CN220021099U - Planar semiconductor device heating device - Google Patents
Planar semiconductor device heating device Download PDFInfo
- Publication number
- CN220021099U CN220021099U CN202321407197.1U CN202321407197U CN220021099U CN 220021099 U CN220021099 U CN 220021099U CN 202321407197 U CN202321407197 U CN 202321407197U CN 220021099 U CN220021099 U CN 220021099U
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- China
- Prior art keywords
- dull
- stereotyped
- semiconductor device
- heat
- oil groove
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- 238000010438 heat treatment Methods 0.000 title claims abstract description 33
- 239000004065 semiconductor Substances 0.000 title claims abstract description 25
- 230000008054 signal transmission Effects 0.000 claims abstract description 4
- 238000010030 laminating Methods 0.000 claims abstract description 3
- 238000007789 sealing Methods 0.000 claims abstract description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- 229910001220 stainless steel Inorganic materials 0.000 claims description 2
- 239000010935 stainless steel Substances 0.000 claims description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000012544 monitoring process Methods 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- 238000013112 stability test Methods 0.000 description 1
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- Resistance Heating (AREA)
Abstract
The utility model discloses a planar semiconductor device heating device, which comprises: dull and stereotyped, heat-conducting plate, fixing base, electric heater, temperature sensor and controller, fixing base top surface indent is provided with the oil groove, dull and stereotyped level sets up the sealing that carries out the oil groove top in the constant head tank, the heat-conducting plate sets up in the oil groove and laminating in the bottom surface of dull and stereotyped, be provided with the water conservancy diversion hole that extends along width direction along length direction interval in the heat-conducting plate, be provided with the conduction oil that submerges the water conservancy diversion hole in the oil groove, dull and stereotyped side is provided with the mounting hole that extends to set up in the dull and stereotyped, temperature sensor sets up in the mounting hole, temperature sensor is connected with the controller, carries out signal transmission. According to the planar semiconductor device heating device, the heating oil is used for heating the heat conducting plate, and then the heat conducting plate is used for transferring heat to the flat plate, so that the temperature distribution uniformity on the flat plate is good.
Description
Technical Field
The utility model relates to the field of semiconductor device heating equipment, in particular to a planar semiconductor device heating device.
Background
In the production process of semiconductor devices, various tests such as a work stability test at a specific temperature are required, and heating of the semiconductor devices by using a heating plate is required so that the semiconductor devices reach a specified temperature, and then performance tests are performed.
The semiconductor device is small in size, and the heating plate is large in area, so that heating of a plurality of semiconductor devices can be performed at a time. In order to improve the heating accuracy, the temperature of the heating plate can be monitored by a temperature sensor. Because the area of the heating plate is large, the temperature distribution is often uneven, so that part of semiconductor devices on the heating plate cannot reach the designated temperature, the testing accuracy is affected, and improvement is needed.
Disclosure of Invention
The utility model aims to provide a planar semiconductor device heating device which is used for heating and temperature monitoring of a semiconductor device and improving the uniformity of temperature distribution.
To achieve the purpose, the utility model adopts the following technical scheme:
a planar semiconductor device heating apparatus comprising: dull and stereotyped, heat-conducting plate, fixing base, electric heater, temperature sensor and controller, fixing base top surface indent is provided with the oil groove, oil groove top edge is provided with the constant head tank that round corresponds with the dull and stereotyped, dull and stereotyped level sets up in the constant head tank and carries out the sealing at oil groove top, electric heater extends to the oil groove from fixing base one side or both sides, the heat-conducting plate sets up in the oil groove and laminating in the bottom surface of dull and stereotyped, be provided with the guiding hole that extends along width direction along length direction interval in the heat-conducting plate, be provided with the conduction oil of submergence guiding hole in the oil groove, dull and stereotyped side is provided with the mounting hole that extends to set up in the dull and stereotyped, temperature sensor sets up in the mounting hole, temperature sensor is connected with the controller, carries out signal transmission, the controller is connected with electric heater, carries out heating control.
The number of the mounting holes is at least 3, and the mounting holes are distributed at intervals along the length direction of the flat plate.
Wherein, the heat conduction plate adopts aluminum plate, the dull and stereotyped corrosion resistant plate that adopts.
The controller adopts PLC, and is provided with the display screen on the controller.
Wherein, dull and stereotyped bottom symmetry is provided with the support.
The bottom of the oil groove is provided with an upright post positioned below the heat conducting plate, and the upright post is positioned above the bracket.
The edge of the top surface of the flat plate is provided with a stepped hole, and a screw connected with the fixing seat is arranged in the stepped hole.
The utility model has the beneficial effects that: a planar semiconductor device heating device heats conduction oil in an oil groove through an electric heater, the conduction oil is utilized to heat the conduction plate, heat is transferred to a flat plate through the conduction plate, the uniformity of temperature distribution on the flat plate is improved, a temperature sensor is utilized to monitor the temperature, the automatic temperature control level is improved, the simultaneous heating of a plurality of semiconductor devices is facilitated, and the uniformity of heating temperature is ensured.
Drawings
Fig. 1 is a schematic structural view of the present utility model.
Detailed Description
The technical solution of the present utility model is further described below with reference to fig. 1 by means of a specific embodiment.
A planar semiconductor device heating apparatus comprising: the device comprises a flat plate 4, a heat conducting plate 3, a fixed seat 1, an electric heater 8, a temperature sensor 5 and a controller 2, wherein in the embodiment, brackets 7 are symmetrically arranged at the bottom of the flat plate 4, so that a certain ground clearance is ensured.
The indent of fixing base 1 top surface is provided with oil groove 6, oil groove 6 top edge is provided with round constant head tank 14 that corresponds with dull and stereotyped 4, dull and stereotyped 4 level sets up in constant head tank 14 carries out the seal at oil groove 6 top, in this embodiment, dull and stereotyped 4 top surface edge is provided with the shoulder hole, be provided with the screw 13 that is connected with fixing base 1 in the shoulder hole, the structural temperature to can carry out the hiding of screw 13 head through the shoulder hole, ensure that dull and stereotyped 4 top surface flushes with fixing base 1 top surface.
The heat conduction plate 3 is disposed in the oil groove 6 and attached to the bottom surface of the flat plate 4, and heat is transferred. In this embodiment, the bottom of the oil groove 6 is provided with a column 10 below the heat-conducting plate 3, so as to support the heat-conducting plate 3. As shown in fig. 1, the upright 10 is located above the bracket 7, and the upright 10 is indirectly supported by the bracket 7. The heat conducting plate 3 adopts an aluminum plate, so that the heat conducting effect is good, the flat plate 4 adopts a stainless steel plate, the corrosion resistance effect is good, and the surface smoothness can be kept.
Guide holes 12 extending in the width direction are formed in the heat conducting plate 3 at intervals along the length direction, and heat conducting oil 11 immersed in the guide holes 12 is arranged in the oil groove 6, so that the heat conducting oil 11 can uniformly heat the heat conducting plate 3. In this embodiment, the electric heater 5 extends from one side or two sides of the fixing seat 1 to the oil groove 6, the electric heater 5 is located below the heat conducting plate 3 to heat the heat conducting oil 11, the heat conducting plate 3 is heated by the heat conducting oil 11, and then heat is transferred to the flat plate 4 through the heat conducting plate 3, so that the uniformity of temperature distribution on the flat plate 4 is improved.
In order to facilitate the temperature monitoring of the flat plate 4, a mounting hole extending into the flat plate 4 is arranged on the side surface of the flat plate 4, and the temperature sensor 5 is arranged in the mounting hole to monitor the temperature of the flat plate 4. The temperature sensor 5 is connected with the controller 2 for signal transmission, in this embodiment, the controller 2 adopts a PLC, and the controller 2 is provided with a display screen 9, so that real-time temperature display can be performed, and an operator can observe and regulate conveniently.
As shown in fig. 1, in this embodiment, the number of the mounting holes is at least 3, and the mounting holes are distributed at intervals along the length direction of the flat plate 4, and the temperature is monitored in the partitions to confirm the uniformity of the temperature distribution. The controller 2 is connected with the electric heater 8 for heating control, and the automation level is improved.
The foregoing is merely exemplary of the present utility model, and those skilled in the art should not be considered as limiting the utility model, since modifications may be made in the specific embodiments and application scope of the utility model in light of the teachings of the present utility model.
Claims (7)
1. A planar semiconductor device heating apparatus, comprising: dull and stereotyped, heat-conducting plate, fixing base, electric heater, temperature sensor and controller, fixing base top surface indent is provided with the oil groove, oil groove top edge is provided with the constant head tank that round corresponds with the dull and stereotyped, dull and stereotyped level sets up in the constant head tank and carries out the sealing at oil groove top, electric heater extends to the oil groove from fixing base one side or both sides, the heat-conducting plate sets up in the oil groove and laminating in the bottom surface of dull and stereotyped, be provided with the guiding hole that extends along width direction along length direction interval in the heat-conducting plate, be provided with the conduction oil of submergence guiding hole in the oil groove, dull and stereotyped side is provided with the mounting hole that extends to set up in the dull and stereotyped, temperature sensor sets up in the mounting hole, temperature sensor is connected with the controller, carries out signal transmission, the controller is connected with electric heater, carries out heating control.
2. The planar semiconductor device heating apparatus of claim 1, wherein the number of mounting holes is at least 3 and is spaced apart along the length of the flat plate.
3. The planar semiconductor device heating apparatus according to claim 1, wherein the heat conductive plate is an aluminum plate, and the flat plate is a stainless steel plate.
4. The planar semiconductor device heating apparatus according to claim 1, wherein the controller employs a PLC and a display screen is provided on the controller.
5. The planar semiconductor device heating apparatus according to claim 1, wherein the flat plate bottom is symmetrically provided with brackets.
6. The planar semiconductor device heating apparatus of claim 1, wherein the bottom of the oil tank is provided with a pillar below the heat conductive plate, the pillar being located above the bracket.
7. The planar semiconductor device heating apparatus according to claim 1, wherein the edge of the top surface of the flat plate is provided with a stepped hole in which a screw connected to the fixing base is provided.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321407197.1U CN220021099U (en) | 2023-06-05 | 2023-06-05 | Planar semiconductor device heating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321407197.1U CN220021099U (en) | 2023-06-05 | 2023-06-05 | Planar semiconductor device heating device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220021099U true CN220021099U (en) | 2023-11-14 |
Family
ID=88676935
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321407197.1U Active CN220021099U (en) | 2023-06-05 | 2023-06-05 | Planar semiconductor device heating device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220021099U (en) |
-
2023
- 2023-06-05 CN CN202321407197.1U patent/CN220021099U/en active Active
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