CN220052106U - Wafer cake slicing device - Google Patents
Wafer cake slicing device Download PDFInfo
- Publication number
- CN220052106U CN220052106U CN202223574700.0U CN202223574700U CN220052106U CN 220052106 U CN220052106 U CN 220052106U CN 202223574700 U CN202223574700 U CN 202223574700U CN 220052106 U CN220052106 U CN 220052106U
- Authority
- CN
- China
- Prior art keywords
- wafer
- lower die
- die
- fan
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 238000007664 blowing Methods 0.000 claims abstract description 16
- 239000002699 waste material Substances 0.000 claims abstract description 12
- 238000005520 cutting process Methods 0.000 claims abstract description 8
- 238000003825 pressing Methods 0.000 claims abstract description 5
- 238000009826 distribution Methods 0.000 claims abstract description 3
- 239000000463 material Substances 0.000 claims description 5
- 210000003205 muscle Anatomy 0.000 claims description 2
- 235000013305 food Nutrition 0.000 abstract description 2
- 235000012431 wafers Nutrition 0.000 description 15
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
Landscapes
- Food-Manufacturing Devices (AREA)
Abstract
The utility model relates to the technical field of food processing, in particular to a wafer cake slicing device which comprises a press, an upper die and a lower die, wherein a plurality of fan-shaped slotted holes are formed in the lower die, cutting ribs are arranged between the slotted holes, a plurality of fan-shaped pressing blocks which are consistent with the slotted holes in shape distribution are arranged on the upper die, a blowing mechanism is arranged on one side of the lower die, a waste material connecting plate is arranged on the side portion of the lower die, and the blowing direction of the blowing mechanism faces to the waste material connecting plate. According to the utility model, the wafer can be cut through the embedding of the upper die and the lower die, the blowing mechanism is arranged on one side of the lower die, the processing waste is blown to the side part of the lower die through the blowing mechanism, and the waste connecting plate is arranged on the side part of the lower die, so that the wafer cutting machine is convenient to use, the integrity of the cut wafer is better, and the processing cost is lower.
Description
Technical Field
The utility model relates to the technical field of food processing, in particular to a wafer slicing device.
Background
Wafers generally need to be processed into specific shapes when being processed, and the prior art is realized by directly designing a mould into the corresponding shape, but the wafer in the production mode increases the processing cost, meanwhile, the wafer is directly manufactured by the mould, the appearance is poor when being packaged, and the whole box wafer spliced by a plurality of wafers has poor integrity.
Disclosure of Invention
In view of the above problems, it is an object of the present utility model to provide a wafer slicing apparatus that is convenient to use.
In order to solve the technical problems, the utility model adopts the following technical scheme: the utility model provides a wafer section device, includes press, last mould and lower mould, be equipped with a plurality of fan-shaped slotted holes on the lower mould, be equipped with the cutting muscle between the slotted hole, upward be equipped with a plurality of fan-shaped briquetting unanimous with slotted hole shape distribution on the mould, one side of lower mould is equipped with blows material mechanism, the lateral part of lower mould is equipped with the waste material fishplate bar, blow material mechanism's blowing direction is towards the waste material fishplate bar.
In the technical scheme, the blowing mechanism comprises a bracket and a nozzle, and the nozzle is arranged on the bracket through a rotating shaft.
In the technical scheme, a receiving tray is arranged at the lower part of the lower die.
In the above technical scheme, the lower part of receiving the charging tray is equipped with the guide rail, receiving the charging tray can follow guide rail reciprocating motion.
In the technical scheme, the fan-shaped pressing block is fixedly connected to the upper die through one bolt and two straight pins.
In the above technical scheme, the upper die and the lower die are connected through the guide post.
In summary, compared with the traditional technical means, the technical scheme provided by the utility model has the following beneficial effects: according to the utility model, the wafer can be cut through the embedding of the upper die and the lower die, the blowing mechanism is arranged on one side of the lower die, the processing waste is blown to the side part of the lower die through the blowing mechanism, and the waste connecting plate is arranged on the side part of the lower die, so that the wafer cutting machine is convenient to use, the integrity of the cut wafer is better, and the processing cost is lower.
Drawings
The foregoing and other objects, features, and advantages of the utility model will become apparent from the following detailed description taken in conjunction with the accompanying drawings.
FIG. 1 is a schematic diagram of a front view of the present utility model;
FIG. 2 is a schematic side view of the present utility model;
FIG. 3 is a schematic top view of the lower die of the present utility model;
the labels are as follows: a press 100; a guide post 110; an upper die 200; a fan-shaped press block 210; a lower die 300; a fan-shaped slot 310; cutting the ribs 320; a receiving tray 330; a blowing mechanism 400; waste tab 500.
Detailed Description
The following preferred embodiments according to the present utility model are intended to suggest that various changes and modifications may be made by the worker skilled in the art without departing from the scope of the technical idea of the present utility model. The technical scope of the present utility model is not limited to the description, but must be determined according to the scope of claims.
The utility model will be further described with reference to the following drawings:
as shown in fig. 1 to 3, a wafer slicing device comprises a press 100, an upper die 200 and a lower die 300, wherein a plurality of sector-shaped slots 310 are formed in the lower die 300, cutting ribs 320 are arranged between the slots 310, and a plurality of sector-shaped pressing blocks 210 which are consistent with the shapes of the slots 310 are arranged on the upper die 200.
One side of the lower die 300 is provided with a blowing mechanism 400, the side of the lower die 300 is provided with a scrap receiving plate 500, and the blowing direction of the blowing mechanism 400 faces the scrap receiving plate 500.
The blowing mechanism 400 includes a holder 410 and a nozzle 420, the nozzle 420 is mounted on the holder 410 through a rotation shaft, the nozzle 420 can blow the wafer residues remained on the lower mold 300 after cutting to the waste connection plate 500, and the wafer residues are collected and processed uniformly.
As shown in fig. 1, a receiving tray 330 is disposed at a lower portion of the lower mold 300.
The lower part of the receiving tray 330 is provided with a guide rail, the receiving tray 330 can reciprocate along the guide rail, and the receiving tray 330 can move along the guide rail after being fully connected, so that the material taking is convenient.
The fan-shaped pressing block 210 is fixedly connected to the upper die 200 by a bolt and two straight pins.
As shown in fig. 1, the upper mold 200 and the lower mold 300 are connected by a guide post 110.
The above description is only of the preferred embodiments of the present utility model and is not intended to limit the present utility model, but various modifications and variations can be made to the present utility model by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present utility model should be included in the protection scope of the present utility model.
Claims (6)
1. The utility model provides a wafer section device which characterized in that: including press (100), go up mould (200) and lower mould (300), be equipped with a plurality of fan-shaped slotted holes (310) on lower mould (300), be equipped with cutting muscle (320) between slotted holes (310), upward be equipped with a plurality of fan-shaped briquetting (210) unanimous with slotted hole (310) shape distribution on mould (200), one side of lower mould (300) is equipped with blows material mechanism (400), the lateral part of lower mould (300) is equipped with waste material fishplate bar (500), the direction of blowing material mechanism (400) is towards waste material fishplate bar (500).
2. Wafer slicing apparatus according to claim 1, wherein: the blowing mechanism (400) comprises a bracket (410) and a nozzle (420), wherein the nozzle (420) is arranged on the bracket (410) through a rotating shaft.
3. Wafer slicing apparatus according to claim 1, wherein: the lower part of the lower die (300) is provided with a receiving disc (330).
4. A wafer slicing apparatus according to claim 3, wherein: the lower part of the receiving tray (330) is provided with a guide rail, and the receiving tray (330) can reciprocate along the guide rail.
5. Wafer slicing apparatus according to claim 1, wherein: the fan-shaped pressing block (210) is fixedly connected to the upper die (200) through a bolt and two straight pins.
6. Wafer slicing apparatus according to claim 1, wherein: the upper die (200) and the lower die (300) are connected through a guide post (110).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223574700.0U CN220052106U (en) | 2022-12-30 | 2022-12-30 | Wafer cake slicing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223574700.0U CN220052106U (en) | 2022-12-30 | 2022-12-30 | Wafer cake slicing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220052106U true CN220052106U (en) | 2023-11-21 |
Family
ID=88784744
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202223574700.0U Active CN220052106U (en) | 2022-12-30 | 2022-12-30 | Wafer cake slicing device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220052106U (en) |
-
2022
- 2022-12-30 CN CN202223574700.0U patent/CN220052106U/en active Active
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |