CN220052512U - Cooling die - Google Patents
Cooling die Download PDFInfo
- Publication number
- CN220052512U CN220052512U CN202321698655.1U CN202321698655U CN220052512U CN 220052512 U CN220052512 U CN 220052512U CN 202321698655 U CN202321698655 U CN 202321698655U CN 220052512 U CN220052512 U CN 220052512U
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- CN
- China
- Prior art keywords
- pipe
- fixed
- die
- water storage
- storage tank
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 238000001816 cooling Methods 0.000 title claims abstract description 25
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 73
- 238000003860 storage Methods 0.000 claims abstract description 40
- 239000004065 semiconductor Substances 0.000 claims abstract description 10
- 239000000463 material Substances 0.000 claims abstract description 9
- 238000001914 filtration Methods 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000003723 Smelting Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000000071 blow moulding Methods 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 238000004512 die casting Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 238000005242 forging Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000012778 molding material Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000005057 refrigeration Methods 0.000 description 1
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
The utility model discloses a cooling die, which comprises a lower die and a die holder, wherein a pipe rack for cooling the interior of the lower die is fixed on the outer side screw of the lower die, a connecting pipe extending into a water storage tank arranged in the die holder is fixed on one side screw of the pipe rack, a fan B for accelerating the air flow rate of the surface of a semiconductor refrigerating sheet arranged on the inner side of the die holder is fixed on the outer side screw of the water storage tank, a branch pipe B for conveying water into a pump body is inserted on one side of the water storage tank, a branch pipe A for conveying water into the pipe rack on one side of a fixed pipe is fixed on one side screw of the pump body, and a fixed plate for connecting the fan A is fixed on the outer side screw of the pipe rack; according to the utility model, through the pipe frame, the connecting pipe, the fixed pipe, the branch pipe A, the branch pipe B, the pump body, the fan A, the semiconductor refrigerating sheet, the fan B and the heat conducting layer, the problem that the lower die is inconvenient to cool and the material in the die cannot be rapidly cooled and molded when the conventional die is used is solved.
Description
Technical Field
The utility model relates to the technical field of dies, in particular to a cooling die.
Background
The mould is used for producing various moulds and tools for injection moulding, blow moulding, extrusion, die casting or forging, smelting, stamping and other methods to obtain required products, the mould is used for manufacturing shaped articles, the tool is composed of various parts, and different moulds are composed of different parts.
The patent number 201120533567.7 discloses a die, and the device improves the quality of products after casting, reduces the labor intensity of operators, and prevents the harm of splashing materials to the personal safety of the operators in the vibration process. Is suitable for popularization and application in the field of mold design and manufacture.
However, when the existing mold is used, the mold is cooled by air cooling, however, the cooling surface of the mold is uneven due to single air cooling, the molding speed of materials in the mold is low, and the processing efficiency of the materials is affected to a certain extent, so that the cooling mold is arranged.
Disclosure of Invention
The utility model mainly aims to provide a cooling die, which solves the problems that the lower die is inconvenient to cool and the materials in the die cannot be rapidly cooled and molded when the conventional die is used by arranging a pipe frame, a connecting pipe, a fixed pipe, a branch pipe A, a branch pipe B, a pump body, a fan A, a semiconductor refrigerating sheet, a fan B and a heat conducting layer.
In order to achieve the above purpose, the technical scheme adopted by the utility model is as follows:
the cooling die comprises a lower die and a die holder, wherein a pipe rack for cooling the interior of the lower die is fixed on the outer side of the lower die through screws, a connecting pipe extending into a water storage tank arranged in the die holder is fixed on one side of the pipe rack through screws, a fan B for accelerating the air flow rate of the surface of a semiconductor refrigerating sheet arranged on the inner side of the die holder is fixed on the outer side of the water storage tank through screws, a branch pipe B for conveying water into a pump body is inserted on one side of the water storage tank, a branch pipe A for conveying water into the pipe rack on one side of a fixed pipe is fixed on one side of the pump body through screws, a fixed plate connected with the fan A is fixed on the outer side of the pipe rack, and an upper die for forming materials is arranged on one side of the lower die;
further, a filter screen for filtering water entering the branch pipe B is fixed in the water storage tank through screws, and a motor for driving the connecting plate to scrape on the surface of the filter screen is fixed on one side of the filter screen through screws; filtering the water entering the branch pipe B through the installed filter screen;
further, the power output end of the motor is connected with the power input end of the connecting plate; the connecting plate is driven to rotate by the installed motor;
further, a heat conduction layer for radiating water in the water storage tank is adhered to the outer side of the water storage tank; the heat dissipation treatment is carried out on the water in the water storage tank through the arranged heat conduction layer;
further, the input ends of the motor and the pump body are electrically connected with the output end of an external power supply; the electric equipment works normally by connecting an external power supply.
Compared with the prior art, the utility model has the following beneficial effects:
1. according to the utility model, through the pipe frame, the connecting pipe, the fixing pipe, the branch pipe A, the branch pipe B, the pump body, the fan A, the semiconductor refrigerating sheet, the fan B and the heat conducting layer, when the mold is to be cooled, the impeller in the pump body outside the mold base rotates at a high speed, then water in the water storage tank is conveyed into the branch pipe A on the pump body through the branch pipe B, then the branch pipe A is conveyed into the pipe frame outside the lower mold through the fixing pipe, then the water in the pipe frame absorbs heat in the lower mold, meanwhile, the fan A on the fixing plate outside the pipe frame accelerates the air flow speed on the surface of the lower mold, then the water absorbing the heat of the lower mold is conveyed back into the water storage tank through the connecting pipe, and meanwhile, the fan B outside the water storage tank drives the semiconductor refrigerating sheet to generate cold energy to be contacted with the water storage frame, so that the water with heat in the water storage frame is cooled, and the water with lower temperature in the water storage frame flows in the pipe frame outside the lower mold, thereby being convenient for cooling and cooling the lower mold and forming the material in the lower mold.
2. According to the utility model, through the filter screen, the motor and the connecting plate which are arranged, when water in the water storage frame enters the branch pipe B, the filter screen in the water storage frame filters the water, so that the blockage of the pipe frame caused by foreign matters in the water conveyed into the pipe frame is avoided, and meanwhile, the motor on the filter screen converts received electric energy into mechanical energy to drive the connecting plate to scrape on the surface of the filter screen, so that the filter screen is prevented from being blocked.
Drawings
FIG. 1 is a schematic view showing the overall structure of a cooling mold according to the present utility model;
FIG. 2 is a schematic view showing the internal structure of a mold base of a cooling mold according to the present utility model;
in the figure: 1. an upper die; 2. a pipe rack; 3. a lower die; 4. a fan A; 5. a fixing plate; 6. a connecting pipe; 7. a die holder; 8. a fixed tube; 9. a branch pipe A; 10. a pump body; 11. a branch pipe B; 12. a water storage tank; 13. a heat conducting layer; 14. a connecting plate; 15. a motor; 16. a semiconductor refrigeration sheet; 17. a fan B; 18. and (5) a filter screen.
Detailed Description
The utility model is further described in connection with the following detailed description, in order to make the technical means, the creation characteristics, the achievement of the purpose and the effect of the utility model easy to understand.
As shown in fig. 1-2, a cooling mold comprises a lower mold 3 and a mold base 7, wherein a pipe frame 2 for cooling the inside of the lower mold 3 is screwed on the outer side of the lower mold 3, a connecting pipe 6 extending into a water storage tank 12 installed in the mold base 7 is screwed on one side of the pipe frame 2, a fan B17 for accelerating the air flow rate of a semiconductor refrigerating sheet 16 installed on the inner side of the mold base 7 is screwed on the outer side of the water storage tank 12, a branch pipe B11 for conveying water into a pump body 10 is inserted on one side of the water storage tank 12, a branch pipe A9 for conveying water into the pipe frame 2 on one side of a fixed pipe 8 is screwed on one side of the pump body 10, a fixed plate 5 for connecting the fan A4 is screwed on the outer side of the pipe frame 2, an upper mold 1 for molding materials is arranged on one side of the lower mold 3, and a heat conducting layer 13 for radiating water in the water storage tank 12 is adhered on the outer side of the water storage tank 12;
the water storage tank 12 is internally provided with a filter screen 18 for filtering water entering the branch pipe B11 by screw fixation, one side of the filter screen 18 is provided with a motor 15 for driving the connecting plate 14 to scrape on the surface of the filter screen 18 by screw fixation, and the power output end of the motor 15 is connected with the power input end of the connecting plate 14; the water entering the branch pipe B11 is filtered through the filter screen 18;
the input ends of the motor 15 and the pump body 10 are electrically connected with the output end of an external power supply; the electric equipment works normally by connecting an external power supply.
It should be noted that, when the cooling mold is used, when the mold is to be cooled, the impeller in the pump body 10 outside the mold base 7 rotates at a high speed, then the water in the water storage tank 12 is conveyed into the branch pipe A9 on the pump body 10 through the branch pipe B11, then the branch pipe A9 is conveyed into the pipe frame 2 outside the lower mold 3 through the fixed pipe 8, then the water in the pipe frame 2 absorbs the heat in the lower mold 3, meanwhile, the fan A4 on the outer fixed plate 5 of the pipe frame 2 accelerates the air flow speed on the surface of the lower mold 3, then the water absorbing the heat of the lower mold 3 is conveyed back into the water storage tank 12 through the connecting pipe 6, simultaneously, the fan B17 outside the water storage tank 12 drives the cold energy generated by the semiconductor refrigerating sheet 16 to be in contact with the water storage frame, the water with heat in the water storage frame is cooled, the water with lower temperature in the water storage frame flows in the pipe frame 2 outside the lower die 3, thereby being convenient for cool down and cool down the lower die 3, enabling materials in the lower die 3 to be cooled and molded, when the water in the water storage frame enters the branch pipe B11, the filter screen 18 in the water storage frame filters the water, the blockage of the pipe frame 2 caused by foreign matters in the water in the pipe frame 2 is avoided, meanwhile, the motor 15 on the filter screen 18 converts the received electric energy into mechanical energy, and the connecting plate 14 is driven to scrape on the surface of the filter screen 18, so that the filter screen 18 is prevented from being blocked.
The foregoing has shown and described the basic principles and main features of the present utility model and the advantages of the present utility model. It will be understood by those skilled in the art that the present utility model is not limited to the embodiments described above, and that the above embodiments and descriptions are merely illustrative of the principles of the present utility model, and various changes and modifications may be made without departing from the spirit and scope of the utility model, which is defined in the appended claims. The scope of the utility model is defined by the appended claims and equivalents thereof.
Claims (5)
1. A cooling die comprises a lower die (3) and a die holder (7); the die is characterized in that a pipe frame (2) for cooling the inside of the lower die (3) is fixed on the outer side screw of the lower die (3), a connecting pipe (6) extending into a water storage tank (12) installed inside a die holder (7) is fixed on one side screw of the pipe frame (2), a fan B (17) for accelerating the air flow rate on the surface of a semiconductor refrigerating sheet (16) installed inside the die holder (7) is fixed on the outer side screw of the water storage tank (12), a branch pipe B (11) for conveying water into the pump body (10) is inserted on one side of the water storage tank (12), a branch pipe A (9) for conveying water into the pipe frame (2) on one side of a fixed pipe (8) is fixed on one side screw of the pump body (10), a fixed plate (5) for connecting the fan A (4) is fixed on the outer side screw of the pipe frame (2), and an upper die (1) for forming materials is arranged on one side of the lower die (3).
2. A cooling die according to claim 1, wherein: the water storage tank is characterized in that a filter screen (18) for filtering water entering the branch pipe B (11) is fixed in the water storage tank (12) through screws, and a motor (15) for driving the connecting plate (14) to scrape on the surface of the filter screen (18) is fixed on one side of the filter screen (18) through screws.
3. A cooling die according to claim 2, wherein: the power output end of the motor (15) is connected with the power input end of the connecting plate (14).
4. A cooling die according to claim 1, wherein: the outside of the water storage tank (12) is adhered with a heat conduction layer (13) for radiating water in the water storage tank (12).
5. A cooling die according to claim 2, wherein: the input ends of the motor (15) and the pump body (10) are electrically connected with the output end of an external power supply.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202321698655.1U CN220052512U (en) | 2023-06-30 | 2023-06-30 | Cooling die |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202321698655.1U CN220052512U (en) | 2023-06-30 | 2023-06-30 | Cooling die |
Publications (1)
Publication Number | Publication Date |
---|---|
CN220052512U true CN220052512U (en) | 2023-11-21 |
Family
ID=88750651
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202321698655.1U Active CN220052512U (en) | 2023-06-30 | 2023-06-30 | Cooling die |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN220052512U (en) |
-
2023
- 2023-06-30 CN CN202321698655.1U patent/CN220052512U/en active Active
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