CN220020042U - Thin film transistor display module - Google Patents
Thin film transistor display module Download PDFInfo
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- CN220020042U CN220020042U CN202321199678.8U CN202321199678U CN220020042U CN 220020042 U CN220020042 U CN 220020042U CN 202321199678 U CN202321199678 U CN 202321199678U CN 220020042 U CN220020042 U CN 220020042U
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- 239000010409 thin film Substances 0.000 title claims abstract description 38
- 238000010438 heat treatment Methods 0.000 claims abstract description 72
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- 239000000758 substrate Substances 0.000 claims abstract description 24
- 239000000463 material Substances 0.000 claims abstract description 12
- 230000005540 biological transmission Effects 0.000 claims description 21
- 239000011521 glass Substances 0.000 claims description 10
- 239000012528 membrane Substances 0.000 claims description 4
- 238000003466 welding Methods 0.000 claims description 4
- 238000010030 laminating Methods 0.000 claims description 2
- 239000004973 liquid crystal related substance Substances 0.000 abstract description 30
- 230000000694 effects Effects 0.000 abstract description 10
- 230000008859 change Effects 0.000 abstract description 5
- 230000006872 improvement Effects 0.000 description 9
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 5
- 239000005357 flat glass Substances 0.000 description 4
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- 239000004065 semiconductor Substances 0.000 description 4
- 238000004026 adhesive bonding Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 229910001887 tin oxide Inorganic materials 0.000 description 3
- 238000002834 transmittance Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- -1 indium tin metal oxide Chemical class 0.000 description 2
- 229910044991 metal oxide Inorganic materials 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 230000004044 response Effects 0.000 description 2
- 238000000151 deposition Methods 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
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- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The utility model belongs to the technical field of TFTs, and relates to a thin film transistor display module, which comprises a TFT substrate, a main FPC and a mobile phone motherboard, wherein the main FPC is connected to the TFT substrate, and one side of the main FPC is connected to the mobile phone motherboard. According to the utility model, the TFT substrate of the liquid crystal display module is plated with the heating film, the heating circuit is additionally arranged in the heating film, when the mobile phone equipment is used at low temperature, the temperature change is sensed by the temperature sensing element in the mobile phone, and the heating circuit in the heating film is controlled by the mobile phone main board at low temperature, so that the installed liquid crystal display module is heated, the situation that the activity of liquid crystal is reduced due to low temperature when the display module of the liquid crystal display screen of the mobile phone is operated at low temperature, and the display is influenced is avoided, and in addition, the heating circuit is additionally arranged in the heating film to heat, so that the situation that the ITO material is easy to generate bad change when the ITO material is directly electrified and heated is avoided.
Description
Technical Field
The utility model relates to the technical field of TFTs, in particular to a thin film transistor display module.
Background
TFTs are abbreviations for thin film transistors. Thin film transistors are one of the types of field effect transistors that are generally fabricated by depositing various thin films, such as semiconductor active layers, dielectric layers, and metal electrode layers, on a substrate. The thin film transistor plays a very important role in the operation performance of the display device. Since the TFT is mainly used in a liquid crystal display, a glass substrate is often used. The TFT type display screen is a mainstream display device on various notebook computers and desktops, each liquid crystal pixel point on the display screen is driven by a thin film transistor integrated behind the pixel point, so that the TFT type display screen is also an active matrix liquid crystal display device, can display screen information at high speed, high brightness and high contrast, and a TFT-LCD (thin film transistor liquid crystal display) is one of most liquid crystal displays. At present, in the mobile phone industry, a great part of display screen modules are used in a TFT liquid crystal display scheme, when a mobile phone is used in a low-temperature environment, the viscosity of liquid crystal is increased, the corresponding required twisting force is increased, the required magnetic field energy is increased, and the response speed of the liquid crystal is reduced under the fixed VOP voltage, so that the display of the mobile phone display screen is gradually diluted along with the temperature reduction, and the use effect of the display screen is affected.
The patent document with the publication number of CN214427701U provides a vehicle-mounted display screen, which comprises a TFT module, wherein the TFT module comprises a rear plate module, a liquid crystal layer and a front plate module, the rear plate module comprises a TFT control panel and rear plate glass, the TFT control panel adopts GIP wires, the rear plate glass is arranged on the back side of the TFT control panel, the TFT module further comprises a heat uniform layer, and the heat uniform layer is arranged on the back side of the rear plate glass; the manufacturing method comprises the steps that a TFT control panel of a vehicle-mounted display screen adopts GIP wiring; setting a negative temperature coefficient material in a TFT control panel target; and a thermal uniform layer is arranged on the back side of the back plate glass of the TFT module of the vehicle-mounted display screen. According to the scheme, the circuit driving capability of the vehicle-mounted display screen GIP circuit at extremely low temperature is improved, the working temperature of the display screen can be quickly improved through the arranged rear glass plate thermal uniform layer, and the electron mobility of the TFT panel is effectively improved.
But this scheme has following problem, mention among the beneficial effect of this scheme, back glass board heat even layer can improve display screen operating temperature fast, but only through addding heat even layer, heat even layer promotes the effect of heating when original component work generates heat for heat even layer can't initiatively heat up, thereby makes the heating effect limited, and protection liquid crystal display screen display effect is also limited relatively.
Disclosure of Invention
The technical problem to be solved by the embodiment of the utility model is that a common TFT liquid crystal display screen is easy to cause viscosity increase due to low temperature when operating at low temperature, so that response speed of the liquid crystal is reduced, and display of the mobile phone display screen is gradually lightened along with temperature reduction.
In order to solve the technical problems, the embodiment of the utility model provides a thin film transistor display module, which comprises a TFT substrate, a main FPC and a mobile phone motherboard, wherein the main FPC is connected and arranged on the TFT substrate, one side of the main FPC is connected with the mobile phone motherboard, the TFT substrate comprises a board body, a heating film is attached and arranged on the board body, one end of the heating film is electrically connected with a connecting FPC, the connecting FPC is welded on the bottom surface of one end of the board body, and the connecting FPC is electrically connected with the main FPC.
As a preferable improvement mode of the thin film transistor display module provided by the utility model, a binding groove is formed in the bottom surface of one end of the plate body, and the connecting FPC is welded on the inner side of the binding groove.
As a preferable improvement mode of the thin film transistor display module provided by the utility model, a first rack is fixedly arranged on the inner side of the binding groove, and the first rack is clamped with the connecting FPC.
As a preferable improvement mode of the thin film transistor display module provided by the utility model, the heating film comprises a film sheet, a heating circuit is arranged on the inner side of the film sheet, and one end of the heating circuit is electrically connected to the connecting FPC.
As a preferable improvement mode of the thin film transistor display module provided by the utility model, the connecting FPC comprises a first FPC board, the first FPC board is welded on the inner side of the binding groove, a first transmission line is electrically connected to the first FPC board, and the tail end of the first transmission line is electrically connected to the heating line.
As a preferable improvement mode of the thin film transistor display module provided by the utility model, a second rack is fixedly arranged on the first FPC board, the second rack is clamped with the first rack, and a clamping plate is arranged on one side of the second rack.
As a preferable improvement mode of the thin film transistor display module provided by the utility model, the length of the clamping plate is the same as the length of the binding groove.
As a preferable improvement mode of the thin film transistor display module provided by the utility model, the TFT substrate is made of glass.
As a preferable improvement mode of the thin film transistor display module provided by the utility model, the membrane is made of transparent ITO material.
As a preferable improvement mode of the thin film transistor display module provided by the utility model, the main FPC comprises a second FPC board, the second FPC board is electrically connected with a second transmission line, the second transmission line is electrically connected to the TFT substrate, the second FPC board is electrically connected with a third transmission line, and the third transmission line is electrically connected to the mobile phone main board.
Compared with the prior art, the embodiment of the utility model has the following main beneficial effects:
1. in the using process, the heating film and the connecting FPC are arranged, and based on a general thin film transistor display module, the scheme is to plate a layer of heating film on a TFT substrate, wherein the heating film is made of ITO (ITO is an N-type oxide semiconductor-indium tin oxide, and the ITO film is an indium tin oxide semiconductor transparent conductive film and generally has two performance indexes, namely resistivity and light transmittance; as nano indium tin metal oxide, has good conductivity and transparency, can cut off the electronic radiation, ultraviolet rays and far infrared rays harmful to human bodies, therefore, the indium tin oxide is usually sprayed on glass, plastic and an electronic display screen to be used as a transparent conductive film, meanwhile, the electronic radiation, the ultraviolet rays and the infrared rays harmful to human bodies are reduced), a heating circuit is additionally arranged in an ITO material, the heating circuit is connected with a connecting FPC, the connecting FPC is welded or glued on the inner side of a binding groove on a TFT substrate, the connecting FPC is electrically connected with a main FPC of a mobile phone display module, and the main FPC is electrically connected with a mobile phone motherboard, so that when the mobile phone equipment is used at low temperature, the temperature change is induced by a temperature sensing element in the mobile phone, the heating circuit in a heating film is controlled by the mobile phone motherboard at low temperature, thus the installed liquid crystal display module of the mobile phone is heated, the liquid crystal is prevented from being reduced in activity due to low temperature when the liquid crystal display module of the liquid crystal display screen is operated at low temperature, the display is prevented from being influenced, the situation that the ITO heating circuit is directly heated in the heating film, the heating mode is prevented from being additionally arranged, and poor material quality is prevented from being changed due to the fact that the heating is directly heated, and this scheme can be through realizing the initiative heating to the heating circuit in the heating film, improves the heating effect to liquid crystal display module.
2. In the using process, the binding groove and the connecting FPC are arranged, and the conventional FPC is directly glued, so that the first rack is arranged on the inner side of the binding groove, the second rack is arranged on the connecting FPC, and the first rack is clamped with the second rack, so that when the connecting FPC is arranged in the binding groove in a welding or gluing mode, the connection tightness is enhanced through the clamping of the first rack and the second rack, the connection stability of the connecting FPC is enhanced, and the stability of a heating circuit in a heating film during use is ensured.
Drawings
The accompanying drawings are included to provide a further understanding of the utility model and are incorporated in and constitute a part of this specification, illustrate the utility model and together with the embodiments of the utility model, serve to explain the utility model. In the drawings:
fig. 1 is a schematic diagram of the overall structure of a thin film transistor display module according to the present utility model;
fig. 2 is a side view of a thin film transistor display module according to the present utility model;
fig. 3 is an enlarged schematic diagram of a thin film transistor display module according to the present utility model at a position a in fig. 2;
fig. 4 is a schematic perspective view of a glass substrate of a tft display module according to the present utility model;
fig. 5 is an enlarged schematic view of a thin film transistor display module according to the present utility model at B in fig. 4;
fig. 6 is a schematic perspective view of a connection FPC of a thin film transistor display module according to the present utility model.
Reference numerals: 1. a TFT substrate; 11. a plate body; 111. binding grooves; 1111. a first rack; 12. heating the film; 121. a membrane; 122. a heating circuit; 13. connecting an FPC; 131. a first FPC board; 1311. a second rack; 1312. a clamping plate; 132. a first transmission line; 2. a main FPC; 21. a second FPC board; 22. a second transmission line; 23. a third transmission line; 3. a mobile phone motherboard.
Detailed Description
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this utility model belongs; the terminology used in the description of the applications herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the utility model. Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment may be included in at least one embodiment of the utility model. The appearances of such phrases in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. Those of skill in the art will explicitly and implicitly appreciate that the embodiments described herein may be combined with other embodiments.
An embodiment of a thin film transistor display module
Example 1
The utility model provides the following technical scheme: the utility model provides a thin film transistor display module assembly, including TFT base plate 1, main FPC2 and mobile phone motherboard 3, connect on the TFT base plate 1 and be equipped with main FPC2, main FPC 2's one side is connected on mobile phone motherboard 3, TFT base plate 1 includes plate body 11, the laminating is equipped with heating film 12 on the plate body 11, the one end electric connection of heating film 12 is equipped with connects FPC13, connect FPC13 welding in the one end bottom surface of plate body 11, connect FPC13 electric connection main FPC2.
Example two
As shown in fig. 1, 2 and 3, specifically, a binding groove 111 is formed on the bottom surface of one end of the board 11, and the connection FPC13 is welded on the inner side of the binding groove 111; a first rack 1111 is fixedly arranged on the inner side of the binding groove 111, and the first rack 1111 is clamped with the connecting FPC 13; the heating film 12 comprises a film 121, a heating circuit 122 is arranged on the inner side of the film 121, and one end of the heating circuit 122 is electrically connected to the connecting FPC 13; the TFT substrate 1 is made of glass; the membrane 121 is made of transparent ITO; the main FPC2 comprises a second FPC board 21, a second transmission line 22 is arranged on the second FPC board 21 in an electric connection mode, the second transmission line 22 is electrically connected to the TFT substrate 1, a third transmission line 23 is arranged on the second FPC board 21 in an electric connection mode, and the third transmission line 23 is electrically connected to the mobile phone motherboard 3; the scheme is based on a mobile phone liquid crystal display module which generally adopts a TFT glass substrate, a layer of heating film 12 is plated on the TFT substrate 1, the heating film 12 is made of ITO (ITO is an N-type oxide semiconductor-indium tin oxide, an ITO film is an indium tin oxide semiconductor transparent conductive film, and usually has two performance indexes, namely resistivity and light transmittance; and this scheme is through add the mode that heating circuit 122 heated in heating film 12, when avoiding directly to ITO material circular telegram heating, leads to the ITO material to produce bad change easily, for example the circumstances of deformation, and this scheme can realize the initiative heating through heating circuit 122 in the heating film 12, improves the heating effect to the liquid crystal display module.
Example III
Referring to fig. 4, 5 and 6, specifically, the connection FPC13 includes a first FPC board 131, the first FPC board 131 is welded on the inner side of the binding groove 111, a first transmission line 132 is electrically connected to the first FPC board 131, and the end of the first transmission line 132 is electrically connected to the heating circuit 122; a second rack 1311 is fixedly arranged on the first FPC board 131, the second rack 1311 is clamped with the first rack 1111, and a clamping plate 1312 is arranged on one side of the second rack 1311; the length of the clamping plate 1312 is the same as the length of the binding groove 111; this scheme sets up rack 1111 in binding the inboard of groove 111 based on general FPC direct gluing's mode, sets up rack 1311 No. two on connecting FPC13, rack 1111 and rack 1311 block No. two for when installing connecting FPC13 in binding groove 111 through welding or gluing's mode, the compactness of being connected is strengthened through rack 1111 and rack 1311 block No. two, thereby reinforcing connects the stability that FPC13 connects, thereby ensures the stability when heating circuit 122 in the heating film 12 uses, thereby makes more stable when the mobile phone display module assembly heats under the low temperature condition.
In summary, the complete working process and the use principle of the utility model are as follows:
when the scheme is used, firstly, a layer of heating film 12 made of ITO (ITO is an N-type oxide semiconductor-indium tin oxide, an ITO film is an indium tin oxide semiconductor transparent conductive film, and has two performance indexes, namely resistivity and light transmittance, generally) is plated on a TFT substrate 1 of a liquid crystal display module; as a nano indium tin metal oxide having excellent conductivity and transparency, it is possible to cut off electron radiation, ultraviolet rays and far infrared rays harmful to human bodies, therefore, indium tin oxide is generally sprayed on glass, plastic and electronic display screens to serve as a transparent conductive film while reducing electron radiation and ultraviolet rays and infrared rays harmful to human bodies), a heating circuit 122 is additionally provided inside a heating film 12 of ITO material, the heating circuit 122 is connected with a connection FPC13, a binding groove 111 is then opened on a TFT substrate 1, the connection FPC13 is welded or glued inside the binding groove 111, a first rack 1111 is additionally provided inside the binding groove 111 with a second rack 1311 provided on the connection FPC13, when the connection FPC13 is welded or glued inside the binding groove 111, the connection tightness is increased by the clamping of the first rack 1111 and the second rack 1311, after the connection FPC13 is mounted inside the binding groove 111, the connection FPC13 is electrically connected with a main FPC2 of a mobile phone display module, the main FPC2 is electrically connected with a mobile phone 3, then the liquid crystal display motherboard is electrically connected with the TFT substrate 1, when the liquid crystal display motherboard is heated by a low temperature sensing device, the temperature is heated by a low temperature sensing device, and the temperature is changed by a low temperature sensing device, and the temperature is controlled in the device when the liquid crystal display module is mounted in the binding groove 12, and the temperature is heated by the heating device is heated by the device, therefore, when the display module of the liquid crystal display screen of the mobile phone operates in a low-temperature state, the situation that the activity of the liquid crystal is reduced due to low temperature to influence the display is avoided; the clamping of the first rack 1111 and the second rack 1311 enhances the connection tightness, so that the connection stability of the connection FPC13 is enhanced, the stability of the heating circuit 122 in the heating film 12 in use is ensured, and the mobile phone display module is more stable in heating under the low temperature condition; and this scheme is through add the mode that heating circuit 122 heated in heating film 12, when avoiding directly to ITO material circular telegram heating, leads to the ITO material to produce bad change easily, for example the circumstances of deformation, and this scheme can realize the initiative heating through heating circuit 122 in the heating film 12, improves the heating effect to the liquid crystal display module.
It is apparent that the above-described embodiments are only some embodiments of the present utility model, but not all embodiments, and the preferred embodiments of the present utility model are shown in the drawings, which do not limit the scope of the patent claims. This utility model may be embodied in many different forms, but rather, embodiments are provided in order to provide a thorough and complete understanding of the present disclosure. Although the utility model has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described in the foregoing description, or equivalents may be substituted for elements thereof. All equivalent structures made by the content of the specification and the drawings of the utility model are directly or indirectly applied to other related technical fields, and are also within the scope of the utility model.
Claims (10)
1. The utility model provides a thin film transistor display module assembly, includes TFT base plate (1), main FPC (2) and mobile phone motherboard (3), its characterized in that: the TFT substrate (1) is connected and is equipped with main FPC (2), one side of main FPC (2) is connected on mobile phone motherboard (3), TFT substrate (1) package rubbing board body (11), the laminating is equipped with heating film (12) on plate body (11), the one end electric connection of heating film (12) is equipped with connects FPC (13), connect FPC (13) welding in the one end bottom surface of plate body (11), connect FPC (13) electric connection main FPC (2).
2. The thin film transistor display module according to claim 1, wherein: binding grooves (111) are formed in the bottom surface of one end of the plate body (11), and the connecting FPC (13) is welded to the inner sides of the binding grooves (111).
3. The thin film transistor display module according to claim 2, wherein: a first rack (1111) is fixedly arranged on the inner side of the binding groove (111), and the first rack (1111) is clamped with the connecting FPC (13).
4. A thin film transistor display module according to claim 3, wherein: the heating film (12) comprises a film (121), a heating circuit (122) is arranged on the inner side of the film (121), and one end of the heating circuit (122) is electrically connected to the connecting FPC (13).
5. The thin film transistor display module according to claim 4, wherein: the connecting FPC (13) comprises a first FPC board (131), the first FPC board (131) is welded on the inner side of the binding groove (111), a first transmission line (132) is arranged on the first FPC board (131) in an electric connection mode, and the tail end of the first transmission line (132) is electrically connected to the heating circuit (122).
6. The thin film transistor display module according to claim 5, wherein: the flexible printed circuit board (FPC) is characterized in that a second rack (1311) is fixedly arranged on the first FPC board (131), the second rack (1311) is clamped with the first rack (1111), and a clamping plate (1312) is arranged on one side of the second rack (1311).
7. The thin film transistor display module according to claim 6, wherein: the length of the clamping plate (1312) is the same as the length of the binding groove (111).
8. The thin film transistor display module of claim 7, wherein: the TFT substrate (1) is made of glass.
9. The thin film transistor display module according to claim 8, wherein: the membrane (121) is made of transparent ITO material.
10. The thin film transistor display module of claim 9, wherein: main FPC (2) includes No. two FPC boards (21), electric connection is equipped with No. two transmission lines (22) on No. two FPC boards (21), no. two transmission lines (22) electric connection are on TFT base plate (1), electric connection all is equipped with No. three transmission lines (23) on No. two FPC boards (21), no. three transmission lines (23) electric connection are on mobile phone motherboard (3).
Priority Applications (1)
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CN202321199678.8U CN220020042U (en) | 2023-05-17 | 2023-05-17 | Thin film transistor display module |
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CN202321199678.8U CN220020042U (en) | 2023-05-17 | 2023-05-17 | Thin film transistor display module |
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CN220020042U true CN220020042U (en) | 2023-11-14 |
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CN202321199678.8U Active CN220020042U (en) | 2023-05-17 | 2023-05-17 | Thin film transistor display module |
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- 2023-05-17 CN CN202321199678.8U patent/CN220020042U/en active Active
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