CN220108331U - Circuit board manufacturing die - Google Patents
Circuit board manufacturing die Download PDFInfo
- Publication number
- CN220108331U CN220108331U CN202321219060.3U CN202321219060U CN220108331U CN 220108331 U CN220108331 U CN 220108331U CN 202321219060 U CN202321219060 U CN 202321219060U CN 220108331 U CN220108331 U CN 220108331U
- Authority
- CN
- China
- Prior art keywords
- circuit board
- board manufacturing
- die
- compression
- wall
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 18
- 230000006835 compression Effects 0.000 claims abstract description 27
- 238000007906 compression Methods 0.000 claims abstract description 27
- 229920002379 silicone rubber Polymers 0.000 claims description 3
- 239000004945 silicone rubber Substances 0.000 claims description 3
- 229910001220 stainless steel Inorganic materials 0.000 claims description 3
- 239000010935 stainless steel Substances 0.000 claims description 3
- 229920001971 elastomer Polymers 0.000 claims description 2
- 230000000149 penetrating effect Effects 0.000 claims description 2
- 230000000712 assembly Effects 0.000 claims 1
- 238000000429 assembly Methods 0.000 claims 1
- 241001391944 Commicarpus scandens Species 0.000 abstract description 4
- 238000012856 packing Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 230000001105 regulatory effect Effects 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000011218 segmentation Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
The utility model discloses a circuit board manufacturing die, which relates to the technical field of circuit board manufacturing dies and comprises a shell, wherein a disassembly and assembly component is arranged on the upper surface of the shell, a hinge is movably connected to the outer side wall of the shell, the disassembly and assembly component is arranged through the mutual matching of a roller, a clamping groove, a limiting block, a pin seat, a die plate, an air cushion and a gasket, the limiting block is screwed when the die plate is replaced, the angle of the roller is adjusted, the disassembly and assembly component is taken down, the die plate is replaced, the pin seat is utilized for supporting the roller, balance can be kept when the die plate is pressed, the compression-resistant component is arranged around the outer wall of the die plate through the mounting seat, the compression-resistant component can be relieved from being stressed when the die plate is pressed by the matching of the air cushion and the gasket, the problems that the die cannot be replaced according to the specification and the size of a user, the disassembly and assembly are required, time and labor are wasted, the die is easy to break when the compression resistance is high, and the use cost is low are solved.
Description
Technical Field
The utility model relates to the technical field of circuit board manufacturing molds, in particular to a circuit board manufacturing mold.
Background
The circuit board die has high precision; the productivity is effectively improved, and benefits are created for customers; the mould of the sub-blue PCB circuit board greatly reduces artificial bad factors when manually cutting the board; providing a precise separating plate for the PCB, the FPC substrate and the assembled PCB and FPC; the device is used for separating PCB and FPC circuit boards; the sub-blue mould, the whole mould structure is kept for 30 ten thousand times, and is applied to the segmentation of electronic industry such as mobile phone boards, memory cards, mobile phone flexible lines and the like.
The existing circuit board manufacturing die cannot be replaced according to the specification and the size of the die required by a user, the die is required to be disassembled again, time and labor are wasted, the die is easy to break when the pressure is high, the compression resistance is poor, the use cost is high, and therefore the optimal use effect cannot be achieved.
Disclosure of Invention
The utility model provides a circuit board manufacturing die, which solves the technical problems that the specification and the size of the die cannot be changed according to the requirement of a user, the die is required to be disassembled again, time and labor are wasted, the die is easy to break when the pressure is high, the compression resistance is poor, the use cost is high, and the optimal use effect cannot be achieved.
In order to solve the technical problems, the circuit board manufacturing die provided by the utility model comprises a shell, wherein the upper surface of the shell is provided with a disassembly and assembly component, the outer side wall of the shell is movably connected with a hinge, the outer side wall of the hinge is movably connected with a cover plate, and the upper surface of the cover plate is provided with a pressing block.
Preferably, the running roller is installed to dismouting subassembly outer wall both sides, and the draw-in groove has been seted up to the running roller lateral wall, stopper is installed to running roller one end outer wall, and running roller both ends swing joint has the cotter seat, dismouting subassembly upper surface mounting has the mould board, and installs compression resistance assembly all around the mould board outer wall.
Preferably, the inner wall of the clamping groove is attached with a rubber pad, and the clamping groove is clamped with two sides of the outer wall of the dismounting assembly.
Preferably, the limiting block penetrates through the roller and is connected with the clamping groove in a penetrating mode.
Preferably, the compression-resistant assembly comprises an air cushion, the air cushion is arranged at the top end of the compression-resistant assembly, the gasket is arranged at the bottom end of the compression-resistant assembly, and the mounting seat is arranged at the bottom end of the gasket.
Preferably, the gasket is attached around the bottom end of the compression assembly, and the gasket is a silicone rubber member.
Preferably, the cover plate is movably connected with the shell through a hinge, and the cover plate is a stainless steel member.
Compared with the related art, the circuit board manufacturing die provided by the utility model has the following beneficial effects:
according to the circuit board manufacturing die, the roller wheels, the clamping grooves, the limiting blocks, the pin seats, the die plates, the air cushion, the gaskets and the mounting seats are matched with each other, the clamping grooves are used for arranging the dismounting components, the limiting blocks are screwed when the die plates are replaced, the angles of the roller wheels are adjusted, the dismounting components are taken down, the die plates are replaced, the pin seats are used for supporting the roller wheels, balance can be kept when the die plates are pressed, the compression components are arranged around the outer walls of the die plates through the mounting seats, the air cushion and the gaskets are matched when the die plates are pressed, the weight bearing force of the compression components can be relieved, breakage is prevented, the problems that the die cannot be replaced according to the specification and the size of a user, the die needs to be dismounted again, time and labor are wasted, the die is easy to break when the compression force is large, the compression resistance is poor, and the use cost is high are solved.
Drawings
FIG. 1 is a schematic perspective view of the present utility model;
FIG. 2 is a schematic view of the assembly and disassembly of the present utility model;
FIG. 3 is an enlarged view of the pin bosses of the present utility model;
fig. 4 is a schematic structural view of the compression assembly of the present utility model.
In the figure: 1. a housing; 2. disassembling and assembling the assembly; 21. a roller; 22. a clamping groove; 23. a limiting block; 24. a pin base; 25. a mold plate; 26. a compression resistant assembly; 261. an air cushion; 262. a gasket; 263. a mounting base; 3. a loose leaf; 4. a cover plate; 5. and (5) briquetting.
Detailed Description
The first embodiment is shown in fig. 1-4, the utility model comprises a shell 1, a disassembly and assembly component 2 is arranged on the upper surface of the shell 1, a hinge 3 is movably connected with the outer side wall of the shell 1, the hinge 3 is used for facilitating the opening and closing of a cover plate 4, the outer side wall of the hinge 3 is movably connected with the cover plate 4, a pressing block 5 can be overturned on the upper surface of the disassembly and assembly component 2 by using the cover plate 4, the pressing block 5 is arranged on the upper surface of the cover plate 4, the cover plate 4 is movably connected with the shell 1 by using the hinge 3, the cover plate 4 is a stainless steel member, and the hinge is corrosion-resistant and prolongs the service life.
The roller 21 is installed to dismouting subassembly 2 outer wall both sides, and draw-in groove 22 has been seted up to roller 21 lateral wall, stopper 23 is installed to roller 21 one end outer wall, and roller 21 both ends swing joint has the boss 24, surface mounting has mould board 25 on the dismouting subassembly 2, and install compression resistance module 26 around the mould board 25 outer wall, settle dismouting subassembly 2 through draw-in groove 22, twist stopper 23 when changing mould board 25, the angle of regulating roller 21 takes off dismouting subassembly 2, change mould board 25, utilize boss 24 to support roller 21, can keep balanced when pressing, the laminating of draw-in groove 22 inner wall has the cushion, and draw-in groove 22 and dismouting subassembly 2 outer wall both sides looks block, can increase its frictional property, reach best result of use, roller 21 and draw-in groove 22 through connection are worn to establish to stopper 23.
The compression resistance assembly 26 includes air cushion 261, air cushion 261 is installed on compression resistance assembly 26 top, and the packing ring 262 is installed to compression resistance assembly 26 bottom, mount pad 263 is installed to the packing ring 262 bottom, installs compression resistance assembly 26 around the mould board 25 outer wall through mount pad 263, utilizes the cooperation of air cushion 261 and packing ring 262 to alleviate its atress when mould board 25 is pressed, prevents to fracture, and packing ring 262 encircles laminating around compression resistance assembly 26 bottom, and packing ring 262 specifically adopts the silicone rubber component, and the wearability is strong, durable.
Working principle: during the use, settle dismouting subassembly 2 through draw-in groove 22, twist stopper 23 when changing mould board 25, the angle of regulating roller 21, take off dismouting subassembly 2, change mould board 25, utilize the cotter seat 24 to support roller 21, can keep balanced when the pressurized, install compressive component 26 around the outer wall of mould board 25 through mount pad 263, can alleviate its atress when mould board 25 is pressurized with the cooperation of packing ring 262, prevent the fracture, utilize loose-leaf 3 to be convenient for apron 4 to open and shut, utilize apron 4 can overturn briquetting 5 in dismouting subassembly 2 upper surface.
It should be noted that the roller 21, the pin seat 24, the mold plate 25, the air cushion 261, the gasket 262, the hinge 3 and the pressing block 5 are devices or apparatuses existing in the prior art, or are devices or apparatuses that can be implemented in the prior art, and the composition and the principle thereof are clear to those skilled in the art, so that detailed descriptions thereof are omitted.
Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.
Claims (7)
1. Circuit board manufacturing mould, including casing (1), its characterized in that: the novel portable electronic device is characterized in that the dismounting assembly (2) is mounted on the upper surface of the shell (1), the hinge (3) is movably connected to the outer side wall of the shell (1), the cover plate (4) is movably connected to the outer side wall of the hinge (3), and the pressing block (5) is mounted on the upper surface of the cover plate (4).
2. The circuit board manufacturing die according to claim 1, wherein rollers (21) are installed on two sides of the outer wall of the dismounting assembly (2), clamping grooves (22) are formed in the outer side walls of the rollers (21), limiting blocks (23) are installed on the outer wall of one end of each roller (21), pin seats (24) are movably connected to two ends of each roller (21), a die plate (25) is installed on the upper surface of the dismounting assembly (2), and compression-resistant assemblies (26) are installed on the periphery of the outer wall of the die plate (25).
3. The circuit board manufacturing mold according to claim 2, wherein the inner wall of the clamping groove (22) is attached with a rubber pad, and the clamping groove (22) is clamped with two sides of the outer wall of the dismounting assembly (2).
4. The circuit board manufacturing die according to claim 2, wherein the limiting block (23) penetrates through the roller (21) and is connected with the clamping groove (22) in a penetrating manner.
5. The circuit board manufacturing mold according to claim 2, wherein the compression-resistant component (26) comprises an air cushion (261), the air cushion (261) is mounted at the top end of the compression-resistant component (26), a gasket (262) is mounted at the bottom end of the compression-resistant component (26), and a mounting seat (263) is mounted at the bottom end of the gasket (262).
6. The circuit board manufacturing mold according to claim 5, wherein the gasket (262) is circumferentially attached to the periphery of the bottom end of the compression assembly (26), and the gasket (262) is specifically a silicone rubber member.
7. The circuit board manufacturing die according to claim 1, wherein the cover plate (4) is movably connected with the housing (1) through a hinge (3), and the cover plate (4) is specifically made of a stainless steel member.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321219060.3U CN220108331U (en) | 2023-05-19 | 2023-05-19 | Circuit board manufacturing die |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321219060.3U CN220108331U (en) | 2023-05-19 | 2023-05-19 | Circuit board manufacturing die |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220108331U true CN220108331U (en) | 2023-11-28 |
Family
ID=88872875
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321219060.3U Active CN220108331U (en) | 2023-05-19 | 2023-05-19 | Circuit board manufacturing die |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220108331U (en) |
-
2023
- 2023-05-19 CN CN202321219060.3U patent/CN220108331U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |