CN220121810U - Semiconductor wafer clamping mechanism capable of automatically centering - Google Patents

Abstract

The utility model belongs to the technical field of semiconductor wafer processing, and discloses a semiconductor wafer clamping mechanism capable of automatically centering, a workbench, wherein a bottom surface of the workbench is fixedly connected with a bottom frame, a pushing mechanism for conveying semiconductor wafers is arranged in the middle of the workbench, and an adjusting mechanism is arranged on the workbench. The swinging rod can be controlled to swing under the operation of the second motor, the two connecting rods are further driven to respectively push or pull the two vertical plates to move, so that the two vertical plates are mutually close to or far away from the two fixed frames so as to adjust clamping positions of different wafer sizes, meanwhile, a person can operate the operation of the first motor, so that the two adjusting plates can adjust the spacing on the fixed frames so as to clamp wafers, when the wafers are rectangular, the two clamping rollers on each L-shaped plate can clamp the rectangular wafers, and the four corners of the rectangular wafers are uniformly divided at the inner included angles of the four L-shaped plates.

Description

Semiconductor wafer clamping mechanism capable of automatically centering

Technical Field

The utility model belongs to the technical field of semiconductor wafer processing, and particularly relates to a semiconductor wafer clamping mechanism capable of automatically centering.

Background

The semiconductor is a production material with conductivity between a conductor and an insulator at normal temperature, wherein the common semiconductor material is silicon, germanium, gallium arsenide and the like, the semiconductor plays an important role in industrial production nowadays, various electronic products comprise more or less semiconductor devices, the development of economy and science and technology are not separated from the semiconductor, the semiconductor is processed by applying the material to an indispensable part in actual production, and in the processing process of a semiconductor wafer, the semiconductor wafer needs to be tested to judge whether the semiconductor wafer meets the use standard or not, and a clamping tool is often needed to clamp and fix the semiconductor wafer so as to detect the semiconductor wafer.

According to the patent number CN217542838U, a clamping device for semiconductor wafer testing is disclosed, the device comprises a bottom plate, the top of bottom plate is fixed with the connecting rod, the top of connecting rod is fixed with clamping assembly, be connected with the constraint area on the clamping assembly, the downside of bottom plate is fixed with the installation pole, sliding connection has the clamping pole on the carriage, one side of clamping pole is fixed with the limiting plate, and the opposite side is fixed with the clamping plate, the periphery of clamping pole has cup jointed the spring, the spring is located between clamping plate and the carriage, the carriage is provided with two, and opposites the setting, and connects through the constraint area, be fixed with the rubber pad on the clamping plate, the constraint area is made by flat rubber band, and the utility model is simple in structure, convenient operation can satisfy the semiconductor wafer centre gripping fixed to different shapes, is worth using widely.

However, in the implementation process, the rectangular wafer is positioned only by the restraint strap, so that the rectangular wafer can cause certain instability, and the fixity of four corners of the rectangular wafer is difficult to ensure. To this end, we provide a semiconductor wafer clamping mechanism that can be self-centering to solve the above problems.

Disclosure of Invention

(one) solving the technical problems

In order to solve the problems in the prior art, the utility model provides a semiconductor wafer clamping mechanism capable of automatically centering, which has the advantage of stable clamping of rectangular wafers and round wafers.

(II) technical scheme

In order to achieve the above purpose, the present utility model provides the following technical solutions: the utility model provides a but semiconductor wafer fixture of automatic centering, includes the workstation, the chassis has been linked firmly to the bottom surface of workstation, the middle part of workstation is provided with the pushing mechanism who is used for carrying semiconductor wafer, be provided with adjustment mechanism on the workstation, adjustment mechanism is including seting up two sliding tray on the workstation and the fixed frame that slides respectively set up in two sliding tray through the link gear, and two fixed frames set up respectively in pushing mechanism's left and right sides, every all install two fixture that set up relatively through actuating mechanism on the fixed frame.

In the above technical scheme, preferably, push mechanism is including seting up fluting on the workstation and installing the electric putter on the chassis, grooved inner wall has linked firmly and has put the frame and articulated have the swing frame, it is provided with the first deflector roll that the equidistance was arranged to rotate on the swing frame, electric putter's flexible end has linked firmly the roof, link firmly the installing frame on the roof, the top of installing frame runs through and puts the frame and slide and set up in putting the frame, the top of installing frame rotates and is provided with the second deflector roll that the equidistance was arranged, and the second deflector roll is parallel and level mutually with first deflector roll, the left surface of roof articulates there is the link plate, and the top of link plate articulates the bottom surface at the swing frame.

In the above technical scheme, preferably, the hinge point of the swing frame is arranged between the middle parts of the front side surface and the rear side surface of the placement frame and the grooved inner wall.

In the above technical scheme, preferably, the placing frame is fixedly connected with partition plates arranged at equal intervals, and the second guide roller is located between every two adjacent partition plates.

In the above technical scheme, preferably, the link gear comprises a second motor installed on the bottom surface of the chassis and vertical plates respectively arranged in the two sliding grooves in a sliding way, the top ends of the vertical plates are connected with the fixed frame, the output ends of the second motor are fixedly connected with swinging rods, connecting rods are respectively arranged at two ends of the swinging rods in a rotating way, and one ends of the two connecting rods are respectively connected with the bottom ends of the two vertical plates in a rotating way.

In the above technical scheme, preferably, the driving mechanism comprises a first motor installed on the fixed frame and a bidirectional screw rod rotatably arranged on the inner wall of the fixed frame, the output end of the first motor is connected with the bidirectional screw rod, and the two clamping mechanisms are both arranged on the bidirectional screw rod.

In the above technical scheme, preferably, the fixture includes the regulating plate that the screw thread cup jointed on two-way screw rod, the L template has been linked firmly on the regulating plate, the both ends rotation on the L template is provided with two grip rolls, and is ninety degrees between two grip rolls, link firmly the contained angle pad on the interior contained angle of L template.

In the above technical scheme, preferably, the left and right sides of the chassis are both fixedly connected with guide rods, and the two guide rods respectively penetrate through the middle parts of the two vertical plates.

(III) beneficial effects

Compared with the prior art, the utility model has the following beneficial effects:

1. according to the utility model, under the cooperation of the underframe, the adjusting mechanism and the clamping mechanism, the swinging rod is controlled to swing under the operation of the second motor, the two connecting rods are further driven to respectively push or pull the two vertical plates to move, so that the two vertical plates are close to or far away from each other to facilitate the adjustment of clamping positions of different wafer sizes, meanwhile, a person can operate the operation of the first motor, so that the two adjusting plates can adjust the spacing on the fixed frames to facilitate the clamping of wafers, when the wafers are rectangular, the two clamping rollers on each L-shaped plate can clamp rectangular wafers, the four corners of each rectangular wafer are uniformly distributed at the inner included angles of the four L-shaped plates, and when the wafers are circular, one clamping roller on each L-shaped plate clamps circular wafers, so that the stability of the wafers is effectively ensured.

2. According to the utility model, by arranging the pushing mechanism, the wafer can be pushed to the middle part of the workbench through the first guide roller and the second guide roller, so that the cleanliness of the wafer before clamping is ensured, the fingerprints of personnel on the wafer are avoided, the friction between the wafer and the workbench can be effectively reduced, when the wafer is required to be clamped on the workbench, the operation of the electric push rod is controlled, the mounting frame is lowered, and the connecting plate pulls the swinging frame to swing downwards, so that the subsequent processing of the wafer on the workbench is ensured.

Drawings

FIG. 1 is a schematic diagram of the structure of the present utility model;

FIG. 2 is a schematic view of the bottom structure of the present utility model;

FIG. 3 is a right side cross-sectional view of the present utility model;

FIG. 4 is an enlarged schematic view of the structure of FIG. 1A according to the present utility model;

FIG. 5 is an enlarged schematic view of the structure of FIG. 2B according to the present utility model;

fig. 6 is an enlarged schematic view of the structure of fig. 3C according to the present utility model.

In the figure: 1. a work table; 2. a chassis; 3. a pushing mechanism; 31. a swinging frame; 32. a first guide roller; 33. slotting; 34. a placing frame; 35. a mounting frame; 36. a connecting plate; 37. a second guide roller; 38. a top plate; 39. an electric push rod; 4. an adjusting mechanism; 41. a fixed frame; 42. a sliding groove; 43. a riser; 44. a guide rod; 45. a connecting rod; 46. a swinging rod; 47. a second motor; 48. a first motor; 49. a bidirectional screw; 5. a clamping mechanism; 51. an adjusting plate; 52. a grip roll; 53. an L-shaped plate; 54. and an included angle pad.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

As shown in fig. 1 to 6, the utility model provides an automatic centering semiconductor wafer clamping mechanism, which comprises a workbench 1, wherein the bottom surface of the workbench 1 is fixedly connected with a bottom frame 2, the middle part of the workbench 1 is provided with a pushing mechanism 3 for conveying a semiconductor wafer, the pushing mechanism 3 is mutually matched with the bottom frame 2, the workbench 1 is provided with an adjusting mechanism 4, the adjusting mechanism 4 is mutually matched with the bottom frame 2, the adjusting mechanism 4 comprises two sliding grooves 42 formed on the workbench 1 and fixing frames 41 respectively arranged in the two sliding grooves 42 in a sliding manner through a linkage mechanism, the fixing frames 41 can stably slide in the sliding grooves 42, and are controlled to be close to or far away from each other through the arrangement of the linkage mechanism, the two fixing frames 41 are respectively arranged at the left side and the right side of the pushing mechanism 3, each fixing frame 41 is provided with two clamping mechanisms 5 which are oppositely arranged through a driving mechanism, and the two clamping mechanisms 5 can relatively move under the arrangement of the driving mechanism, so that the distance between the two clamping mechanisms 5 is controlled, and the wafer clamping device can conveniently and effectively improve the wafer clamping performance of different sizes.

As shown in fig. 4, 5 and 6, the pushing mechanism 3 comprises a slot 33 formed on the workbench 1 and an electric push rod 39 arranged on the underframe 2, wherein the inner wall of the slot 33 is fixedly connected with a placing frame 34 and is hinged with a swinging frame 31, the swinging frame 31 can turn over on the inner wall of the slot 33, first guide rollers 32 which are equidistantly arranged are rotatably arranged on the swinging frame 31, the first guide rollers 32 are arranged so that wafers can be pushed on the first guide rollers 32, therefore, the wafers are not required to be placed in the middle of the workbench 1 by personnel, the personnel can push the edges of the wafers, the cleanliness of the wafers is ensured, the placement of the wafers is also convenient, the friction between the wafers and the upper surface of the workbench 1 is effectively avoided, the telescopic end of the electric push rod 39 is fixedly connected with a top plate 38, the top plate 38 is fixedly connected with a mounting frame 35, the top of the mounting frame 35 penetrates through the placing frame 34 and is arranged in the placing frame 34 in a sliding manner, the mounting frame 35 consists of a plurality of vertical plates and a bottom plate, the top of the mounting frame 35 is rotatably provided with second guide rollers 37 which are arranged at equal intervals, the second guide rollers 37 are flush with the first guide rollers 32, wafers can be pushed onto the first guide rollers 32 and then continuously pushed onto the second guide rollers 37 so as to be better clamped on the second guide rollers 37, the left side surface of the top plate 38 is hinged with a connecting plate 36, the top end of the connecting plate 36 is hinged to the bottom surface of the swinging frame 31, the wafers are better pushed to the middle part of the workbench 1 through the first guide rollers 32 and the second guide rollers 37 through the arrangement of the structure, the cleanliness of the wafers before clamping is effectively ensured, the fingerprints of personnel on the wafers are avoided, the friction between the wafers and the workbench 1 can also be effectively reduced, when the wafers need to be clamped on the workbench 1, the operation of the electric push rod 39 is controlled, the mounting frame 35 is lowered and the link plate 36 pulls the swing frame 31 to swing downward to ensure subsequent processing of the wafer on the table 1.

As shown in fig. 6, the hinge points of the swinging frame 31 are arranged between the middle parts of the front and rear side surfaces of the placement frame 34 and the inner wall of the slot 33, so that the swinging frame 31 can be ensured to normally turn over in the slot 33.

As shown in fig. 4 and 6, the placing frame 34 is fixedly connected with partition plates arranged at equal distance, and the second guide rollers 37 are located between every two adjacent partition plates, so that the wafers can be more stably placed on the placing frame 34 after the second guide rollers 37 descend through the arrangement of the partition plates.

As shown in fig. 1 and 5, the linkage mechanism includes a second motor 47 mounted on the bottom surface of the chassis 2 and risers 43 slidably disposed in the two sliding grooves 42, the top ends of the risers 43 are connected with the fixed frames 41, the output ends of the second motor 47 are fixedly connected with a swinging rod 46, two ends of the swinging rod 46 are rotatably provided with connecting rods 45, one ends of the two connecting rods 45 are rotatably connected with the bottom ends of the two risers 43 respectively, under the arrangement of the structure, the swinging rod 46 can be swung under the operation of the second motor 47, and the two connecting rods 45 are further driven to push or pull the two risers 43 to move respectively, so that the two risers 43 approach or separate the two fixed frames 41, and the clamping positions of different wafer sizes can be adjusted conveniently.

As shown in fig. 1, 3 and 4, the driving mechanism includes a first motor 48 mounted on the fixed frame 41 and a bi-directional screw 49 rotatably provided on the inner wall of the fixed frame 41, and the output end of the first motor 48 is connected with the bi-directional screw 49, and both the two clamping mechanisms 5 are provided on the bi-directional screw 49, and by the arrangement of the above structure, the positional adjustment of the two clamping mechanisms 5 can be provided.

As shown in fig. 4, the clamping mechanism 5 comprises an adjusting plate 51 screwed on a bidirectional screw 49, an L-shaped plate 53 is fixedly connected to the adjusting plate 51, two ends of the L-shaped plate 53 are rotatably provided with two clamping rollers 52, ninety degrees are formed between the two clamping rollers 52, an included angle pad 54 is fixedly connected to an inner included angle of the L-shaped plate 53, the included angle pad 54 can protect rectangular wafers at the included angle of the L-shaped plate 53, and the included angle pad 54 is a silica gel pad.

As shown in fig. 5, the left and right sides of the chassis 2 are both fixedly connected with guide rods 44, and the two guide rods 44 respectively penetrate through the middle parts of the two risers 43, so that the risers 43 can be further limited and guided under the arrangement of the guide rods 44, and the risers 43 are more stable during movement.

The working principle and the using flow of the utility model are as follows: firstly, a wafer is pushed to the middle part of the workbench 1 through the first guide roller 32 and the second guide roller 37, cleanliness of the wafer before clamping is effectively guaranteed, when the wafer is required to be clamped on the workbench 1, the operation of the electric push rod 39 is controlled, the mounting frame 35 is lowered, the connecting plate 36 pulls the swinging frame 31 to swing downwards, then the operation of the second motor 47 is controlled, the swinging rod 46 is further driven to push or pull the two vertical plates 43 to move respectively, the two vertical plates 43 are enabled to approach or separate from the two fixed frames 41 so as to facilitate adjustment of clamping positions of different wafer sizes, meanwhile, a person can operate the operation of the first motor 48, the two adjusting plates 51 can conduct adjustment of the distance on the fixed frames 41 so as to clamp the wafer, when the wafer is rectangular, the two clamping rollers 52 on each L-shaped plate 53 clamp the rectangular wafer, four corners of the wafer are respectively located at inner angles of four L53, and when the wafer is circular, the wafer is clamped by one L-shaped roller 52 on each L-shaped plate 53, so that the wafer is effectively clamped by the L-shaped plate 52.

It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims (8)

1. The utility model provides a semiconductor wafer fixture that can center automatically, includes workstation (1), its characterized in that: the bottom surface of workstation (1) has linked firmly chassis (2), the middle part of workstation (1) is provided with pushing mechanism (3) that are used for carrying semiconductor wafer, be provided with adjustment mechanism (4) on workstation (1), adjustment mechanism (4) are including seting up two sliding tray (42) on workstation (1) and sliding fixed frame (41) that set up in two sliding tray (42) respectively through the link gear, and two fixed frames (41) set up respectively in pushing mechanism's (3) left and right sides, every fixture (5) that set up relatively are all installed through actuating mechanism on fixed frame (41).

2. An automatically centering semiconductor wafer clamping mechanism as claimed in claim 1, wherein: push mechanism (3) are including seting up fluting (33) on workstation (1) and installing electric putter (39) on chassis (2), the inner wall of fluting (33) has linked firmly and has put frame (34) and articulated have swing frame (31), rotate on swing frame (31) and be provided with first deflector roll (32) that the equidistance was arranged, the flexible end of electric putter (39) has linked firmly roof (38), link firmly installing frame (35) on roof (38), the top of installing frame (35) runs through put frame (34) and slides and set up in putting frame (34), the top of installing frame (35) rotates and is provided with second deflector roll (37) that the equidistance was arranged, and second deflector roll (37) are parallel and level with first deflector roll (32), the left surface of roof (38) articulates there is link plate (36), and link plate (36) top articulates the bottom surface at swing frame (31).

3. An automatically centering semiconductor wafer clamping mechanism as claimed in claim 2, wherein: the hinge point of the swinging frame (31) is arranged between the middle parts of the front side surface and the rear side surface of the placing frame (34) and the inner wall of the slot (33).

4. An automatically centering semiconductor wafer clamping mechanism as claimed in claim 2, wherein: the placing frame (34) is fixedly connected with partition plates which are arranged at equal intervals, and the second guide roller (37) is positioned between every two adjacent partition plates.

5. An automatically centering semiconductor wafer clamping mechanism as claimed in claim 1, wherein: the linkage mechanism comprises a second motor (47) arranged on the bottom surface of the underframe (2) and vertical plates (43) respectively arranged in the two sliding grooves (42) in a sliding mode, the top ends of the vertical plates (43) are connected with the fixed frame (41), swinging rods (46) are fixedly connected with the output ends of the second motor (47), connecting rods (45) are respectively arranged at the two ends of the swinging rods (46) in a rotating mode, and one ends of the two connecting rods (45) are respectively connected with the bottom ends of the two vertical plates (43) in a rotating mode.

6. An automatically centering semiconductor wafer clamping mechanism as claimed in claim 1, wherein: the driving mechanism comprises a first motor (48) arranged on the fixed frame (41) and a bidirectional screw rod (49) rotatably arranged on the inner wall of the fixed frame (41), the output end of the first motor (48) is connected with the bidirectional screw rod (49), and the two clamping mechanisms (5) are arranged on the bidirectional screw rod (49).

7. An automatically centering semiconductor wafer clamping mechanism as claimed in claim 6, wherein: the clamping mechanism (5) comprises an adjusting plate (51) which is sleeved on a bidirectional screw rod (49) through threads, an L-shaped plate (53) is fixedly connected to the adjusting plate (51), two clamping rollers (52) are rotatably arranged at two ends of the L-shaped plate (53), ninety degrees are arranged between the two clamping rollers (52), and an included angle pad (54) is fixedly connected to an inner included angle of the L-shaped plate (53).

8. An automatically centering semiconductor wafer clamping mechanism as claimed in claim 5, wherein: guide rods (44) are fixedly connected to the left side surface and the right side surface of the underframe (2), and the two guide rods (44) penetrate through the middle parts of the two vertical plates (43) respectively.