CN220121786U - Integrated circuit packaging gumming device - Google Patents

Abstract

An integrated circuit packaging photoresist removing device belongs to the technical field of integrated circuit packaging. The utility model comprises an installing table, an upper die, a lower die and a pressing plate, wherein the lower die comprises two lower die units which are identical in structure and symmetrically arranged, first blanking holes and lower supporting convex strips are alternately arranged on the lower die units at intervals, cutters are arranged at the edges of two sides of each first blanking hole, a blowing pipe along the length direction of the lower die units is arranged on the outer side of each lower die unit, a first air channel is arranged in each blowing pipe, a first air outlet hole communicated with the first air channel is arranged on one side of each blowing pipe, which faces the lower die units, of each blowing pipe, and a hose is communicated with each first air channel and is connected with an air pump through the hose. The utility model can effectively remove the residual packaging adhesive on the packaging chip board by combining the pressing of the pressing bar and the cutting of the cutter. According to the utility model, the first air duct, the first air outlet hole, the air pump and the hose are matched, so that packaging glue scraps generated in the cutting and photoresist removing process can be effectively removed, and the subsequent packaging chip board can be conveniently placed flatly.

Description

Integrated circuit packaging gumming device

Technical Field

The utility model belongs to the technical field of integrated circuit packaging, and particularly relates to an integrated circuit packaging photoresist removing device.

Background

In the production process of the integrated circuit chip, a plastic packaging mode is adopted to package the chip; after plastic packaging, the packaging adhesive remains on the through groove between two adjacent packaging chips due to the packaging mold and the process reasons, and the packaging adhesive is connected with the packaging chips, as shown in fig. 1. Before the packaged chip is transferred to the next production process, the residual packaging adhesive is removed.

The existing packaging gumming device generally adopts a cutter cutting mode to remove packaging gum, but in the cutting gumming process, packaging gum scraps are generated, if the packaging gum scraps are not removed in time, the packaging gum scraps can abut against packaging chips after accumulation, a packaging chip board is tilted, the flat placing of the packaging chip board is affected, and therefore the cutting position and effect of the cutter are affected.

There is therefore a need to propose a new solution to this problem.

Disclosure of Invention

The utility model mainly solves the technical problems existing in the prior art and provides an integrated circuit packaging photoresist removing device.

The technical problems of the utility model are mainly solved by the following technical proposal: the integrated circuit packaging and glue removing device comprises a mounting table, an upper die, a lower die and a pressing plate, wherein the lower die is arranged on the upper surface of the mounting table and comprises two lower die units which are identical in structure and are symmetrically arranged, first blanking holes and lower supporting convex strips are alternately arranged on the lower die units at intervals, the first blanking holes and the lower supporting convex strips are corresponding to a spacing area between two adjacent packaging chips on a packaging chip board and are arranged along the width direction of the lower die units, cutters are arranged at the edges of two sides of the first blanking holes, accommodating grooves are formed in the edges of the lower die units, accommodating brackets for accommodating packaging chip boards are arranged above the lower die units and can move into the accommodating grooves, a first air duct is arranged in the air duct along the length direction of the lower die units, a first air outlet hole which is communicated with the first air duct is arranged on one side of the lower die units, the first air outlet hole corresponds to the first blanking holes and the lower supporting convex strips, a plurality of air pumps are arranged on the lower die units and are correspondingly connected with the first air pumps through the lower hose units, and the corresponding hose units are arranged between the lower die units; the upper die is positioned above the lower die, layering holes and upper supporting raised strips are alternately arranged on the upper die at intervals, the layering holes correspond to the first blanking holes, and the upper supporting raised strips correspond to the lower supporting raised strips; the pressing plate is positioned above the upper die, a pressing bar corresponding to the pressing bar hole is arranged on the lower surface of the pressing plate, and the end part of the pressing bar can pass through the pressing bar hole and move to the lower part of the upper die.

Preferably, the tank bottom of holding tank has seted up the support mounting groove, first telescopic link is installed to the tank bottom of support mounting groove, the tip of first telescopic link links to each other with the bottom that holds the support, the cover is equipped with first spring on the first telescopic link.

Preferably, the outer side surface of the accommodating support is provided with a flanging, the top end of the accommodating support is provided with a limiting column, and the height of the limiting column is lower than that of the flanging.

Preferably, a second air duct is arranged in the upper die corresponding to the second blanking hole, a second air outlet hole communicated with the second air duct is arranged on the upper die, and the second air duct is communicated with a hose and is connected with an air pump through the hose.

Preferably, the fixed columns are arranged on two sides of the upper surface of the mounting table, the fixed plates are connected through the fixed columns, the first air cylinders are arranged on the lower surface of the fixed plates, the output ends of the first air cylinders are connected with mounting plates, the mounting plates are fixedly connected with the upper die, the second air cylinders are arranged on the mounting plates, and the output ends of the second air cylinders are connected with the upper surface of the pressing plate.

Preferably, guide rods are mounted on two sides of the upper surface of the mounting table, the end portions of the guide rods penetrate through the mounting plate and extend to the upper portion of the mounting plate, and second springs are sleeved on the guide rods.

Preferably, a second telescopic rod is arranged on the upper surface of the upper die, the end part of the second telescopic rod is connected with the lower surface of the pressing plate, and a third spring is sleeved on the second telescopic rod.

Preferably, a recovery box is mounted on the lower surface of the mounting table, and the recovery box corresponds to the lower die.

The utility model has the beneficial effects that: the utility model can effectively remove the residual packaging adhesive on the packaging chip board by combining the pressing of the pressing bar and the cutting of the cutter. According to the utility model, the first air duct, the first air outlet hole, the air pump and the hose are matched, so that packaging glue fragments generated in the cutting and photoresist removing process can be effectively removed, the subsequent packaging chip board can be horizontally placed, and meanwhile, the first blanking hole and the lower supporting raised strips are arranged along the width direction of the lower die unit, so that the blown air cannot be interfered in the chip removing process, and the blowing effect is affected.

Drawings

FIG. 1 is a schematic diagram of a structure of a packaged chip-on-chip package;

FIG. 2 is a schematic view of a construction of the present utility model;

fig. 3 is an enlarged view of a portion a in fig. 2;

FIG. 4 is a schematic view of a lower die of the present utility model;

FIG. 5 is a schematic view of a structure of the accommodating bracket of the present utility model;

FIG. 6 is a schematic top view of the packaged chip board of the present utility model placed on a lower die;

FIG. 7 is a schematic view of an upper die of the present utility model;

fig. 8 is a schematic diagram of a structure of a packaged chip board after the package photoresist is removed.

In the figure: 1. a mounting table; 2. an upper die; 3. a lower die unit; 4. a pressing plate; 5. a first blanking hole; 6. a lower support convex strip; 7. a cutter; 8. a receiving groove; 9. a housing bracket; 10. a blowing pipe; 11. a first air duct; 12. a first air outlet hole; 13. a hose; 14. an air pump; 15. a second blanking hole; 16. a layering hole; 17. an upper support convex strip; 18. pressing strips; 19. a bracket mounting groove; 20. a first telescopic rod; 21. a first spring; 22. flanging; 23. a limit column; 24. a second air duct; 25. a second air outlet hole; 26. fixing the column; 27. a fixing plate; 28. a first cylinder; 29. a mounting plate; 30. a second cylinder; 31. a guide rod; 32. a second spring; 33. a second telescopic rod; 34. a third spring; 35. a recovery box; 36. packaging a chip board; 37. packaging the chip; 38. a spacer; 39. a through groove; 40. packaging glue; 41. and a limiting hole.

Detailed Description

The technical scheme of the utility model is further specifically described below through examples and with reference to the accompanying drawings.

Examples: 1-8, an integrated circuit packaging photoresist removing device comprises a mounting table 1, an upper die 2, a lower die and a pressing plate 4, wherein the lower die is fixedly arranged on the upper surface of the mounting table 1, the lower die comprises two lower die units 3 which are identical in structure and symmetrically arranged, the lower die units 3 are of cuboid structures, first blanking holes 5 and lower supporting raised strips 6 are alternately arranged on the lower die units 3 at intervals, the first blanking holes 5 and the lower supporting raised strips 6 are corresponding to a spacing area 38 between two adjacent packaging chips 37 on a packaging chip board 36 and are arranged along the width direction of the lower die units 3, the first blanking holes 5 are arranged through the lower die units 3, cutters 7 are arranged at the edges of two sides of the first blanking holes 5, accommodating grooves 8 are arranged along the edges of the lower die units 3, the accommodating grooves 8 are of a reverse-U-shaped structure, accommodating brackets 9 for accommodating the packaging chip board 36 are arranged above the lower die units 3, and the accommodating brackets 9 are matched with the accommodating grooves 8 and can move into the accommodating grooves 8 in a reverse-U-shaped structure; the mounting table 1 is provided with a plurality of second blanking holes 15, the second blanking holes 15 are positioned between the two lower die units 3 and correspond to the first blanking holes 5 and the lower supporting convex strips 6, and the second blanking holes 15 penetrate through the mounting table 1; the upper die 2 is positioned above the lower die, the lower surface of the upper die 2 is alternately provided with pressing strip holes 16 and upper supporting raised strips 17 at intervals, the pressing strip holes 16 correspond to the first blanking holes 5, and the upper supporting raised strips 17 correspond to the lower supporting raised strips 6; the pressing plate 4 is located above the upper die 2, a pressing bar 18 corresponding to the pressing bar hole 16 is arranged on the lower surface of the pressing plate 4, and the end portion of the pressing bar 18 can pass through the pressing bar hole 16 and move below the upper die 2.

As shown in fig. 1, which is a schematic structural diagram of a packaged chip board 36 after chip packaging, a plurality of packaged chips 37 are distributed on the back surface of the packaged chip board 36 in a matrix, a spacing area 38 of the packaged chips 37 is arranged between two adjacent packaged chips 37 along the width direction of the packaged chip board 36, and a through slot 39 along the width direction of the packaged chip board 36 is formed in the spacing area 38; after the chips of the package chip board 36 are packaged, the package adhesive 40 remains on the through groove 39 (i.e., the back surface of the package chip board 36), the remaining package adhesive 40 is connected to the adjacent two package chips 37, and the two package chip boards 36 are connected by the remaining package adhesive 40.

When the packaging gumming device is used, a packaging chip plate 36 is placed on a containing bracket 9, the containing bracket 9 is driven to move downwards by the lower die applied by the lower die 2, the containing bracket 9 is placed in a containing groove 8, and the cutter 7 is abutted against the residual packaging adhesive 40 and cuts the packaging adhesive 40 by the lower die applied by the upper die 2; pressing down the pressing plate 4, enabling the end part of the pressing bar 18 on the lower surface of the pressing plate 4 to pass through the pressing bar hole 16 and the through groove 39 of the packaging chip board 36 and then to be abutted against the packaging adhesive 40, then continuing to press down the pressing plate 4, and enabling the cutter 7 to cut off the packaging adhesive 40 through the pressing bar 18; then the pressing plate 4 and the upper die 2 move upwards to reset, the accommodating bracket 9 moves upwards and is separated from the accommodating groove 8 to reset, and in the process of separating from the accommodating groove 8, the packaging adhesive 40 and the packaging chip board 36 are separated and fall into the recovery box 35 below the mounting table 1 through the first blanking hole 5 and the second blanking hole 15.

When the accommodating bracket 9 is located in the accommodating groove 8 (i.e. the upper die 2 and the lower die are pressed against each other), the first blanking hole 5 and the lower supporting convex strip 6 are both located in the interval area 38 between the two adjacent package chips 37, and the upper end face of the cutter 7 at the edge of the first blanking hole 5 is flush with the upper end face of the lower supporting convex strip 6 and is higher than the upper surface of the lower die unit 3. The cutter 7 is used for cutting the residual packaging adhesive 40, and the lower supporting raised strips 6 are used for supporting the packaging chip board 36.

The tank bottom of holding tank 8 has seted up support mounting groove 19, support mounting groove 19 is provided with four, and two liang symmetries set up the left and right sides at every lower mould unit 3, first telescopic link 20 is installed to the tank bottom of support mounting groove 19, the tip of first telescopic link 20 links to each other with the bottom that holds support 9, the cover is equipped with first spring 21 on the first telescopic link 20, the one end and the tank bottom butt of support mounting groove 19 of first spring 21, the other end and the bottom butt that holds support 9. By matching the first telescopic rod 20 and the first spring 21, the accommodating bracket 9 is moved upwards and separated from the accommodating groove 8 to reset in the process of moving up the upper die 2, so that the accommodating bracket 9 is convenient for loading the packaged chip board 36 next time.

The outer side surface of the accommodating support 9 is provided with a flanging 22, the top end of the accommodating support 9 is provided with a limiting column 23, and the height of the limiting column 23 is lower than that of the flanging 22. By arranging the flange 22, the packaged chip board 36 can be limited, and the packaged chip board 36 is prevented from being separated from the accommodating bracket 9 in the process of moving up and down the accommodating bracket 9; by arranging the limiting column 23, the packaging chip plate 36 can be further limited, and the packaging chip plate 36 is prevented from being separated from the accommodating bracket 9 under the action of the elastic force of the first spring 21 when the accommodating bracket 9 just starts to move upwards to reset under the action of the elastic force of the first spring 21. Preferably, limit holes 41 adapted to the limit posts 23 are provided on both sides of the package chip board 36.

The outside of lower mould unit 3 is equipped with the blowing pipe 10 that sets up along lower mould unit 3 length direction, be equipped with first wind channel 11 in the blowing pipe 10, blowing pipe 10 is equipped with first air outlet 12 towards one side of lower mould unit 3, first air outlet 12 is corresponding with first unloading hole 5, lower support sand grip 6, first wind channel 11 intercommunication has hose 13 to connect air pump 14 through hose 13. When the encapsulation cement 40 is cut off, the air pump 14 pumps air to the first air duct 11 through the hose 13, the air is blown to the upper surface of the lower die unit 3 through the first air outlet hole 12, and the fragments of the encapsulation cement 40 remained in the lower die unit 3 are blown into the first blanking hole 5 and the second blanking hole 15 through the blowing, so that the accumulation of the fragments of the encapsulation cement 40 is prevented.

Preferably, a second air duct 24 is disposed in the upper die 2, the second air duct 24 corresponds to the second blanking hole 15, a second air outlet hole 25 communicated with the second air duct 24 is disposed on the upper die 2, and the second air duct 24 is communicated with the hose 13 and is connected with the air pump 14 through the hose 13. When the packaging adhesive 40 is cut off, the upper die 2 moves upwards, the air pump 14 pumps air to the second air duct 24 through the hose 13, the air is blown to the packaging adhesive 40 through the second air outlet hole 25, and the packaging adhesive 40 is enabled to fall into the first blanking hole 5 and the second blanking hole 15 rapidly through the blowing action on the packaging adhesive 40. Further, the air pumping of the first air duct 11 and the second air duct 24 can be independently controlled by arranging an electromagnetic valve to be matched with the four-way valve.

The fixed column 26 is installed to both sides of mount table 1 upper surface to be connected with fixed plate 27 through fixed column 26, the lower surface mounting of fixed plate 27 has first cylinder 28, the output of first cylinder 28 is connected with mounting panel 29, mounting panel 29 and last mould 2 fixed connection, install second cylinder 30 on the mounting panel 29, the output of second cylinder 30 is connected with the upper surface of clamp plate 4. Wherein, the first cylinder 28 drives the upper die 2 to move up and down through the mounting plate 29 so as to realize the pressing and separation of the lower die by the upper die 2; the second air cylinder 30 drives the pressing bar 18 to press the packaging adhesive 40 downwards through the pressing plate 4, so that the cutter 7 cuts off the packaging adhesive 40.

Preferably, guide rods 31 are mounted on both sides of the upper surface of the mounting table 1, the end portions of the guide rods 31 penetrate through the mounting plate 29 and extend above the mounting plate 29, a second spring 32 is sleeved on the guide rods 31, one end of the second spring 32 abuts against the upper surface of the mounting table 1, and the other end abuts against the lower surface of the mounting plate 29. Wherein the guide bar 31 plays a guiding role; the second spring 32 plays a role in slowing down, so that the upper die 2 slowly presses the lower die, and the upper die 2 and the lower die are protected.

The upper surface of the upper die 2 is provided with a second telescopic rod 33, the end part of the second telescopic rod 33 is connected with the lower surface of the pressing plate 4, a third spring 34 is sleeved on the second telescopic rod 33, one end of the third spring 34 is abutted to the upper surface of the upper die 2, and the other end is abutted to the lower surface of the pressing plate 4. Wherein the second telescopic rod 33 plays a guiding role; the third spring 34 plays a role in slowing down, the pressing bar 18 is pressed down slowly to the package foot through the pressing plate 4, and the cutter 7 is protected.

The lower surface of the mounting table 1 is provided with a recovery box 35, and the recovery box 35 corresponds to the lower die. The cut encapsulation adhesive 40 is stored by providing the recovery box 35, and then recovered and reused in a unified manner.

Finally, it should be noted that the above embodiments are merely representative examples of the present utility model. Obviously, the utility model is not limited to the above-described embodiments, but many variations are possible. Any simple modification, equivalent variation and modification of the above embodiments according to the technical substance of the present utility model should be considered to be within the scope of the present utility model.

Claims (8)

1. The utility model provides an integrated circuit encapsulation gumming device, includes mount table (1), goes up mould (2), lower mould and clamp plate (4), its characterized in that, the lower mould is installed at the upper surface of mount table (1), the lower mould includes two lower mould units (3) that the structure is the same and the symmetry sets up, the interval is equipped with first unloading hole (5) and lower support sand grip (6) on lower mould unit (3) in turn, interval district (38) between two adjacent encapsulation chips (37) on first unloading hole (5) and lower support sand grip (6) all correspond with encapsulation chip board (36), and all set up along lower mould unit (3) width direction, the edge of first unloading hole (5) both sides is equipped with cutter (7), lower mould unit (3) are equipped with holding tank (8) along its edge, the top of lower mould unit (3) is equipped with holding bracket (9) that are used for placing encapsulation chip board (36), holding bracket (9) can move to holding tank (8), the interval district (38) between lower mould unit (3) and two encapsulation chips (37) are all corresponding, and all set up along lower mould unit (3) width direction, the edge of a blowing pipe (10) is equipped with a blowing pipe (10) in the blowing pipe (10) down, blowing pipe (10) side is equipped with a blowing pipe (10), the first air outlet hole (12) corresponds to the first blanking hole (5) and the lower supporting raised strips (6), the first air duct (11) is communicated with a hose (13) and is connected with an air pump (14) through the hose (13), the mounting table (1) is provided with a plurality of second blanking holes (15), and the second blanking holes (15) are positioned between the two lower die units (3) and correspond to the first blanking holes (5) and the lower supporting raised strips (6); the upper die (2) is positioned above the lower die, layering holes (16) and upper supporting raised strips (17) are alternately arranged on the upper die (2) at intervals, the layering holes (16) correspond to the first blanking holes (5), and the upper supporting raised strips (17) correspond to the lower supporting raised strips (6); the pressing plate (4) is positioned above the upper die (2), a pressing bar (18) corresponding to the pressing bar hole (16) is arranged on the lower surface of the pressing plate (4), and the end part of the pressing bar (18) can pass through the pressing bar hole (16) and move to the lower part of the upper die (2).

2. The integrated circuit packaging photoresist removing device according to claim 1, wherein a bracket mounting groove (19) is formed in the groove bottom of the accommodating groove (8), a first telescopic rod (20) is mounted at the groove bottom of the bracket mounting groove (19), the end part of the first telescopic rod (20) is connected with the bottom end of the accommodating bracket (9), and a first spring (21) is sleeved on the first telescopic rod (20).

3. The integrated circuit packaging photoresist removing device according to claim 1, wherein a flanging (22) is arranged on the outer side surface of the accommodating bracket (9), a limit column (23) is arranged at the top end of the accommodating bracket (9), and the height of the limit column (23) is lower than that of the flanging (22).

4. An integrated circuit packaging photoresist stripper according to claim 1, wherein a second air duct (24) is arranged in the upper die (2) corresponding to the second blanking hole (15), a second air outlet hole (25) communicated with the second air duct (24) is arranged on the upper die (2), and the second air duct (24) is communicated with a hose (13) and is connected with an air pump (14) through the hose (13).

5. The integrated circuit packaging photoresist removing device according to claim 1, wherein fixing columns (26) are installed on two sides of the upper surface of the mounting table (1), a fixing plate (27) is connected with the fixing columns (26), a first air cylinder (28) is installed on the lower surface of the fixing plate (27), an output end of the first air cylinder (28) is connected with a mounting plate (29), the mounting plate (29) is fixedly connected with the upper die (2), a second air cylinder (30) is installed on the mounting plate (29), and an output end of the second air cylinder (30) is connected with the upper surface of the pressing plate (4).

6. The integrated circuit packaging photoresist removing device according to claim 5, wherein guide rods (31) are installed on two sides of the upper surface of the mounting table (1), the end parts of the guide rods (31) penetrate through the mounting plate (29) and extend to the upper side of the mounting plate (29), and the guide rods (31) are sleeved with second springs (32).

7. An integrated circuit packaging photoresist stripper according to claim 1, wherein a second telescopic rod (33) is mounted on the upper surface of the upper die (2), the end of the second telescopic rod (33) is connected with the lower surface of the pressing plate (4), and a third spring (34) is sleeved on the second telescopic rod (33).

8. An integrated circuit package photoresist stripper according to claim 1, wherein a recovery box (35) is mounted on the lower surface of the mounting table (1), and the recovery box (35) corresponds to the lower die.