CN220063001U - Inertial device, circuit and electronic equipment - Google Patents

Abstract

The present disclosure relates to an inertial device, a circuit, and an electronic apparatus, wherein the inertial device includes a first sensing assembly having a first sample piece and a second sample piece, and a second sensing assembly having a first reference piece and a second reference piece, one of the first sample piece and the second sample piece being a movable sample piece; the first reference member and the second reference member are both fixed sampling members. According to the inertial device testing device, the second sensing assembly with the first reference piece and the second reference piece is used as the reference sensor assembly and used for detecting the condition that the sensor assembly is affected by the environment, so that the influence of environmental change can be removed in the inertial device testing, the testing is more accurate, and the inertial device testing requirement is met.

Description

Inertial device, circuit and electronic equipment

Technical Field

The present disclosure relates to the field of electronic technologies, and in particular, to an inertial device, a circuit, and an electronic device.

Background

Microelectromechanical systems (micro electro mechanical system, MEMS) refer to high-tech devices of a size of a few millimeters or even smaller, the internal structure of which is typically on the order of micrometers or even nanometers, and which are generally considered to be microsystems consisting of micromechanical sensors, actuators and microelectronic circuits, being a self-contained intelligent system. The MEMS device is a sensor as an inertial device and is widely applied to the fields of consumer electronics, industrial production, medical electronics, automotive electronics, aerospace, military and the like.

Since the sensor assembly of the inertial device is relatively greatly affected by the environment, such as stress variation and temperature variation, the influence on the sensor assembly has a problem of inaccurate test, and the test requirement of the inertial device cannot be satisfied.

Disclosure of Invention

To overcome the problems in the related art, the present disclosure provides an inertial device, a circuit, and an electronic apparatus.

According to a first aspect of embodiments of the present disclosure, there is provided an inertial device comprising: a first sensing assembly having a first sample piece and a second sample piece, one of the first sample piece and the second sample piece being a movable sample piece; and a second sensing assembly having a first reference member and a second reference member, both of which are stationary sampling members.

In some embodiments, the first reference member and the first sample member are the same material and shape, and the second reference member and the second sample member are the same material and shape.

In some embodiments, the relative positional relationship of the first reference member and the second reference member is the same as the relative positional relationship of the first sample member and the second sample member.

In some embodiments, the first reference member includes a first tooth, the second reference member includes a second tooth, a preset gap is provided between the first tooth and the second tooth, and the first tooth and the second tooth are electrically connected to a power connection end, where the power connection end is used for connecting a sampling circuit.

In some embodiments, the first reference comprises a plurality of the first teeth spaced apart from each other and the second reference comprises a plurality of the second teeth spaced apart from each other.

In some embodiments, the first sampling element includes a third tooth, the second sampling element includes a fourth tooth, a preset gap is provided between the third tooth and the fourth tooth, and the third tooth and the fourth tooth are electrically connected to a power connection end, and the power connection end is used for connecting a sampling circuit.

In some embodiments, the first sampling member includes a plurality of the third teeth spaced apart from each other and the second sampling member includes a plurality of the fourth teeth spaced apart from each other.

In some embodiments, the inertial device further comprises: the device comprises a suspension frame, a first sampling piece, a first mass block and a second sampling piece, wherein the first sampling piece is arranged on the suspension frame, the second sampling piece is arranged on the first mass block, and the first mass block is connected with the suspension frame through an elastic connecting piece.

In some embodiments, the inertial device further comprises: the first reference piece is arranged on the suspension frame, the second reference piece is arranged on the second mass block, and the second mass block is fixedly connected with the suspension frame.

In some embodiments, the inertial device includes a plurality of the second sensing assemblies, each of the second sensing assemblies being disposed corresponding to a first dimension, a second dimension, or a third dimension, respectively.

In some embodiments, the inertial device includes any one or more of an accelerometer, a gyroscope, a pressure sensor, a magnetic sensor, and a vibration sensor.

According to a second aspect of embodiments of the present disclosure, there is provided a circuit comprising an inertial device as described in any of the embodiments of the first aspect above.

In some embodiments, the circuit comprises: the control module is connected to the calibration module, the two sampling modules are respectively and electrically connected to the first sensing assembly and the second sensing assembly, the two sampling modules are connected to the calibration module, the calibration module is provided with a comparison unit, and the comparison unit subtracts the electric signal of the second sensing assembly from the electric signal of the first sensing assembly.

According to a third aspect of embodiments of the present disclosure, there is provided an electronic device comprising an inertial device according to any one of the embodiments of the first aspect described above; or comprises a circuit as described in any of the embodiments of the second aspect above.

The technical scheme provided by the embodiment of the disclosure can comprise the following beneficial effects: the present disclosure provides an inertial device having a first sensing assembly of a first sample piece and a second sample piece, one of the first sample piece and the second sample piece being a movable sample piece; the second sensing assembly is provided with a first reference piece and a second reference piece, and the first reference piece and the second reference piece are fixed sampling pieces. According to the inertial device testing device, the second sensing assembly with the first reference piece and the second reference piece is used as the reference sensor assembly and used for detecting the condition that the sensor assembly is affected by the environment, so that the influence of environmental change can be removed in the inertial device testing, the testing is more accurate, and the inertial device testing requirement is met.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosure.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the disclosure and together with the description, serve to explain the principles of the disclosure.

Fig. 1 is a schematic diagram illustrating a structure of an inertial device according to an exemplary embodiment.

Fig. 2 is a schematic diagram of a structure of another inertial device according to an example embodiment.

Fig. 3 is a schematic diagram illustrating a structure of a first sensing assembly according to an exemplary embodiment.

Fig. 4 is a schematic structural view of another first sensing assembly according to an exemplary embodiment.

Fig. 5 is a schematic diagram of a circuit according to an exemplary embodiment.

Reference numerals:

100. a first sensing assembly; 101. a first sampling member; 1011. a third tooth; 102. a second sampling member; 1021. a fourth tooth; 1001. a first mass; 1002. a movable comb; 1003. fixing comb teeth; 1004. an elastic connection member;

200. a second sensing assembly; 201. a first reference member; 2011. a first tooth; 202. a second reference member; 2021. a second tooth; 2001. a second mass; 2002. a first fixed comb; 2003. a second fixed comb; 2004. fixing the connecting piece;

300. a suspension frame;

400. a control module; 500. a sampling module; 600 calibration module, 601, comparison unit.

Detailed Description

Reference will now be made in detail to exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, the same numbers in different drawings refer to the same or similar elements, unless otherwise indicated. The implementations described in the following exemplary examples are not representative of all implementations consistent with the present disclosure. Rather, they are merely examples of apparatus and methods consistent with some aspects of the present disclosure as detailed in the accompanying claims.

The zero offset is defined as follows: inertial devices, represented by gyroscopes and accelerometers, typically take a mean of measured values over a period of time to eliminate noise effects, with non-zero output values without input. The unit is deg/h (rate integration gyro), g (accelerometer). In inertial navigation systems, the zero offset is typically subtracted out as a constant error, and whether this operation is effective in suppressing the accumulated integrated error depends on whether the zero offset itself is accurate.

In the related art, a static zero offset value, i.e. a compensation value, is obtained by calibration in a static state, and the value should be zero in a perfect state. When the electronic equipment comprising the inertia device moves, detecting a current movement value, and subtracting the zero offset value from the current movement value, namely the actual movement state value of the electronic equipment. Calibration must be performed in a stationary state to obtain a zero offset value for algorithmic compensation.

However, since the inertial device is very sensitive to environmental changes such as stress changes and temperature changes. Electronic equipment comprising an inertial device can generate excessive zero bias for the inertial device due to factors such as installation stress, temperature change of heating when the electronic equipment works and the like. If the zero offset value is different from the environment obtained by the current motion value, the problem of inaccurate test exists, and the test requirement of an inertial device cannot be met.

In order to solve the technical problems, the present disclosure provides an inertial device, a circuit and an electronic apparatus.

According to a first aspect of embodiments of the present disclosure, an inertial device is provided, and fig. 1 is a schematic structural diagram of an inertial device according to an exemplary embodiment. Fig. 2 is a schematic diagram of a structure of another inertial device according to an example embodiment.

As shown in fig. 1-2, the inertial device includes: the first sensing assembly 100 and the second sensing assembly 200.

The first sensing assembly 100 has a first sample piece 101 and a second sample piece 102, one of the first sample piece 101 and the second sample piece 102 being a movable sample piece; the second sensing assembly 200 has a first reference member 201 and a second reference member 202, both of which are stationary sampling members 201 and 202.

The inertial device can measure the inertial force and finally output the inertial force in an electrical signal manner. The inertial devices in the present disclosure may also be referred to as inertial sensors, inertial measurement devices, and the like. The sensing assembly is used for measuring inertial force, such as linear acceleration or angular velocity, and is a core component of an inertial device.

The first sensing assembly 100 is configured to implement real-time measurement of an inertial force, and is configured to obtain a sampled value of the inertial force of the motion carrier in a current motion form; for example, the linear acceleration or angular velocity, etc. The second sensing assembly 200 is used for realizing real-time measurement of inertial force and obtaining zero offset value of the inertial force under the current motion form of the motion carrier; for example, the linear acceleration or angular velocity, etc. And subtracting the zero offset value from the sampling value to obtain the actual motion state value of the motion carrier.

One of the first sample piece 101 and the second sample piece 102 is a movable sample piece, and illustratively, the first sample piece 101 is a movable sample piece, the second sample piece 102 is a fixed sample piece, and the first sample piece 101 and the second sample piece 102 together acquire a sampling value of an inertial force under a current motion form of the motion carrier. Illustratively, the first sample piece 101 is a fixed sample piece, and the second sample piece 102 is a movable sample piece, and the first sample piece 101 and the second sample piece 102 together acquire a sampled value of an inertial force in a current motion form of the motion carrier.

The first reference piece 201 and the second reference piece 202 are fixed sampling pieces, and the first reference piece 201 and the second reference piece 202 together acquire zero offset values of inertial force under the current motion mode of the motion carrier.

In the present disclosure, a first sensing assembly 100 having a first sample piece 101 and a second sample piece 102, one of the first sample piece 101 and the second sample piece 102 being a movable sample piece; the second sensing assembly 200 having the first reference member 201 and the second reference member 202, both the first reference member 201 and the second reference member 202 are stationary sampling members. The second sensing assembly 200 with the first reference member 201 and the second reference member 202 is used as a reference sensor assembly for detecting the condition of the sensor assembly affected by the environment, so that the influence of the environment change can be removed in the test of the inertial device, the test is more accurate, and the test requirement of the inertial device is met.

In some embodiments, as shown in fig. 1-2, the first reference piece 201 is the same material and shape as the first sample piece 101, and the second reference piece 202 is the same material and shape as the second sample piece 102.

Since the first sensing component 100 and the second sensing component 200 need to have conductive properties, the first reference member 201 and the first sample member 101, and the second reference member 202 and the second sample member 102 are all made of conductive materials.

Illustratively, the first reference 201 and the first sample 101, the second reference 202 and the second sample 102 are all semiconductor materials. Further, the first reference member 201 and the first sampling member 101 may be silicon, polysilicon or any other semiconductor material. The second reference member 202 and the second sampling member 102 may be silicon, polysilicon, or any other semiconductor material, which is not particularly limited in the embodiments of the present disclosure.

The first reference member 201 and the first sample member 101 may have the same shape, and the cross-sectional shapes of the first reference member 201 and the first sample member 101 may be rectangular, circular, elliptical, square, triangular, etc., the second reference member 202 and the second sample member 102 may have the same shape, and the cross-sectional shapes of the second reference member 202 and the second sample member 102 may be rectangular, circular, elliptical, square, triangular, etc., which is not particularly limited in this disclosure.

In the embodiment of the disclosure, the second sensing assembly 200 having the first reference member 201 and the second reference member 202 is used as a reference sensor assembly to obtain a zero offset value of an inertial force of a current motion form of the motion carrier, to detect an environment influence condition of the sensor assembly, and the first sensing assembly 100 having the first sampling member 101 and the second sampling member 102 is used as a sampling sensor assembly to obtain a sampling value of the inertial force of the current motion form of the motion carrier, and the sampling value is subtracted by the zero offset value, that is, an actual motion state value of the motion carrier, so that the influence of the environment change can be removed in the test of the inertial device, the test is more accurate, and the test requirement of the inertial device is satisfied.

In some embodiments, as shown in fig. 1-2, the relative positional relationship of the first reference member 201 and the second reference member 202 is the same as the relative positional relationship of the first sample member 101 and the second sample member 102.

For example, the relative positional relationship between the first reference member 201 and the second reference member 202 may be staggered, and the relative positional relationship between the first sample member 101 and the second sample member 102 may be staggered.

In the embodiment of the disclosure, the second sensing assembly 200 with the first reference member 201 and the second reference member 202 is used as a reference sensor assembly, the first reference member 201 and the second reference member 202 cannot cause output value change due to change of motion form of the motion carrier, the first reference member 201 and the second reference member 202 are only used for detecting zero offset caused by stress change and temperature change, and are used for detecting the condition that the sensor assembly is affected by environment, the first sensing assembly 100 with the first sampling member 101 and the second sampling member 102 is used as a sampling sensor assembly, and is used for obtaining a sampling value of inertial force of the motion carrier in the current motion form, and subtracting the zero offset value, namely the actual motion state value of the motion carrier, so that the influence of environment change can be removed in the test of the inertial device, the test is more accurate, and the test requirement of the inertial device is met.

In some embodiments, as shown in fig. 1-2, the first reference member 201 includes a first tooth 2011, the second reference member 202 includes a second tooth 2021, a predetermined gap is provided between the first tooth 2011 and the second tooth 2021, and the first tooth 2011 and the second tooth 2021 are electrically connected to a power connection terminal, which is used for connecting a sampling circuit.

The relative positions of the first reference element 201 and the second reference element 202 together define a reference capacitance, and the reference capacitance is transmitted to the sampling circuit through the power connection end, because the capacitance of the second sensing assembly 200 changes due to external environmental factors such as stress changes and temperature changes, the sensor assembly is detected to be affected by the environment according to the capacitance change signal, and real-time calibration is realized without static conditions. The predetermined gap between the first tooth 2011 and the second tooth 2021 is determined according to design requirements, and embodiments of the present disclosure are not particularly limited thereto.

It should be noted that the sampling circuit is used to collect the electrical signal of the second sensing assembly 200.

Further, the first reference member 201 includes a plurality of the first teeth 2011 spaced apart from each other, and the second reference member 202 includes a plurality of the second teeth 2021 spaced apart from each other.

Adjacent two first teeth 2011 are disposed in parallel and adjacent two second teeth 2021 are disposed in parallel. The first teeth 2011 and the second teeth 2021 are arranged in parallel and spaced apart, so long as the relative positions of the first reference member 201 and the second reference member 202 can be guaranteed to jointly define a reference capacitance, the relative positions of the first teeth 2011 and the second teeth 2021 are not specifically limited in the embodiment of the present disclosure.

In the embodiment of the disclosure, the first reference member 201 includes a plurality of first teeth 2011 spaced apart from each other, the second reference member 202 includes a plurality of second teeth 2021 spaced apart from each other, and the first teeth 2011 on the first reference member 201 are staggered with two adjacent second teeth 2021 on the second reference member 202, so as to form a reference capacitor, the reference capacitor does not change the output value due to the change of the motion form of the motion carrier, and the reference capacitor is only used for detecting the zero offset caused by the stress change and the temperature change, and is used for detecting the condition that the sensor assembly is affected by the environment, and the real-time calibration is realized without the static condition.

In some embodiments, as shown in fig. 1-2, the first sampling member 101 includes a third tooth 1011, the second sampling member 102 includes a fourth tooth 1021, a predetermined gap is provided between the third tooth 1011 and the fourth tooth 1021, and the third tooth 1011 and the fourth tooth 1021 are electrically connected to a power connection terminal for connection of a sampling circuit.

The relative positions of the first sampling element 101 and the second sampling element 102 together define a sampling capacitor, and the sampling capacitor is transmitted to the sampling circuit through the power connection end, because the change of the motion form of the motion carrier and the external environmental factors such as stress change and temperature change can all cause the capacitance of the first sensing assembly 100 to change, and the sampling value of the current motion carrier is obtained according to the capacitance change signal. The preset gap between the third tooth 1011 and the fourth tooth 1021 is determined according to design requirements, and the embodiment of the present disclosure is not limited thereto.

It should be noted that the sampling circuit is used to collect the electrical signal of the first sensing assembly 100. The fourth tooth 1021 is movable.

Further, the first sampling member 101 includes a plurality of the third teeth 1011 spaced apart from each other, and the second sampling member 102 includes a plurality of the fourth teeth 1021 spaced apart from each other.

Two adjacent third teeth 1011 are arranged in parallel, and two adjacent fourth teeth 1021 are arranged in parallel. The third tooth 1011 and the fourth tooth 1021 are arranged in parallel at intervals, so long as the relative positions of the first sampling member 101 and the second sampling member 102 can be guaranteed to jointly define a sampling capacitance, and the relative positions of the third tooth 1011 and the fourth tooth 1021 are not particularly limited in the embodiment of the present disclosure.

In the disclosed embodiment, the first sampling member 101 includes a plurality of third teeth 1011 disposed at intervals, and two adjacent third teeth 1011 are disposed in parallel. The second sampling member 102 includes a plurality of fourth teeth 1021 arranged at intervals, two adjacent fourth teeth 1021 are arranged in parallel, and a third tooth 1011 on the first sampling member 101 is staggered with two adjacent fourth teeth 1021 on the second sampling member 102, so as to form a sampling capacitor, the sampling capacitor can displace the second sampling member 102 relative to the first sampling member 101 due to the change of the motion form of the motion carrier and external environmental factors such as stress change and temperature change, so that the distance between the fourth tooth 1021 and the third tooth 1011 is changed, thereby causing the change of the capacitor, and the sampling value of the current motion carrier is obtained according to the sampling capacitor.

In some embodiments, as shown in fig. 2, the inertial device further includes: the levitation frame 300 and the first mass 1001.

The first sampling member 101 is disposed on the suspension frame 300, the second sampling member 102 is disposed on the first mass block 1001, and the first mass block 1001 is connected to the suspension frame 300 through the elastic connection member 1004.

Wherein the levitation frame 300 may be made of an insulating material. The elastic connection member 1004 may be understood that the elastic connection member 1004 may be deformed when receiving an inertial force, and the elastic connection member 1004 may be restored when the inertial force is removed. The first mass 1001 may be a cuboid block, or may be other three-dimensional structures, which is not specifically limited in the embodiments of the present disclosure.

In the embodiment of the disclosure, by using the first sensing assembly 100 having the first sampling member 101 and the second sampling member 102 as the sampling sensor assembly, the elastic connection member 1004 may deform when receiving the inertial force, and further the first mass 1001 drives the second sampling member 102 to move relative to the first sampling member 101, and when the inertial force disappears, the elastic connection member 1004 resets.

In some embodiments, as shown in fig. 2, the inertial device further includes: a second mass 2001.

The first reference member 201 is disposed on the levitation frame 300, the second reference member 202 is disposed on the second mass 2001, and the second mass 2001 is fixedly connected to the levitation frame 300.

Wherein the levitation frame 300 may be made of an insulating material. The second mass 2001 may be a rectangular block, or may be other three-dimensional structures, which are not specifically limited in this disclosure.

The second mass 2001 is fixedly connected to the levitation frame 300, in particular, the second mass 2001 is connected to the levitation frame 300 by a fixed connection 2004. The fixed connection 2004 does not deform when subjected to inertial forces.

In the embodiment of the present disclosure, the second sensing assembly 200 with the first reference member 201 and the second reference member 202 is used as a reference sensor assembly to obtain the zero offset value of the inertial force of the motion carrier in the current motion mode, and is only used to detect the condition that the sensor assembly is affected by the environment.

In some embodiments, the inertial device includes a plurality of second sensing assemblies 200, each of the second sensing assemblies 200 being disposed corresponding to a first dimension, a second dimension, or a third dimension, respectively.

Illustratively, the second sensing assembly 200 may be three, and the first and second dimensions are X-axis and Y-axis directions, respectively. Each second sensing assembly 200 is configured to implement real-time measurement of an inertial force, and is configured to obtain a zero offset value of the inertial force in a current motion form of the motion carrier; for example, the linear acceleration or angular velocity, etc.

Illustratively, the second sensing assembly 200 may be three, and accordingly, the first, second and third dimensions are X-axis, Y-axis and Z-axis directions, respectively. Each second sensing assembly 200 is configured to implement real-time measurement of an inertial force, and is configured to obtain a zero offset value of the inertial force in a current motion form of the motion carrier; for example, the linear acceleration or angular velocity, etc.

In some embodiments, the inertial device includes any one or more of an accelerometer, a gyroscope, a pressure sensor, a magnetic sensor, and a vibration sensor.

The inertial device in the embodiments of the present disclosure may be an inertial measurement device such as an accelerometer or a gyroscope, and in addition, may be a pressure sensor, a magnetic sensor, a vibration sensor, or the like, to which the embodiments of the present disclosure are not limited.

The inertial device is taken as an example of a capacitive accelerometer, and the first sensing assembly 100 and the second sensing assembly 200 in the embodiments of the present disclosure are further described with reference to fig. 1-4.

It should be noted that the working principle of the capacitive accelerometer is an inertial effect. The basic structure of the capacitance type accelerometer for detecting the capacitance is a movable electrode and a fixed electrode, when the sensitive mass block is displaced by the inertia force generated by acceleration, the area or the distance between the opposite polar plates of the capacitance is changed, and the acceleration is measured by measuring the change of the capacitance.

As shown in fig. 2, the inertial device includes a first sensing assembly 100 and a second sensing assembly 200.

The second sensing assembly 200 includes a second mass 2001, a first fixed comb 2002, a second fixed comb 2003, and a fixed connection 2004.

Wherein the second mass 2001 is connected to the levitation frame 300 through a plurality of fixed connection members 2004 such that the second mass 2001 cannot move under the effect of inertial force.

The first fixed comb 2002 is connected to the second mass 2001 and extends in an outer direction with respect to the second mass 2001, and the first fixed comb 2002 includes a plurality of comb teeth arranged in parallel, and the pitches of adjacent comb teeth are the same. The plurality of first fixed comb teeth 2002 are electrically connected by the second mass 2001.

The second fixed comb 2003 is fixedly disposed outside the second mass 2001 and extends in the direction of the second mass 2001, and the second fixed comb 2003 includes a plurality of comb teeth disposed in parallel and adjacent comb teeth are equally spaced. The first fixed comb teeth 2002 and the second fixed comb teeth 2003 are oppositely matched and arranged, specifically, the first fixed comb teeth 2002 and the second fixed comb teeth 2003 are arranged at parallel intervals, and a parallel plate capacitor is formed between the first fixed comb teeth 2002 and the second fixed comb teeth, and the capacitor is only used for detecting zero offset caused by stress change and temperature change and is used for detecting the condition that the sensor assembly is affected by the environment.

The first sensing assembly 100 includes a first mass 1001, movable comb teeth 1002, fixed comb teeth 1003, and elastic connection 1004.

Wherein, the first mass 1001 is connected with the levitation frame 300 through a plurality of elastic connection members 1004, the elastic connection members 1004 have a certain elasticity, so that the first mass 1001 can move under the action of inertial force, and when the inertial force disappears, the first mass 1001 can be restored to the original position.

The movable comb 1002 is connected to the first mass 1001 and extends in an outer direction with respect to the first mass 1001, and the movable comb 1002 includes a plurality of comb teeth arranged in parallel with the adjacent comb teeth being equally spaced. A plurality of movable combs 1002 are electrically connected by a first mass 1001.

The fixed comb teeth 1003 are fixedly disposed outside the first mass 1001 and extend toward the first mass 1001, and the fixed comb teeth 1003 include a plurality of comb teeth disposed in parallel and the pitches of adjacent comb teeth are the same. The fixed comb teeth 1003 are disposed in opposition to the movable comb teeth 1002, specifically, the fixed comb teeth 1003 are disposed in parallel with the movable comb teeth 1002 with a parallel plate capacitor therebetween.

Specifically, as shown in fig. 3, there are two fixed comb teeth 1003, and accordingly, there are two movable comb teeth 1002, and the two fixed comb teeth 1003 are disposed on the same side as each other and have opposite electric polarities. Each of the movable comb teeth 1002 is staggered with each of the corresponding fixed comb teeth 1003, and the fixed comb teeth 1003 and the movable comb teeth 1002 form a differential capacitance.

Specifically, as shown in fig. 4, there are four fixed comb teeth 1003, correspondingly, there are four movable comb teeth 1002, two fixed comb teeth 1003 arranged opposite to each other up and down are connected by a metal lead, and the electric polarities of the two fixed comb teeth 1003 arranged on the same side are opposite. Each of the movable comb teeth 1002 is staggered with each of the corresponding fixed comb teeth 1003, and the fixed comb teeth 1003 and the movable comb teeth 1002 form a differential capacitance.

Under the differential detection condition, the capacitance variation in the X-axis direction is only related to the displacement in the X-axis direction and is not related to the displacement in the Y-axis and Z-axis directions, so that the interference of the Y-axis and the Z-axis is eliminated; the capacitance variation in the Y-axis direction is only related to the displacement in the Y-axis direction and is not related to the displacement in the X-axis and Z-axis directions, so that the interference of the X-axis and the Z-axis is eliminated; the capacitance change in the Z-axis direction is related to the displacement in the Z-axis direction only, and is unrelated to the displacement in the X-axis and Y-axis directions, so that the interference of the X-axis and the Y-axis is eliminated. The magnitude and direction of the acceleration can be calculated using differential measurement techniques well known in the art.

Based on the same inventive concept, according to a second aspect of embodiments of the present disclosure, there is provided a circuit comprising an inertial device as in any of the embodiments of the first aspect described above.

In the present disclosure, the circuit is used to collect the electrical signal of the first sensing assembly 100 and the electrical signal of the second sensing assembly 200, and process the collected electrical signals. The method can remove the influence of environmental change in the test of the inertial device, so that the test is more accurate, and the test requirement of the inertial device is met.

In some embodiments, as shown in fig. 5, the circuit includes: the control module 400, the sampling module 500 and the calibration module 600, the control module 400 is connected to the calibration module 600, the two sampling modules 500 are respectively electrically connected to the first sensing component 100 and the second sensing component 200, the two sampling modules 500 are connected to the calibration module 600, and the calibration module 600 has a comparison unit 601, and the comparison unit 601 subtracts the electrical signal of the second sensing component 200 from the electrical signal of the first sensing component 100.

In the disclosed embodiment, one of the two sampling modules 500 is used to collect an electrical signal change, such as a capacitance change signal, of the first sensing assembly 100; because the change of the motion form of the motion carrier and the external environmental factors such as stress change and temperature change can cause the electric signal of the first sensing assembly 100 to change, the sampling value of the current motion carrier is obtained according to the electric signal.

The other of the two sampling modules 500 is used for acquiring an electrical signal change, such as a capacitance change signal, of the second sensing assembly 200; because external environmental factors such as stress change and temperature change can cause the electric signal of the second sensing component 200 to change, a zero offset value is obtained according to the electric signal, and the sampling value is subtracted by the zero offset value, namely the actual motion state value of the motion carrier. The change in the electrical signal of the second sensor assembly 200 is used to detect environmental conditions of the sensor assembly, and real-time calibration is achieved without the need for stationary conditions.

Based on the same inventive concept, according to a third aspect of embodiments of the present disclosure, there is provided an electronic device comprising an inertial device as in any of the embodiments of the first aspect described above, or comprising a circuit as in any of the embodiments of the second aspect described above.

The electronic device may include, but is not limited to, a mobile or fixed terminal with the above-mentioned inertial device, such as a mobile phone, a tablet computer, a notebook computer, an ultra-mobile personal computer (UMPC), a handheld computer, an intercom, a netbook, a Point of sale (POS), a personal digital assistant (personal digital assistant, PDA), a wearable device, a virtual reality device, a wireless U-disc, a bluetooth sound/earphone, or a vehicle front-mounted device, a vehicle recorder, a security device, etc.

In the present disclosure, when a user invokes an inertial device using an electronic device, the second sensing assembly 200 having the first reference member 201 and the second reference member 202 is used as a reference sensor assembly to obtain a zero offset value of an inertial force of a current motion form of a motion carrier, to detect an environment influence condition of the sensor assembly, the first sensing assembly 100 having the first sampling member 101 and the second sampling member 102 is used as a sampling sensor assembly to obtain a sampling value of the inertial force of the current motion form of the motion carrier, and the sampling value is subtracted by the zero offset value, that is, an actual motion state value of the motion carrier, so that the influence of the environment change can be removed in the test of the inertial device, so that the test is more accurate, and the test requirement of the inertial device is satisfied.

It is understood that the term "plurality" in this disclosure means two or more, and other adjectives are similar thereto. "and/or", describes an association relationship of an association object, and indicates that there may be three relationships, for example, a and/or B, and may indicate: a exists alone, A and B exist together, and B exists alone. The character "/" generally indicates that the context-dependent object is an "or" relationship. The singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.

It is further understood that the terms "first," "second," and the like are used to describe various information, but such information should not be limited to these terms. These terms are only used to distinguish one type of information from another and do not denote a particular order or importance. Indeed, the expressions "first", "second", etc. may be used entirely interchangeably. For example, first information may also be referred to as second information, and similarly, second information may also be referred to as first information, without departing from the scope of the present disclosure.

It will be further understood that the terms "center," "longitudinal," "transverse," "front," "rear," "upper," "lower," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like, as used herein, refer to an orientation or positional relationship based on that shown in the drawings, merely for convenience in describing the present embodiments and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operate in a particular orientation.

It will be further understood that "connected" includes both direct connection where no other member is present and indirect connection where other element is present, unless specifically stated otherwise.

It will be further understood that although operations are depicted in the drawings in a particular order, this should not be understood as requiring that such operations be performed in the particular order shown or in sequential order, or that all illustrated operations be performed, to achieve desirable results. In certain circumstances, multitasking and parallel processing may be advantageous.

Other embodiments of the disclosure will be apparent to those skilled in the art from consideration of the specification and practice of the disclosure disclosed herein. This disclosure is intended to cover any adaptations, uses, or adaptations of the disclosure following the general principles of the disclosure and including such departures from the present disclosure as come within known or customary practice within the art to which the disclosure pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the disclosure being indicated by the following claims.

It is to be understood that the present disclosure is not limited to the precise arrangements and instrumentalities shown in the drawings, and that various modifications and changes may be effected without departing from the scope thereof. The scope of the present disclosure is limited only by the scope of the appended claims.

Claims (14)

1. An inertial device, comprising:

a first sensing assembly having a first sample piece and a second sample piece, one of the first sample piece and the second sample piece being a movable sample piece; the method comprises the steps of,

the second sensing assembly is provided with a first reference piece and a second reference piece, and the first reference piece and the second reference piece are fixed sampling pieces.

2. An inertial device as claimed in claim 1, characterized in that,

the first reference piece and the first sampling piece are the same in material and shape, and the second reference piece and the second sampling piece are the same in material and shape.

3. An inertial device as claimed in claim 1, characterized in that,

the relative positional relationship between the first reference member and the second reference member is the same as the relative positional relationship between the first sample member and the second sample member.

4. An inertial device as claimed in claim 1, characterized in that,

the first reference piece comprises a first tooth, the second reference piece comprises a second tooth, a preset gap is reserved between the first tooth and the second tooth, the first tooth and the second tooth are electrically connected to a power-on end, and the power-on end is used for connecting a sampling circuit.

5. The inertial device of claim 4, wherein the inertial device is configured to,

the first reference member includes a plurality of the first teeth spaced apart from each other and the second reference member includes a plurality of the second teeth spaced apart from each other.

6. An inertial device as claimed in claim 1, characterized in that,

the first sampling piece comprises a third tooth, the second sampling piece comprises a fourth tooth, a preset gap is reserved between the third tooth and the fourth tooth, the third tooth is electrically connected with the fourth tooth at an electric connection end, and the electric connection end is used for connecting a sampling circuit.

7. The inertial device of claim 6, wherein the inertial device is configured to,

the first sampling member includes a plurality of the third teeth spaced apart from each other and the second sampling member includes a plurality of the fourth teeth spaced apart from each other.

8. The inertial device of claim 1, further comprising:

a suspension frame, the first sampling member is arranged on the suspension frame, and,

the first mass block, the second sampling piece set up in the first mass block, the first mass block pass through elastic connection spare connect in the suspension frame.

9. The inertial device of claim 8, further comprising:

the first reference piece is arranged on the suspension frame, the second reference piece is arranged on the second mass block, and the second mass block is fixedly connected with the suspension frame.

10. An inertial device as claimed in claim 1, characterized in that,

the sensor comprises a plurality of second sensing assemblies, and each second sensing assembly is arranged corresponding to the first dimension, the second dimension or the third dimension respectively.

11. An inertial device as claimed in claim 1, characterized in that,

the inertial device includes any one or more of an accelerometer, a gyroscope, a pressure sensor, a magnetic sensor, and a vibration sensor.

12. A circuit comprising an inertial device according to any one of claims 1 to 11.

13. The circuit of claim 12, comprising: the control module is connected to the calibration module, the two sampling modules are respectively and electrically connected to the first sensing assembly and the second sensing assembly, the two sampling modules are connected to the calibration module, the calibration module is provided with a comparison unit, and the comparison unit subtracts the electric signal of the second sensing assembly from the electric signal of the first sensing assembly.

14. An electronic device, comprising

Inertial device according to any of the preceding claims 1-11; or,

a circuit comprising any of the above claims 12-13.