CN220031094U - Temperature control mechanism of injection mold - Google Patents
Temperature control mechanism of injection mold Download PDFInfo
- Publication number
- CN220031094U CN220031094U CN202321430181.2U CN202321430181U CN220031094U CN 220031094 U CN220031094 U CN 220031094U CN 202321430181 U CN202321430181 U CN 202321430181U CN 220031094 U CN220031094 U CN 220031094U
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- Prior art keywords
- water tank
- lower die
- injection mold
- cooling
- cavity
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- 230000007246 mechanism Effects 0.000 title claims abstract description 35
- 238000002347 injection Methods 0.000 title claims abstract description 23
- 239000007924 injection Substances 0.000 title claims abstract description 23
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 49
- 238000001816 cooling Methods 0.000 claims abstract description 27
- 239000004065 semiconductor Substances 0.000 claims abstract description 12
- 238000010438 heat treatment Methods 0.000 claims abstract description 9
- 230000008859 change Effects 0.000 claims abstract description 3
- 238000001746 injection moulding Methods 0.000 claims description 17
- 238000005485 electric heating Methods 0.000 claims description 14
- 238000009434 installation Methods 0.000 claims description 4
- 239000002994 raw material Substances 0.000 abstract description 9
- 238000000465 moulding Methods 0.000 abstract description 7
- 239000004033 plastic Substances 0.000 abstract description 5
- 229920003023 plastic Polymers 0.000 abstract description 5
- 239000000498 cooling water Substances 0.000 abstract description 4
- 230000005611 electricity Effects 0.000 abstract description 2
- 239000002991 molded plastic Substances 0.000 abstract description 2
- 238000000034 method Methods 0.000 description 6
- 230000009471 action Effects 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 239000007788 liquid Substances 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 210000001503 joint Anatomy 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
The utility model relates to a temperature control mechanism of an injection mold, which comprises a base, wherein a lower mold is fixedly arranged at the top of the base, an upper mold is arranged at the top of the lower mold, and a cooling mechanism and a heating mechanism are arranged in the bottom of the lower mold; the cooling mechanism comprises a water tank, the water tank is fixedly arranged on the right side of the top of the base, and the front surface of the water tank is fixedly provided with a semiconductor refrigerator and a controller. This injection mold's control by temperature change mechanism, through setting up cooling mechanism and heating mechanism, when moulding plastics, insert the electricity to the electrothermal tube to heat the bed die, through the temperature sensor control bed die's temperature, after the raw materials is moulded plastics and is accomplished, close the electrothermal tube again, cool down through the water in the semiconductor refrigerator to the water tank, and start the water pump and make the cooling water in the water tank flow back into the water tank again through the cooling tube, alright take away the heat of bed die, thereby accelerate refrigerated speed, alright improve the efficiency of moulding plastics.
Description
Technical Field
The utility model relates to the technical field of injection molds, in particular to a temperature control mechanism of an injection mold.
Background
The injection mold is a tool for producing plastic products, and comprises an upper mold and a lower mold, wherein after the upper mold and the lower mold are attached, injection molding liquid is injected into a molding cavity, and after the injection molding liquid is cooled and molded, a product is formed.
According to the injection mold of the automobile injection molding piece of Chinese patent publication No. CN217670763U, the injection mold comprises a male mold, a female mold and a cavity positioned between the male mold and the female mold, a threaded hole is formed in the side wall of the cavity, a screw is connected in the threaded hole in a threaded manner, one end of the screw is fixedly connected with a bulge, the bulge is provided with a first abutting surface, a gasket is arranged between the first abutting surface and the side wall of the cavity, and the screw is arranged in the gasket in a penetrating manner;
in the injection molding process, as the injection mold does not have the function of temperature control, after the molten raw material is injected into the inner side of the mold cavity, the temperature is easily and quickly reduced, so that the raw material which is not completely filled into the mold cavity and enters into the mold cavity first is easily solidified in advance, normal injection molding is influenced, meanwhile, the injection mold cannot quickly cool a molded finished product, the finished product is required to be cooled for a longer time, and the injection molding efficiency is reduced, so that the temperature control mechanism of the injection mold is provided.
Disclosure of Invention
Aiming at the defects of the prior art, the utility model provides a temperature control mechanism of an injection mold, which has the advantages of temperature control and the like and solves the problem of low injection efficiency.
In order to achieve the above purpose, the present utility model provides the following technical solutions: the temperature control mechanism of the injection mold comprises a base, wherein a lower mold is fixedly arranged at the top of the base, an upper mold is arranged at the top of the lower mold, and a cooling mechanism and a heating mechanism are arranged in the bottom of the lower mold.
The cooling mechanism comprises a water tank, the right side at base top is fixed mounting to the water tank, the positive fixed mounting of water tank has semiconductor refrigerator and controller, the left side fixedly connected with water pump of water tank, the left end fixedly connected with cooling tube of water pump, the cavity has been seted up to the inside of bed die, cooling tube fixed mounting is in the inside of cavity, the interior bottom fixed mounting of cavity has temperature sensor, the one end that the water pump was kept away from to the cooling tube runs through the bed die and extends to outside and with water tank fixed connection.
The heating mechanism comprises an electric heating tube, a mounting cavity is formed in the lower die, and the electric heating tube is fixedly mounted in the mounting cavity.
Further, the top of last mould runs through and is fixed with two injection molding pipe of quantity, the left and right sides of last mould and bed die is all fixed mounting has the installation piece.
Further, the mounting blocks on the left side and the right side of the upper die are fixedly connected with the mounting blocks on the left side and the right side of the lower die through bolts.
Further, the semiconductor refrigerator, the temperature sensor and the electric heating tube are all electrically connected with the controller.
Further, the left side and the right side of the bottom of the upper die are fixedly connected with positioning blocks, the left side and the right side of the top of the lower die are provided with positioning grooves, and the positioning blocks are matched with the positioning grooves.
Further, a forming cavity is formed in the top of the lower die, and the upper die abuts against the top of the lower die.
Compared with the prior art, the technical scheme of the utility model has the following beneficial effects:
this injection mold's control by temperature change mechanism, through setting up cooling mechanism and heating mechanism, when moulding plastics, insert the electricity to the electrothermal tube to heat the bed die, through the temperature sensor control bed die's temperature, after the raw materials is moulded plastics and is accomplished, close the electrothermal tube again, cool down through the water in the semiconductor refrigerator to the water tank, and start the water pump and make the cooling water in the water tank flow back into the water tank again through the cooling tube, alright take away the heat of bed die, thereby accelerate refrigerated speed, alright improve the efficiency of moulding plastics.
Drawings
FIG. 1 is a schematic diagram of the structure of the present utility model;
FIG. 2 is a top view of a cooling tube of the present utility model;
fig. 3 is a front view of the lower mold of the structure of the present utility model.
In the figure: 1. a base; 2. a water pump; 3. a water tank; 4. a semiconductor refrigerator; 5. a controller; 6. a lower die; 7. injection molding a tube; 8. an upper die; 9. a temperature sensor; 10. a cooling tube; 11. a cavity; 12. a mounting cavity; 13. an electric heating tube; 14. a positioning block; 15. and a positioning groove.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
Referring to fig. 1-3, a temperature control mechanism of an injection mold in this embodiment includes a base 1, a lower mold 6 is fixedly installed at the top of the base 1, an upper mold 8 is installed at the top of the lower mold 6, and a cooling mechanism and a heating mechanism are installed inside the bottom of the lower mold 6.
The cooling mechanism comprises a water tank 3, the water tank 3 is fixedly arranged on the right side of the top of the base 1, a semiconductor refrigerator 4 and a controller 5 are fixedly arranged on the front surface of the water tank 3, a water pump 2 is fixedly connected to the left side of the water tank 3, a cooling pipe 10 is fixedly connected to the left end of the water pump 2, a cavity 11 is formed in the lower die 6, the cooling pipe 10 is fixedly arranged in the cavity 11, a temperature sensor 9 is fixedly arranged in the inner bottom of the cavity 11, and one end, far away from the water pump 2, of the cooling pipe 10 penetrates through the lower die 6 to extend to the outside and is fixedly connected with the water tank 3.
After the injection molding of the raw materials is completed, the electric heating tube 13 is closed, the semiconductor refrigerator 4 is started to cool the water in the water tank 3 through the controller 5, and the water pump 2 is started to enable the cooling water in the water tank 3 to flow back into the water tank 3 through the cooling tube 10, so that the heat of the lower die 6 can be taken away, and the cooling speed is increased.
The heating mechanism comprises an electric heating tube 13, a mounting cavity 12 is formed in the lower die 6, the electric heating tube 13 is fixedly mounted in the mounting cavity 12, and the semiconductor refrigerator 4, the temperature sensor 9 and the electric heating tube 13 are electrically connected with the controller 5.
When injection molding is performed, the electric heating tube 13 is inserted to heat the lower die 6, the temperature of the lower die 6 is controlled by the temperature sensor 9, and then molten raw materials can be injected into the lower die 6 from the injection molding tube 7, so that the raw materials injected into the molding cavity at first are prevented from being easily and quickly cooled.
In this embodiment, the top of the upper mold 8 is penetrated and fixed with two injection molding pipes 7, the left and right sides of the upper mold 8 and the lower mold 6 are fixedly provided with mounting blocks, and the mounting blocks on the left and right sides of the upper mold 8 are fixedly connected with the mounting blocks on the left and right sides of the lower mold 6 through bolts.
After the bolts are removed, the upper die 8 and the lower die 6 can be separated, so that a molded finished product is taken out, and the positioning block 14 plays a role in positioning, so that the upper die 8 and the lower die 6 are conveniently in butt joint and fixed.
In this embodiment, the left and right sides of the bottom of the upper mold 8 are fixedly connected with positioning blocks 14, the left and right sides of the top of the lower mold 6 are provided with positioning grooves 15, the positioning blocks 14 are matched with the positioning grooves 15, the top of the lower mold 6 is provided with a molding cavity, and the upper mold 8 is abutted against the top of the lower mold 6.
The temperature sensor 9 is convenient for detecting the temperature of the lower die 6.
The working principle of the embodiment is as follows: when injection molding is performed, the electric heating tube 13 is inserted, so that the lower die 6 is heated, the temperature of the lower die 6 is controlled through the temperature sensor 9, then molten raw materials can be injected into the lower die 6 from the injection molding tube 7, after injection molding of the raw materials is completed, the electric heating tube 13 is closed, the semiconductor refrigerator 4 is started to cool water in the water tank 3 through the controller 5, the water pump 2 is started to enable cooling water in the water tank 3 to flow back into the water tank 3 through the cooling tube 10, heat of the lower die 6 can be taken away, cooling speed is increased, and injection molding efficiency can be improved.
It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.
Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. The utility model provides a control by temperature change mechanism of injection mold, includes base (1), its characterized in that: the top of the base (1) is fixedly provided with a lower die (6), the top of the lower die (6) is provided with an upper die (8), and the bottom of the lower die (6) is internally provided with a cooling mechanism and a heating mechanism;
the cooling mechanism comprises a water tank (3), the water tank (3) is fixedly arranged on the right side of the top of the base (1), a semiconductor refrigerator (4) and a controller (5) are fixedly arranged on the front surface of the water tank (3), a water pump (2) is fixedly connected to the left side of the water tank (3), a cooling pipe (10) is fixedly connected to the left end of the water pump (2), a cavity (11) is formed in the lower die (6), the cooling pipe (10) is fixedly arranged in the cavity (11), a temperature sensor (9) is fixedly arranged at the inner bottom of the cavity (11), and one end, far away from the water pump (2), of the cooling pipe (10) penetrates through the lower die (6) to extend to the outside and is fixedly connected with the water tank (3);
the heating mechanism comprises an electric heating tube (13), an installation cavity (12) is formed in the lower die (6), and the electric heating tube (13) is fixedly installed in the installation cavity (12).
2. The temperature control mechanism of an injection mold according to claim 1, wherein: the top of last mould (8) runs through and is fixed with injection molding pipe (7) that is two in quantity, the left and right sides of last mould (8) and bed die (6) all fixed mounting has the installation piece.
3. The temperature control mechanism of an injection mold according to claim 2, wherein: the mounting blocks on the left side and the right side of the upper die (8) are fixedly connected with the mounting blocks on the left side and the right side of the lower die (6) through bolts.
4. The temperature control mechanism of an injection mold according to claim 1, wherein: the semiconductor refrigerator (4), the temperature sensor (9) and the electric heating tube (13) are electrically connected with the controller (5).
5. The temperature control mechanism of an injection mold according to claim 1, wherein: the left side and the right side of the bottom of the upper die (8) are fixedly connected with positioning blocks (14), positioning grooves (15) are formed in the left side and the right side of the top of the lower die (6), and the positioning blocks (14) are matched with the positioning grooves (15).
6. The temperature control mechanism of an injection mold according to claim 1, wherein: the top of the lower die (6) is provided with a forming cavity, and the upper die (8) is abutted against the top of the lower die (6).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321430181.2U CN220031094U (en) | 2023-06-07 | 2023-06-07 | Temperature control mechanism of injection mold |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321430181.2U CN220031094U (en) | 2023-06-07 | 2023-06-07 | Temperature control mechanism of injection mold |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220031094U true CN220031094U (en) | 2023-11-17 |
Family
ID=88740258
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321430181.2U Active CN220031094U (en) | 2023-06-07 | 2023-06-07 | Temperature control mechanism of injection mold |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220031094U (en) |
-
2023
- 2023-06-07 CN CN202321430181.2U patent/CN220031094U/en active Active
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