CN220024704U - Cup capable of rapidly refrigerating and heating - Google Patents
Cup capable of rapidly refrigerating and heating Download PDFInfo
- Publication number
- CN220024704U CN220024704U CN202321120534.9U CN202321120534U CN220024704U CN 220024704 U CN220024704 U CN 220024704U CN 202321120534 U CN202321120534 U CN 202321120534U CN 220024704 U CN220024704 U CN 220024704U
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- heating
- base
- semiconductor refrigerating
- cup body
- cup
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- 238000010438 heat treatment Methods 0.000 title claims abstract description 82
- 239000004065 semiconductor Substances 0.000 claims abstract description 69
- 238000001816 cooling Methods 0.000 claims abstract description 27
- 238000005057 refrigeration Methods 0.000 claims abstract description 11
- 230000017525 heat dissipation Effects 0.000 claims description 10
- 230000005611 electricity Effects 0.000 claims 1
- 239000007788 liquid Substances 0.000 description 7
- 238000000034 method Methods 0.000 description 4
- 238000002955 isolation Methods 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 238000007664 blowing Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
Landscapes
- Devices That Are Associated With Refrigeration Equipment (AREA)
Abstract
The utility model relates to the technical field of refrigerating and heating cups, and discloses a rapid refrigerating and heating cup, which comprises: the cup comprises a power supply device, a power receiving device, a base, a control panel, a semiconductor refrigerating and heating device and a cup body; the base is provided with an electric connection device and is electrically connected with the power supply device; the control board is arranged on the base and is electrically connected with the power connection device; the semiconductor refrigerating and heating device is arranged on the base and is electrically connected with the control board; the cup body is arranged on the base and is in abutting connection with the semiconductor refrigerating and heating device; the cup body is provided with an elastic convex part which is used for abutting a container needing to be refrigerated and heated with the side wall of the cup body; the semiconductor refrigerating and heating device is used for heating or cooling the cup body; through the elastic protruding part, the cup body is contacted with the base and the side wall, so that the heat exchange area is enlarged, and rapid refrigeration and heating are realized.
Description
Technical Field
The utility model relates to the technical field of refrigerating and heating cups, in particular to a rapid refrigerating and heating cup.
Background
The cup is a container for holding water in daily life of people, along with development and popularization of automobiles, more and more people have own loving cars, the automobiles are taken as an important part of life and work of people, especially business people, the time spent in the automobiles per day exceeds a plurality of hours, and heating or refrigerating equipment is difficult to set in the automobiles, so that whether to drink a cup of hot boiled water or whether to obtain a cup of cold boiled water in summer when driving in winter becomes a problem to be solved at present.
CN210018797U discloses a vehicle-mounted refrigerating and heating cup, wherein the air intake and the air exhaust form from bottom to top, and the air intake channel and the air outlet channel form physical isolation, so that the crosstalk phenomenon of wind formed between the air intake and the air outlet is eliminated; the characteristic of large area of the axial flow fan is utilized to forcibly blow the air port to the aluminum radiator, so that the air can exchange heat with the aluminum radiator more effectively in the flowing process, and the refrigerating/heating effect is achieved; however, the product can generate energy loss by refrigerating/heating through a way of blowing by a rotating fan, and the refrigerating and heating efficiency is low, so that improvement is needed.
Disclosure of Invention
The utility model aims at solving the technical problems of the prior art, and provides an adjustable refrigerating and heating cup to solve the problems of energy loss and low refrigerating and heating efficiency caused by the fact that the vehicle-mounted refrigerating and heating cup provided in the background art refrigerates/heats in a way of blowing by a rotating fan.
In order to solve the technical problems, the utility model adopts the following technical scheme: a rapid cooling and heating cup comprising: the cup comprises a power supply device, a power receiving device, a base, a control panel, a semiconductor refrigerating and heating device and a cup body;
the base is provided with an electric connection device and is electrically connected with the power supply device;
the control board is arranged on the base and is electrically connected with the power connection device;
the semiconductor refrigerating and heating device is arranged on the base and is electrically connected with the control board;
the cup body is arranged on the base and is in abutting connection with the semiconductor refrigerating and heating device; the cup body is provided with an elastic convex part which is used for abutting a container needing to be refrigerated and heated with the side wall of the cup body; the semiconductor refrigerating and heating device is used for heating or cooling the cup body.
Firstly, placing a bottle to be refrigerated or heated into a cup body, abutting the bottom of the cup body, abutting the bottle with the side wall of the cup body through an elastic convex part, inserting an electric connection device into a power supply device to electrify a control board, and driving a semiconductor refrigerating and heating device to refrigerate or heat the cup body by the control board so as to refrigerate or heat liquid of the bottle; through the elastic protruding part, the cup body is contacted with the base and the side wall, so that the heat exchange area is enlarged, and rapid refrigeration and heating are realized.
Further, the semiconductor refrigerating and heating device comprises a first semiconductor refrigerating and heating assembly arranged on the side wall of the cup body and a second semiconductor refrigerating and heating assembly arranged at the bottom; the first semiconductor refrigerating and heating assembly and the second semiconductor refrigerating and heating assembly are both used for being abutted to the cup body.
Further, the first semiconductor refrigerating and heating assembly comprises a first semiconductor refrigerating sheet, a first fan arranged on the first semiconductor sheet and a first heat radiating unit arranged on the cup body; the first semiconductor refrigerating sheet is used for transferring heat, and the first fan is used for assisting the first radiating unit to radiate heat.
Further, the first heat dissipation unit comprises a first air inlet and a first air outlet which are formed in the cup body, the first air inlet and the first air outlet are correspondingly formed, and wind generated by the first fan passes through the first air inlet and the first air outlet.
Further, the second semiconductor refrigerating and heating assembly comprises a second semiconductor refrigerating sheet, a second fan arranged on the second semiconductor sheet and a second heat radiating unit arranged on the cup body; the second semiconductor refrigerating sheet is used for transferring heat, and the second fan is used for assisting the second radiating unit to radiate heat.
Further, the second heat dissipation unit comprises a second air inlet and a second air outlet which are arranged on the cup body, the second air inlet and the second air outlet are correspondingly arranged, and air generated by the second fan passes through the second air inlet and the second air outlet.
Further, the power supply device comprises a fixed seat arranged on the automobile and a power supply socket arranged on the fixed seat; the power supply socket is electrically connected with an automobile power supply; the power connection device comprises a power connection head which is arranged on the base and corresponds to the power supply socket and a power supply interface which is arranged on the base; the power supply interface is a TYPE-C interface.
Still further still include locate the lug of base and locate the recess of fixing base, the lug with the recess grafting cooperation.
Compared with the prior art, the utility model has the beneficial effects that: when liquid needs to be heated or cooled, firstly placing a bottle to be refrigerated or heated into a cup body, abutting the bottle with the bottom of the cup body, abutting the bottle with the side wall of the cup body through an elastic convex part, inserting an electric connection device into a power supply device to electrify a control board, and driving a semiconductor refrigerating and heating device to refrigerate or heat the cup body by the control board so as to refrigerate or heat the liquid of the bottle; through the elastic protruding part, the cup body is contacted with the base and the side wall, so that the heat exchange area is enlarged, quick refrigeration and heating are realized, and the bottle with various specifications can be met.
Drawings
FIG. 1 is a schematic diagram of the overall structure of a rapid cooling and heating cup according to the present utility model;
FIG. 2 is a schematic view of the hidden cup and holder of FIG. 1;
FIG. 3 is a schematic view of the structure of FIG. 2 from another perspective;
FIG. 4 is an enlarged schematic view of portion A of FIG. 3;
FIG. 5 is a schematic view of the structure of the cup of FIG. 1;
FIG. 6 is a schematic view of the fixing base in FIG. 1;
fig. 7 is a schematic view of the structure of the base in fig. 1.
Reference numerals: 10. a power supply device; 11. a fixing seat; 111. a groove; 12. a power supply socket; 20. an electrical connection device; 21. a power connection head; 22. a power supply interface; 30. a base; 31. a bump; 40. a control board; 50. a semiconductor refrigerating and heating device; 51. a first semiconductor cooling and heating assembly; 511. a first semiconductor refrigeration sheet; 512. a first fan; 513. a first heat dissipation unit; 514. a first air inlet; 515. a first air outlet; 52. a second semiconductor cooling and heating assembly; 521. a second semiconductor refrigeration sheet; 522. a second fan; 523. a second heat dissipation unit; 524. a second air inlet; 525. a second air outlet; 60. a cup body; 61. an elastic convex part.
Detailed Description
The utility model is described in further detail below with reference to the accompanying drawings.
The embodiments described by referring to the drawings are exemplary and intended to be illustrative of the utility model and are not to be construed as limiting the utility model. In the description of the present utility model, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present utility model and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present utility model. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present utility model, the meaning of "a number", "a plurality" or "a plurality" is two or more, unless specifically defined otherwise. In the present utility model, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances. In the present utility model, unless expressly stated or limited otherwise, a first feature "above" or "below" a second feature may include both the first and second features being in direct contact, as well as the first and second features not being in direct contact but being in contact with each other through additional features therebetween. Moreover, a first feature being "above," "over" and "on" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is higher in level than the second feature. The first feature being "under", "below" and "beneath" the second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is less level than the second feature.
As shown in fig. 1 to 4, a rapid cooling and heating cup includes: the power supply device 10, the power receiving device 20, the base 30, the control board 40, the semiconductor refrigerating and heating device 50 and the cup 60; the base 30, the said base 30 has power-on device 20, connect with power supply unit 10 electrically; a control board 40 provided on the base 30 and electrically connected to the power receiving device 20; a semiconductor refrigerating and heating device 50 provided on the base 30 and electrically connected to the control board 40; a cup 60 provided on the base 30 and contacting the semiconductor cooling/heating device 50; the cup 60 is provided with an elastic protrusion 61 for abutting the container to be cooled and heated with the side wall of the cup 60; the semiconductor refrigerating and heating device 50 is used for heating or cooling the cup 60.
Specifically, the cup body 60 can be internally provided with various specifications of cold-resistant and heat-resistant bottles, and the bottles are filled with liquid; in practice, when liquid needs to be heated or cooled, firstly, a bottle to be cooled or heated is placed into the cup 60 and is abutted against the bottom of the cup 60, the bottle is abutted against the side wall of the cup 60 through the elastic convex part 61, then the power connection device 20 is inserted into the power supply device 10 to electrify the control board 40, and the control board 40 drives the semiconductor cooling and heating device 50 to cool or heat the cup 60, so that the liquid of the bottle is cooled or heated; the elastic convex part 61 makes the cup 60 contact with the base 30 and the side wall, and enlarges the heat exchange area, thereby realizing rapid cooling and heating.
As shown in fig. 1 to 2, the semiconductor refrigerating and heating apparatus 50 includes a first semiconductor refrigerating and heating assembly 51 provided at a side wall of the cup 60 and a second semiconductor refrigerating and heating assembly 52 provided at a bottom; the first semiconductor cooling and heating assembly 51 and the second semiconductor cooling and heating assembly 52 are both used for abutting against the cup 60; so arranged, the first semiconductor refrigerating and heating assembly 51 and the second semiconductor refrigerating and heating assembly 52 can work independently or simultaneously, and can meet the two modes of conventional refrigerating and heating and rapid refrigerating and heating.
As shown in fig. 1 to 2, the first semiconductor refrigeration and heating assembly 51 includes a first semiconductor refrigeration sheet 511, a first fan 512 provided to the first semiconductor sheet, and a first heat dissipation unit 513 provided to the cup 60; the first semiconductor refrigeration sheet 511 is used for transferring heat, and the first fan 512 is used for assisting the first heat dissipation unit 513 to dissipate heat; this is arranged so that the air exchanges heat with the first semiconductor refrigeration sheet 511 more effectively during the flow process.
The first heat dissipation unit 513 includes a first air inlet 514 and a first air outlet 515 provided in the cup 60, the first air inlet 514 and the first air outlet 515 are correspondingly provided, and the air generated by the first fan 512 passes through the first air inlet 514 and the first air outlet 515; by the arrangement, the separation of air inlet and air outlet is realized, and the heat exchange isolation is better realized.
As shown in fig. 2, the second semiconductor cooling/heating unit 52 includes a second semiconductor cooling plate 521, a second fan 522 provided on the second semiconductor plate, and a second heat dissipating unit 523 provided on the cup 60; the second semiconductor refrigerating plate 521 is used for transferring heat, and the second fan 522 is used for assisting the second heat radiating unit 523 to radiate heat; thereby allowing the air to more effectively exchange heat with the second semiconductor refrigeration sheet 521 during the flow process.
The second heat dissipating unit 523 includes a second air inlet 524 and a second air outlet 525 disposed in the cup 60, the second air inlet 524 and the second air outlet 525 are disposed correspondingly, and the air generated by the second fan 522 passes through the second air inlet 524 and the second air outlet 525; by the arrangement, the separation of air inlet and air outlet is realized, and the heat exchange isolation is better realized.
As shown in fig. 1 to 4, the power supply device 10 includes a fixed seat 11 provided on the automobile and a power supply socket 12 provided on the fixed seat 11; the power supply socket 12 is electrically connected with an automobile power supply; the power receiving device 20 comprises a power receiving head 21 which is arranged on the base 30 and corresponds to the power supply socket 12, and a power supply interface 22 which is arranged on the base 30; the power supply interface 22 is a TYPE-C interface (not shown in the drawings); the quick cooling and heating cup can be used in the vehicle and can also be used in other scenes such as home/office.
The rapid cooling and heating cup also comprises a protruding block 31 arranged on the base and a groove 111 arranged on the fixing seat, wherein the protruding block 31 is in plug-in fit with the groove 111; in implementation, the power connector is inserted into the power supply socket, the base is rotated at this time, the protruding block 31 is in plug-in fit with the groove 111, the groove 111 locks the protruding block 31, and the control board is electrified.
The working process comprises the following steps: firstly, a bottle to be cooled or heated is placed into the cup 60 and is abutted with the bottom of the cup 60, the bottle is abutted with the side wall of the cup 60 through the elastic convex part 61, then the connector is inserted into the power supply socket, the base is rotated, the convex block 31 is in plug-in fit with the concave groove 111, the concave groove 111 locks the convex block 31, the control board is electrified, the control board 40 drives the first fan 512 and the second fan 522 to alternately heat the first semiconductor refrigerating sheet 511 and the second semiconductor refrigerating sheet 521 respectively, so that the cup 60 is cooled or heated, and liquid in the bottle is cooled or heated.
The above description should not be taken as limiting the scope of the utility model, and any modifications, equivalent changes and modifications made to the above embodiments according to the technical principles of the present utility model still fall within the scope of the technical solutions of the present utility model.
Claims (8)
1. A rapid cooling and heating cup, comprising: the cup comprises a power supply device (10), a power receiving device (20), a base (30), a control board (40), a semiconductor refrigerating and heating device (50) and a cup body (60);
the base (30), the said base (30) has power-on device (20), connect with power supply unit (10) electricity;
a control board (40) provided on the base (30) and electrically connected to the power receiving device (20);
a semiconductor refrigerating and heating device (50) which is arranged on the base (30) and is electrically connected with the control board (40);
a cup body (60) provided on the base (30) and in contact with the semiconductor cooling/heating device (50); the cup body (60) is provided with an elastic convex part (61) for abutting a container needing to be refrigerated and heated with the side wall of the cup body (60); the semiconductor refrigerating and heating device (50) is used for heating or cooling the cup body (60).
2. The rapid cooling and heating cup according to claim 1, wherein: the semiconductor refrigerating and heating device (50) comprises a first semiconductor refrigerating and heating assembly (51) arranged on the side wall of the cup body (60) and a second semiconductor refrigerating and heating assembly (52) arranged at the bottom; the first semiconductor refrigerating and heating assembly (51) and the second semiconductor refrigerating and heating assembly (52) are both used for being abutted against the cup body (60).
3. The rapid cooling and heating cup according to claim 2, wherein: the first semiconductor refrigerating and heating assembly (51) comprises a first semiconductor refrigerating sheet (511), a first fan (512) arranged on the first semiconductor sheet and a first radiating unit (513) arranged on the cup body (60); the first semiconductor refrigeration sheet (511) is used for transferring heat, and the first fan (512) is used for assisting the first heat dissipation unit (513) in dissipating heat.
4. A rapid cooling and heating cup according to claim 3, wherein: the first heat dissipation unit (513) comprises a first air inlet (514) and a first air outlet (515) which are arranged on the cup body (60), the first air inlet (514) and the first air outlet (515) are correspondingly arranged, and air generated by the first fan (512) passes through the first air inlet (514) and the first air outlet (515).
5. The rapid cooling and heating cup according to claim 2, wherein: the second semiconductor refrigerating and heating assembly (52) comprises a second semiconductor refrigerating sheet (521), a second fan (522) arranged on the second semiconductor sheet and a second heat radiating unit (523) arranged on the cup body (60); the second semiconductor refrigerating plate (521) is used for transferring heat, and the second fan (522) is used for assisting the second heat radiating unit (523) to radiate heat.
6. The rapid cooling and heating cup according to claim 5, wherein: the second heat dissipation unit (523) comprises a second air inlet (524) and a second air outlet (525) which are arranged on the cup body (60), the second air inlet (524) and the second air outlet (525) are correspondingly arranged, and air generated by the second fan (522) passes through the second air inlet (524) and the second air outlet (525).
7. The rapid cooling and heating cup according to claim 1, wherein: the power supply device (10) comprises a fixed seat (11) arranged on the automobile and a power supply socket (12) arranged on the fixed seat (11); the power supply socket (12) is electrically connected with an automobile power supply; the power connection device (20) comprises a power connection head (21) which is arranged on the base (30) and corresponds to the power supply socket (12) and a power supply interface (22) which is arranged on the base (30); the power supply interface (22) is a TYPE-C interface.
8. The rapid cooling and heating cup according to claim 7, wherein: the novel fixing seat also comprises a protruding block (31) arranged on the base and a groove (111) arranged on the fixing seat, wherein the protruding block (31) is in plug-in fit with the groove (111).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321120534.9U CN220024704U (en) | 2023-05-11 | 2023-05-11 | Cup capable of rapidly refrigerating and heating |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321120534.9U CN220024704U (en) | 2023-05-11 | 2023-05-11 | Cup capable of rapidly refrigerating and heating |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220024704U true CN220024704U (en) | 2023-11-17 |
Family
ID=88741657
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321120534.9U Active CN220024704U (en) | 2023-05-11 | 2023-05-11 | Cup capable of rapidly refrigerating and heating |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220024704U (en) |
-
2023
- 2023-05-11 CN CN202321120534.9U patent/CN220024704U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| PP01 | Preservation of patent right |
Effective date of registration: 20240506 Granted publication date: 20231117 |
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| PP01 | Preservation of patent right |