more than two PPG sensors and is used for acquiring photoelectric volume signals;

a pressure module with more than two pressure sensors for acquiring pressure signals;

the sensor groups formed by more than two PPG sensors and more than two pressure sensors are distributed in an array mode as a whole.

As a preferred mode of the utility model, the photoelectric volume signal acquisition device further comprises a control module for controlling the photoelectric module and the pressure module to synchronously acquire the photoelectric volume signal and the pressure signal.

As a preferred mode of the present utility model, in the optoelectronic module, more than two PPG sensors are distributed in an array form to form a PPG sensor array; in the pressure module, more than two pressure sensors are distributed in an array mode to form a pressure sensor array.

As a preferred mode of the present utility model, a PPG sensor and a pressure sensor form a measuring unit for acquiring signals of the same location; more than two measuring units are distributed in an array.

As a preferred mode of the present utility model, two or more of the measuring units are arranged in sequence in the longitudinal direction or the transverse direction or in the longitudinal direction and the transverse direction to form an array.

As a preferred embodiment of the present utility model, the method further comprises: the main board, the silica gel shell and the bottom cover diaphragm;

the main board comprises a flexible circuit board and a hard circuit board;

the photoelectric module and the pressure module are arranged on the flexible circuit board, and the control module is arranged on the hard circuit board;

the main board is integrally arranged in the silica gel shell, and an opening at the outer side of the silica gel shell is closed through a bottom cover diaphragm.

As a preferred mode of the present utility model, the bottom cover membrane includes a silicone layer and a rigid membrane layer disposed outside the silicone layer.

As a preferred mode of the present utility model, each of the pressure sensors includes a pressure sensing element and a pressure signal conditioning chip;

the pressure sensing element is used for pressure change and further converting the pressure change into an analog signal; the pressure signal conditioning chip is used for converting the pressure analog signal into a digital signal and sending the digital signal to the control module.

As a preferred mode of the utility model, each pressure sensor in the pressure module comprises a pressure sensing element, and all the pressure sensing elements share a pressure signal conditioning chip;

the pressure sensing element is used for pressure change and further converting the pressure change into an analog signal; the pressure signal conditioning chip is used for converting the pressure analog signal into a digital signal and sending the digital signal to the control module.

As a preferred mode of the present utility model, the pressure sensor further includes an insulating substrate having a rail;

the area surrounded by the fence is a sensitive area; the pressure sensing element and the pressure signal conditioning chip are arranged in the sensitive area; an air hole is formed below the pressure sensing element on the insulating substrate;

and the sensitive area is filled with pressure transmission medium.

As a preferred mode of the present utility model, the pressure transmission medium is silica gel.

As a preferred mode of the present utility model, the pressure sensing element is a MEMS pressure sensing element; and the MEMS pressure sensing element and the pressure signal conditioning chip are packaged by wafers to form an MEMS wafer and a pressure signal conditioning chip wafer.

In a preferred mode of the utility model, the insulating substrate is a ceramic substrate, and the fence is fixed on the ceramic substrate to form a hollow structure as a sensitive area.

As a preferred embodiment of the present utility model, the insulating substrate and the rail are a monolithic ceramic structure.

As a preferred embodiment of the present utility model, the method further comprises: the main board, the silica gel shell and the bottom cover diaphragm;

the main board comprises a flexible circuit board and a hard circuit board;

the photoelectric module and the pressure module are arranged on the flexible circuit board, and the control module is arranged on the hard circuit board;

the main board is integrally arranged in the silica gel shell, and an opening at the outer side of the silica gel shell is closed by a bottom cover diaphragm;

the silica gel shell at the corresponding position of the pressure sensor is of a round cap-shaped structure with the middle thick and the four sides thin, so that a spring arm is formed at the thin wall.

As a preferred mode of the utility model, the inner side surface of the silica gel shell opposite to the MEMS wafer is provided with a bulge with the same cross-sectional dimension as the MEMS wafer at the position opposite to the MEMS wafer.

As a preferred mode of the present utility model, the PPG sensor includes one or more light emitting diodes and one or more photo receivers.

In a preferred mode of the utility model, an opening is arranged on the silica gel shell at a position corresponding to the PPG sensor, and a glass lens is arranged at the opening.

As a preferable mode of the utility model, a plurality of measuring units are arranged along the length direction of the silica gel shell, and bending grooves are formed on two sides of each measuring unit on the inner side surface of the silica gel shell.

As a preferred mode of the present utility model, the flexible circuit board is a stretchable flexible circuit board including a stretchable base material and a stretchable conductor.

As a preferred mode of the utility model, when the control module collects the data of the pressure module and the photoelectric module, firstly, selecting an optimal pressure signal according to a set waveform optimal condition, so that a pressure sensor corresponding to the optimal pressure signal is an optimal pressure sensor; and then synchronously triggering the PPG sensor which is positioned in the same measuring unit as the optimal pressure sensor, thereby obtaining a photoplethysmography pulse wave signal, and reporting the obtained optimal pressure signal and photoplethysmography pulse wave signal to an upper computer.

As a preferable mode of the utility model, the control module synchronously triggers the pressure module and the photoelectric module, wherein in the pressure module, each pressure sensor is polled and started to collect pressure pulse wave signals, and in the photoelectric module, each PPG sensor is polled and started to collect photoelectric volume pulse wave signals; the control module respectively selects an optimal pressure waveform and an optimal photoelectric waveform according to the set waveform optimal conditions and reports the optimal pressure waveform and the optimal photoelectric waveform to the upper computer.

In addition, the utility model provides intelligent wearing equipment, and the pressure and PPG composite array sensor is arranged on the intelligent wearing equipment.

In addition, the utility model also provides a pulse wave measuring device, which comprises: the acquisition unit and the processing unit;

the acquisition unit is used for acquiring pulse wave signals generated by the target object and sending the pulse wave signals to the processing unit;

the processing unit is used for analyzing and processing the pulse wave signals acquired by the acquisition unit to generate target pulse data;

the acquisition unit is the pressure and PPG composite array sensor.

As a preferred embodiment of the present utility model, the method further comprises: a display unit;

the processing unit sends the generated target pulse data to the display unit;

the display unit is used for displaying the pulse beat frequency or waveform of the target object according to the received target pulse data.

The beneficial effects are that:

(1) The utility model adopts a mode of arranging a plurality of pressure sensors and a plurality of PPG sensors in an array way, so that two types of waveform signals can be collected simultaneously, and the harsh requirements of the sensors on the pulse position can be reduced in an array way; by adopting the design mode of the array, at least one group of pressure and PPG sensors can acquire the strongest position of the signal to be acquired (such as the pulse wave signal of a human body), and meanwhile, the signals can be continuously acquired without inflation, so that the signal acquisition precision and the use experience are greatly improved.

(2) The photoelectric volume signal and the pressure signal are synchronously acquired by controlling the photoelectric module and the pressure module through the control module, so that the sensor can synchronously acquire the strongest position of the signal to be acquired simultaneously by combining array arrangement, and the signal acquisition precision is further improved.

(3) When the sensor is used for radial artery pulse wave signal acquisition, n pressure sensors and n PPG sensors are arranged at the radial artery, and the pressure sensors and the PPG sensors form a sensor group in a one-to-one correspondence manner to form a 2 Xn array; the array layout is adopted, so that one sensor group is always positioned above the radial artery, and stable and optimal waveforms can be obtained without purposely aligning the radial artery when the sensor group is used.

(4) The MEMS pressure sensing element and the pressure conditioning chip in the pressure sensor are packaged in a wafer mode, the MEMS wafer is placed at the center position, and the size in the aspect of thickness is reduced as much as possible, so that the pressure sensor has small structural size and is suitable for putting in products with high space requirements such as wearing.

(5) The pressure transmission medium in the traditional pressure sensor is mostly gas or liquid, such as nitrogen, argon, glycerol, kerosene and the like; the tightness of the pressure transmission medium is ensured structurally, so that the pressure sensor must be made into an airtight or oil-tight structure, and the complexity of the structure is high, so that the size of the sensor cannot be finished in a small size; in the pressure sensor, the pressure is directly transmitted through filling the filler such as silica gel to form the gauge pressure sensor, and the silica gel is used for protecting internal electronic elements and conducting mechanics, so that the pressure sensor is simple in structure; the silica gel can be directly contacted with the object to be measured after solidification, and further sealing is not needed, so that the pressure sensor has a simple structure and can be used for processing a small-size pressure sensor; and because the pressure transmission medium can contact the measured object, the medium for conversion does not need to be added, and the sensitivity of the pressure sensor can be improved.

(6) In the pressure sensor, the elastic arm is formed by the structural design of the silica gel shell, so that the pressure can be sensed more easily, and the sensitivity of the pressure sensor is improved.

(7) In view of the manner in which the plurality of pressure sensors and the plurality of PPG sensors are arranged in an array, when used in a wrist strap type device, the silicone housing is designed in a crawler type so that the sensor portion is easier to bend, and better fits the skin without pulling the internal device.

(8) The bottom diaphragm is lined with a rigid diaphragm layer to ensure that the sensor is not stretched and deformed and to protect the internal components.

Drawings

FIG. 1 is a block diagram of a pressure and PPG composite flexible array sensor according to the present utility model;

FIG. 2 is a schematic diagram of a layout of the array sensor (for pulse wave measurement of a artery);

FIG. 3 is a schematic diagram of a layout of the array sensor (for pulse wave measurement of the cun-guan ruler);

FIG. 4 is a block diagram of one component of a pressure and PPG composite flexible array sensor;

FIG. 5 is a schematic diagram (exploded view) of a pressure and PPG composite flexible array sensor according to the present utility model;

FIG. 6 is a schematic structural view of a tracked silica gel shell;

FIG. 7 is a schematic diagram of a configuration of a pressure sensor;

FIG. 8 is a view A-A of FIG. 7;

FIG. 9 is a schematic diagram of the pressure sensor of FIG. 8;

FIG. 10 is a schematic structural view of a silica gel housing at a pressure sensor;

fig. 11 is a front view of one structure of the PPG sensor;

fig. 12 is a side view of the PPG sensor of fig. 11;

fig. 13 to 15 are schematic views of three other structures of PPG sensors, respectively;

FIG. 16 is a schematic diagram of the internal layout of a pressure and PPG composite flexible array sensor;

FIG. 17 is a signal selection flow chart of the composite flexible array sensor;

FIG. 18 is a flow chart of another signal selection of the composite flexible array sensor;

wherein: 1-a pressure sensor; a 2-PPG sensor; 3-a flexible circuit board; 4-a hard circuit board; 5-a silica gel shell; 6, bending grooves; 7-a bottom membrane; 8-a ceramic substrate; 9-fencing; 10-sensitive area; 11-MEMS wafer; 12-pressure signal conditioning chip wafer; 13-a pressure transmission medium; 14-spring arms; 15-a light emitting diode; a 16-photo receiver; 17-an optoelectronic circuit board; 18-an optoelectronic internal support; 19-glass lenses; 20-a radial artery; 21-bottom cover membrane.

Detailed Description

The present utility model will be described in further detail with reference to the accompanying drawings and examples.

Example 1:

the embodiment provides a pressure and PPG composite array sensor, and the sensor adopts a mode that a plurality of pressure sensors and a plurality of PPG sensor arrays are arranged, so that at least one group of pressure sensors and PPG sensors can synchronously acquire the strongest position of a signal to be acquired (such as a human pulse wave signal) at the same time, and the signal acquisition precision can be greatly improved.

As shown in fig. 1, the pressure and PPG composite array sensor includes: the device comprises a photoelectric module, a pressure module and a control module; the photoelectric module comprises more than two PPG sensors 2 and is used for acquiring photoelectric volume signals; the pressure module comprises more than two pressure sensors 1 and is used for acquiring pressure signals; the control module is used for controlling and synchronizing signals of the pressure module and the photoelectric module, and realizing synchronous acquisition of the pressure signal and the photoelectric signal. The pressure and PPG composite array sensor can be used for measuring human body photoelectric volume pulse wave signals and pressure pulse wave signals; or to measure internal fistula occlusion signals after bypass surgery.

The two or more PPG sensors 2 and the two or more pressure sensors 1 form a sensor group which is distributed in an array, and as a preferable implementation mode, the two or more PPG sensors 2 are distributed in an array to form a PPG sensor array; more than two pressure sensors 1 are distributed in an array manner to form a pressure sensor array; the PPG sensor 2 and the pressure sensor 1 may be arranged to intersect, but distributed in an array as a whole, depending on the application requirements.

As shown in fig. 2, a schematic layout diagram of the composite array sensor for radial artery pulse wave measurement is given; radial artery is along the arm direction (let this direction be vertical, the length direction of arm), and PPG sensor array and pressure sensor array all follow transversely, and adopts one-to-one arrangement mode (for the convenience of description, let the hoop of arm be transversely, transversely same position, along vertically respectively setting up a PPG sensor array 2 and a pressure sensor 1), from this guarantee that PPG sensor 2 and pressure sensor 1 gather the signal of same position blood vessel. As shown in fig. 2, n (n is 4 in this example) pressure sensors 1 and n PPG sensors 2 are arranged on the wristband (at radial artery) in the lateral direction, and the pressure sensors 1 and PPG sensors 2 are in one-to-one correspondence to form a 2×n array. The sensor array may be formed by vertically distributing a plurality of measuring units using the 2×n array as one measuring unit.

Besides pulse wave signals at radial artery, the sensor can also be used for collecting pulse wave signals of other parts of human body; the layout is not limited to the planar layout. As shown in fig. 3, another layout schematic of the composite flexible array sensor is given; the PPG sensor array and the pressure sensor array are vertical, and one-to-one arrangement mode is adopted. If n (n is 4 in this example) pressure sensors 1 and n PPG sensors 2 are vertically arranged, the n pressure sensors 1 and the n PPG sensors 2 are in one-to-one correspondence, so as to form an n×2 array. The n×2 array may be used as one measuring unit, and a plurality of measuring units may be distributed in the lateral direction, thereby forming a sensor array; the pulse wave of the cunguan ruler as taught by the traditional Chinese medicine can be obtained by adopting the distribution mode. In addition to the above planar layout, a three-dimensional layout may be adopted, that is, the PPG sensor and the pressure sensor are stacked and disposed as one measurement unit (the pressure sensor collects the pressure signal transmitted by the PPG sensor at this time), and a plurality of measurement units are distributed in an array to form a sensor array.

In this embodiment, as shown in fig. 1, each pressure sensor 1 in the pressure module has the same structure and includes a MEMS pressure sensing element and a pressure signal conditioning chip; the MEMS pressure sensing element is used for sensing the tiny pressure change of the outside and converting the tiny pressure change into an analog signal; the pressure signal conditioning chip is used for converting the pressure analog signal of the MEMS pressure sensing element into a digital signal. As one possible way, the element that senses the pressure change is not limited to the MEMS pressure sensing element, but may be a piezoelectric ceramic, a piezoelectric film or a pressure strain gauge, an FSR resistive strain film, or the like.

When the MEMS pressure sensing element is used, in order to reduce the size of the pressure sensor as much as possible, the MEMS pressure sensing element and the pressure signal conditioning chip are packaged in a wafer manner, thereby forming the MEMS wafer 11 and the pressure signal conditioning chip wafer 12. In this embodiment, each MEMS wafer 11 is paired with a pressure signal conditioning chip wafer 12 for converting the pressure analog signal into a digital signal, and uploading the digital signal to the control module through the data bus. In this example, the pressure module comprises four pressure sensors 1, the four pressure sensors 1 being connected to the control module respectively.

As another implementation, as shown in fig. 4, the pressure module includes a plurality of MEMS pressure sensing elements and a pressure signal conditioning chip; namely, a plurality of MEMS pressure sensing elements share one pressure signal conditioning chip; in order to minimize the size of the pressure sensor, the MEMS pressure sensor element is packaged as a wafer, thereby forming the MEMS wafer 11. At this time, the pressure module includes four MEMS wafers 11 and a packaged pressure signal conditioning chip, the four MEMS wafers 11 are respectively connected with the pressure signal conditioning chip, and the pressure signal conditioning chip is connected with the control module through a data bus.

It can be seen that the pressure unit can adopt a one-to-one mode, that is, one MEMS wafer 11 corresponds to one pressure signal conditioning chip wafer 12; one-to-many approach, i.e., one pressure signal conditioning chip, may also be used to control multiple MEMS wafers 11.

As one implementation, the optoelectronic module includes a plurality of PPG sensors and 1 optoelectronic signal front-end processing chip; the PPG sensor comprises more than one light emitting diode (two in this embodiment) and one photo receiver. The light emitting diode emits light into human skin, and receives the light reflected by the human body through the photoelectric receiver and converts the light into an electric signal; then transmitting the electric signal to a photoelectric signal front-end processing chip, and converting the electric signal into a digital signal; the photoelectric signal front-end processing chip uploads the digital signal to the control module through the data bus.

The light emitting diodes of the PPG sensors in the photoelectric module can be light with the same wavelength or light with different wavelengths, and the light with various wavelengths has different penetrability to the skin; when the PPG sensor includes a plurality of light emitting diodes, the light emitting diodes in the same PPG sensor may be light with the same wavelength or light with different wavelengths. As one possible way, two light emitting diodes for green light (530 nm wavelength) are included in the PPG sensor; as another implementation, the PPG sensor includes two light emitting diodes, one of which is a green light emitting diode and the other of which is a red light emitting diode. Or green light and infrared light emitting diode combination, red light and infrared light emitting diode combination, etc., as shown in fig. 13-15.

Example 2:

on the basis of the above-described embodiment 1, the present embodiment gives specific structures of the respective modules, which are applicable to various planar layout modes in the above-described embodiment 1.

As shown in fig. 5, each template of the pressure and PPG composite array sensor is welded on a motherboard, wherein the motherboard is a soft and hard combined board, and comprises a flexible circuit board 3 and a hard circuit board 4, wherein a photoelectric module and a pressure module are welded on the flexible circuit board 3 in a set array arrangement mode, and a control module is welded on the hard circuit board 4. The whole main board is adhered into the silica gel shell 5 through glue.

In this embodiment, the sensor is used for a wrist strap, one pressure sensor 1 and one PPG sensor 2 form one measuring unit, four measuring units are arranged along the length direction of the wrist strap (the direction is the circumferential direction of the arm), and in order to make the wrist strap more fit with the skin when in use, the measuring precision is improved, and the silica gel housing 5 is designed into a crawler-type structure according to the arrangement mode of the four measuring units; as shown in fig. 6, bending grooves 6 are formed on both sides (both sides along the length direction of the silica gel housing 5) of each measuring unit on the inner side surface (i.e., the side surface contacting with the skin when in use) of the silica gel housing 5, so that the silica gel housing 5 is easily bent at the positions of the bending grooves 6, and the measuring units are further attached to the skin. The silicone housing 6 is typically medical grade silicone, which is not allergic to human skin.

The bottom cover diaphragm 7 is adhered to the outer side of the silica gel shell 5 through glue and is used for protecting the measuring unit; in this example, the bottom cover membrane 7 has two layers, namely a silica gel layer and a membrane layer (which may be a PC membrane or a PET membrane) sequentially from inside to outside, and the membrane layer is combined with the silica gel layer by an in-mold molding manner. The thickness of the membrane layer is 0.1mm, and the flexible circuit board can be bent and cannot be stretched due to the fact that the membrane layer is thin and rigid, and the whole structure is guaranteed to be stressed and not to be stretched.

Because the sensor can be bent in the use process, although the bending is ensured not to pull the flexible circuit board 3 through the crawler-type silica gel shell 5 and the bottom diaphragm 7 in the structural design, a certain risk exists; based on this, as one possible way, the flexible circuit board 3 adopts a stretchable structure to form a stretchable flexible circuit board, whereby the service life of the wristband can be further improved. As an example, stretchable flexible circuit boards include a stretchable substrate, typically a flexible fiber, and a stretchable conductor having two ways: stretchable conductive ink and serpentine copper foil; the stretchable flexible circuit board can adopt a structure form of a stretchable base material and stretchable conductive ink; the structure of the flexible base material and the serpentine copper foil can also be adopted.

The pressure sensor 1 is a core component for sensing pulse pressure, as an implementation manner, as shown in fig. 7 and 8, each pressure sensor structure in the pressure module is the same, and each pressure sensor structure comprises a MEMS wafer 11, a pressure signal conditioning chip wafer 12, a ceramic substrate 8 and a fence 9; the ceramic substrate 8 is square, the fence 9 is made of metal, and is plated with stainless steel to enable the fence to be welded; during assembly, the circular welding fence 9 is firstly arranged on the ceramic substrate 8 with high insulation and flatness, and preferably, the outer diameter of the fence 9 is consistent with the inscribed circle diameter of the ceramic substrate 8, so that the whole structure of the pressure sensor is compact. The area surrounded by the fence 9 is a sensitive area 10, and the diameter is generally within 6 mm; both the MEMS wafer 11 and the pressure signal conditioning chip wafer 12 are mounted within the sensitive area 10 of the enclosure 9. The purpose of the enclosure 9 is to protect the internal circuitry and wafers (MEMS wafer 11 and pressure signal conditioning chip wafer 12) and to provide a space filled pressure transmission medium 13. The MEMS wafer 11 is mounted in the center of the enclosure 9 by COB process (die bonding and bonding wires), i.e., the MEMS wafer 11 is placed at the center of the enclosure 9. The center of the ceramic substrate 8 (i.e., the position corresponding to the MEMS wafer 11) is provided with a vent hole.

The pressure signal conditioning chip wafer 12 is also connected to the ceramic substrate 8 by a COB process. After the MEMS wafer 11 and the pressure signal conditioning chip wafer 12 are installed, the pressure transmission medium 13 is filled in the sensitive area 10 of the fence 9, in the scheme, the pressure transmission medium 13 is high-viscosity silica gel, and after the glue is solidified, the pressure transmission medium has certain elasticity and can well transmit pressure. In this embodiment, the pressure transmission medium 13 is a high viscosity (viscosity is 2000) silica gel, but any glue can be used as long as the pressure transmission medium meets the following requirements: (1) Has certain viscosity (the viscosity is 1000-3000), and is convenient for filling and sealing operation; (2) After the glue is solidified, the glue has certain elasticity, and the hardness is within 40 degrees of Shore; (3) the glue is subjected to defoaming treatment, and bubbles are not allowed in the glue; (4) after the glue is solidified, the shrinkage rate is as small as possible; (5) the curing time is as short as possible; (6) having insulation properties; and (7) aging resistance and temperature resistance in the range of-40-85 ℃.

On the premise of meeting the COB process (high gold wire throwing and set safety distance), the rail 9 is as low as possible, so that the encapsulated silica gel is as thin as possible to transmit pressure to the greatest extent. In this embodiment, the distance between the upper end surface of the MEMS wafer 11 and the top of the rail 9 should be greater than 0.45mm. The overall thickness of the pressure sensor (i.e., the distance between the bottom surface of the ceramic substrate and the top surface of the rail) is controlled to be 1.6mm. The size is very small and thus very suitable for being placed in products with relatively high space requirements, such as wearing products.

In the above embodiment, the pressure sensor is a hollow structure formed by welding a metal fence 9 on a ceramic substrate 8; other materials of the rail, such as plastic, may be used, and the rail is bonded to the ceramic substrate 8 by glue. As an implementation manner, a 3D ceramic manner may be adopted, and the ceramic substrate 8 and the rail 9 may be directly made into an integral ceramic structure, as shown in fig. 9.

When assembled, the pressure sensor shown in fig. 7 is integrally welded to the flexible circuit board 3 of the main board; when in use, the silica gel shell 5 is attached to the skin of a measuring position, and the pulse generated by the pulse is transmitted to the pressure transmission medium 13 through the silica gel shell 5 above the pressure sensor and finally transmitted to the MEMS wafer 11.

As an example, as shown in fig. 10, the silicone housing 5 (the side in contact with the skin) at the position corresponding to the pressure sensor is designed in a circular cap shape, that is, the silicone housing 5 at this position has a structure with a thick middle and a thin periphery (the position corresponding to the rail 9), whereby the spring arm 14 is formed at the thin wall so that it can be easily deformed to receive a weak pressure change. The spring arm 14 is typically 0.2mm to 0.3mm thick. As a preferred embodiment, further, a protrusion having a size consistent with the cross-sectional dimension of the MEMS wafer is provided on the inner side surface of the silicone housing 5 opposite to the MEMS wafer at a position opposite to the MEMS wafer, whereby the sensitivity of the pressure sensor can be further improved.

As an example, as shown in fig. 11, 12 and 16, the PPG sensor includes two light emitting diodes 15 and one photo receiver 16 soldered on a photo circuit board 17; wherein the photo receiver 16 is located between two light emitting diodes 15. During assembly, the PPG sensor is integrally welded to the flexible circuit board 3 of the main board, and the flexible circuit board 3 is adhered to the photoelectric internal support 18 arranged inside the silica gel shell 5 through glue. The optoelectronic inner support 18 is made of hard material, typically PA or PC material, and is integrally combined with the silicone housing by an in-mold molding process.

An opening is arranged on the silica gel shell 5 at a position corresponding to the PPG sensor, a glass lens 19 is arranged at the opening, and in the example, the glass lens 19 is adhered to the photoelectric internal support 18; the glass lens 19 protects the led 15 and the photo receiver 16, the glass lens 19 is as thin as possible, in this example 0.3mm glass, and the surface is subjected to an anti-reflection treatment so that the light transmittance is >97%, and the led 15 and the photo receiver 16 are as close to the glass as possible to reduce the attenuation of light.

The control unit is the control circuit of setting on the mainboard, and the mainboard passes through glue to be glued to the mainboard support on, for the protection mainboard, the mainboard support must have certain rigidity and shielding nature, and this example adopts stainless steel material, combines together with the silica gel shell through the mode of in-mould shaping.

Example 3:

on the basis of embodiment 1 or embodiment 2 described above, a plurality of pressure sensors and PPG sensors are provided in the sensor, whereby a plurality of sets of photoplethysmography wave signals and pressure pulse wave signals can be obtained; when in use, the optimal photoplethysmography pulse wave signal and pressure pulse wave signal are selected.

Because the fluctuation of the photoelectric signal is large and is greatly influenced by the environment, the photoelectric optimal signal is not well selected, and in the case, when the sensor acquires data each time, a mode of searching the pressure optimal signal at first and then synchronously selecting the corresponding photoelectric signal is adopted. This ensures that the signal selected by the array is the signal at the artery, i.e. the strongest signal (pulse strongest) location is found by the pressure array. The signal selection flow is as shown in fig. 17:

firstly, a control module polls each pressure sensor in a starting pressure module to acquire pressure pulse wave signals, so that a plurality of pressure waveforms are obtained, an optimal pressure waveform is selected according to a set waveform optimal condition (such as maximum amplitude or optimal signal to noise ratio), and the pressure sensor corresponding to the optimal waveform is an optimal pressure sensor; then synchronously triggering a PPG sensor which is positioned in the same measuring unit as the optimal pressure sensor, thereby obtaining a photoplethysmography pulse wave signal; reporting to an upper computer.

Example 4:

in this embodiment, another selection process of the pressure signal and the photoelectric signal is given, that is, in one measurement period, the control module searches for the optimal signals of the pressure module and the photoelectric module respectively, and then reports the searched optimal signals to the upper computer.

As shown in fig. 18, the control module synchronously triggers the pressure module and the photoelectric module, wherein in the pressure module, each pressure sensor is polled and started to collect pressure pulse wave signals, and in the photoelectric module, each PPG sensor is polled and started to collect photoelectric volume pulse wave signals; the control module respectively selects the optimal pressure waveform and the optimal photoelectric waveform according to the set waveform optimal conditions (such as maximum amplitude or optimal signal-to-noise ratio) and reports the optimal pressure waveform and the optimal photoelectric waveform to the upper computer.

Example 5:

the embodiment provides an intelligent wearable device such as an intelligent bracelet or a watch; the wearing belt of the smart wristband or the watch is provided with the pressure and PPG composite array sensor in the embodiment 1 or the embodiment 2.

Example 6:

the present embodiment provides a pulse wave measuring apparatus, including: the device comprises an acquisition unit, a processing unit and a display unit;

the acquisition unit is used for acquiring pulse wave signals generated by the target object and sending the pulse wave signals to the processing unit;

the processing unit is used for analyzing and processing the pulse wave signals acquired by the acquisition unit, generating target pulse data and sending the target pulse data to the display unit;

the display unit is used for displaying the pulse beat frequency or waveform of the target object according to the received target pulse data.

Wherein the acquisition unit is the pressure and PPG composite array sensor described in example 1 or example 2 above.

While the utility model has been described in detail in the foregoing general description and specific examples, it will be apparent to those skilled in the art that modifications and improvements can be made thereto. Accordingly, such modifications or improvements may be made without departing from the spirit of the utility model and are intended to be within the scope of the utility model as claimed.

Claims (23)

1. Pressure and PPG compound array sensor, its characterized in that: comprising the following steps:

the photoelectric module is provided with more than two PPG sensors and is used for acquiring photoelectric volume signals;

a pressure module with more than two pressure sensors for acquiring pressure signals;

the sensor groups formed by more than two PPG sensors and more than two pressure sensors are distributed in an array mode as a whole.

2. The pressure and PPG composite array sensor of claim 1, wherein: the photoelectric volume signal and pressure signal synchronous acquisition control module is used for controlling the photoelectric module and the pressure module to synchronously acquire the photoelectric volume signal and the pressure signal.

3. The pressure and PPG composite array sensor of claim 1, wherein:

in the photoelectric module, more than two PPG sensors are distributed in an array manner to form a PPG sensor array;

in the pressure module, more than two pressure sensors are distributed in an array mode to form a pressure sensor array.

4. The pressure and PPG composite array sensor of claim 1, wherein: a PPG sensor and a pressure sensor form a measuring unit for collecting signals of the same position; more than two measuring units are distributed in an array.

5. The pressure and PPG composite array sensor of claim 4, wherein: and more than two measuring units are sequentially arranged along the longitudinal direction or the transverse direction or the longitudinal direction and the transverse direction to form an array.

6. The pressure and PPG composite array sensor of claim 2, wherein: further comprises: the main board, the silica gel shell and the bottom cover diaphragm;

the main board comprises a flexible circuit board and a hard circuit board;

the photoelectric module and the pressure module are arranged on the flexible circuit board, and the control module is arranged on the hard circuit board;

the main board is integrally arranged in the silica gel shell, and an opening at the outer side of the silica gel shell is closed through a bottom cover diaphragm.

7. The pressure and PPG composite array sensor of claim 6, wherein: the bottom cover diaphragm comprises a silica gel layer and a rigid diaphragm layer arranged on the outer side of the silica gel layer.

8. The pressure and PPG composite array sensor of claim 2, wherein: each pressure sensor comprises a pressure sensing element and a pressure signal conditioning chip;

the pressure sensing element is used for pressure change and further converting the pressure change into an analog signal; the pressure signal conditioning chip is used for converting the pressure analog signal into a digital signal and sending the digital signal to the control module.

9. The pressure and PPG composite array sensor of claim 2, wherein: each pressure sensor in the pressure module comprises a pressure sensing element, and all the pressure sensing elements share a pressure signal conditioning chip;

the pressure sensing element is used for pressure change and further converting the pressure change into an analog signal; the pressure signal conditioning chip is used for converting the pressure analog signal into a digital signal and sending the digital signal to the control module.

10. The pressure and PPG composite array sensor of claim 8, wherein: the pressure sensor further includes an insulating substrate having a rail;

the area surrounded by the fence is a sensitive area; the pressure sensing element and the pressure signal conditioning chip are arranged in the sensitive area; an air hole is formed below the pressure sensing element on the insulating substrate;

and the sensitive area is filled with pressure transmission medium.

11. The pressure and PPG composite array sensor of claim 10, wherein: the pressure transmission medium is silica gel.

12. The pressure and PPG composite array sensor of claim 10 or 11, wherein: the pressure sensing element is an MEMS pressure sensing element; and the MEMS pressure sensing element and the pressure signal conditioning chip are packaged by wafers to form an MEMS wafer and a pressure signal conditioning chip wafer.

13. The pressure and PPG composite array sensor of claim 10 or 11, wherein: the insulating substrate is a ceramic substrate, and the fence is fixed on the ceramic substrate to form a hollow structure serving as a sensitive area.

14. The pressure and PPG composite array sensor of claim 10 or 11, wherein: the insulating substrate and the fence are of an integrated ceramic structure.

15. The pressure and PPG composite array sensor of claim 12, wherein: further comprises: the main board, the silica gel shell and the bottom cover diaphragm;

the main board comprises a flexible circuit board and a hard circuit board;

the photoelectric module and the pressure module are arranged on the flexible circuit board, and the control module is arranged on the hard circuit board;

the main board is integrally arranged in the silica gel shell, and an opening at the outer side of the silica gel shell is closed by a bottom cover diaphragm;

the silica gel shell at the corresponding position of the pressure sensor is of a round cap-shaped structure with the middle thick and the four sides thin, so that a spring arm is formed at the thin wall.

16. The pressure and PPG composite array sensor of claim 15, wherein: and the inner side surface of the silica gel shell opposite to the MEMS wafer is provided with a bulge with the same cross-sectional dimension as the MEMS wafer at the position opposite to the MEMS wafer.

17. A pressure and PPG composite array sensor according to any one of claims 1-5, wherein: the PPG sensor includes one or more light emitting diodes and one or more photo receivers.

18. The pressure and PPG composite array sensor of claim 6, wherein: and an opening is formed in the position, corresponding to the PPG sensor, of the silica gel shell, and a glass lens is installed at the opening.

19. The pressure and PPG composite array sensor of claim 6, wherein: a plurality of measuring units are arranged along the length direction of the silica gel shell, and bending grooves are formed in two sides of each measuring unit on the inner side face of the silica gel shell.

20. The pressure and PPG composite array sensor of claim 6, wherein: the flexible circuit board is a stretchable flexible circuit board and comprises a telescopic base material and a telescopic conductor.

21. An intelligent wearable device, characterized in that: a pressure and PPG composite array sensor as claimed in any one of claims 1 to 20 disposed thereon.

22. A pulse wave measuring device, characterized in that: comprising the following steps: the acquisition unit and the processing unit;

the acquisition unit is used for acquiring pulse wave signals generated by the target object and sending the pulse wave signals to the processing unit;

the processing unit is used for analyzing and processing the pulse wave signals acquired by the acquisition unit to generate target pulse data;

the acquisition unit is the pressure and PPG composite array sensor of any one of claims 1-20.

23. The pulse wave measurement device of claim 22, wherein: further comprises: a display unit;

the processing unit sends the generated target pulse data to the display unit;

the display unit is used for displaying the pulse beat frequency or waveform of the target object according to the received target pulse data.