CN220096075U - Integrated thermal management device and car - Google Patents

Abstract

The embodiment of the utility model discloses an integrated heat management device and an automobile, relates to the field of automobile heat management, and solves the problems that an existing integrated heat management device is large in size and high in flow resistance of an internal pipeline. The integrated thermal management device comprises a waterway substrate and a multi-way valve core. The waterway substrate comprises a plurality of runner plates and a multi-way valve body, and the runner plates enclose a runner cavity with a plurality of waterway runners. The runner plate is provided with a multi-way valve mounting port. The multi-way valve body is embedded in the flow channel cavity and is positioned at the multi-way valve mounting port. The multi-way valve body is provided with a plurality of valve ports which are respectively communicated with a plurality of waterway runners. The multi-way valve core is arranged in the multi-way valve body through a multi-way valve mounting port. The multi-way valve core is embedded in the flow channel cavity of the waterway substrate, so that the occupied space of the waterway substrate in the thickness direction is reduced, the integration level of the integrated heat management device is improved, and the problem that the flow resistance of the vertical internal pipeline is high due to the fact that the conventional multi-way valve is directly arranged on the waterway substrate is effectively avoided.

Description

Integrated thermal management device and car

Technical Field

The utility model relates to the technical field of automobile thermal management, in particular to an integrated thermal management device and an automobile.

Background

Along with the rapid popularization of the pure electric vehicle, the whole vehicle heat management technology is evolved and upgraded from a traditional part scattered arrangement scheme to an integrated whole vehicle heat management system. The integrated whole car thermal management system has greatly reduced the occupation space of the front cabin, but users are pursuing larger effective available space (namely the front cabin box space and the passenger cabin space), further squeeze the engine cabin space, and also put higher demands on the integration level and miniaturization of the current integrated thermal management system.

The existing integrated thermal management device has a large volume, and a plurality of internal crossed and vertical pipelines exist in the waterway substrate of the internal communication pipeline, so that the flow resistance of the internal pipeline is high. Thus, performance and power consumption of the integrated thermal management device are affected.

Disclosure of Invention

The embodiment of the utility model provides an integrated thermal management device and an automobile, which solve the problems of larger volume and high flow resistance of an internal pipeline of the existing integrated thermal management device.

In order to achieve the above purpose, the utility model adopts the following technical scheme:

in a first aspect, an embodiment of the present utility model provides an integrated thermal management device. The integrated thermal management device comprises a waterway substrate and a multi-way valve core. The waterway substrate comprises a plurality of runner plates and a multi-way valve body, and the runner plates enclose a runner cavity with a plurality of waterway runners. The runner plate is provided with a multi-way valve mounting port. The multi-way valve body is embedded in the flow channel cavity and is positioned at the multi-way valve mounting port. The multi-way valve body is provided with a plurality of valve ports which are respectively communicated with a plurality of waterway channels. The multi-way valve core is arranged in the multi-way valve body through a multi-way valve mounting port. Therefore, the multi-way valve is embedded in the flow channel cavity of the waterway substrate, so that the occupied space of the waterway substrate in the thickness direction is reduced, the volume of the integrated thermal management device is reduced, and the integration level of the integrated thermal management device is improved. Meanwhile, the multi-way valve body is integrated on the original waterway substrate, so that the problem of high flow resistance of the vertical internal pipeline caused by the fact that the conventional multi-way valve is directly arranged on the waterway substrate is effectively solved, the performance of the integrated thermal management device is improved, and the power consumption is reduced.

Based on the above structure, in some embodiments of the present utility model, the multiple valve ports of the multi-way valve body are respectively flush with the connected multiple waterway channels. The multiple valve ports of the multi-way valve body are flush with the waterway runner of the waterway substrate, so that the waterway substrate does not need to be provided with a vertical waterway runner, the local waterway flow resistance of the original multi-way valve is reduced, the performance of the integrated thermal management device is further improved, and the energy consumption is reduced. In addition, the valve core of the multi-way valve can be fixed with the runner plate through screw fastening, welding, gluing and the like.

The waterway substrate in the embodiment of the utility model can comprise a multi-way valve body and also can comprise a plurality of multi-way valve bodies. Accordingly, the integrated thermal management device may include one multi-way valve cartridge or may include a plurality of multi-way valve cartridges. In some embodiments of the present utility model, the flow channel plate is provided with a plurality of multi-way valve mounting ports, and the plurality of multi-way valve mounting ports are arranged at intervals. The waterway substrate comprises a plurality of multi-way valve bodies which are embedded in the runner cavity at intervals and are respectively positioned at a plurality of multi-way valve mounting openings. The integrated thermal management device comprises a plurality of multi-way valve cores which are respectively arranged in the multi-way valve bodies through a plurality of multi-way valve mounting ports. The multiple multi-way valve cores can be multi-way valves with different numbers of passes, such as three-way valves, five-way valves, eight-way valves, ten-way valves and the like. Therefore, the integrated thermal management device can integrate various multi-way valves, and has wider application range.

In addition, in order to ensure the tightness of the multi-way valve body and the multi-way valve core, in some embodiments of the present utility model, the integrated thermal management device further includes a valve body sealing ring, and the valve body sealing ring is disposed between the outer sidewall of the multi-way valve core and the sidewall of the multi-way valve body. The valve body sealing ring realizes the radial sealing of the multi-way valve core and the multi-way valve body (namely, the sealing is carried out on the cylindrical surfaces of the multi-way valve core and the multi-way valve body), and the sealing performance is good.

Based on the above embodiments, in some embodiments of the present utility model, the integrated thermal management device further includes a multi-way valve motor, where the multi-way valve motor is in driving connection with the multi-way valve body, and the multi-way valve motor may provide switching power for the multi-way valve core. The multi-way valve motor is positioned at the outer side of the flow channel plate, so that the water and electricity isolation of the multi-way valve is realized.

In addition, in some embodiments of the present utility model, a water pump mounting port is formed on a flow channel plate of the waterway substrate. The waterway substrate further comprises a water pump volute, wherein the water pump volute is embedded into the runner cavity and is positioned at the water pump mounting opening. The water pump volute is provided with a water inlet and a water outlet, and the water inlet and the water outlet are respectively communicated with a plurality of waterway channels. The integrated heat management device further comprises an impeller assembly, and the impeller assembly is installed in the water pump volute through the water pump installation opening. The impeller assembly is illustratively secured to the flow field plate in the waterway base plate by means of screw fastening, welding, gluing, or the like. Therefore, the water pump is embedded in the waterway runner of the waterway substrate, so that the occupied space of the waterway substrate in the thickness direction is reduced, the volume of the integrated thermal management device is further reduced, and the integration level of the integrated thermal management device is improved. And the water pump volute is integrated on the original waterway substrate, so that the flow resistance of the vertical internal pipeline introduced by the direct installation of the existing water pump on the waterway substrate is effectively reduced, the performance of the integrated thermal management device is improved, and the energy consumption is reduced.

Based on the above, the water outlet and the water inlet of the water pump volute are respectively flush with the connected waterway runner, so that the waterway base plate does not need to be provided with a vertical waterway runner, the local waterway flow resistance of the original water pump is reduced, the performance of the integrated heat management device is further improved, and the energy consumption is reduced.

The waterway substrate in the embodiment of the utility model can comprise one water pump volute, and can also comprise a plurality of water pump volutes. Accordingly, the integrated thermal management device may include one impeller assembly or may include a plurality of impeller assemblies. In some embodiments of the present utility model, the flow channel plate is provided with a plurality of water pump mounting openings, and the plurality of water pump mounting openings are arranged at intervals. The waterway substrate comprises a plurality of water pump volutes which are embedded in the runner cavity at intervals and are respectively positioned at a plurality of water pump mounting ports. The integrated heat management device comprises a plurality of impeller assemblies which are respectively arranged in a plurality of water pump volutes through a plurality of water pump mounting ports. Therefore, the integrated heat management device can integrate a plurality of impeller assemblies, and the application range is wider.

In order to ensure the tightness between the impeller assembly and the water pump volute, in some embodiments of the present utility model, the integrated thermal management device further includes a water pump sealing ring, and the water pump sealing ring is disposed between the impeller assembly and the water pump volute. The water pump sealing ring can seal the gap between the impeller assembly and the water pump volute, and has good sealing performance.

In addition, the integrated thermal management device further comprises a cooling medium substrate, and the cooling medium substrate is connected with the waterway substrate. A refrigerant flow passage is formed in the refrigerant substrate, and can provide a refrigerant-refrigerant pipeline in the refrigeration system, so that the integration level of the integrated heat management device is improved.

In a second aspect, embodiments of the present utility model also include an automobile. The automobile comprises an automobile body and the integrated heat management device according to the embodiment, wherein the integrated heat management device is arranged in the automobile body. Because the integrated thermal management device in the automobile of the embodiment of the utility model has the same structure as the integrated thermal management device in the above embodiment, the two devices can solve the same technical problems and obtain the same technical effects, and the description is omitted here.

Drawings

In order to describe the technical solution of the embodiment of the present utility model, the drawings required to be used in the embodiment of the present utility model will be described below.

FIG. 1 is a schematic view of an automobile according to an embodiment of the present utility model;

FIG. 2 is an exploded view of a first integrated thermal management device according to an embodiment of the present utility model;

FIG. 3 is a partial cross-sectional view of a waterway substrate of a first integrated thermal management device according to an embodiment of the present utility model;

FIG. 4 is a schematic diagram of a waterway substrate in a first integrated thermal management device according to an embodiment of the present utility model;

FIG. 5 is an exploded view of a second integrated thermal management device according to an embodiment of the present utility model;

FIG. 6 is a partial cross-sectional view of a waterway substrate of a second integrated thermal management device according to an embodiment of the present utility model;

FIG. 7 is a schematic diagram of a waterway substrate in a second integrated thermal management device according to the present utility model;

FIG. 8 is an exploded view of a third integrated thermal management device according to an embodiment of the present utility model;

FIG. 9 is a partial cross-sectional view of a waterway substrate of a third integrated thermal management device in accordance with an embodiment of the present utility model;

fig. 10 is a schematic structural diagram of a waterway substrate in a third integrated thermal management device according to an embodiment of the present utility model;

fig. 11 is a schematic diagram of an assembled structure of an integrated thermal management device according to an embodiment of the utility model.

Reference numerals:

1000-automobile; 100-car body; 200-wheels; 300-an integrated thermal management device; 1-a waterway substrate; 11-runner plate; 111-waterway channels; 112-a flow channel cavity; 113-a multi-way valve mounting port; 113 a-a first multi-way valve mounting port; 113 b-a second multi-way valve mounting port; 113 c-a third multi-way valve mounting port; 114-a water pump mounting port; 114 a-a first water pump mounting port; 114 b-a second water pump mounting port; 12-a multi-way valve body; 12 a-a first multi-way valve body; 12 b-a second multi-way valve body; 12 c-a third multi-way valve body; 121-valve port; 13-a water pump volute; 13 a-a first water pump volute; 13 b-a second water pump volute; 2-multi-way valve spool; 2 a-a first multi-way valve cartridge; 2 b-a second multi-way valve cartridge; 2 c-a third multi-way valve cartridge; 3-a valve body sealing ring; 31-avoiding port; 4-multi-way valve motor; 5-an impeller assembly; 5 a-a first impeller assembly; 5 b-a second impeller assembly; 6-a water pump sealing ring; 7-a refrigerant substrate; 8-electronic expansion valve.

Detailed Description

In order to make the objects, technical solutions and advantages of the present utility model more apparent, the present utility model will be further described in detail with reference to the accompanying drawings.

Hereinafter, the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first", "a second", etc. may explicitly or implicitly include one or more such feature. In the description of the present utility model, unless otherwise indicated, the meaning of "a plurality" is two or more.

Furthermore, in the present utility model, the terms of orientation such as "upper," "lower," "left," "right," "horizontal," and "vertical" are defined with respect to the orientation in which the components in the drawings are schematically disposed, and it should be understood that these directional terms are relative terms, which are used for descriptive and clarity with respect thereto, and which may be correspondingly altered in response to changes in the orientation in which the components in the drawings are disposed. In the present utility model, unless specifically stated and limited otherwise, the term "coupled" is to be construed broadly, e.g., the term "coupled" may refer to a mechanical, physical, or a combination of structures. For example, the two parts can be fixedly connected, detachably connected or integrated; can be directly connected or indirectly connected through an intermediate medium. The circuit structure is also understood to be in physical contact and electrical conduction with components, and also understood to be in a form of connection between different components in a circuit structure through a PCB copper foil or a lead and other physical circuits capable of transmitting electric signals.

An embodiment of the present utility model includes an automobile, as shown in fig. 1, the automobile 1000 includes a vehicle body 100, wheels 200, a driving device (not shown), and the like. The wheel 200 is mounted on the vehicle body 100. The number of wheels 200 is three or more, and the utility model is not limited in this regard. The driving device is a power device of the automobile 1000, for example, the driving device is a driving motor, a fuel engine, and the like. The driving device is in transmission connection with the wheel 200 and is used for driving the wheel 200 to rotate, so as to drive the vehicle body 100 to move.

Fig. 1 illustrates a perspective view of a car 1000 in some embodiments of the utility model, which is a four-wheel car. It is to be understood that fig. 1 only schematically illustrates some components included in an electronic device 1000, and the actual shape, actual size, actual position, and actual configuration of these components are not limited by fig. 1. In other examples, the automobile 1000 further includes a valve train, an oil supply system, a cooling system, a lubrication system, an ignition system, a start system, and the like.

For a new energy automobile (namely an electric automobile), a thermal management system (thermal management system, TMS) of the automobile is used for comprehensively matching, optimizing and controlling related components and subsystems of an engine, an air conditioner, a battery, a motor and the like of the automobile from the whole automobile angle so as to solve the problem of heat correlation of the whole automobile, enable each functional module to be in an optimal temperature working condition interval, improve the economy and the dynamic performance of the whole automobile and ensure the safe running of the automobile. The automobile 1000 therefore also includes thermal management devices including water pumps, valves, compressors, heaters, electronic fans, expansion valves, evaporators, condensers, and integrated thermal management devices. The integrated heat management device is used for integrating the waterway pipeline and the refrigerant pipeline. For example, if the integrated thermal management device includes a waterway substrate having a plurality of channels therein, and the water pump and the valve are directly mounted on the waterway substrate in the integrated thermal management device, the plurality of channels in the waterway substrate have a plurality of internal intersecting and vertical pipelines, which results in high flow resistance of the internal channels, and the integrated thermal management device has a large volume.

Therefore, the embodiment of the utility model improves the integrated thermal management device by integrating and embedding the valve into the waterway substrate to solve the above problems. As shown in fig. 2, 3 and 4, the integrated thermal management device 300 according to the embodiment of the present utility model includes a waterway substrate 1 and a multi-way valve core 2. The waterway substrate 1 includes a plurality of runner plates 11 and a multi-way valve body 12, and the runner plates 11 may enclose a runner cavity 112 having a plurality of waterway runners 111. The flow channel plate 11 is provided with a multi-way valve mounting port 113. The multi-way valve body 12 is embedded and arranged in the flow channel cavity 112, and the multi-way valve body 12 is positioned at the multi-way valve mounting port 113. The multi-way valve body 12 is provided with a plurality of valve ports 121, and the valve ports 121 are respectively communicated with the plurality of waterway channels 111. The multi-way valve spool 2 is mounted in the multi-way valve body 12 through a multi-way valve mounting port 113.

Therefore, compared to an integrated thermal management device in which the multi-way valve is directly mounted on the waterway substrate 1, the multi-way valve in the integrated thermal management device 300 of the embodiment of the utility model can be embedded in the runner cavity 112 of the waterway substrate 1, so that the occupied space of the waterway substrate 1 in the thickness direction is reduced, the volume of the integrated thermal management device 300 is reduced, and the integration level of the integrated thermal management device 300 is improved. For example, the waterway substrate 1 of the present utility model may be reduced by about 40mm in the thickness direction, and the volume of the integrated thermal management device 300 may be reduced by about 15%. Meanwhile, the multi-way valve core 2 is integrated on the original waterway substrate 1, so that the problem of high flow resistance of the vertical internal pipeline introduced by the fact that the existing multi-way valve is directly arranged on the waterway substrate 1 is effectively avoided, the performance of the integrated thermal management device 300 is improved, and the power consumption is reduced.

Based on the above structure, in some embodiments of the present utility model, as shown in fig. 3, the plurality of valve ports 121 of the multi-way valve body 12 are respectively flush with the plurality of connected waterway channels 111. Flush means that the orientation of the valve port 121 is the same as the extending direction of the waterway channel 111 to which the valve port 121 is connected. For example, the direction of the valve ports 121 is horizontal in fig. 3, and the extending directions of the waterway channels 111 connected to the valve ports 121 are all directions. The multiple valve ports 121 of the multi-way valve body 12 are flush with the waterway runner 111 of the waterway substrate 1, so that the waterway substrate 1 does not need to be provided with a vertical waterway runner 111, the local waterway flow resistance of the original multi-way valve is reduced, the performance of the integrated thermal management device 300 is further improved, and the energy consumption is reduced.

In order to further reduce the flow resistance of the waterway channels 111, the inner walls of the plurality of channels in the waterway substrate 1 are highly smooth.

The plurality of flow path plates 11 and the multi-way valve body 12 may be connected by various mechanical means (e.g., screw fastening, welding, gluing, etc.).

It will be appreciated that the number and type of multi-way valves required will vary for different waterway designs of thermal management devices. Therefore, the waterway substrate 1 in the embodiment of the present utility model may include one multi-way valve body 12, and may include a plurality of multi-way valve bodies 12. Accordingly, the integrated thermal management device 300 may include one multi-way valve cartridge 2 or may include a plurality of multi-way valve cartridges 2.

In some embodiments of the present utility model, the flow channel plate 11 is provided with a plurality of multi-way valve mounting ports 113, and the plurality of multi-way valve mounting ports 113 are spaced apart. The waterway substrate 1 includes a plurality of multi-way valve bodies 12, and the multi-way valve bodies 12 are embedded in the flow channel cavity 112 and are respectively positioned at a plurality of multi-way valve mounting ports 113. The integrated thermal management device 300 includes a plurality of multi-way valve cartridges 2, and the plurality of multi-way valve cartridges 2 are respectively installed in the plurality of multi-way valve body 12 through multi-way valve installation ports 113. The multiple multi-way valve cores 2 can be multi-way valves with different numbers of passes, such as three-way valves, five-way valves, eight-way valves, ten-way valves and the like. Therefore, the integrated thermal management device 300 can integrate various multi-way valves, and has wider application range.

For example, a first multi-way valve mounting port 113a and a second multi-way valve mounting port 113b are formed in the top flow channel plate 11 of the waterway substrate 1 shown in fig. 2, and the first multi-way valve mounting port 113a and the second multi-way valve mounting port 113b are disposed at intervals. The waterway substrate 1 includes a first multi-way valve body 12a and a second multi-way valve body 12b, the first multi-way valve body 12a is a ten-way valve body, and the ten-way valve body is installed in the flow channel cavity 112 and is located at the first multi-way valve installation port 113 a. The second multi-way valve body 12b is a three-way valve body that is mounted in the flow channel chamber 112 at the second multi-way valve mounting port 113 b. The integrated thermal management device 300 includes a first multi-way valve spool 2a and a second multi-way valve spool 2b, the first multi-way valve spool 2a being a ten-way valve spool, the first multi-way valve spool 2a being mounted in the first multi-way valve body 12a through a first multi-way valve mounting port 113 a. The second multi-way valve spool 2b is a three-way valve spool, and the second multi-way valve spool 2b is mounted in the second multi-way valve body 12b through the second multi-way valve mounting port 113 b. And, the first multi-way valve spool 2a and the second multi-way valve spool 2b may be assembled together.

For example, the first multi-way valve mounting port 113a, the second multi-way valve mounting port 113b, and the third multi-way valve mounting port 113c are formed in the top flow channel plate 11 of the waterway substrate 1 shown in fig. 5, 6, and 7, and the first multi-way valve mounting port 113a, the second multi-way valve mounting port 113b, and the third multi-way valve mounting port 113c are disposed at intervals. The waterway substrate 1 includes a first multi-way valve body 12a, a second multi-way valve body 12b, and a third multi-way valve body 12c, wherein the first multi-way valve body 12a is a ten-way valve body, and the ten-way valve body is installed in the flow channel cavity 112 and is located at the first multi-way valve installation port 113 a. The second multi-way valve body 12b and the third multi-way valve body 12c are three-way valve bodies, and the second multi-way valve body 12b is installed in the flow channel cavity 112 and is located at the second multi-way valve installation port 113 b. The third multi-way valve body 12c is mounted within the flow passage chamber 112 at a third multi-way valve mounting port 113 c. The integrated thermal management device 300 includes a first multi-way valve spool 2a, a second multi-way valve spool 2b, and a third multi-way valve spool 2c, the first multi-way valve spool 2a is a ten-way valve spool, and the first multi-way valve spool 2a is mounted in the first multi-way valve body 12a through a first multi-way valve mounting port 113 a. The second multi-way valve spool 2b and the third multi-way valve spool 2c are three-way valve spools, and the second multi-way valve spool 2b is mounted in the second multi-way valve body 12b through the second multi-way valve mounting port 113 b. The third multi-way valve spool 2c is mounted in the third multi-way valve body 12c through the third multi-way valve mounting port 113 c. The first multi-way valve element 2a, the second multi-way valve element 2b, and the third multi-way valve element 2c may be assembled together.

By way of example, the number of multi-way valves embedded in the integrated thermal management device 300 shown in fig. 8, 9, and 10 is equal to the number of multi-way valves embedded in the integrated thermal management device 300 shown in fig. 5. The difference is that, in the integrated thermal management device 300 shown in fig. 8, the first multi-way valve body 12a of the waterway substrate 1 is an eight-way valve body, and the first multi-way valve element 2a is an eight-way valve element.

In addition, in order to ensure the tightness between the multi-way valve body 12 and the multi-way valve core 2, in some embodiments of the present utility model, the integrated thermal management device 300 further includes a valve body sealing ring 3 as shown in fig. 8, where the valve body sealing ring 3 is disposed between an outer sidewall of the multi-way valve core 2 and a sidewall of the multi-way valve body 12. The valve body sealing ring 3 realizes radial sealing of the multi-way valve core 2 and the multi-way valve body 12 (namely, the multi-way valve core 2 and the multi-way valve body 12 are sealed on a cylindrical surface), and has good sealing performance.

It will be appreciated that, as shown in fig. 8, the valve sealing ring 3 is provided with a plurality of relief ports 31, and the relief ports 31 correspond to the valve ports 121 on the valve body. Therefore, the multi-way valve body 12 and the multi-way valve core 2 of different types can be sealed by adopting the valve body sealing rings 3 with different structures.

Also, in some embodiments of the present utility model, the integrated thermal management device 300 further includes a multi-way valve motor 4 as shown in fig. 11, where the multi-way valve motor 4 is in driving connection with the multi-way valve body 12. The multi-way valve motor 4 provides switching power for the multi-way valve core 2. The multi-way valve motor 4 is positioned on the outer side of the runner plate 11 to realize water and electricity isolation. As shown in fig. 8, the integrated thermal management device 300 includes a multi-way valve motor 4, and the multi-way valve motor 4 can drive the first multi-way valve element 2a, the second multi-way valve element 2b, and the third multi-way valve element 2 c.

Furthermore, in some embodiments of the present utility model, a water pump is also embedded within the waterway base plate 1. As shown in fig. 2, the flow path plate 11 of the water path substrate 1 is provided with a water pump mounting port 114. The waterway base plate 1 further comprises a water pump volute 13, wherein the water pump volute 13 is embedded in the runner cavity 112 and is positioned at the water pump mounting port 114. The water pump volute 13 is provided with a water inlet and a water outlet, and the water inlet and the water outlet are respectively communicated with a plurality of waterway channels 111. The integrated thermal management device also includes an impeller assembly 5, which impeller assembly 5 may include all the components of an existing water pump except the water pump volute 13. The impeller assembly 5 is mounted within the water pump volute 13 through a water pump mounting port 114. The impeller assembly 5 is illustratively fastened to the flow field plate 11 in the waterway base plate 1 by means of screws, welding, gluing, etc. Therefore, the water pump is embedded in the waterway runner 111 of the waterway substrate 1, which reduces the occupied space of the waterway substrate 1 in the thickness direction, further reduces the volume of the integrated thermal management device 300, and improves the integration level of the integrated thermal management device 300. In addition, the impeller assembly 5 is integrated on the original waterway substrate 1, so that the flow resistance of the vertical internal pipeline introduced by the fact that the existing water pump is directly arranged on the waterway substrate 1 is effectively reduced, the performance of the integrated thermal management device 300 is improved, and the energy consumption is reduced.

Based on the above structure, in some embodiments of the present utility model, as shown in fig. 3, the water inlet of the water pump volute 13 is flush with the water channel 111 connected to the water inlet, and the water outlet of the water pump volute 13 is flush with the water channel 111 connected to the water outlet. The waterway base plate 1 does not need to be provided with a vertical waterway runner 111, so that the local waterway flow resistance of the original water pump is reduced, the performance of the integrated thermal management device 300 is further improved, and the energy consumption is reduced.

It will be appreciated that the number of water pumps required will vary for different waterway designs of thermal management devices. Therefore, the waterway base 1 in the embodiment of the present utility model may include one water pump volute 13, and may also include a plurality of water pump volutes 13. Accordingly, the integrated thermal management device 300 may include one impeller assembly 5 or may include a plurality of impeller assemblies 5. In some embodiments of the present utility model, the flow channel plate 11 is provided with a plurality of water pump mounting ports 114, and the plurality of water pump mounting ports 114 are spaced apart. The waterway substrate 1 includes a plurality of water pump volutes 13, and the plurality of water pump volutes 13 are embedded in the flow channel cavity 112 and are respectively located at the plurality of water pump mounting ports 114. The integrated thermal management device 300 includes a plurality of impeller assemblies 5, and the plurality of impeller assemblies 5 are respectively installed in a plurality of water pump volutes 13. Thus, the integrated thermal management device 300 can integrate a plurality of impeller assemblies 5, and has wider application range.

By way of example, fig. 2 shows that only one water pump mounting port 114 is provided in the top flow channel plate 11 of the waterway base plate 1. The waterway base plate 1 only comprises one water pump volute 13, and the water pump volute 13 is embedded in the runner cavity 112 and is positioned at the water pump mounting port 114. The integrated thermal management device 300 includes only one impeller assembly 5, and the impeller assembly 5 is correspondingly installed in the water pump volute 13.

For example, the flow channel plate 11 of the waterway substrate 1 shown in fig. 5 and 8, which is located at the top, is provided with a first water pump mounting port 114a and a second water pump mounting port 114b, and the first water pump mounting port 114a and the second water pump mounting port 114b are disposed at intervals and are located at two sides of the multi-way valve mounting port 113 respectively. The waterway base plate 1 comprises a first water pump volute 13a and a second water pump volute 13b, wherein the first water pump volute 13a is embedded in the runner cavity 112 and is positioned at the first water pump mounting port 114 a. The second water pump volute 13b is embedded in the flow path chamber 112 and is located at the second water pump mounting port 114 b. The integrated thermal management device 300 includes a first impeller assembly 5a and a second impeller assembly 5b, the first impeller assembly 5a being mounted within the first water pump volute 13a through the first water pump mounting port 114 a. The second impeller assembly 5b is mounted within the second water pump volute 13b through the second water pump mounting port 114 b.

In addition, to ensure the tightness between the impeller assembly 5 and the water pump volute 13, in some embodiments of the present utility model, the integrated thermal management device 300 further includes a water pump seal ring 6 as shown in fig. 2, where the water pump seal ring 6 is disposed between the impeller assembly 5 and the water pump volute 13. The water pump sealing ring 6 can seal the gap between the impeller assembly 5 and the water pump volute 13, and has good sealing performance. The sealing mode of the water pump sealing ring 6 for the gap between the impeller assembly 5 and the water pump volute 13 can be end face sealing or radial sealing, and the utility model is not limited to the end face sealing.

The integrated thermal management device 300 of the embodiment of the utility model is integrated with a water pipeline and a refrigerant pipeline. Therefore, as shown in fig. 2, in some embodiments of the present utility model, the integrated thermal management device 300 further includes a refrigerant substrate 7, and a refrigerant channel is formed in the refrigerant substrate 7. The refrigerant substrate 7 is connected to the waterway substrate 1. For example, the coolant substrate 7 shown in fig. 2 may be installed below the waterway substrate 1. The refrigerant flow channel is used as a part of pipelines of the refrigerant-refrigerant in the refrigerating system, and the integration level of the integrated thermal management device 300 is further improved.

Based on the above structure, the integrated thermal management device 300 further includes an electronic expansion valve 8 as shown in fig. 2, and the electronic expansion valve 8 is embedded in the refrigerant substrate 7. The inlet and outlet of the electronic expansion valve 8 are respectively connected to the refrigerant flow path in the refrigerant substrate 7. The electronic expansion valve 8 does not increase the thickness of the refrigerant substrate 7, improves the performance of the integrated thermal management device 300, and reduces the power consumption.

The foregoing is merely illustrative of the present utility model, and the present utility model is not limited thereto, and any person skilled in the art will readily recognize that variations or substitutions are within the scope of the present utility model. Therefore, the protection scope of the present utility model shall be subject to the protection scope of the claims.

Claims (11)

1. An integrated thermal management device, comprising:

the water channel substrate comprises a plurality of flow channel plates and a multi-way valve body, and the flow channel plates enclose a flow channel cavity with a plurality of water channel flow channels; the runner plate is provided with a multi-way valve mounting port, and the multi-way valve body is embedded in the runner cavity and is positioned at the multi-way valve mounting port; the multi-way valve body is provided with a plurality of valve ports which are respectively communicated with a plurality of waterway runners;

the multi-way valve core is arranged in the multi-way valve body through the multi-way valve mounting port.

2. The integrated thermal management device of claim 1, wherein the plurality of valve ports are flush with the connected plurality of waterway channels.

3. The integrated thermal management device of claim 1 or 2, wherein the flow conduit plate is provided with a plurality of multi-way valve mounting openings, and the plurality of multi-way valve mounting openings are arranged at intervals; the waterway substrate comprises a plurality of multi-way valve bodies which are embedded in the flow channel cavity and are respectively positioned at the mounting openings of the multi-way valves; the integrated thermal management device comprises a plurality of multi-way valve cores, and the multi-way valve cores are respectively arranged in the multi-way valve bodies through the multi-way valve mounting ports.

4. The integrated thermal management device of claim 1, further comprising:

the valve body sealing ring is arranged between the outer side wall of the multi-way valve core and the side wall of the multi-way valve body.

5. The integrated thermal management device of claim 1, further comprising:

the multi-way valve motor is in transmission connection with the multi-way valve body and is positioned on the outer side of the flow channel plate.

6. The integrated thermal management device of claim 1, wherein the flow channel plate is provided with a water pump mounting port, the waterway substrate further comprises a water pump volute, and the water pump volute is embedded in the flow channel cavity and is positioned at the water pump mounting port; the water pump volute is provided with a water inlet and a water outlet, and the water inlet and the water outlet are respectively communicated with the plurality of waterway channels;

the integrated heat management device further comprises an impeller assembly, and the impeller assembly is installed in the water pump volute through the water pump installation opening.

7. The integrated thermal management device of claim 6, wherein the water inlet and the water outlet are each flush with the connected waterway.

8. The integrated thermal management device of claim 6 or 7, wherein a plurality of water pump mounting ports are formed in the runner plate, and the plurality of water pump mounting ports are arranged at intervals; the waterway substrate comprises a plurality of water pump volutes which are embedded in the runner cavity and are respectively positioned at the plurality of water pump mounting ports;

the integrated heat management device comprises a plurality of impeller assemblies, and the impeller assemblies are respectively installed in the water pump volutes through the water pump installing ports.

9. The integrated thermal management device of claim 6 or 7, further comprising:

the water pump sealing ring is arranged between the impeller assembly and the water pump volute.

10. The integrated thermal management device of claim 1, further comprising:

and the refrigerant base plate is internally provided with a refrigerant flow passage and is connected with the waterway base plate.

11. An automobile comprising a body and an integrated thermal management device according to any one of claims 1-10, said integrated thermal management device being mounted in said body.