CN220064289U - Testing device for semiconductor chip - Google Patents

Testing device for semiconductor chip Download PDF

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Publication number
CN220064289U
CN220064289U CN202321468264.0U CN202321468264U CN220064289U CN 220064289 U CN220064289 U CN 220064289U CN 202321468264 U CN202321468264 U CN 202321468264U CN 220064289 U CN220064289 U CN 220064289U
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China
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fixedly connected
wall
semiconductor chip
bottom box
testing machine
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CN202321468264.0U
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Chinese (zh)
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彭劲松
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Jiangsu Aisi Semiconductor Technology Co ltd
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Jiangsu Aisi Semiconductor Technology Co ltd
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    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00Energy generation through renewable energy sources
    • Y02E10/50Photovoltaic [PV] energy

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  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

A testing device for semiconductor chips comprises a bottom box. Compared with the prior art, the utility model has the advantages that: the output shaft of servo motor drives the driving gear and rotates, through the transmission of toothed belt, driven gear drives bi-directional screw and rotates, two movable blocks can be close to each other when bi-directional screw rotates, under the effect of connecting rod, the fly leaf can descend, the universal wheel contacts ground and props up the base box, thereby can remove the chip testing machine, labour saving and time saving utilizes adjusting part can make the chip testing machine adjust into the level at subaerial of co-altitude, prevent to lead to the inaccurate scheduling problem of test result because of the chip testing machine slope, during the removal, damping spring can provide shock attenuation buffering for the chip testing machine, the attenuator can restrain shock that damping spring absorbed the back rebound and absorb the energy that the road surface was strikeed, make the chip testing machine stabilize fast, protect its inside components and parts, and is more practical.

Description

Testing device for semiconductor chip
Technical Field
The utility model relates to the technical field of semiconductor chip testing, in particular to a testing device for a semiconductor chip.
Background
Semiconductor testing is a predictive method of identifying and discarding defective electronic components before they are brought to market or assembled into electronic products. With advances in semiconductor electronics, semiconductor testing has become a critical industrial process for quality assurance. In addition to semiconductor components, PCB, IC semiconductor testing is typically performed under burn-in conditions. Semiconductor testing is to apply electrical and thermal stresses to semiconductor devices, highlighting intrinsic faults as soon as possible.
The Chinese patent with the publication number of CN115308568A discloses an automatic testing device for semiconductor chips, which comprises: the machine case, the upper portion of machine case is provided with the operation panel and both sides are provided with the mounting bracket, the mounting bracket is L type structure setting and the mounting bracket inboard is provided with reel installation mechanism, reel installation mechanism includes spliced pole and rotates between mounting bracket and the spliced pole, the inside of spliced pole is provided with mounting groove and mounting groove be provided with the movable groove all around, the inside of movable groove is provided with the regulation pole and adjusts the pole and rotate between being connected through pivot and the movable groove, the side of adjusting the pole is provided with arc and pass through fixed connection between bolt and the regulation pole, the upper portion of operation panel is provided with the inside of support frame and is provided with the second sliding tray, the inside of second sliding tray is provided with the second motor and the power take off end of second motor is provided with the second screw rod, the surface of second screw rod is provided with the second sliding block and the side of second sliding block is provided with the mounting panel, the lower part of the mounting plate is provided with a driver, the power output end of the driver is provided with a clamping mechanism, the two sides of the clamping mechanism are provided with a third motor, the power output end of the third motor is provided with a third screw rod, the surface of the third screw rod is provided with a third sliding block, the lower part of the third sliding block is provided with clamping rods, the third sliding blocks are provided with two groups and are symmetrically distributed with each other, the inside of the clamping rods is provided with a telescopic slot and a spring column, the side surface of the spring column is provided with a clamping plate, the clamping plate is in telescopic connection with the telescopic slot through the spring column, the inside of the operating table is provided with a rotating motor, the upper part of the rotating motor is provided with a turntable, the surface of the turntable is provided with a plurality of groups and is circumferentially distributed, the upper part of the operating table is provided with a fixing frame, the fixing frame is positioned at the two sides of the turntable, the lower part of the fixing frame is provided with a detection device, the detection device corresponds to the fixing groove, the upper part of the operating platform is provided with a conveying mechanism, and the middle part of the conveying mechanism is provided with a through hole for taking materials.
The prior art scheme has the following defects: the test equipment is heavier, when needs move, needs many people to lift, wastes time and energy, in addition in case askew, can cause concussion to the components and parts in the equipment, leads to equipment damage, and the practicality is not high.
Disclosure of Invention
In view of the above-mentioned shortcomings in the prior art, the present utility model provides a testing device for a semiconductor chip, so as to solve the problems set forth in the background art.
In order to achieve the above purpose, the technical scheme adopted by the utility model is that the testing device for the semiconductor chip comprises a bottom box, wherein a connecting box is fixedly connected to the outer wall of the upper side of the bottom box, dampers are respectively and fixedly connected to four corners of the inner wall of the lower side of the connecting box, a chip testing machine is fixedly connected to the telescopic ends of the dampers, damping springs are sleeved on the outer sides of the dampers, one ends of the damping springs are fixedly connected with the inner wall of the lower side of the connecting box, the other ends of the damping springs are fixedly connected with the chip testing machine, a moving assembly is arranged in the bottom box, and an adjusting assembly is arranged on the lower side wall of the bottom box.
As an improvement: the movable assembly comprises a support frame fixedly connected to the inner wall of one side of the bottom box, a servo motor is mounted on the support frame, two symmetrically distributed bidirectional screws are rotationally connected between the inner walls of two sides of the bottom box, a driven gear is fixedly connected to one end part of each bidirectional screw, which is close to the servo motor, a driving gear is fixedly connected to the output shaft end of each servo motor, and a toothed belt is arranged between each driving gear and each driven gear for transmission.
As an improvement: the movable assembly further comprises two movable blocks which are connected onto the bidirectional screw in a threaded mode, a movable plate is connected between the inner walls of the two sides of the bottom box in a sliding mode, connecting rods are hinged to the lower side walls of the movable blocks, the other ends of the connecting rods are hinged to the upper side walls of the movable plate, and universal wheels are fixedly connected to the four corners of the lower side walls of the movable plate respectively.
As an improvement: the adjusting component comprises fixing sleeves which are respectively and fixedly connected to four corners on the lower side wall of the bottom box, a threaded rod is arranged on the lower side wall of the fixing sleeve in a threaded manner through a threaded hole, the upper end of the threaded rod extends to the inside of the fixing sleeve and is fixedly connected with a limiting block, and the lower end of the threaded rod is fixedly connected with supporting legs.
As an improvement: the lower ends of the supporting legs are fixedly connected with rubber anti-slip pads.
As an improvement: and a storage battery is arranged on the outer wall of one side of the bottom box, and the servo motor is electrically connected with the storage battery.
Compared with the prior art, the utility model has the following beneficial effects:
1. the output shaft of the servo motor drives the driving gear to rotate, the driven gear drives the bidirectional screw to rotate through the transmission of the toothed belt, two moving blocks can be mutually close when the bidirectional screw rotates, the movable plate can descend under the action of the connecting rod, the universal wheels are in contact with the ground and prop up the bottom box, so that the chip tester can be moved, time and labor are saved, the chip tester can be adjusted to be horizontal on the ground at different heights by utilizing the adjusting component, and the problems of inaccurate test results and the like caused by inclination of the chip tester are prevented.
2. When moving, the damping spring can provide damping buffer for the chip tester, and the damper can inhibit rebound vibration and absorption of energy of road impact after the damping spring absorbs vibration, so that the chip tester is fast and stable, and internal components and parts of the chip tester are protected, and the chip tester is more practical.
Drawings
FIG. 1 is a schematic diagram showing the overall structure of a testing apparatus for semiconductor chips according to the present utility model;
FIG. 2 is a schematic view showing the internal structure of a connection box of a testing apparatus for semiconductor chips according to the present utility model;
FIG. 3 is a schematic diagram showing a moving assembly of a testing apparatus for semiconductor chips according to the present utility model;
FIG. 4 is a schematic diagram showing a toothed belt structure of a testing device for semiconductor chips according to the present utility model;
FIG. 5 is a schematic diagram showing the structure of an adjusting assembly of a testing apparatus for semiconductor chips according to the present utility model;
as shown in the figure:
1. a bottom box; 2. a connection box; 2.1, a damper; 3. a chip tester; 2.2, damping springs; 4. a moving assembly; 5. an adjustment assembly; 4.1, a supporting frame; 4.2, a servo motor; 4.3, a bidirectional screw; 4.31, driven gear; 4.21, a driving gear; 4.22, toothed belt; 4.4, moving the block; 4.5, a movable plate; 4.6, connecting rod; 4.7, universal wheels; 5.1, fixing the sleeve; 5.11, threaded holes; 5.2, threaded rod; 5.5, limiting blocks; 5.3, supporting legs; 5.4, rubber anti-slip pad; 6. and a storage battery.
Detailed Description
In order to make the technical means, the creation characteristics and the effect of achieving the object of the present utility model easy to understand, the present utility model is further described below with reference to the specific embodiments.
In the description of the present utility model, it should be noted that the directions or positional relationships indicated by the terms "upper", "lower", "inner", "outer", "front", "rear", "both sides", "one side", "the other side", etc. are based on the directions or positional relationships shown in the drawings, are merely for convenience of describing the present utility model and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific direction, be configured and operated in the specific direction, and thus should not be construed as limiting the present utility model. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present utility model, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "provided," "connected," and the like are to be construed broadly, and may be fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art.
As shown in fig. 1 and 2, a testing device for semiconductor chips comprises a bottom box 1, fixedly connected with connection box 2 is arranged on the upper outer wall of the bottom box 1, dampers 2.1 are fixedly connected to four corners of the lower inner wall of the connection box 2 respectively, the telescopic ends of the dampers 2.1 are fixedly connected with a chip testing machine 3, damping springs 2.2 are sleeved on the outer sides of the dampers 2.1, one ends of the damping springs 2.2 are fixedly connected with the lower inner wall of the connection box 2, the other ends of the damping springs are fixedly connected with the chip testing machine 3, a moving component 4 is arranged in the bottom box 1, an adjusting component 5 is arranged on the lower side wall of the bottom box 1, when jolting occurs during moving, the damping springs 2.2 can provide damping buffer for the chip testing machine 3, external force is prevented from directly acting on the chip testing machine 3, the dampers 2.1 can inhibit rebound vibration and absorb energy of road surface impact after the damping springs 2.2 absorb the vibration, the chip testing machine 3 is enabled to be fast and stable, and internal components are protected.
Specifically, as shown in fig. 4, a testing device for a semiconductor chip, the moving assembly 4 includes a supporting frame 4.1 fixedly connected to an inner wall at one side of the bottom case 1, a servo motor 4.2 is installed on the supporting frame 4.1, two symmetrically distributed bidirectional screws 4.3 are rotatably connected between inner walls at two sides of the bottom case 1, a driven gear 4.31 is fixedly connected to one end part of the bidirectional screws 4.3, which is close to the servo motor 4.2, an output shaft end of the servo motor 4.2 is fixedly connected with a driving gear 4.21, a transmission is arranged between the driving gear 4.21 and the driven gear 4.31, the driving gear 4.21 can be driven to rotate by an output shaft of the servo motor 4.2, so that the bidirectional screws 4.3 rotate under the transmission of the toothed belt 4.22, and when the servo motor 4.2 is reversed, the bidirectional screws 4.3 are reversed, and the purpose of controlling the bidirectional screws 4.3 to turn is achieved by controlling the servo motor 4.2.
Specifically, as shown in fig. 3, a testing device for a semiconductor chip, the moving assembly 4 further includes two moving blocks 4.4 screwed on the bidirectional screw 4.3, a movable plate 4.5 is slidingly connected between inner walls of two sides of the bottom case 1, a connecting rod 4.6 is hinged on a lower side wall of the moving block 4.4, the other end of the connecting rod 4.6 is hinged with an upper side wall of the movable plate 4.5, universal wheels 4.7 are fixedly connected at four corners on the lower side wall of the movable plate 4.5 respectively, when the bidirectional screw 4.3 rotates, the two moving blocks 4.4 screwed with the bidirectional screw are mutually close, under the action of the connecting rod 4.6, the movable plate 4.5 is stressed to move downwards, so that the universal wheels 4.7 contact the ground and prop up the bottom case 1, thereby moving, when the bidirectional screw 4.3 reverses, the two moving blocks 4.4 are mutually far away, under the driving of the connecting rod 4.6, the movable plate 4.5 drives the universal wheels 4.7 to rise, and the four supporting legs 5.3 contact the ground to form a supporting structure.
Specifically, as shown in fig. 3 and 5, a testing device for a semiconductor chip, the adjusting component 5 includes fixing sleeves 5.1 respectively fixedly connected to four corners on the lower side wall of the bottom case 1, threaded rods 5.2 are connected to the lower side wall of the fixing sleeves 5.1 through threads provided with threaded holes 5.11, the upper ends of the threaded rods 5.2 extend to the inside of the fixing sleeves 5.1 and are fixedly connected with limiting blocks 5.5, the lower ends of the threaded rods 5.2 are fixedly connected with supporting legs 5.3, the threaded rods 5.2 are rotated by hands, under the action of the threaded holes 5.11, the threaded rods 5.2 can move up and down in the fixing sleeves 5.1, so that the purpose of adjusting the heights of the supporting legs 5.3 is achieved, and the four supporting legs 5.3 provide horizontal support for the chip testing machine 3, and the problem that testing results are inaccurate due to the inclination of the chip testing machine 3 is prevented.
Specifically, as shown in fig. 5, in the testing device for a semiconductor chip, the lower ends of the supporting legs 5.3 are fixedly connected with the rubber anti-slip pads 5.4, so that the friction force between the supporting legs and the ground is increased, and the whole is more stable.
Specifically, as shown in fig. 1, a testing device for a semiconductor chip is provided, a storage battery 6 is installed on an outer wall of one side of a bottom case 1, a servo motor 4.2 is electrically connected with the storage battery 6, and the storage battery 6 can provide power for the servo motor 4.2 so as to ensure normal operation of the servo motor 4.2.
In the utility model, when the chip testing machine 3 is required to be moved, the servo motor 4.2 is started, the output shaft of the servo motor 4.2 drives the driving gear 4.21 to rotate, the driven gear 4.31 can drive the bidirectional screw 4.3 to rotate through the transmission of the toothed belt 4.22, two moving blocks 4.4 which are in threaded connection with the bidirectional screw 4.3 during rotation can be mutually close, under the action of the connecting rod 4.6, the movable plate 4.5 can descend, the universal wheel 4.7 contacts the ground and props up the bottom box 1, so that the chip testing machine 3 can be moved, when jolting is encountered during movement, the damping spring 2.2 can provide damping buffer for the chip testing machine 3, external force can be prevented from being directly acted on the chip testing machine 3, the damper 2.1 can inhibit rebound shock after the damping spring 2.2 absorbs shock and absorb energy of road surface impact, the chip testing machine 3 can be quickly stabilized, and internal components are protected, more practical, after moving to the destination, make servo motor 4.2 reverse, through the back two-way screw rod 4.3 reverse rotation of transmission, two movable blocks 4.4 can keep away from each other, fly leaf 4.5 rises under the pulling of connecting rod 4.6, drive universal wheel 4.7 and rise, four supporting legs 5.3 contact ground formation supports, make chip tester 3 more stable, when chip tester 3 is in the uneven ground of height, can rotate threaded rod 5.2 by hand, under the effect of screw hole 5.11, threaded rod 5.2 can reciprocate in fixed sleeve 5.1, thereby reach the purpose of adjusting supporting leg 5.3 height, make four supporting legs 5.3 provide horizontal support for chip tester 3, prevent to lead to the inaccurate scheduling problem of test result because of chip tester 3 slope, rubber slipmat 5.4 of supporting leg 5.3 lower extreme can increase the frictional force with ground, make whole more stable.
The foregoing has shown and described the basic principles and main features of the present utility model and the advantages of the present utility model. It will be understood by those skilled in the art that the present utility model is not limited to the embodiments described above, and that the above embodiments and descriptions are merely illustrative of the principles of the present utility model, and various changes and modifications may be made without departing from the spirit and scope of the utility model, which is defined in the appended claims. The scope of the utility model is defined by the appended claims and equivalents thereof.

Claims (6)

1. The testing device for the semiconductor chip comprises a bottom box (1), and is characterized in that: fixedly connected with connection box (2) on the upside outer wall of base tank (1), the downside inner wall four corners department of connection box (2) is fixedly connected with attenuator (2.1) respectively, the flexible end fixedly connected with chip test machine (3) of attenuator (2.1), the outside cover of attenuator (2.1) is equipped with damping spring (2.2), damping spring's (2.2) one end and the downside inner wall fixed connection and the other end and chip test machine (3) fixed connection of connection box (2), the inside of base tank (1) is equipped with movable assembly (4), be equipped with adjusting part (5) on the lower lateral wall of base tank (1).
2. The test apparatus for a semiconductor chip according to claim 1, wherein: the movable assembly (4) comprises a supporting frame (4.1) fixedly connected to the inner wall of one side of a bottom box (1), a servo motor (4.2) is installed on the supporting frame (4.1), two symmetrically distributed bidirectional screws (4.3) are rotationally connected between the inner walls of the two sides of the bottom box (1), one end part of each bidirectional screw (4.3) close to the servo motor (4.2) is fixedly connected with a driven gear (4.31), the output shaft end of each servo motor (4.2) is fixedly connected with a driving gear (4.21), and a toothed belt (4.22) is arranged between each driving gear (4.21) and each driven gear (4.31) for transmission.
3. The test apparatus for a semiconductor chip according to claim 2, wherein: the movable assembly (4) further comprises two movable blocks (4.4) which are connected onto the bidirectional screw rod (4.3) through threads, a movable plate (4.5) is connected between the inner walls of the two sides of the bottom box (1) in a sliding mode, a connecting rod (4.6) is hinged to the lower side wall of the movable block (4.4), the other end of the connecting rod (4.6) is hinged to the upper side wall of the movable plate (4.5), and universal wheels (4.7) are fixedly connected to the four corners of the lower side wall of the movable plate (4.5) respectively.
4. The test apparatus for a semiconductor chip according to claim 1, wherein: the adjusting component (5) comprises fixing sleeves (5.1) which are respectively and fixedly connected to four corners on the lower side wall of the bottom box (1), threaded rods (5.2) are connected to the lower side wall of the fixing sleeve (5.1) through threads provided with threaded holes (5.11), the upper ends of the threaded rods (5.2) extend to the inside of the fixing sleeve (5.1) and are fixedly connected with limiting blocks (5.5), and supporting legs (5.3) are fixedly connected to the lower ends of the threaded rods (5.2).
5. The test apparatus for a semiconductor chip according to claim 4, wherein: the lower ends of the supporting legs (5.3) are fixedly connected with rubber anti-slip pads (5.4).
6. The test apparatus for a semiconductor chip according to claim 2, wherein: and a storage battery (6) is arranged on the outer wall of one side of the bottom box (1), and the servo motor (4.2) is electrically connected with the storage battery (6).
CN202321468264.0U 2023-06-09 2023-06-09 Testing device for semiconductor chip Active CN220064289U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202321468264.0U CN220064289U (en) 2023-06-09 2023-06-09 Testing device for semiconductor chip

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202321468264.0U CN220064289U (en) 2023-06-09 2023-06-09 Testing device for semiconductor chip

Publications (1)

Publication Number Publication Date
CN220064289U true CN220064289U (en) 2023-11-21

Family

ID=88766762

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202321468264.0U Active CN220064289U (en) 2023-06-09 2023-06-09 Testing device for semiconductor chip

Country Status (1)

Country Link
CN (1) CN220064289U (en)

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