CN220106494U

CN220106494U - Power semiconductor module packaging structure

Info

Publication number: CN220106494U
Application number: CN202321353015.7U
Authority: CN
Inventors: 谢安全; 张池
Original assignee: Shenzhen Light Electronics Co ltd
Current assignee: Shenzhen Light Electronics Co ltd
Priority date: 2023-05-31
Filing date: 2023-05-31
Publication date: 2023-11-28
Anticipated expiration: 2033-05-31

Abstract

The utility model relates to the technical field of semiconductors, in particular to a power semiconductor module packaging structure, which comprises a bottom shell frame body, wherein a T-shaped long block is fixedly connected to the middle part of the inner upper wall of the bottom shell frame body, a clamping groove is formed in the inner lower wall of the bottom shell frame body, a semiconductor body is placed in the clamping groove, screws are fixedly connected to the front part of the upper end and the rear part of the upper end of the bottom shell frame body, nuts are connected to the upper parts of the outer surfaces of the four nuts in a threaded manner, a fixing structure is arranged at the upper end of the bottom shell frame body, a heat dissipation mechanism is inserted into the bottom shell frame body through the four screws together, and the heat dissipation mechanism is located on the upper side of the fixing structure. According to the power semiconductor module packaging structure, the heat dissipation mechanism is arranged, so that under the matched use of the heat dissipation fan and the two heat dissipation fins, a good cooling and heat dissipation effect can be achieved on heat generated by the semiconductor body placed in the bottom shell frame body during working, and the long-term normal use of the semiconductor module is ensured.

Description

Power semiconductor module packaging structure

Technical Field

The utility model relates to the technical field of semiconductors, in particular to a power semiconductor module packaging structure.

Background

The semiconductor power module is widely used in the industries such as electric transmission, motor control and the like and various fields such as automobile driving, hybrid power, wind energy, welding machine, locomotive traction and the like, converts input direct current into three-phase alternating current to be output as various switching power supplies, but has at least the following defects in the use process of the existing power semiconductor module packaging structure: 1. the general semiconductor needs to be welded when being installed, so that the installation is complicated and the subsequent disassembly and overhaul of the semiconductor are not easy; 2. after the installation of the general semiconductor module, the heat dissipation performance of the semiconductor module is poor, so that the internal temperature of the electronic component can be increased to cause faults after long-time use, and the normal operation of the semiconductor module is affected.

Disclosure of Invention

The utility model mainly aims to provide a power semiconductor module packaging structure which can effectively solve the problems in the background technology.

In order to achieve the above purpose, the technical scheme adopted by the utility model is as follows:

the utility model provides a power semiconductor module packaging structure, includes the drain pan framework, the interior upper wall middle part fixedly connected with T type long piece of drain pan framework, open the interior lower wall of drain pan framework has the draw-in groove, semiconductor body has been placed in the draw-in groove, the equal fixedly connected with screw in upper end front portion and the upper end rear portion of drain pan framework, four equal threaded connection in surface upper portion of screw has the nut, the upper end of drain pan framework is equipped with fixed knot constructs, the drain pan framework has heat dissipation mechanism through four screw pegging graft jointly, and heat dissipation mechanism is located fixed knot constructs's upside.

Preferably, the fixed knot constructs including the dust screen, the equal fixedly connected with connecting block in left end middle part and the right-hand member middle part of dust screen, two the equal activity of one end lower part that the dust screen was kept away from to the connecting block is pegged graft there is fixed subassembly, two fixed subassembly is bilateral symmetry and distributes.

Preferably, the fixed subassembly includes the picture peg, the right-hand member fixedly connected with round block of picture peg, the left end fixedly connected with fixed block of picture peg, the upper end of fixed block is opened there is left end T type groove that runs through.

Preferably, the fixed block is in sliding connection with the T-shaped long block through a T-shaped groove, and the plugboard is in penetrating and movable connection with the connecting block but not fixed.

Preferably, the heat dissipation mechanism comprises a sealing cover, two through threaded holes are formed in the front part of the upper end and the rear part of the upper end of the sealing cover, a heat dissipation fan is fixedly connected to the middle part of the inner upper wall of the sealing cover, and heat dissipation fins are fixedly connected to the front part of the inner upper wall and the rear part of the inner upper wall of the sealing cover.

Preferably, the four screw holes are in one-to-one correspondence with the positions of the four screws, the sealing cover is detachably connected with the bottom shell frame body through the four screw holes and the four screws respectively, and the two radiating fins are tightly attached to the upper end face of the dust screen with the lower end of the sealing cover.

Compared with the prior art, the utility model has the following beneficial effects:

1. through setting up fixed knot constructs and two bilateral symmetry's fixed subassembly, under the cooperation of two, can tightly support the dust screen with the upper end of drain pan framework, drive picture peg and fixed block through manual pulling circle piece respectively and carry out the removal in opposite directions, can make the T type groove that all opens on two fixed blocks together with the slip grafting of T type long piece together for the dust screen can play the effect of fixed protection to the semiconductor body of joint in the draw-in groove, thereby be convenient for personnel to install;

2. through setting up cooling mechanism, be equipped with the closing cap on the cooling mechanism, upper wall middle part fixed mounting has radiator fan in the closing cap, and upper wall front portion and interior upper wall rear portion are all fixed mounting has the fin that looses in the closing cap for two fin are hugged closely with the dust screen terminal surface, thereby can play the heat absorption effect through the dust screen to the heat that the semiconductor body during operation is bad, and the use of cooperation radiator fan can play the effect of cooling of blowing to the heat that produces in the drain pan framework.

Drawings

Fig. 1 is a schematic diagram of the overall structure of a power semiconductor module package structure according to the present utility model;

fig. 2 is a schematic diagram of the whole structure of a fixing structure of a power semiconductor module package structure according to the present utility model;

FIG. 3 is a schematic diagram showing the overall structure of a fixing assembly of a power semiconductor module package structure according to the present utility model;

fig. 4 is a schematic diagram of the overall structure of a heat dissipation mechanism of a power semiconductor module package structure according to the present utility model.

In the figure: 1. a bottom shell frame; 2. a T-shaped long block; 3. a clamping groove; 4. a semiconductor body; 5. a screw; 6. a screw cap; 7. a fixed structure; 8. a heat dissipation mechanism; 71. a dust screen; 72. a connecting block; 73. a fixing assembly; 81. a closing cap; 82. a threaded hole; 83. a heat radiation fan; 84. radiating fins; 731. inserting plate; 732. round blocks; 733. a fixed block; 734. t-shaped groove.

Detailed Description

The utility model is further described in connection with the following detailed description, in order to make the technical means, the creation characteristics, the achievement of the purpose and the effect of the utility model easy to understand.

In the description of the present utility model, it should be noted that the directions or positional relationships indicated by the terms "upper", "lower", "inner", "outer", "front", "rear", "both ends", "one end", "the other end", etc. are based on the directions or positional relationships shown in the drawings, are merely for convenience of describing the present utility model and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific direction, be configured and operated in the specific direction, and thus should not be construed as limiting the present utility model. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present utility model, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "provided," "connected," and the like are to be construed broadly, and may be fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art.

Referring to fig. 1-4, the present utility model provides a technical solution:

the utility model provides a power semiconductor module packaging structure, including drain pan framework 1, the interior upper wall middle part fixedly connected with T type long piece 2 of drain pan framework 1, open the interior lower wall of drain pan framework 1 has draw-in groove 3, semiconductor body 4 has been placed in the draw-in groove 3, the equal fixedly connected with screw 5 in upper end front portion and the upper end rear portion of drain pan framework 1, the equal threaded connection in surface upper portion of four screw 5 has nut 6, the upper end of drain pan framework 1 is equipped with fixed knot constructs 7, drain pan framework 1 has heat dissipation mechanism 8 through pegging graft jointly by four screw 5, and heat dissipation mechanism 8 is located fixed knot constructs 7's upside.

In this embodiment, the fixing structure 7 includes a dust screen 71, the middle part of the left end and the middle part of the right end of the dust screen 71 are fixedly connected with connecting blocks 72, the lower parts of one ends of the two connecting blocks 72, which are far away from the dust screen 71, are movably inserted with fixing components 73, and the two fixing components 73 are distributed in bilateral symmetry; the fixing assembly 73 comprises an inserting plate 731, a round block 732 is fixedly connected to the right end of the inserting plate 731, a fixing block 733 is fixedly connected to the left end of the inserting plate 731, a T-shaped groove 734 through which the left end is penetrated is formed in the upper end of the fixing block 733, the fixing block 733 is slidably connected with the T-shaped long block 2 through the T-shaped groove 734, and the inserting plate 731 is inserted into the connecting block 72 to be movably connected but not fixed; through setting up fixed knot constructs 7 and two fixed subassembly 73, and two fixed subassembly 73 are bilateral symmetry and distribute, personnel can tightly support the back with dust screen 71 and the upper end of drain pan framework 1, and manual two round pieces 732 of dragging drive picture peg 731 and fixed block 733 respectively carry out the removal in opposite directions for all open T type slot 734 on two fixed blocks 733 together with the slip grafting of T type long piece 2, thereby the dust screen 71 still can play the ash prevention effect to the semiconductor body 4 that the downside was placed when playing the fixed action, so make personnel be convenient for install fast and dismantle semiconductor body 4.

In this embodiment, the heat dissipation mechanism 8 includes a closing cap 81, two threaded holes 82 are formed in the front portion of the upper end and the rear portion of the upper end of the closing cap 81, a heat dissipation fan 83 is fixedly connected to the middle portion of the inner upper wall of the closing cap 81, heat dissipation fins 84 are fixedly connected to the front portion of the annual upper wall of the closing cap 81 and the rear portion of the inner upper wall, the four threaded holes 82 are in one-to-one correspondence with the positions of the four screws 5, the closing cap 81 is detachably connected with the bottom shell frame 1 through the four threaded holes 82 and the four screws 5, the two heat dissipation fins 84 are tightly attached to the upper end surface of the dustproof net 71, and the heat dissipation mechanism 8 is arranged on the heat dissipation mechanism 8.

It should be noted that, in the use process, the lower wall in the bottom shell frame 1 is opened with the clamping groove 3, the semiconductor body 4 to be installed is placed in the clamping groove 3 to be clamped, the upper end surface of the clamping groove 3 is lower than the upper end surface of the bottom shell frame 1, the fixing structure 7 is arranged at the upper end of the bottom shell frame 1, the dustproof net 71 is arranged on the fixing structure 7, the dustproof net 71 can play an ash-proof effect on the semiconductor body 4 placed in the bottom shell frame 1, the two connecting blocks 72 are inserted and movably connected with the fixing components 73, a person can tightly press the dustproof net 71 against the upper end surface of the bottom shell frame 1, then manually pulls the round block 732 to enable the round block 732 to drive the plug board 731 to slide along the direction of the bottom shell frame 1 in cooperation with the fixing block 733, the T-shaped groove 734 on the fixing block 733 is in sliding connection with the T-shaped long block 2, so the clamping groove 3 can be fixed, thereby avoiding the complicated work during the traditional welding installation, then the sealing cover 81 arranged on the heat dissipation mechanism 8 is respectively inserted with four screws 5 through four threaded holes 82, so that the lower end of the sealing cover 81 is tightly attached to the upper end face of the dust screen 71, then four nuts 6 are respectively manually screwed, so that the sealing cover 81 and the bottom shell frame 1 are fixed together through the threaded installation, the installation of personnel is convenient, the clamping groove 3 is closed, the upper wall in the sealing cover 81 is provided with the heat dissipation fan 83 and two heat dissipation fins 84, and the two heat dissipation fins 84 are tightly abutted against the dust screen 71, so that the heat generated by the clamping groove 3 during the work can be absorbed and conducted through the heat dissipation fins 84 through the dust screen 71, and the heat generated during the work can be cooled down under the cooperation of the heat dissipation fan 83, therefore, the clamping groove 3 is protected, so that the clamping groove 3 cannot be broken down due to overhigh temperature.

The foregoing has shown and described the basic principles and main features of the present utility model and the advantages of the present utility model. It will be understood by those skilled in the art that the present utility model is not limited to the embodiments described above, and that the above embodiments and descriptions are merely illustrative of the principles of the present utility model, and various changes and modifications may be made without departing from the spirit and scope of the utility model, which is defined in the appended claims. The scope of the utility model is defined by the appended claims and equivalents thereof.

Claims

1. The utility model provides a power semiconductor module packaging structure which characterized in that: the novel solar cell module comprises a bottom shell frame body (1), wherein a T-shaped long block (2) is fixedly connected to the middle part of the inner upper wall of the bottom shell frame body (1), a clamping groove (3) is formed in the inner lower wall of the bottom shell frame body (1), a semiconductor body (4) is placed in the clamping groove (3), screws (5) are fixedly connected to the front part of the upper end and the rear part of the upper end of the bottom shell frame body (1), nuts (6) are uniformly connected to the upper parts of the outer surfaces of the four screws (5), a fixing structure (7) is arranged at the upper end of the bottom shell frame body (1), a heat dissipation mechanism (8) is jointly inserted into the bottom shell frame body (1) through the four screws (5), and the heat dissipation mechanism (8) is located on the upper side of the fixing structure (7);

the fixed knot constructs (7) including dust screen (71), the equal fixedly connected with connecting block (72) in left end middle part and the right-hand member middle part of dust screen (71), two the one end lower part that dust screen (71) was kept away from to connecting block (72) all activity grafting has fixed subassembly (73), two fixed subassembly (73) are bilateral symmetry and distribute.

2. The power semiconductor module package according to claim 1, wherein: the fixing assembly (73) comprises an inserting plate (731), the right end of the inserting plate (731) is fixedly connected with a round block (732), the left end of the inserting plate (731) is fixedly connected with a fixing block (733), and the upper end of the fixing block (733) is provided with a T-shaped groove (734) with the left end penetrating through.

3. The power semiconductor module package according to claim 2, wherein: the fixing block (733) is in sliding connection with the T-shaped long block (2) through the T-shaped groove (734), and the inserting plate (731) is in penetrating and movable connection with the connecting block (72) but not fixed.

4. The power semiconductor module package according to claim 1, wherein: the heat dissipation mechanism (8) comprises a sealing cover (81), two through threaded holes (82) are formed in the front part of the upper end and the rear part of the upper end of the sealing cover (81), a heat dissipation fan (83) is fixedly connected to the middle part of the inner upper wall of the sealing cover (81), and heat dissipation fins (84) are fixedly connected to the front part of the annual upper wall and the rear part of the inner upper wall of the sealing cover (81).

5. The power semiconductor module package according to claim 4, wherein: the four threaded holes (82) are in one-to-one correspondence with the positions of the four screws (5), the sealing cover (81) is detachably connected with the bottom shell frame body (1) through the four threaded holes (82) and the four screws (5), and the two radiating fins (84) are tightly attached to the upper end face of the dustproof net (71) with the lower end of the sealing cover (81).