CN220106531U - LED lamp bead - Google Patents

Abstract

The utility model relates to an LED lamp bead, which comprises: the first plate surface of the substrate is provided with at least four RGB chip sets, wherein three chips in each RGB chip set are arranged into a triangular structure, and at least one chip in each RGB chip set and chips with different luminous colors in adjacent at least one RGB chip set are arranged into a triangular structure, so that at least 12 virtual pixels are formed by multiplexing the at least four RGB chip sets; the second plate surface of the substrate is provided with two common electrode pins and at least 6 non-common electrode pins, and the two common electrode pins and the at least 6 non-common electrode pins are distributed on two opposite sides of the substrate; the first poles of the chips in the at least four RGB chipsets are correspondingly electrically connected to the common pole pin, and the second poles of the chips in the at least four RGB chipsets are correspondingly electrically connected to the at least 6 non-common pole pins, wherein the polarities of the first poles and the second poles are opposite. The utility model can realize virtual pixel multiplexing and greatly reduce the number of pins.

Description

LED lamp bead

Technical Field

The utility model relates to the technical field of LED lamp beads, in particular to an LED lamp bead.

Background

The light emitting diode LED is a new generation semiconductor light emitting device, which has the characteristics of high light efficiency, long service life, environmental protection, energy saving, etc., and is being paid attention to as a continuous replacement for the traditional lighting technology. LEDs have great potential as new illumination sources to replace conventional illumination sources, both from the point of view of saving electrical energy, reducing greenhouse gas emissions, and from the point of view of reducing environmental pollution.

In the related art, the LED lamp beads are generally composed of RGB three-color light LED chips, when the dot spacing is smaller, the RGB chips are distributed densely, the number of pins is increased, the LED lamp beads are in the same size, the size of each pin is reduced due to the increase of the number of pins, the welding area of the pins is reduced, and meanwhile, the client-side line density is also increased due to the increase of the number of pins.

Therefore, there is a need to design a new LED lamp bead to overcome the above-mentioned problems.

Disclosure of Invention

The embodiment of the utility model provides an LED lamp bead, which aims to solve the problems that the number of pins of the LED lamp bead is increased, the size of the pins is reduced, the welding area of the pins is reduced, and the line density of a client is increased in the related art.

In a first aspect, there is provided an LED lamp bead, comprising: the first plate surface of the substrate is provided with at least four RGB chip sets, wherein three chips in each RGB chip set are arranged into a triangular structure, and at least one chip in each RGB chip set and adjacent chips with different luminous colors in at least one RGB chip set are arranged into a triangular structure, so that at least four RGB chip sets are multiplexed to form at least 12 virtual pixels; the second plate surface of the substrate is provided with two common electrode pins and at least 6 non-common electrode pins, and the two common electrode pins and the at least 6 non-common electrode pins are distributed on two opposite sides of the substrate; a first pole of a chip in at least four of the RGB chip sets is electrically connected to the common pole pin, and a second pole of a chip in at least four of the RGB chip sets is electrically connected to at least 6 of the non-common pole pins, wherein the first pole is opposite in polarity to the second pole.

In some embodiments, one of the common electrode pins is disposed on a first side of the substrate, and the other common electrode pin is disposed on a second side of the substrate; the first pole of the RGB chipset arranged on the first side of the substrate is electrically connected to the common pole pin of that side, and the first pole of the RGB chipset arranged on the second side of the substrate is electrically connected to the other common pole pin.

In some embodiments, half of at least 6 of the non-common electrode pins are located on a first side of the substrate and the other half of the non-common electrode pins are located on a second side of the substrate.

In some embodiments, the chips in the same row emit light in the same color, and the second electrodes of the chips in the same row are electrically connected to the same non-common electrode pin.

In some embodiments, the at least 6 non-common electrode pins include at least two first pins, at least two second pins, and at least two third pins, each of the RGB chip sets includes a first chip, a second chip, and a third chip, the first chip, the second chip, and the third chip have different light emission colors, the first pin is electrically connected to the first chip, the second pin is electrically connected to the second chip, and the third pin is electrically connected to the third chip; at least one first pin and at least two second pins are distributed on a first side of the substrate, and at least one first pin and at least two third pins are distributed on a second side of the substrate.

In some embodiments, the common electrode pin of the first side of the substrate is located between at least one of the first pins and at least two of the second pins; the common electrode pin on the second side of the substrate is located between at least one of the first pins and at least two of the third pins.

In some embodiments, at least two of the first pins, at least two of the second pins, and at least two of the third pins are distributed on the substrate in a central symmetry.

In some embodiments, the substrate is provided with two first conductive lines and a plurality of second conductive lines which are arranged at intervals on the first board surface, and is provided with a plurality of third conductive lines which are arranged at intervals on the second board surface, and a first conductive through hole is further arranged at the position of the substrate corresponding to the common electrode pin, and a second conductive through hole is arranged corresponding to the second conductive lines; a first pole of the chip is electrically connected to the respective common pole pin through the respective first conductive trace and the first conductive via; the second pole of the chip is electrically connected to the corresponding non-common pole pin through the corresponding second conductive line, the second conductive through hole and the third conductive line.

In some embodiments, the chips in at least four RGB chip sets are arranged in an array on the first board, and in a first direction, the light emitting colors of the chips in the same row are the same, and in a second direction, the light emitting colors of the chips in the same column are different; the two common electrode pins and at least 6 non-common electrode pins are distributed on two opposite sides of the substrate along a first direction or on two opposite sides of the substrate along a second direction.

In some embodiments, three chips in each RGB chipset are arranged in an equilateral triangle structure, and at least one chip in each RGB chipset and a chip with a different emission color in an adjacent at least one RGB chipset are arranged in an equilateral triangle structure.

The technical scheme provided by the utility model has the beneficial effects that:

the embodiment of the utility model provides an LED lamp bead, because three chips in each RGB chip set are arranged into a triangle structure, at least one pixel can be formed in each RGB chip set, and at least one chip in each RGB chip set and chips with different luminous colors in adjacent RGB chip sets are also arranged into a triangle structure, so that virtual pixels can be formed by multiplexing the adjacent two RGB chip sets, further virtual pixel multiplexing can be realized, more pixels can be formed under the condition that the chip arrangement is relatively not dense, and the density of the chips can be reduced; meanwhile, two common electrode pins and at least 6 non-common electrode pins are distributed on two opposite sides of the substrate to control at least four RGB chip sets, control of 12 chips can be achieved by using 8 pins at least, the number of pins is greatly reduced, the LED lamp beads are larger in size under the same number of chips and the same size, the welding area of each pin is larger, the reject ratio after welding is lower, maintenance is more convenient, and the number of pins is smaller, and the line density of a client is smaller.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings required for the description of the embodiments will be briefly described below, and it is apparent that the drawings in the following description are only some embodiments of the present utility model, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

Fig. 1 is a schematic distribution diagram of pins and chips of an LED lamp bead according to an embodiment of the present utility model;

fig. 2 is a schematic diagram of a pixel structure formed by four RGB chip sets according to an embodiment of the present utility model;

fig. 3 is a schematic top view of an LED lamp bead according to an embodiment of the present utility model;

fig. 4 is a schematic bottom view of an LED lamp bead according to an embodiment of the present utility model;

fig. 5 is a schematic front view of an LED lamp bead according to an embodiment of the present utility model;

fig. 6 is a schematic distribution diagram of pins and chips of another LED lamp bead according to an embodiment of the present utility model;

FIG. 7 is a schematic top view of another LED lamp bead according to an embodiment of the present utility model;

FIG. 8 is a schematic bottom view of another LED light bead according to an embodiment of the present utility model;

fig. 9 is a schematic front view of another LED lamp bead according to an embodiment of the present utility model;

fig. 10 is a schematic circuit control logic diagram of an LED lamp bead according to an embodiment of the present utility model.

In the figure:

1. a substrate; 11. a first conductive line; 12. a second conductive line; 13. a third conductive line; 14. a first conductive via; 15. a second conductive via;

2. a chip; 21. a first chip; 22. a second chip; 23. a third chip;

3. a common electrode pin;

4. a non-common electrode pin; 41. a first pin; 42. a second pin; 43. a third pin; 5. and (5) colloid.

Detailed Description

For the purpose of making the objects, technical solutions and advantages of the embodiments of the present utility model more apparent, the technical solutions of the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model, and it is apparent that the described embodiments are some embodiments of the present utility model, but not all embodiments of the present utility model. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

The embodiment of the utility model provides an LED lamp bead, which can solve the problems that the number of pins of the LED lamp bead is increased, the size of the pins is reduced, the welding area of the pins is reduced, and meanwhile, the line density of a client is higher in the related art. In order to solve the above problems, and reduce the cost of the RGB chip, the virtual pixel technology gradually advances into the field of LED packaging.

Referring to fig. 1, an LED lamp bead provided in an embodiment of the present utility model may include: the substrate 1, the substrate 1 is preferably made of an insulating material, the first board surface of the substrate 1 is provided with at least four RGB chip sets, that is, four RGB chip sets may be disposed on the substrate 1 to form four-in-one light beads, or a greater number of RGB chip sets may be disposed to form multiple-in-one light beads, where, as shown in fig. 2, three chips 2 in each RGB chip set are arranged in a triangle structure, three chips 2 in each RGB chip set are respectively R chip 2, G chip 2 and B chip 2, the light emission colors of the three chips 2 are different, the three chips 2 may form a real pixel, and at least one chip 2 in each RGB chip set may be arranged in a triangle structure with at least one chip 2 in an adjacent RGB chip set (that is, another RGB chip set) having different light emission colors, so that the at least four RGB chip sets are multiplexed to form at least 12 virtual pixels, including at least 4 real pixels formed by the four RGB chip sets, and at least 8 virtual pixels formed between two adjacent RGB chip sets.

Referring to fig. 4, the second board surface of the substrate 1 is provided with two common electrode pins 3 and at least 6 non-common electrode pins 4, and the two common electrode pins 3 and the at least 6 non-common electrode pins 4 are distributed on opposite sides of the substrate 1; the second plate surface and the first plate surface are distributed on opposite sides of the substrate 1, and the two common electrode pins 3 and at least 6 non-common electrode pins 4 may be distributed on the left and right sides of the substrate 1 or may be distributed on the front and rear sides of the substrate 1.

Referring to fig. 3, the first poles of the chips 2 in at least four of the RGB chip sets are electrically connected to the common electrode pins 3, that is, the first poles of some of the chips 2 are electrically connected to one of the common electrode pins 3, and the first poles of other of the chips 2 are electrically connected to the other common electrode pin 3; the second poles of the chips 2 in at least four of the RGB chip sets are correspondingly electrically connected to at least 6 of the non-common pole pins 4, wherein the polarities of the first poles and the second poles are opposite. Each non-common electrode pin 4 may be electrically connected to a second electrode of two of the chips 2, with different non-common electrodes being electrically connected to different chips 2.

In this embodiment, since the three chips 2 in each RGB chipset are arranged in a triangle structure, at least one pixel may be formed in each RGB chipset, the pixel may be referred to as a real pixel, and at least one chip 2 in each RGB chipset may be arranged in a triangle structure with chips 2 having different light emission colors in adjacent RGB chipsets, so that virtual pixels can be formed by multiplexing between adjacent two RGB chipsets, further virtual pixel multiplexing can be implemented, so that a relatively large number of pixels may be formed if the chip 2 arrangement is relatively not very dense, that is, if virtual pixel multiplexing is not adopted, 12 RGB chipsets need to be set when 12 pixels are formed, while in this embodiment, multiple virtual pixels may be formed by multiplexing between two adjacent RGB chipsets, therefore, 12 pixels can be realized without arranging 12 RGB chip sets and arranging four RGB chip sets, therefore, under the condition of the same pixel forming quantity, the quantity of the RGB chip sets is reduced, the density of the chips 2 is reduced, the density is reduced, the wiring difficulty of lamp beads is correspondingly reduced, meanwhile, the control of at least four RGB chip sets is realized by distributing two common electrode pins 3 and at least 6 non-common electrode pins 4 on two opposite sides of a substrate 1, the control of 8-pin four-in-one lamp beads is realized, the control of 12 chips can be realized by using 8 pins at least, the quantity of pins is greatly reduced, under the same quantity of chips and the same size of the LED lamp beads, because the quantity of pins is greatly reduced, the size of each pin can be made larger, the solderable area of each pin is larger, the reject ratio after soldering is lower, the maintenance is more convenient, and the smaller the pin count, the less client line density.

It should be understood that, referring to fig. 2, at least one chip 2 in each RGB chipset and at least one adjacent chip 2 in the RGB chipset having different emission colors are arranged in a triangle structure, that is, a first chip 21 (such as R chip 2) in one of the RGB chipsets and a second chip 22 (such as G chip 2) and a third chip 23 (such as B chip 2) in an adjacent one of the RGB chipsets form virtual pixels, that is, the G chip 2 and the B chip 2 are in the same RGB chipset; alternatively, a first chip 21 (such as an R chip 2) in one of the RGB chip sets and a second chip 22 (such as a G chip 2) in an adjacent one of the RGB chip sets, and a third chip 23 (such as a B chip 2) in an adjacent other one of the RGB chip sets form virtual pixels, that is, the R chip 2, the G chip 2, and the B chip 2 are chips 2 in three different RGB chip sets, respectively.

Referring to fig. 1, in some embodiments, one of the common electrode pins 3 is disposed on a first side of the substrate 1, and the other common electrode pin 3 is disposed on a second side of the substrate 1, where the first side is opposite to the second side, and the first side may be a left side (see fig. 1) or a front side (see fig. 6); the first pole of the RGB chipset arranged on the first side of the substrate 1 is electrically connected to the common pole pin 3 of that side, and the first pole of the RGB chipset arranged on the second side of the substrate 1 is electrically connected to the other common pole pin 3. In this embodiment, the first electrode of the chip 2 closer to the common electrode pin 3 on the first side is electrically connected to the common electrode pin 3 on the side, the first electrode of the chip 2 closer to the common electrode pin 3 on the second side is electrically connected to the common electrode pin 3 on the side, and each chip 2 is closer to the common electrode pin 3, so that the wiring length on the substrate 1 can be shortened, and the wiring is simplified.

Further, referring to fig. 4, in some alternative embodiments, half of at least 6 of the non-common electrode pins 4 are located on a first side of the substrate 1, and the other half of the non-common electrode pins 4 are located on a second side of the substrate 1. When the number of the non-common electrode pins 4 is 6, three are located on the first side of the substrate 1 and three are located on the second side of the substrate 1, the embodiment equally divides the plurality of non-common electrode pins 4 on two opposite sides of the substrate 1, so that the positions of the non-common electrode pins 4 on each side are not too crowded.

Referring to fig. 3, it is preferable that the chips 2 located in the same row have the same light emission color, and the second electrodes of the chips 2 located in the same row are electrically connected to the same non-common electrode pin 4. Wherein, at least four RGB chip sets may be arranged in six rows, the light emitting colors of the chips 2 of the first three rows are different, and the light emitting colors of the chips 2 of the last three rows are also different. In this embodiment, the second poles of the chips 2 in the same row are electrically connected to the same non-common pole pin 4, so that the control of the chips 2 in the same row can be realized through the non-common pole pin 4, the pin number is reduced, the non-common pole pin 4 can be arranged in the same row with the chips 2 in the same row or in the vicinity of the chips 2 in the same row, and the distance between the chips 2 and the non-common pole pin 4 to be connected can also be shortened.

Referring to fig. 4, in some embodiments, at least 6 of the non-common electrode pins 4 may include at least two first pins 41, at least two second pins 42, and at least two third pins 43, each of the RGB chip sets includes a first chip 21, a second chip 22, and a third chip 23, the first chip 21, the second chip 22, and the third chip 23 have different light emission colors, the first pins 41 are electrically connected to the first chip 21, the second pins 42 are electrically connected to the second chip 22, and the third pins 43 are electrically connected to the third chip 23; wherein at least one of the first pins 41 and at least two of the second pins 42 are distributed on a first side of the substrate 1, and at least one of the first pins 41 and at least two of the third pins 43 are distributed on a second side of the substrate 1. By the arrangement, the distance between each pin and the chip 2 with the corresponding luminous color can be kept not far, and the circuit can be simplified.

It will be appreciated that in this embodiment, one first pin 41 is electrically connected to two first chips 21, one second pin 42 is electrically connected to two second chips 22, and one third pin 43 is connected to two third chips 23. Referring to fig. 4, one first pin 41 and two second pins 42 may be disposed at the left side of the substrate 1, the other first pin 41 and two third pins 43 may be disposed at the right side of the substrate 1, and referring to fig. 8, one first pin 41 and two second pins 42 may be disposed at the front side of the substrate 1, and the other first pin 41 and two third pins 43 may be disposed at the rear side of the substrate 1.

Referring to fig. 4, in some embodiments, the common electrode pin 3 on the first side of the substrate 1 is located between at least one of the first pins 41 and at least two of the second pins 42, that is, the arrangement is that the first pin 41, the common electrode pin 3, and the two second pins 42; the common electrode pin 3 on the second side of the substrate 1 is located between at least one of the first pins 41 and at least two of the third pins 43, and the arrangement of the sides is that of the first pin 41, the common electrode pin 3, and two second pins 42. In this embodiment, the common electrode pins 3 are arranged near the middle, and the first pins 41 and the second pins 42 are distributed on two sides of the common electrode pins 3, as shown in fig. 1, so that the first pins 41 may be arranged near the first chips 21 in the first row, and other pins may be arranged relatively near the corresponding chips 2.

Specifically, referring to fig. 3, in this embodiment, four RGB chip sets are taken as an example to describe the details, 12 chips 2 in the four RGB chip sets are arranged in six rows, the first row is two first chips 21, the second row is two second chips 22, the third row is two third chips 23, the fourth row is two first chips 21, the fifth row is two second chips 22, the sixth row is two third chips 23, the chips 2 in the two adjacent rows are arranged in a staggered manner, the first chips 21 of the first row can be arranged opposite to the third chips 23 of the third row and the second chips 22 of the fifth row, and the second chips 22 of the second row can be arranged opposite to the first chips 21 of the fourth row and the third chips 23 of the sixth row. When the two common electrode pins 3 and at least 6 non-common electrode pins 4 are distributed on the left side and the right side of the substrate 1, the pins on the left side are sequentially arranged into a first pin 41, the common electrode pin 3 and two second pins 42, and the pins on the right side are sequentially arranged into two third pins 43, the common electrode pin 3 and the first pin 41. Referring to fig. 8, when two common electrode pins 3 and at least 6 non-common electrode pins 4 are distributed on both front and rear sides of the substrate 1, the front side pins are sequentially arranged as the common electrode pins 3, a first pin 41, a second pin 42, and a third pin 43, and the rear side pins are sequentially arranged as the first pin 41, the second pin 42, the third pin 43, and the common electrode pins 3, and the arrangement manner of each chip 2 may not be changed (see fig. 7).

As shown in fig. 4, preferably, at least two of the first pins 41, at least two of the second pins 42, and at least two of the third pins 43 are distributed on the substrate 1 in a central symmetry. The first pins 41 and the two second pins 42 distributed on the left side of the substrate 1 are center-symmetrical to the positions of the first pins 41 and the two third pins 43 distributed on the right side of the substrate 1.

Referring to fig. 3, in some alternative embodiments, the substrate 1 is provided with two first conductive traces 11 and a plurality of second conductive traces 12 disposed at intervals on the first board surface, and the substrate 1 is provided with a plurality of third conductive traces 13 (see fig. 4) disposed at intervals on the second board surface, where the substrate 1 is further provided with a first conductive via 14 corresponding to the common electrode pin 3, and a second conductive via 15 corresponding to the second conductive traces 12; the first pole of the chip 2 is electrically connected to the respective common pole pin 3 through the respective first conductive trace 11 and the first conductive via 14; the second pole of the chip 2 is electrically connected to the respective non-common pole pin 4 through the respective second conductive trace 12 and the second conductive via 15, third conductive trace 13. That is, each common electrode pin 3 corresponds to each first conductive line 11, each non-common electrode pin 4 corresponds to each second conductive line, the conductive lines are not connected to each other, and independent control over 12 chips 2 is achieved through corresponding guide through holes. The circuit control logic is shown in fig. 10, wherein R1 is a first pin, G1 is a second pin, B1 is a third pin, L1 is a common electrode pin on the left side or the front side, and L2 is a common electrode pin on the right side or the rear side.

Fig. 3 shows one of the line connection modes, in which, taking four RGB chip sets as an example, two first conductive lines 11 on the substrate 1, one of the first conductive lines 11 is disposed at the left side edge of the substrate 1, the other first conductive line 11 is disposed at the right side edge of the substrate 1, first poles of all chips 2 in the two RGB chip sets located at the left side of the substrate 1 are electrically connected to the first conductive lines 11 at the left side, and first poles of all chips 2 in the two RGB chip sets located at the right side of the substrate 1 are electrically connected to the first conductive lines 11 at the right side. Meanwhile, the substrate 1 is provided with a first conductive via 14 on the left side thereof, and the first conductive trace 11 on the left side is electrically connected to the common electrode pin 3 on the back side of the substrate 1 through the first conductive via 14 on the left side (see fig. 4, where it is connected to the common electrode pin 3 on the left side of the substrate 1); the substrate 1 is also provided with a first conductive via 14 on its right side, through which first conductive via 14 the first conductive track 11 on the right side is electrically connected to the common electrode pin 3 on the back side of the substrate 1 (see fig. 4, where it is connected to the common electrode pin 3 on the right side of the substrate 1).

Further, referring to fig. 3, four RGB chipsets are defined as a first RGB chipset, a second RGB chipset, a third RGB chipset, and a fourth RGB chipset, respectively, the first RGB chipset being located at the upper left corner of the substrate 1, the second RGB chipset being located at the upper right corner of the substrate 1, the third RGB chipset being located at the lower left corner of the substrate 1, and the fourth RGB chipset being located at the lower right corner of the substrate 1. The first RGB chip set is electrically connected with the second pole of the first chip 21 in the second RGB chip set through a second conductive line 12 and is electrically connected to the first pin 41 on the left side of the back surface of the substrate 1 through a second conductive via 15 and a third conductive line 13; the first RGB chipset is electrically connected to the second pole of the second chip 22 in the second RGB chipset through a second conductive trace 12 and electrically connected to the second pin 42 on the left side of the back surface of the substrate 1 through a second conductive via 15 and a third conductive trace 13; the first RGB chipset is electrically connected to the second pole of the third chip 23 in the second RGB chipset through a second conductive trace 12 and is electrically connected to the third pin 43 on the right side of the back surface of the substrate 1 through a second conductive via 15 and a third conductive trace 13; the third RGB chip set is electrically connected to the second pole of the first chip 21 in the fourth RGB chip set through a second conductive line 12 and is electrically connected to the first pin 41 on the right side of the back surface of the substrate 1 through a second conductive via 15 and a third conductive line 13; the third RGB chipset is electrically connected to the second pole of the second chip 22 in the fourth RGB chipset through a second conductive trace 12, and is electrically connected to the second pin 42 on the left side of the back surface of the substrate 1 through a second conductive via 15 and a third conductive trace 13; the third RGB chip set is electrically connected to the second pole of the third chip 23 in the fourth RGB chip set through a second conductive trace 12 and is electrically connected to the third pin 43 on the right side of the back surface of the substrate 1 through a second conductive via 15 and a third conductive trace 13.

Fig. 7 shows another line connection mode, in which two first conductive lines 11 on the substrate 1 are arranged at the middle position of the substrate 1, one of the first conductive lines 11 is biased to the left, the other first conductive line 11 is biased to the right, first poles of all chips in two RGB chip sets located at the left side of the substrate 1 are electrically connected to the biased first conductive lines 11, and first poles of all chips in two RGB chip sets located at the right side of the substrate 1 are electrically connected to the biased first conductive lines 11. Meanwhile, the substrate 1 is provided with two first conductive vias 14 at the middle thereof, and the leftwards-offset first conductive trace 11 is electrically connected to the common electrode pin 3 on the rear surface of the substrate 1 through one of the first conductive vias 14 (see fig. 8, where it is connected to the common electrode pin 3 on the front side of the substrate 1); the first conductive trace 11 on the right is electrically connected to the common electrode pin 3 on the back side of the substrate 1 through another first conductive via 14 (see fig. 8 where it is connected to the common electrode pin 3 on the back side of the substrate 1).

Further, referring to fig. 7, the first RGB chip set is electrically connected to the second pole of the first chip 21 in the second RGB chip set through a second conductive trace 12 and is electrically connected to the first pin 41 on the front side of the back surface of the substrate 1 through a second conductive via 15; the first RGB chip set is electrically connected to the second pole of the second chip 22 in the second RGB chip set through a second conductive trace 12, and is electrically connected to the second pin 42 on the front side of the back surface of the substrate 1 through a second conductive via 15 and a third conductive trace 13; the first RGB chip set is electrically connected to the second pole of the third chip 23 in the second RGB chip set through a second conductive trace 12 and is electrically connected to the third pin 43 on the front side of the back surface of the substrate 1 through a second conductive via 15 and a third conductive trace 13; the third RGB chip set is electrically connected to the second pole of the first chip 21 in the fourth RGB chip set through a second conductive trace 12 and is electrically connected to the first pin 41 on the back side of the substrate 1 through a second conductive via 15 and a third conductive trace 13; the third RGB chip set is electrically connected to the second pole of the second chip 22 in the fourth RGB chip set through a second conductive trace 12, and is electrically connected to the second pin 42 on the rear side of the back surface of the substrate 1 through a second conductive via 15 and a third conductive trace 13; the third RGB chip set is electrically connected to the second pole of the third chip 23 in the fourth RGB chip set through a second conductive trace 12 and is electrically connected to the third pin 43 on the rear side of the back surface of the substrate 1 through a second conductive via 15.

Referring to fig. 2, in some embodiments, the chips 2 in at least four RGB chip sets are arranged in an array on the first board surface, and the light emitting colors of the chips 2 in the same row are the same along a first direction, and the light emitting colors of the chips 2 in the same column are different along a second direction, where the first direction may be a left-right direction, and the second direction may be a front-back direction; two of the common electrode pins 3 and at least 6 of the non-common electrode pins 4 are distributed on opposite sides of the substrate 1 in a first direction or on opposite sides of the substrate 1 in a second direction. That is, the common electrode pins 3 and at least 6 non-common electrode pins 4 may be arranged on the left and right sides of the substrate 1, or may be arranged on the front and rear sides of the substrate 1.

Referring to fig. 2, preferably, three chips 2 in each of the RGB chip sets are arranged in an equilateral triangle structure, and at least one chip 2 in each of the RGB chip sets is arranged in an equilateral triangle structure with chips 2 having different emission colors in adjacent at least one of the RGB chip sets. In this embodiment, the three chips 2 are arranged according to an equilateral triangle structure, so that the positions of the three chips 2 are more symmetrical, the light is emitted more uniformly, and the display effect of unbiased full viewing angle is achieved. Of course, in other embodiments, the arrangement may be in an isosceles or other triangular configuration.

Further, referring to fig. 5, the surface of the substrate 1 may be further encapsulated with a glue 5, and fig. 9 shows a structure of another LED lamp bead encapsulated with the glue 5.

In the description of the present utility model, it should be noted that the azimuth or positional relationship indicated by the terms "upper", "lower", etc. are based on the azimuth or positional relationship shown in the drawings, and are merely for convenience of describing the present utility model and simplifying the description, and are not indicative or implying that the apparatus or element in question must have a specific azimuth, be constructed and operated in a specific azimuth, and thus should not be construed as limiting the present utility model. Unless specifically stated or limited otherwise, the terms "mounted," "connected," and "coupled" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances.

It should be noted that in the present utility model, relational terms such as "first" and "second" and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.

The foregoing is only a specific embodiment of the utility model to enable those skilled in the art to understand or practice the utility model. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the utility model. Thus, the present utility model is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims (10)

1. An LED light bead, characterized in that it comprises:

the display device comprises a substrate (1), wherein a first plate surface of the substrate (1) is provided with at least four RGB chip sets, three chips (2) in each RGB chip set are arranged into a triangular structure, and at least one chip (2) in each RGB chip set and at least one adjacent chip (2) with different luminous colors in each RGB chip set are arranged into a triangular structure, so that at least four RGB chip sets are multiplexed to form at least 12 virtual pixels;

the second plate surface of the substrate (1) is provided with two common electrode pins (3) and at least 6 non-common electrode pins (4), and the two common electrode pins (3) and the at least 6 non-common electrode pins (4) are distributed on two opposite sides of the substrate (1);

a first pole of the at least four RGB chipset chips (2) is electrically connected to the common pole pin (3), and a second pole of the at least four RGB chipset chips (2) is electrically connected to at least 6 non-common pole pins (4), wherein the polarities of the first pole and the second pole are opposite.

2. The LED light bulb of claim 1, wherein:

one of the common electrode pins (3) is distributed on a first side of the substrate (1), and the other common electrode pin (3) is distributed on a second side of the substrate (1);

the first pole of the RGB chipset arranged on a first side of the substrate (1) is electrically connected to the common pole pin (3) of that side, and the first pole of the RGB chipset arranged on a second side of the substrate (1) is electrically connected to the other common pole pin (3).

3. The LED light bulb of claim 1 or 2, wherein:

at least half of 6 of the non-common electrode pins (4) are located on a first side of the substrate (1), and the other half of the non-common electrode pins (4) are located on a second side of the substrate (1).

4. The LED light bulb of claim 1, wherein:

the chips (2) located in the same row have the same light emission color, and the second poles of the chips (2) located in the same row are electrically connected to the same non-common pole pin (4).

5. The LED light bulb of claim 1, wherein:

at least 6 non-common electrode pins (4) comprise at least two first pins (41), at least two second pins (42) and at least two third pins (43), each RGB chip set comprises a first chip (21), a second chip (22) and a third chip (23), the first chip (21), the second chip (22) and the third chip (23) have different luminous colors, the first pins (41) are electrically connected with the first chip (21), the second pins (42) are electrically connected with the second chip (22), and the third pins (43) are electrically connected with the third chip (23);

wherein at least one of the first pins (41) and at least two of the second pins (42) are distributed on a first side of the substrate (1), and at least one of the first pins (41) and at least two of the third pins (43) are distributed on a second side of the substrate (1).

6. The LED light bulb of claim 5, wherein:

-said common electrode pin (3) of a first side of said substrate (1) is located between at least one of said first pins (41) and at least two of said second pins (42);

the common electrode pin (3) of the second side of the substrate (1) is located between at least one of the first pins (41) and at least two of the third pins (43).

7. The LED light bulb of claim 5, wherein:

at least two of the first pins (41), at least two of the second pins (42) and at least two of the third pins (43) are distributed on the substrate (1) in a central symmetry manner.

8. The LED light bulb of claim 1, wherein:

two first conductive lines (11) and a plurality of second conductive lines (12) which are arranged at intervals are arranged on the first plate surface of the substrate (1), a plurality of third conductive lines (13) which are arranged at intervals are arranged on the second plate surface of the substrate (1), a first conductive through hole (14) is further arranged at the position, corresponding to the public electrode pin (3), of the substrate (1), and a second conductive through hole (15) is arranged corresponding to the second conductive lines (12);

-a first pole of the chip (2) is electrically connected to the respective common pole pin (3) through the respective first conductive track (11) and the first conductive via (14);

the second pole of the chip (2) is electrically connected to the corresponding non-common pole pin (4) through the corresponding second conductive line (12) and the second conductive via (15), the third conductive line (13).

9. The LED light bulb of claim 1, wherein:

the chips (2) in the at least four RGB chip sets are arranged on the first plate surface in an array mode, the luminous colors of the chips (2) in the same row are the same along the first direction, and the luminous colors of the chips (2) in the same column are different along the second direction;

two of the common electrode pins (3) and at least 6 of the non-common electrode pins (4) are distributed on opposite sides of the substrate (1) along a first direction or on opposite sides of the substrate (1) along a second direction.

10. The LED light bulb of claim 1, wherein:

three chips (2) in each RGB chip set are arranged into an equilateral triangle structure, and at least one chip (2) in each RGB chip set and at least one adjacent chip (2) with different luminous colors in each RGB chip set are arranged into an equilateral triangle structure.