CN220030775U

CN220030775U - GaN-based wafer cutting device

Info

Publication number: CN220030775U
Application number: CN202321598282.0U
Authority: CN
Inventors: 胡晓海
Original assignee: Suzhou Zhongke Heavy Instrument Semiconductor Materials Co ltd
Current assignee: Suzhou Zhongke Heavy Instrument Semiconductor Materials Co ltd
Priority date: 2023-06-21
Filing date: 2023-06-21
Publication date: 2023-11-17
Anticipated expiration: 2033-06-21

Abstract

The utility model discloses a GaN-based wafer cutting device, which belongs to the technical field of GaN-based wafer cutting equipment and comprises a wafer cutting machine, wherein a shell frame is sleeved outside an emergency switch of the wafer cutting machine, a pressing plate is slidably arranged at the front part of the shell frame and is in contact with the emergency switch of the wafer cutting machine, a plastic sheet is arranged between the pressing plate and the shell frame, the plastic sheet is inserted in the shell frame, and a stop bolt is rotatably connected to the side part of the shell frame. The shell frame comprises a frame body, a guide sleeve and a fixed shaft, wherein the side part of the frame body is hollowed out to form a slot, the fixed shaft is symmetrically and fixedly connected to the side part of the frame body, in a non-emergency state, the plastic sheet is used for blocking behind the pressing plate, so that the pressing plate is prevented from being operated by mistake, the pressing plate is directly pressed hard when the emergency shutdown is carried out, the plastic sheet is broken through the pressing plate, the emergency switch is pressed backwards, the pressing is not influenced when the false touch is guaranteed, and therefore the error rate is reduced, and the practicability is improved.

Description

GaN-based wafer cutting device

Technical Field

The utility model belongs to the technical field of GaN-based wafer cutting equipment, and particularly relates to a GaN-based wafer cutting device.

Background

The wafer cutting machine is automatic precise cutting equipment, an emergency switch is arranged outside the wafer cutting machine, a guardrail is usually arranged outside the wafer cutting machine in order to prevent false touch, and the wafer cutting machine can be used for aiming at the emergency switch in the guardrail to flap when the wafer cutting machine is in emergency shutdown.

Because the emergency switch of the conventional wafer cutting machine needs to avoid the guardrail to be turned off emergently, in an emergency state, the accuracy of hands of a user is lower in tension, so that the emergency switch of the conventional wafer cutting machine is pressed mistakenly.

For this reason, we propose a GaN-based wafer dicing apparatus to solve the above-mentioned problems.

Disclosure of Invention

The utility model aims to solve the problem of pressing errors of emergency switches of a conventional wafer cutting machine and provides a GaN-based wafer cutting device.

In order to achieve the above purpose, the present utility model adopts the following technical scheme:

the utility model provides a GaN-based wafer cutting device, includes the wafer cutting machine, the emergency switch overcoat of wafer cutting machine has the shell frame, the anterior slidable mounting of shell frame has the press plate, press plate and the emergency switch contact of wafer cutting machine, be equipped with plastic sheet between press plate and the shell frame, plastic sheet alternates in the shell frame, the lateral part rotation of shell frame is connected with keeps off the bolt. Under non-emergency state, utilize plastic sheet to keep off behind the push plate, avoid the mistake to operate the push plate, when promptly closing, directly press hard the push plate, through push plate rupture plastic sheet, press emergency switch backward, also do not influence the pressing when guaranteeing the mistake and touch, improved the practicality.

Preferably, the shell frame comprises a frame body, a guide sleeve and a fixed shaft, the side part of the frame body is hollowed out to form a slot, the fixed shaft is symmetrically and fixedly connected to the side part of the frame body, and the guide sleeve is fixedly connected to the inside of the frame body.

Preferably, the shell frame further comprises a storage groove, and the storage groove is fixedly connected to the upper end of the frame body. The plastic sheet is conveniently stored through the storage groove.

Preferably, the stop bolt comprises a rotating sleeve and a stop piece, and the stop piece is fixedly connected to the lower part of the rotating sleeve. The baffle is used for blocking the outside of the plastic sheet, so that the plastic sheet is prevented from falling outwards, and the stability of the insertion of the plastic sheet and the shell frame is improved.

Preferably, the pressing plate comprises a plate block, a sliding block, a connecting spring and a pressing block, wherein the sliding block is uniformly and fixedly connected to the rear part of the plate block, and the pressing block is symmetrically and fixedly connected to the rear part of the plate block. After the plate is pressed manually with force, the plate is utilized to drive the pressing block to press the plastic sheet, the emergency switch of the wafer cutting machine is pressed backwards through the plate, the pressing area is increased through the plate, and the operation error rate is reduced.

Preferably, the pressing plate further comprises a hemispherical pressing block, and the hemispherical pressing block is fixedly connected to the rear end of the plate. The hemispherical pressing block is convenient for the plate to press the emergency switch backwards.

Preferably, the plastic sheet comprises a sheet body and a pull button, and the sheet body and the pull button are fixedly connected into a whole.

In summary, the technical effects and advantages of the present utility model are:

1. under non-emergency state, utilize plastic sheet to keep off behind the push plate, avoid the misoperation to press the clamp plate, when promptly closing, directly press hard the push plate, through the push plate rupture plastic sheet, press emergency switch backward, also not influence the pressing when guaranteeing the mistake and touch to the error rate has been reduced and has been improved the practicality.

2. After the plate is pressed manually with force, the plate is utilized to drive the pressing block to press the plastic sheet, the emergency switch of the wafer cutting machine is pressed backwards through the plate, the pressing area is increased through the plate, and the operation error rate is reduced.

Drawings

FIG. 1 is a schematic diagram of the overall structure of the present utility model;

FIG. 2 is a schematic diagram of a housing structure according to the present utility model;

FIG. 3 is a schematic view of a latch structure according to the present utility model;

FIG. 4 is a schematic view of a pressing plate structure according to the present utility model;

fig. 5 is a schematic view of the plastic sheet structure of the present utility model.

In the figure: 1. a wafer cutter; 2. a housing; 3. a stop bolt; 4. pressing the plate; 5. a plastic sheet; 21. a storage tank; 22. a frame body; 23. a slot; 24. guide sleeve; 25. a fixed shaft; 31. a rotating sleeve; 32. a baffle; 41. a plate; 42. a slide block; 43. a connecting spring; 44. a hemispherical briquette; 45. briquetting; 51. a sheet body; 52. pulling the button.

Detailed Description

The following description of the technical solutions in the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings in the embodiments of the present utility model, and it is apparent that the described embodiments are only some embodiments of the present utility model, not all embodiments.

Referring to fig. 1, the embodiment discloses a GaN-based wafer cutting device, which comprises a wafer cutting machine 1, wherein a housing 2 is sleeved outside an emergency switch of the wafer cutting machine 1, a pressing plate 4 is slidably mounted at the front part of the housing 2, the pressing plate 4 is in contact with the emergency switch of the wafer cutting machine 1, a plastic sheet 5 is arranged between the pressing plate 4 and the housing 2, the plastic sheet 5 is inserted in the housing 2, and a stop bolt 3 is rotatably connected to the side part of the housing 2.

Referring to fig. 1 and 2, the shell 2 includes a frame 22, a guide sleeve 24 and a fixing shaft 25, the side portion of the frame 22 is hollowed out to form a slot 23, the fixing shaft 25 is symmetrically and fixedly connected to the side portion of the frame 22, and the guide sleeve 24 is fixedly connected to the inside of the frame 22. The slot 23 is used for inserting the plastic sheet 5, the fixed shaft 25 is used for rotatably connecting the stop bolt 3, and the guide sleeve 24 is used for guiding the pressing plate 4 to slide.

Referring to fig. 1 and 2, the housing 2 further includes a storage tank 21, and the storage tank 21 is fixedly coupled to an upper end of the frame body 22. The storage tank 21 is used for storing the plastic sheet 5.

Referring to fig. 1, 2 and 3, the stopper 3 includes a rotating sleeve 31 rotatably coupled to the fixed shaft 25, and a stopper 32 fixedly coupled to a lower portion of the rotating sleeve 31. The blocking piece 32 is used for blocking the outside of the plastic sheet 5, so that the plastic sheet 5 is prevented from falling outwards.

Referring to fig. 1, 2 and 4, the pressing plate 4 includes a plate 41, a slider 42, a connection spring 43 and a pressing block 45, the slider 42 is slidably inserted in the guide sleeve 24, one end of the connection spring 43 facing away from the plate 41 is fixedly connected to the frame 22, the slider 42 is uniformly and fixedly connected to the rear portion of the plate 41, and the pressing block 45 is symmetrically and fixedly connected to the rear portion of the plate 41. After the plate 41 is pressed manually with force, the plate 41 drives the pressing block 45 to press the plastic sheet 5, and the emergency switch of the wafer cutting machine 1 is pressed backwards through the plate 41.

Referring to fig. 1 and 4, the pressing plate 4 further includes a hemispherical pressing block 44, and the hemispherical pressing block 44 is fixedly coupled to the rear end of the plate 41. When the plate 41 moves backward, the emergency switch is pressed backward by the hemispherical pressing block 44.

Referring to fig. 1, 2, 3, 4 and 5, the plastic sheet 5 includes a sheet body 51 and a pull button 52, the sheet body 51 is movably inserted into the slot 23, the sheet body 51 is blocked behind the pressing block 45, the blocking piece 32 is movably blocked outside the pull button 52, and the sheet body 51 and the pull button 52 are fixedly connected into a whole.

Working principle: when the user presses the force of conventional button to act on the pressing plate 4, keep off behind pressing plate 4 with plastic sheet 5, avoid pressing plate 4 touching emergency switch, in the emergency, strike pressing plate 4 hard, make pressing plate 4 back press off plastic sheet 5, make pressing plate 4 back press emergency switch, outwards turn off the fender bolt 3, take off plastic sheet 5 after breaking, insert new plastic sheet 5 back for reuse.

The foregoing is only a preferred embodiment of the utility model, but the scope of the utility model is not limited thereto, and any person skilled in the art who is in the field of the utility model can apply equivalent substitution or modification to the technical solution and the inventive concept according to the utility model within the scope of the utility model.

The application direction is simply mentioned in the description for the prior art that the utility model is known to the person skilled in the art and has not changed, and the utility model is combined to form the complete technology; techniques well known to those skilled in the art to avoid undue popularity are employed to assist those skilled in the art in quickly understanding the principles of the utility model.

Claims

1. The utility model provides a GaN-based wafer cutting device, its characterized in that, includes wafer cutting machine (1), be provided with emergency switch on wafer cutting machine (1), emergency switch's outside cover has shell frame (2), the anterior slidable mounting of shell frame (2) has press board (4), press board (4) with emergency switch contacts, press board (4) with be equipped with plastic sheet (5) between shell frame (2), plastic sheet (5) alternate in shell frame (2), the lateral part rotation of shell frame (2) is connected with keeps off bolt (3).

2. The GaN-based wafer cutting device according to claim 1, wherein the housing frame (2) comprises a frame body (22), guide sleeves (24) and a fixed shaft (25), slots (23) are formed in hollow side portions of the frame body (22), the fixed shafts (25) are arranged on two opposite side walls of the frame body (22) respectively, the two fixed shafts (25) are symmetrically distributed, and the guide sleeves (24) are fixedly connected inside the frame body (22).

3. The GaN-based wafer dicing apparatus according to claim 2, wherein the housing frame (2) further comprises a storage tank (21), and the storage tank (21) is fixedly connected to an upper end of the frame body (22).

4. The GaN-based wafer dicing apparatus according to claim 1, wherein the stopper (3) comprises a rotating sleeve (31) and a stopper (32), and the stopper (32) is fixedly connected to a lower portion of the rotating sleeve (31).

5. The GaN-based wafer cutting device according to claim 1, wherein the pressing plate (4) comprises a plate (41), a sliding block (42), a connecting spring (43) and pressing blocks (45), the sliding block (42) is uniformly and fixedly connected to the rear portion of the plate (41), two pressing blocks (45) are arranged, and the two pressing blocks (45) are respectively arranged on two sides of the rear portion of the plate (41) and are symmetrically distributed.

6. The GaN-based wafer dicing apparatus according to claim 5, wherein the pressing plate (4) further comprises a hemispherical press block (44), the hemispherical press block (44) being fixedly connected to the rear end of the plate (41).

7. The GaN-based wafer dicing apparatus according to claim 1, wherein the plastic sheet (5) comprises a sheet body (51) and a pull button (52), the sheet body (51) being fixedly connected to the pull button (52) as a single body.