CN219999584U

CN219999584U - Speaker and electronic equipment

Info

Publication number: CN219999584U
Application number: CN202320729939.6U
Authority: CN
Inventors: 王磊; 刘阳; 黄真; 胡成博; 秦仁轩; 许超; 申呈洁; 朱统
Original assignee: Huawei Technologies Co Ltd
Current assignee: Huawei Technologies Co Ltd
Priority date: 2023-03-23
Filing date: 2023-03-23
Publication date: 2023-11-10
Anticipated expiration: 2033-03-23

Abstract

The application provides a loudspeaker and electronic equipment, and relates to the technical field of electronic equipment, wherein the loudspeaker comprises a shell, a magnetic circuit system and a vibration system; the vibration system includes: the device comprises a dome skeleton, an upper vibrating diaphragm, a lower vibrating diaphragm and a voice coil; the dome skeleton is of a step type annular hollow structure, and the upper vibrating diaphragm, the lower vibrating diaphragm and the voice coil are of annular hollow structures; the voice coil and the upper vibrating diaphragm are connected with the upper step part of the dome skeleton, and the lower vibrating diaphragm is connected with the lower step part of the dome skeleton; the magnetic circuit wears to establish at voice coil loudspeaker voice coil, ball top skeleton, go up the hollow structure of vibrating diaphragm and lower vibrating diaphragm, and magnetic circuit's top is connected with the top of casing, and magnetic circuit's bottom is connected with the bottom of casing, can solve the great technical problem of speaker thickness.

Description

Speaker and electronic equipment

Technical Field

The application belongs to the technical field of electronic equipment, and particularly relates to a loudspeaker and electronic equipment.

Background

The speaker is a transducer for converting an electric signal into an acoustic signal, and has been widely used in electronic devices such as mobile phones and audio devices. The loudspeaker generally comprises a vibration system and a magnetic circuit system, wherein a magnetic field generated by the magnetic circuit system interacts with a magnetic field generated by a voice coil in the vibration system in an electrified state, so that the voice coil vibrates up and down, and then a vibrating diaphragm in the vibration system is driven to vibrate and sound.

Electronic devices gradually develop towards the direction of light and thin, however, a vibration system and a magnetic circuit in a traditional speaker are generally stacked up and down along the thickness direction of the speaker, and the thickness of the speaker is the sum of the thicknesses of the vibration system and the magnetic circuit, so that the thickness of the speaker is larger, and a larger space is required to be occupied, so that the light and thin requirements cannot be met.

Disclosure of Invention

The utility model provides a loudspeaker and electronic equipment, which can solve the technical problem of larger thickness of the loudspeaker.

In order to achieve the above purpose, the utility model adopts the following technical scheme:

in a first aspect, the present utility model provides a loudspeaker comprising: the device comprises a shell, a magnetic circuit system and a vibration system; the vibration system includes: the device comprises a dome skeleton, an upper vibrating diaphragm, a lower vibrating diaphragm and a voice coil; the dome skeleton is of a step type annular hollow structure, and the upper vibrating diaphragm, the lower vibrating diaphragm and the voice coil are of annular hollow structures; the voice coil and the upper vibrating diaphragm are connected with the upper step part of the dome skeleton, and the lower vibrating diaphragm is connected with the lower step part of the dome skeleton; the magnetic circuit wears to establish at voice coil loudspeaker voice coil, ball top skeleton, go up the hollow structure of vibrating diaphragm and lower vibrating diaphragm, and magnetic circuit's top is connected with the top of casing, and magnetic circuit's bottom is connected with the bottom of casing.

In the loudspeaker provided by the application, the magnetic circuit system is arranged in the hollow structure of the vibration system in a penetrating way, so that the vibration system is arranged on the periphery of the magnetic circuit system, the magnetic circuit system and the vibration system can be arranged separately in the thickness direction, the thickness of the loudspeaker is reduced, and the thickness of the loudspeaker is the sum of the thicknesses of the magnetic circuit system and the shell or the sum of the thicknesses of the vibration system and the shell. In addition, the dome skeleton in the speaker is the step structure, goes up step portion and lower step portion and is connected with last vibrating diaphragm and lower vibrating diaphragm respectively for go up and lower vibrating diaphragm and set up separately in the direction of height, the height of speaker can be further reduced, and the dome skeleton is connected the voice coil loudspeaker voice coil, both possesses dome function, vibration sound production under the drive of voice coil loudspeaker voice coil, possesses the function of transmission displacement again, drives last vibrating diaphragm and lower vibrating diaphragm vibration sound production, can increase vibration system's vibrating area, promotes the sensitivity of speaker. Meanwhile, the upper vibrating diaphragm, the lower vibrating diaphragm, the ball top framework and the shell can form a sealed front cavity of the loudspeaker, the double vibrating diaphragm structure can enable the vibration of the vibration system to be more balanced, noise generated by unbalanced vibration is reduced, and the tone quality and stability of the loudspeaker are improved.

In one possible design, the top surface of the voice coil is connected to the bottom surface of the upper step portion, and the bottom surface of the upper diaphragm is connected to the top surface of the upper step portion.

In another possible design, the outer side wall of the voice coil is connected with the inner side wall of the upper step portion, and the bottom surface of the upper diaphragm is connected with the top surface of the upper step portion.

In one possible design, the upper step is provided inside the lower step.

Optionally, the dome frame is an integrally formed structure, and the bottom surface of the upper step portion is higher than the bottom surface of the lower step portion.

Based on this optional mode, and can connect through connecting portion between last step portion and the lower step portion for have certain difference in height between the bottom surface of last step portion and the bottom surface of lower step portion, the ball top skeleton is the step platy structure of integral type, compare with skeleton and the disconnect-type skeleton supporting structure of fretwork formula, intensity is higher, the phenomenon of bending and polarization is difficult for taking place at the in-process of vibration system vibration, improve vibration system's stability, vibration that produces when can also reciprocate the voice coil loudspeaker voice coil is transmitted to lower vibrating diaphragm and last vibrating diaphragm effectively, thereby promote the air vibration sound production in the speaker front chamber.

In one possible design, the magnetic circuit system includes an upper magnet, a magnetically permeable plate, and a lower magnet that are stacked; the upper magnet is connected with the top of the shell, and the lower magnet is connected with the bottom of the shell.

Optionally, the magnetic circuit system further comprises a porcelain bowl, and the porcelain bowl is arranged at the bottom of the shell; the porcelain bowl comprises a bottom plate, and an extension part extending towards the top of the shell is arranged on the bottom plate; the upper magnet, the magnetic conduction plate and the lower magnet are arranged on the bottom plate in a stacked manner; a magnetic gap is formed between the extension part and the upper magnet, between the extension part and the magnetic conduction plate, and between the extension part and the lower magnet, and the voice coil is arranged in the magnetic gap.

Based on this optional mode, the upper magnet, the magnetic conduction board and the lower magnet of range upon range of setting can produce the permanent magnetic field, with upper magnet, magnetic conduction board and lower magnet setting in the porcelain bowl, can promote the magnetic field intensity of permanent magnetic field to when the voice coil loudspeaker voice coil circular telegram, the interact effort between the mutual magnetic field that the reinforcing voice coil loudspeaker voice coil produced and the permanent magnetic field, the displacement volume when increasing the voice coil loudspeaker voice coil and reciprocate in the magnetic gap promotes vibration system's vibration intensity, and the magnetic gap that forms between extension and upper magnet, magnetic conduction board and the lower magnet can fix the movable region of voice coil loudspeaker voice coil simultaneously.

Optionally, a clamping groove is formed in the bottom of the shell, and the porcelain bowl is arranged in the clamping groove. The porcelain bowl is clamped on the shell, so that the outer surface of the porcelain bowl is flush with the outer surface of the shell, and the sum of the thicknesses of the magnetic circuit system and the shell can be reduced.

In one possible design, the area of the upper magnet is smaller than the area of the magnetic conductive plate; the upper vibrating diaphragm comprises: the first inner ring part is arranged on the inner side of the first ring part, and the first outer ring part is arranged on the outer side of the first ring part; the first folding ring part is of an arc-shaped structure which is sunken towards the top of the shell; the bottom surface of first inner ring portion is connected with the top surface of magnetic conduction board, and the bottom surface of first outer ring portion is connected with the top surface of last step portion.

In another possible design, the upper diaphragm includes: the first inner ring part is arranged on the inner side of the first ring part, and the first outer ring part is arranged on the outer side of the first ring part; the first folding ring part is of an arc-shaped structure which is sunken towards the bottom of the shell; the bottom surface of first inner ring portion is connected with the top surface of last step portion, and the top surface of first outer ring portion is connected with the top of casing.

Based on this optional mode, if first ring portion is sunken to the top of casing, then highly should be the sum of the high vibration height when going up the vibrating diaphragm vibration from top to bottom of ring and last vibrating diaphragm between the top of going up vibrating diaphragm and casing, with first ring portion to the bottom of casing sunken, then can reduce the high space that first ring portion occupy, and then reduce the distance between last vibrating diaphragm and the casing top for the distance between last vibrating diaphragm and the casing top satisfies the required vibration height when going up vibrating diaphragm vibration from top to bottom can, thereby further reduce the thickness of speaker.

Optionally, the first inner ring portion and the first outer ring portion are located at the same level, or the height of the first inner ring portion relative to the first collar portion is smaller than the height of the first outer ring portion relative to the first collar portion.

In one possible design, the lower diaphragm comprises: the second ring folding part, the second inner ring part arranged on the inner side of the second ring folding part and the second outer ring part arranged on the outer side of the second ring folding part; the bottom surface of the second inner ring part is connected with the top surface of the lower step part, and the bottom surface of the second outer ring part is connected with the side surface of the shell.

Optionally, the second ring-folding portion is an arc-shaped structure recessed toward the top of the housing or an arc-shaped structure recessed toward the bottom of the housing.

In one possible design, the housing includes: an upper basin stand and a lower basin stand; the upper basin frame is covered on the lower basin frame and forms a containing cavity of the loudspeaker with the lower basin frame; the magnetic circuit system and the vibration system are arranged in the accommodating cavity.

In one possible design, the upper frame comprises a first base plate; and the first substrate is provided with a through hole, the through hole is opposite to the hollow structure of the upper vibrating diaphragm, and the area of the through hole is larger than or equal to the vertical projection area of the magnetic circuit system on the first substrate.

Based on the optional mode, the through hole formed in the first substrate corresponds to the position of the magnetic circuit system, the area of the through hole is larger than that of the magnetic circuit system, and the relative installation position of the magnetic circuit system and the vibration system can be accurately positioned through the through hole in the process of assembling the loudspeaker.

In one possible design, the speaker further comprises a connection plate; the connecting plate is of an annular hollow structure, and the area of the through hole is larger than or equal to the vertical projection area of the upper vibrating diaphragm on the first substrate; the top surface of connecting plate is connected with the top surface of casing, and the bottom surface of connecting plate is connected with the top surface of last vibrating diaphragm.

Based on this optional mode, can pass through the top fixed connection of connecting plate and casing with last vibrating diaphragm, produce the displacement when avoiding going up the vibrating diaphragm vibration, improve vibration system's stability. Simultaneously, casing, connecting plate, go up vibrating diaphragm, lower vibrating diaphragm and dome skeleton can enclose into the sealed front chamber of speaker jointly, reduce the production of noise, promote the tone quality of speaker.

In one possible design, the speaker further comprises a cover plate, the cover plate being arranged at the through hole.

Based on this alternative, the area of the cover plate may be adapted to the area of the through hole, so that the cover plate may be clamped at the through hole. The area of the cover plate can be larger than that of the through hole, so that the cover is changed to be covered on the outer side of the through hole, and the sealing performance of the sounding front cavity in the loudspeaker is improved.

In one possible design, the first base plate is provided with a first surrounding edge extending towards the lower basin stand; and the first peripheral edge is provided with a sound outlet hole which is used for leading out sound generated in the accommodating cavity to the loudspeaker.

In one possible design, the speaker further comprises leads; the lower basin frame is provided with a perforation; one end of the lead wire is connected with the voice coil, and the other end of the lead wire penetrates out of the perforation to be connected with the driving module.

In a second aspect, the present application provides an electronic device comprising: a housing and a loudspeaker in any possible implementation of the first aspect, the loudspeaker being accommodated in the housing.

In one possible design, the housing is provided with a sound outlet; the sound outlet hole is communicated with the sound outlet hole of the loudspeaker.

In one possible design, the electronic device further comprises a drive module; the driving module is connected with the lead wire of the loudspeaker and is used for providing audio electric signals for the voice coil of the loudspeaker through the lead wire.

Drawings

Fig. 1 is a schematic cross-sectional structure of a speaker according to an embodiment of the present application.

Fig. 2 is a schematic structural diagram of a speaker according to an embodiment of the present application.

Fig. 3 is an exploded view of a speaker according to an embodiment of the present application.

Fig. 4 is a schematic cross-sectional view of a speaker according to an embodiment of the present application.

Fig. 5 is a schematic cross-sectional view of a speaker according to an embodiment of the present application.

Fig. 6 is a schematic cross-sectional view of a speaker according to an embodiment of the present application.

Fig. 7 is a schematic cross-sectional view of a speaker according to an embodiment of the present application.

Fig. 8 is a schematic structural diagram of another speaker according to an embodiment of the present application.

Fig. 9 is a schematic diagram of an exploded structure of another speaker according to an embodiment of the present application.

Fig. 10 is a schematic cross-sectional view of another speaker according to an embodiment of the present application.

Fig. 11 is a schematic cross-sectional view of another speaker according to an embodiment of the present application.

Fig. 12 is a schematic cross-sectional view of another speaker according to an embodiment of the present application.

Fig. 13 is a schematic cross-sectional view of another speaker according to an embodiment of the present application.

Fig. 14 is a flow chart of an assembly process of a speaker according to an embodiment of the present application.

Fig. 15 is a schematic structural diagram of an electronic device according to an embodiment of the present application.

Reference numerals:

10. a speaker; 101. a vibration system; 1011. a vibrating diaphragm; 1012. a voice coil; 1013. a dome; 1014. a bracket; 102. a magnetic circuit system; 1021. an upper magnetic conductive plate; 1022. a lower magnetic conductive plate; 1023. a magnet; 1024. a magnetic gap; 103. a housing;

100. a speaker; 110. a housing; 111. loading a basin frame; 1111. a first substrate; 11111. a through hole; 1112. a first peripheral edge; 11121. a first sidewall; 11122. a second sidewall; 1113. a sound outlet hole; 112. setting basin frames; 1121. a second substrate; 11211. a clamping groove; 11212. perforating; 1122. a second peripheral edge; 113. a cover plate; 120. a magnetic circuit system; 121. a magnet is arranged on the upper part; 122. a magnetic conductive plate; 123. a lower magnet; 124. a porcelain bowl; 1241. a bottom plate; 1242. an extension; 125. a magnetic gap; 130. a vibration system; 131. a dome bone frame; 1311. an upper step portion; 1312. a lower step portion; 1313. a connection part; 132. an upper vibrating diaphragm; 1321. a first collar portion; 1322. a first outer ring portion; 1323. a first inner ring portion; 133. a lower vibrating diaphragm; 1331. a second collar portion; 1332. a second inner ring portion; 1333. a second outer ring portion; 134. a voice coil; 135. a lead wire; 140. a connecting plate; 150. an adhesive layer; 160. a receiving chamber;

200. An electronic device; 210. a housing; 211. a sound outlet hole; 220. a sound emitting pipeline; 230. and a driving module.

Detailed Description

For the purpose of making the objects, technical solutions and advantages of the embodiments of the present application more apparent, the technical solutions of the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application, and it is apparent that the described embodiments are some embodiments of the present application, but not all embodiments of the present application. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.

In describing embodiments of the present application, it should be understood that the terms "first," "second," and "second" are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or number of features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature.

In the description of the present application, the meaning of "plurality" means at least two, for example, two, three, etc., unless specifically defined otherwise.

In the present application, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; either directly or indirectly, through intermediaries, or both, may be in communication with each other or in interaction with each other, unless expressly defined otherwise. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art according to the specific circumstances.

In the present application, unless expressly stated or limited otherwise, a first feature "up" or "down" a second feature may be the first and second features in direct contact, or the first and second features in indirect contact via an intervening medium. Moreover, a first feature being "above," "over" and "on" a second feature may be a first feature being directly above or obliquely above the second feature, or simply indicating that the first feature is level higher than the second feature. The first feature being "under", "below" and "beneath" the second feature may be the first feature being directly under or obliquely below the second feature, or simply indicating that the first feature is less level than the second feature.

In the description of the present application, it should be understood that the terms "inner", "outer", "side", "upper", "bottom", "front", "rear", and the like indicate orientations or positional relationships merely for convenience in describing the present application and simplifying the description, and do not indicate or imply that the devices or elements being referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the present application.

In the description of the present application, it should be noted that the term "and/or" is merely an association relationship describing an association object, and indicates that three relationships may exist, for example, a and/or B may indicate: a exists alone, A and B exist together, and B exists alone.

It should be further noted that, in the embodiments of the present application, the same reference numerals denote the same components or the same parts, and for the same parts in the embodiments of the present application, reference numerals may be given to only one of the parts or the parts in the drawings, and it should be understood that, for other same parts or parts, the reference numerals are equally applicable.

A speaker is a transducer element that converts an electric signal into an acoustic signal, and has been widely used in various electronic devices. Referring to a schematic cross-sectional structure of a loudspeaker 10 shown in fig. 1, the loudspeaker 10 generally includes a housing 103, and a vibration system 101 and a magnetic circuit system 102 disposed within the housing 103. The magnetic circuit system 102 is configured to generate a permanent magnetic field, and specifically includes an upper magnetic conductive plate 1021, a magnet 1023, and a lower magnetic conductive plate 1022 that are stacked along a thickness direction of the speaker 10, where an avoidance gap formed on the upper magnetic conductive plate 1021 is communicated with an avoidance gap formed on the magnet 1023 to form a magnetic gap 1024. The vibration system 101 includes a diaphragm 1011, a voice coil 1012, a dome 1013, and a bracket 1014, the voice coil 1012 is disposed in the magnetic gap 1024, the diaphragm 1011 and the dome 1013 are disposed on top of the voice coil 1012, and the bracket 1014 is disposed between the magnet 1023 and the edge of the diaphragm 1011 for supporting the diaphragm 1011.

Based on the speaker 10 shown in fig. 1, the permanent magnetic field generated by the magnetic circuit system 102 interacts with the changing magnetic field generated when the voice coil 1012 is connected with the alternating current, so that the voice coil 1012 moves up and down in the magnetic gap 1024, and drives the diaphragm 1011 to vibrate through the dome 1013 during the movement process, so as to push the air to vibrate.

The electronic devices gradually develop toward light and thin, and correspondingly, the speaker 10 also needs to develop toward light and thin, however, the magnetic circuit system 102 and the vibration system 101 in the speaker 10 are stacked up and down, and the thickness of the speaker is the sum of the thicknesses of the magnetic circuit system 102, the vibration system 101 and the housing 103, so that the thickness of the speaker 10 is larger, and it is difficult to satisfy the light and thin requirement.

In addition, the dome 1013 and the support 1014 in the speaker 10 are two separate structures, and in the process that the voice coil 1012 drives the dome 1013 and the diaphragm 1011 to vibrate, the separated dome 1013 and the support 1014 may cause a plane difference on the vibration surface of the diaphragm 1011, thereby causing polarization and noise of the vibration system 101. Further, some technologies may connect the bracket 1014 and the dome 1013 in the speaker 10 through the connection ribs, but the strength of the connection ribs is insufficient, which is easy to bend and polarize, so as to reduce the effective displacement of the dome 1013, and the displacement of the voice coil 1012 cannot be effectively conducted to the diaphragm 1011 through the dome 1013, so as to push the air to sound.

In order to solve the above technical problems, the present application provides a speaker 100 and an electronic device 200, in the speaker 100, a vibration system 130 is distributed around a magnetic circuit 120, the magnetic circuit 120 and the vibration system 130 are separately arranged in a thickness direction, so that the thickness of the speaker 100 is limited only by the thickness of the magnetic circuit 120 or the thickness of the vibration system 130, the thickness of the speaker 100 is thinned, and a dome frame 131 in the vibration system 130 is of an integral structure, which has a dome function to vibrate and sound under the driving of a voice coil 134, and a function of transmitting displacement, and connects the voice coil 134, an upper diaphragm 132 and a lower diaphragm 133 to vibrate and drive the upper diaphragm 132 and the lower diaphragm 133, thereby driving air to vibrate and sound, and improving the stability of the vibration system 130.

The following describes the technical solution in the embodiment of the present application with reference to the drawings and related embodiments in the embodiment of the present application. In the description of embodiments of the application, the terminology used in the embodiments below is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.

As shown in fig. 2 to 13, a speaker 100 according to an embodiment of the present application includes: a housing 110, and a magnetic circuit system 120 and a vibration system 130 disposed within the housing 110. Specifically, the housing 110 is provided with a containing cavity 160 for containing the magnetic circuit system 120 and the vibration system 130, the magnetic circuit system 120 can be used for driving the vibration system 130 to vibrate, and when the vibration system 130 vibrates, air in the containing cavity 160 can be driven to vibrate and sound.

Referring to the overall structure of the speaker 100 shown in fig. 2, the exploded structure of one speaker 100 shown in fig. 3, and the exploded structure of another speaker 100 shown in fig. 9, the housing 110 of the speaker 100 includes an upper frame 111 and a lower frame 112, and the housing chamber 160 may be formed when the upper frame 111 and the lower frame 112 are closed.

The upper frame 111 of the housing 110 includes a first base plate 1111 and a first peripheral edge 1112 disposed at an edge of the first base plate 1111, the first peripheral edge 1112 extending from the edge of the first base plate 1111 toward the lower frame 112. The first peripheral edge 1112 is provided with an acoustic hole 1113, and the acoustic hole 1113 is used for guiding the sound generated by the vibration system 130 to the outside of the speaker 100.

The lower frame 112 of the case 110 includes a second substrate 1121 and a second peripheral edge 1122 provided at an edge of the second substrate 1121, the second peripheral edge 1122 extending from the edge of the second substrate 1121 toward the upper frame 111.

Alternatively, the shapes of the first substrate 1111 of the upper frame 111 and the second substrate 1121 of the lower frame 112 may be rectangular, square, circular or other shapes.

In one example, when the upper frame 111 is covered on the lower frame 112, the first peripheral edge 1112 of the upper frame 111 may be opposite to the second peripheral edge 1122 of the lower frame 112, so that the upper frame 111 and the lower frame 112 enclose the accommodating chamber 160.

In another example, as shown in fig. 3 and 9, the first peripheral edge 1112 of the upper frame 111 may include a first sidewall 11121 disposed on one of the sides of the first substrate 1111 and one or more second sidewalls 11122 disposed on the remaining sides, respectively. Referring to the schematic cross-sectional structure of the speaker 100 shown in fig. 4, 5, 10 and 11, each of the second side walls 11122 is perpendicular to the first substrate 1111, the first side wall 11121 is inclined towards a side far away from the first substrate 1111, and the height of the first side wall 11121 in the first peripheral edge 1112 is greater than the height of the second side wall 11122, so that when the upper frame 111 is covered on the lower frame 112, the bottom end of the second side wall 11122 is opposite to the top end of the second peripheral edge 1122 of the lower frame 112, and the inner side surface of the first side wall 11121 is connected to the outer side surface of the second peripheral edge 1122.

The inner side surface of the first side wall 11121 is the side surface of the first side wall 11121 facing the accommodating cavity 160, and the outer side surface of the second surrounding edge 1122 is the side surface of the second surrounding edge 1122 facing away from the accommodating cavity 160.

Further, the first peripheral edge 1112 of the upper basin frame 111 may be provided with a sound outlet 1113, the sound outlet 1113 may be communicated with a sound-producing front cavity in the speaker 100, the vibration system 130 may drive the air in the front cavity in the accommodating cavity 160 to produce sound when vibrating, and the sound outlet 1113 may guide the sound produced by the sound-producing front cavity out of the speaker 100. For example, as shown in fig. 4, the first sidewall 11121 of the first peripheral edge 1112 may be provided with an acoustic hole 1113.

In some embodiments, as shown in fig. 3 and 9, in order to precisely position the installation positions of the magnetic circuit 120 and the vibration system 130 during the assembly of the speaker 100, a through hole 11111 may be formed in the first substrate 1111 of the upper frame 111, and the position of the through hole 11111 is opposite to the position of the magnetic circuit 120, thereby providing a positioning window for installing the magnetic circuit 120 and the vibration system 130 so as to precisely position the relative installation positions of the magnetic circuit 120 and the vibration system 130 in the receiving cavity 160.

For example, if the magnetic circuit 120 is located in the central region of the receiving chamber 160, the through hole 11111 may be correspondingly disposed in the central region of the first substrate 1111, i.e., the center of the through hole 11111 may coincide with the center of the first substrate 1111.

Alternatively, the area of the through hole 11111 may be greater than or equal to the perpendicular projection area of the magnetic circuit 120 on the first substrate 1111, and the shape of the through hole 11111 may be the same as or different from the shape of the magnetic circuit 120. Illustratively, the through-hole 11111 may be rectangular in shape.

Further, in order to maintain the sealing of the front chamber in the speaker 100, a cover plate 113 may be provided at the through hole 11111.

In one example, the cover plate 113 may have the same shape and area as the through hole 11111, so that the cover plate 113 may be caught in the through hole 11111.

In another example, the area of the cover plate 113 may be larger than the area of the through hole 11111, so that the cover plate 113 is disposed on the outer side surface of the first substrate 1111 and covers the through hole 11111, and the outer side surface of the first substrate 1111 is the side surface of the first substrate 1111 facing away from the accommodating cavity 160. For example, the cover plate 113 may be adhered to the outer side surface of the first substrate 1111.

As shown in fig. 4 and 10, the magnetic circuit 120 in the speaker 100 according to the embodiment of the present application includes an upper magnet 121, a magnetic conductive plate 122, and a lower magnet 123 that are sequentially stacked up and down along the thickness direction of the speaker 100, and the magnetic circuit 120 is used for generating a permanent magnetic field.

The top of the upper magnet 121 of the magnetic circuit 120 may be connected to the first substrate 1111 of the upper frame 111, and the bottom of the lower magnet 123 may be connected to the second substrate 1121 of the lower frame 112.

Illustratively, the upper magnet 121 and the lower magnet 123 may each be composed of a material such as neodymium iron boron, ferrite, or the like that can generate a permanent magnetic field. The magnetic conductive plate 122 may be a magnetic conductive material such as cold rolled steel (Cold Rolled Steel, SPCC). The upper magnet 121, the magnetic conductive plate 122, and the lower magnet 123 may have rectangular, square, circular, or other shapes, and the areas of the upper magnet 121, the magnetic conductive plate 122, and the lower magnet 123 may be the same or different. The vertical projection area of the magnetic circuit 120 on the first substrate 1111 may be the vertical projection area of the largest area of the upper magnet 121, the magnetic conductive plate 122, and the lower magnet 123 on the first substrate 1111. The shape and size of the upper magnet 121, the magnetic conductive plate 122, and the lower magnet 123 are not limited in this embodiment.

Further, the magnetic circuit 120 in the speaker 100 further includes a ceramic bowl 124, where the ceramic bowl 124 is disposed at the bottom of the accommodating cavity 160, and is used for placing the upper magnet 121, the magnetic conductive plate 122, and the lower magnet 123. The porcelain bowl 124 is made of a magnetic conductive material, so as to increase the magnetic field strength of the magnetic circuit system 120 and further increase the vibration strength of the vibration system 130.

In one example, the bottom of the bowl 124 may directly fix the second substrate 1121 of the lower tub 112.

In another example, in order to further reduce the thickness of the speaker 100, a clamping groove 11211 may be provided on the second substrate 1121, and the porcelain bowl 124 is disposed in the clamping groove 11211 and clamped or adhered to the lower frame 112, and the size of the clamping groove 11211 is adapted to the size of the porcelain bowl 124.

As shown in fig. 3 and 9, the bowl 124 is an integrally formed structure. The bowl 124 includes a base plate 1241 and an extension part 1242 disposed at an edge of the base plate 1241, and the extension part 1242 is perpendicular to the base plate 1241. When the porcelain bowl 124 is disposed in the clamping slot 11211, the bottom plate 1241 of the porcelain bowl 124 is parallel to the second substrate 1121, the extension part 1242 extends from the edge of the bottom plate 1241 toward the upper basin frame 111, and the top surface of the extension part 1242 is opposite to the upper basin frame 111, and the area of the bottom plate 1241 is larger than the area of the lower magnet 123, so that a certain magnetic gap 125 is formed between the inner side wall of the extension part 1242 and the magnetic conductive plate 122. The inner side wall of the extension part 1242 is a side wall of the extension part 1242 facing the lower magnet 123, and the side wall of the extension part 1242 facing away from the lower magnet 123 is an outer side wall.

By way of example and not limitation, the extension 1242 of the bowl 124 may enclose a communicating peripheral edge at the edge of the base 1241; the extension part 1242 may be two side plates oppositely disposed at the edge of the bottom plate 1241; the extension 1242 may also be at least three side panels spaced apart at the edge of the bottom panel 1241. The bottom plate 1241 of the porcelain bowl 124 may be square, rectangular, circular or other shapes, and the shapes of the upper magnet 121, the magnetic conductive plate 122, the lower magnet 123 and the bottom plate 1241 are not limited in the embodiments of the present application.

Referring to fig. 2 to 13, the vibration system 130 in the speaker 100 includes: dome frame 131, upper diaphragm 132, lower diaphragm 133, and voice coil 134. Wherein, the dome skeleton 131 is a stepped annular hollow structure, and the upper diaphragm 132, the lower diaphragm 133 and the voice coil 134 are all annular hollow structures.

The magnetic circuit 120 is disposed in the hollow structure of the dome frame 131, the upper diaphragm 132, the lower diaphragm 133, and the voice coil 134, and the top of the magnetic circuit 120 is connected to the top of the housing 110, and the bottom of the magnetic circuit 120 is connected to the bottom of the housing 110. The voice coil 134 is sleeved on the periphery of the magnetic circuit system 120, the voice coil 134 is connected with an upper step 1311 of the dome frame 131, the upper diaphragm 132 is connected with the upper step 1311 of the dome frame 131, and the lower diaphragm 133 is connected with a lower step 1312 of the dome frame 131.

Wherein, the dome skeleton 131 in the vibration system 130 is an integrated structure, and is used for connecting the voice coil 134, the upper diaphragm 132 and the lower diaphragm 133, and when the voice coil 134 moves up and down, the upper diaphragm 132 and the lower diaphragm 133 can be driven to vibrate by the dome skeleton 131, so as to further push the air vibration in the front cavity to occur.

Further, the upper step portion 1311 of the dome frame 131 is located inside the lower step portion 1312, the upper diaphragm 132 is connected with the upper step portion 1311, and the lower diaphragm 133 is connected with the lower step portion 1312, so that the lower diaphragm 133 and the upper diaphragm 132 are separately disposed in the thickness direction of the speaker 100, and the upper diaphragm 132 extends toward the inside of the speaker 100, the lower diaphragm 133 extends toward the outside, and the lower diaphragm 133 is located at the periphery of the upper diaphragm 132, so that the thickness of the speaker 100 can be further reduced. The inner side of the lower step 1312 is the side surface of the lower step 1312 facing the magnetic guide plate 122.

In one example, as shown in fig. 3 and 4, the dome frame 131 may include a connection portion 1313, an upper step portion 1311 connected inside the connection portion 1313, and a lower step portion 1312 connected outside the connection portion 1313, wherein a bottom surface of the upper step portion 1311 is higher than a bottom surface of the upper step portion 1311, wherein an inside of the connection portion 1313 is a side surface of the connection portion 1313 facing the magnetic conductive plate 122 of the magnetic circuit 120, and an outside of the connection portion 1313 is a side surface of the connection portion 1313 facing away from the magnetic conductive plate 122 of the magnetic circuit.

Alternatively, the connection portion 1313 may be perpendicular to both the upper step portion 1311 and the lower step portion 1312, or the connection portion 1313 and the upper step portion 1311 and/or the lower step portion 1312 may have a curved configuration. In this example, the bottom surface of the upper diaphragm 132 may be connected to the top surface of the upper stepped portion 1311, and the outer sidewall of the voice coil 134 may be connected to the inner sidewall of the upper stepped portion 1311 or the top surface of the voice coil 134 may be connected to the bottom surface of the upper stepped portion 1311.

In other examples, referring to the schematic sectional structure of the speaker 100 shown in fig. 7 and 13, the dome frame 131 may include an upper step 1311 and a lower step 1312 connected to a bottom surface of the upper step 1311, and the upper step 1311 is disposed inside the lower step 1312, and a bottom surface of the upper step 1311 is the same as a bottom surface of the upper step 1311 in height. Alternatively, the upper step 1311 and the lower step 1312 may be perpendicular to each other. In this example, an outer sidewall of the voice coil 134 may be connected with an inner sidewall of the upper stepped portion 1311, and a bottom surface of the upper diaphragm 132 may be connected with a top surface of the upper stepped portion 1311.

In the loudspeaker 100 provided by the application, the dome frame 131 has the dome function, can vibrate and sound under the drive of the voice coil 134, has the function of transmitting displacement, and can support and connect the voice coil 134, the upper vibrating diaphragm 132 and the lower vibrating diaphragm 133 to drive the upper vibrating diaphragm 132 and the lower vibrating diaphragm 133 to sound, so that the problems of polarization and noise of the vibration system 130 caused by insufficient strength of the separated dome and connecting frameworks or the connecting frameworks are avoided. In addition, the integrally formed dome frame 131 can prevent the vibration system 130 from causing a plane difference during vibration, thereby preventing the vibration system 130 from being polarized and emitting noise, compared to the speaker 10 having the bracket 1014 and the dome 1013 as two separate members as shown in fig. 1. In addition, the dome frame 131 in the loudspeaker 100 provided by the application has a hollow plate-shaped structure, compared with a frame formed by combining connecting ribs, the strength is higher, the phenomena of bending and polarization are not easy to occur in the vibration process of the vibration system 130, meanwhile, the dome frame 131 can not only increase the effective vibration area of the vibration system 130, but also effectively transmit the vibration generated in the movement process of the voice coil 134 to the lower vibrating diaphragm 133 and the upper vibrating diaphragm 132, thereby pushing the air in the front cavity of the loudspeaker 100 to vibrate and sound, and improving the sound quality of the loudspeaker 100.

In the loudspeaker 100 provided by the application, the upper diaphragm 132 and the lower diaphragm 133 in the vibration system 130 are all integrally formed. Specifically, the upper diaphragm 132 includes a first ring portion 1321, a first inner ring portion 1323 disposed inside the first ring portion 1321, and a first outer ring portion 1322 disposed outside the first ring portion 1321. The lower diaphragm 133 includes a second ring portion 1331, a second inner ring portion 1332 disposed inside the second ring portion 1331, and a second outer ring portion 1333 disposed outside the second ring portion 1331.

The lower diaphragm 133 is located at the periphery of the upper diaphragm 132, that is, the circumference of the second outer ring portion 1333 of the lower diaphragm 133 is greater than the circumference of the first outer ring portion 1322 of the upper diaphragm 132, so that the lower diaphragm 133 and the upper diaphragm 132 are disposed separately in the thickness direction of the speaker 100, and the thickness of the speaker 100 is further reduced. And the sound-producing front cavity of the loudspeaker 100 can be formed between the upper diaphragm 132 and the lower diaphragm 133, and the dual-diaphragm vibration system 130 arranged up and down is beneficial to reducing the rolling vibration phenomenon caused by unbalanced front-back air pressure under the ultra-thin thickness, thereby improving the stability of the vibration system 130 and the sound quality of the loudspeaker 100.

By way of example and not limitation, the shape of the upper diaphragm 132 and the lower diaphragm 133 may each be rectangular, square, circular, or other shapes. The hollow structures of the upper diaphragm 132, the lower diaphragm 133, and the dome frame 131 may have a rectangular, square, circular, or other shape.

In the speaker 100 provided by the present application, the voice coil 134 in the vibration system 130 is composed of a winding coil wound around the periphery of the magnetic conductive plate 122 along the thickness direction of the speaker 100, and is located in the magnetic gap 125 in the magnetic circuit 120, and gaps are formed between the inner side wall of the voice coil 134 and the magnetic conductive plate 122, between the inner side wall of the voice coil 134 and the upper magnet 121, and between the voice coil and the lower magnet 123, and between the outer side wall of the voice coil 134 and the extension part 1242 of the porcelain bowl 124. The varying magnetic field generated when the voice coil 134 is energized interacts with the permanent magnetic field generated by the magnetic circuit 120, and thus drives the voice coil 134 to move up and down along the thickness direction of the magnetic circuit 120 within the magnetic gap 125.

Further, as shown in fig. 3 and 9, two ends of the voice coil 134 are respectively connected with a lead 135, and one or more through holes 11212 corresponding to the leads 135 are provided on the second substrate 1121 of the lower frame 112. The two leads 135 may respectively pass through the two through holes 11212 to be connected with two electrodes of the external driving module 230, and the driving module 230 is configured to provide an audio electric signal to the voice coil 134 through the leads 135, where the audio electric signal is an alternating current generated by the driving module 230 and changed according to an audio rule. Two leads 135 may also extend from the same aperture 11212 and connect to two electrodes of the drive module 230. When an alternating current flows through the voice coil 134, the voice coil 134 generates a magnetic field that varies with the alternating current, and the varying magnetic field interacts with the permanent magnetic field generated by the magnetic circuit 120, so that the voice coil 134 vibrates up and down in the thickness direction of the speaker 100.

It should be noted that, the bottom surface of each component described in the embodiment of the present application refers to the area of each component facing the second substrate 1121 of the lower frame 112, and the top surface of each component refers to the area of each component facing the first substrate 1111 of the upper frame 111.

Based on the speaker 100 provided by the application, the magnetic circuit system 120 is arranged on the periphery of the vibration system 130, so that the vibration system 130 and the magnetic circuit system 120 in the speaker 100 are arranged separately in the thickness direction of the speaker 100, namely, the thickness of the speaker 100 is the sum of the thicknesses of the housing 110 and the magnetic circuit system 120 or the sum of the thicknesses of the housing 110 and the vibration system 130, compared with the speaker 10 shown in fig. 1 and comprising the magnetic circuit system 102 and the vibration system 101 which are arranged in a vertically stacked manner, the speaker 100 provided by the embodiment of the application can effectively reduce the thickness of the speaker 100 and meet the requirement of thinning the speaker 100.

The following describes different connection modes of the vibration system 130, the magnetic circuit system 120 and the housing 210 in the speaker 100 according to the present application with reference to different drawings.

Example 1

Referring to fig. 2 to 7, fig. 2 is a schematic overall structure of a speaker 100 according to the first embodiment, fig. 3 is a schematic exploded structure of the speaker 100 shown in fig. 2, and fig. 4 to 7 are schematic sectional structures of the speaker 100 according to the first embodiment.

In the first embodiment, the upper diaphragm 132 and the lower diaphragm 133 in the vibration system 130 are both annular diaphragms having hollow structures, the lower diaphragm 133 is located at the periphery of the upper diaphragm 132, and the inner circumference of the lower diaphragm 133 is larger than the outer circumference of the upper diaphragm 132.

As shown in fig. 3 to 7, in the first embodiment, the perpendicular projection areas of the magnetic conductive plate 122 and the lower magnet 123 on the first substrate 1111 in the magnetic circuit system 120 are equal, the perpendicular projection area of the upper magnet 121 on the first substrate 1111 is smaller than the perpendicular projection area of the magnetic conductive plate 122 on the first substrate 1111, and the upper magnet 121 is located in the central area of the magnetic conductive plate 122.

In one example, referring to the sectional views shown in fig. 4 to 6, if the dome frame 131 includes a connection portion 1313, an upper step portion 1311 connected inside the connection portion 1313, and a lower step portion 1312 connected outside the connection portion 1313, a bottom surface of the upper step portion 1311 of the dome frame 131 may be connected with a top surface of the voice coil 134 or an inner side wall of the upper step portion 1311 may be connected with an outer side wall of the voice coil 134, a top surface of the upper step portion 1311 may be connected with a bottom surface of the first outer ring portion 1322 of the upper diaphragm 132, and a bottom surface of the first inner ring portion 1323 of the upper diaphragm 132 may be connected with a top surface of the magnetic conductive plate 122. The top surface of the lower step portion 1312 of the dome frame 131 is connected to the bottom surface of the second inner ring portion 1332 of the lower diaphragm 133, the bottom surface of the second outer ring portion 1333 of the lower diaphragm 133 is connected to the top surface of the second peripheral edge 1122 of the lower frame 112, and the bottom surface of the lower step portion 1312 is opposite to the second substrate 1121 with a certain gap therebetween.

Further, in this example, if the porcelain bowl 124 is disposed in the clamping groove 11211 of the lower basin frame 112, the voice coil 134 may be disposed in the magnetic gap 125 between the extension part 1242 of the porcelain bowl 124 and the magnetic conductive plate 122, and the outer sidewall of the extension part 1242 of the porcelain bowl 124 is opposite to the inner sidewall of the connection part 1313 of the dome frame 131, and has a certain gap with the inner sidewall of the connection part 1313. Meanwhile, the top surface of the extension part 1242 is opposite to the bottom surface of the upper step part 1311 of the dome frame 131, and has a certain gap with the bottom surface of the upper step part 1311. The height of the gap between the top surface of the extension part 1242 and the bottom surface of the upper step part 1311 and the height of the gap between the bottom surface of the lower step part 1312 and the second substrate 1121 should be greater than the height required for the dome frame 131 to vibrate up and down in the thickness direction of the speaker 100.

By way of example and not limitation, the dome frame 131 may be fixedly connected to the voice coil 134, the upper diaphragm 132, and the lower diaphragm 133 by bonding or welding.

In other examples, referring to the cross-sectional view shown in fig. 7, if the dome frame 131 includes an upper step 1311 and a lower step 1312 connected to the bottom of the connection portion 1313, the upper step 1311 is located inside the lower step 1312, the bottom surface of the upper step 1311 is at the same level as the bottom surface of the lower step 1312, and at the same time, the top surface of the upper step 1311 and the top surface of the voice coil 134 may be at the same level or the top surface of the upper step 1311 is higher than the top surface of the voice coil 134, the inner side wall of the upper step 1311 may be connected to the outer side wall of the voice coil 134, the bottom surface of the first inner ring 1323 of the upper diaphragm 132 is connected to the top surface of the magnetic conductive plate 122, and the bottom surface of the first outer ring 1322 of the upper diaphragm 132 is connected to the top surface of the upper step 1311 across the voice coil 134. The top surface of the lower step portion 1312 of the dome frame 131 is connected to the bottom surface of the second inner ring portion 1332 of the lower diaphragm 133 or the bottom surface of the lower step portion 1312 is connected to the top surface of the second inner ring portion 1332, the bottom surface of the second outer ring portion 1333 of the lower diaphragm 133 is connected to the top surface of the second peripheral edge 1122 of the lower frame 112, and the bottom surface of the lower step portion 1312 is opposite to the second substrate 1121 with a certain gap therebetween.

Further, in this example, if the bowl 124 is disposed in the clamping groove 11211 of the lower tub 112, the top surface of the extension 1242 of the bowl 124 may be opposite to the bottom surface of the upper step 1311 with a certain gap therebetween, and the height of the gap may be greater than the vibration height required when the dome frame 131 vibrates. The extension 1242 of the porcelain bowl 124 has a magnetic gap 125 with the magnetic conductive plate 122, and the voice coil 134 can move up and down in the magnetic gap 125.

In the first embodiment, as shown in fig. 4, the first ring portion 1321 of the upper diaphragm 132 may have an upwardly concave semi-arc structure, and the top surface of the first ring portion 1321 is opposite to the first substrate 1111 of the upper frame 111 and has a certain gap, and the height of the gap should be greater than the height of the upper diaphragm 132 for up-down vibration.

In one example, as shown in fig. 3-5, the first outer ring portion 1322 of the upper diaphragm 132 may be at the same level as the first inner ring portion 1323, with no level difference therebetween. If the voice coil 134 is in the non-energized state, the top of the voice coil 134 is higher than the magnetic conductive plate 122, the bottom of the first inner ring 1323 and the top of the magnetic conductive plate 122 may be fixedly connected by the adhesive layer 150 sleeved on the periphery of the upper magnet 121, and the top surface of the adhesive layer 150 and the top surface of the upper step 1311 of the dome frame 131 are located at the same level.

Illustratively, the adhesive layer 150 may be made of adhesive, gel, silicone grease, or the like.

In other examples, referring to the schematic cross-sectional structure of the speaker 100 shown in fig. 6 and 7, if the top surface of the voice coil 134 is higher than the magnetic plate 122 in the non-energized state of the voice coil 134, the first outer ring portion 1322 of the upper diaphragm 132 and the first inner ring portion 1323 may be not at the same level, and have a certain height difference therebetween, and the height of the first outer ring portion 1322 is higher than the height of the first inner ring portion 1323, so that the bottom surface of the first inner ring portion 1323 is fixedly connected with the top surface of the magnetic plate 122, and the bottom surface of the first outer ring portion 1322 is fixedly connected with the top surface of the upper step portion 1311 of the dome frame 131.

Illustratively, the first inner ring portion 1323 may be fixed to the top of the magnetically permeable plate 122 and the first outer ring portion 1322 may be fixed to the top surface of the upper step portion 1311 by an adhesive process.

In the first embodiment, as shown in fig. 5, the top surface of the upper magnet 121 in the magnetic circuit system 120 may be fixedly connected with the inner side wall of the first substrate 1111, and the upper frame 111, the upper magnet 121, the upper diaphragm 132, the dome skeleton 131 and the lower diaphragm 133 may be jointly enclosed to form a sealed front cavity of the speaker 100, so that the vibration of the vibration system 130 is more balanced, noise is reduced, and the sound quality of the speaker 100 is improved. The inner sidewall of the first substrate 1111 is a side surface of the first substrate 1111 facing the lower frame 112.

Alternatively, in order to precisely position the relative arrangement positions of the magnetic circuit 120 and the vibration system 130 when the speaker 100 is assembled, a through hole 11111 may be formed in the first substrate 1111, and the area of the through hole 11111 may be larger than the vertical projection area of the lower magnet 123 on the first substrate 1111 of the upper frame 111.

Further, as shown in fig. 4, in order to form a sealed front cavity in the speaker 100, a cover plate 113 may be disposed at the through hole 11111, so that the cover plate 113, the upper frame 111, the upper magnet 121, the upper diaphragm 132, the dome skeleton 131 and the lower diaphragm 133 jointly enclose the sealed front cavity, and the top of the upper magnet 121 in the magnetic circuit system 120 may be fixedly connected with the inner sidewall of the cover plate 113. The inner side wall of the cover plate 113 is the side surface of the cover plate 113 facing the lower basin frame 112.

By way of example and not limitation, the cover plate 113 may be snapped at the through hole 11111. The cover plate 113 may be fixed on the outer side surface of the first substrate 1111 by bonding or the like, and the cover plate 113 is covered at the through hole 11111, where the area of the cover plate 113 is larger than the area of the through hole 11111, so that not only the sealing performance of the sealed front cavity can be further improved, but also a sufficient vibration space can be provided for the first ring folding portion 1321 of the upper diaphragm 132.

In the first embodiment, the second ring 1331 of the lower diaphragm 133 may have a semi-arc structure recessed toward the second substrate 1121 of the lower frame 112 or a semi-arc structure recessed toward the first substrate 1111 of the upper frame 111. If the second ring 1331 is recessed toward the first substrate 1111 of the upper frame 111, the height of the gap between the top surface of the second ring 1331 and the first substrate 1111 should be greater than the vibration height of the lower diaphragm 133. As shown in fig. 4, if the second ring-shaped portion 1331 is recessed toward the second substrate 1121 of the lower frame 112, the height of the gap between the bottom surface of the second ring-shaped portion 1331 and the second substrate 1121 should be greater than the vibration height of the lower diaphragm 133.

Referring to the overall structure of the speaker 100 shown in fig. 2 and the cross-sectional structure of the speaker 100 shown in fig. 4, the shape of the housing 210 of the speaker 100 may be a matrix, the first peripheral edge 1112 of the upper frame 111 includes a first sidewall 11121 disposed obliquely with respect to the first substrate 1111 and three second sidewalls 11122 disposed perpendicularly with respect to the first substrate 1111, and when the upper frame 111 is covered with the lower frame 112, the bottom surface of the second sidewall 11122 is opposite to the top surface of the second peripheral edge 1122 of the lower frame 112, and the inner side surface of the first sidewall 11121 is connected to the outer side surface of the second peripheral edge 1122. The second ring-folded portion 1331 of the lower diaphragm 133 has a partial region fixedly disposed on the top surface of the second peripheral edge 1122 and opposite to the sound outlet 1113 formed in the first side wall 11121, and other regions in the second ring-folded portion 1331 are fixedly disposed between the bottom surface of the second side wall 11122 and the top surface of the second peripheral edge 1122. The sound outlet 1113 formed on the first sidewall 11121 may be communicated with the sealed front cavity of the speaker 100, and the vibration system 130 may drive air in the sealed front cavity to vibrate and sound when vibrating, and the sound outlet 1113 may transmit the generated sound to the outside of the speaker 100.

According to the speaker 100 provided in the first embodiment of the present application, the vibration system 130 is distributed around the magnetic circuit system 120, and the magnetic circuit system 120 and the vibration system 130 are separately arranged in the thickness direction, so that the upper limit of the thickness of the speaker 100 is the sum of the thicknesses of the magnetic circuit system 120 and the housing 110 or the sum of the thicknesses of the vibration system 130 and the housing 110, thereby reducing the thickness of the speaker 100. And the dome frame 131, the upper diaphragm 132, the lower diaphragm 133, the upper frame 111, the cover plate 113, and the upper magnet 121 may be enclosed to form a sealed front cavity of the speaker 100, so that stability of the vibration system 130 may be improved. The first ring-folded portion 1321 of the upper diaphragm 132 and the second ring-folded portion 1331 of the lower diaphragm 133 in the vibration system 130 are also separately arranged in the thickness direction, so that the height of the vibration system 130 can be further reduced, and meanwhile, the double annular diaphragms arranged up and down are beneficial to reducing the rolling vibration phenomenon caused by unbalanced front-back air pressure under the ultra-thin thickness, and reducing the generation of noise. The integrated dome frame 131 in the vibration system 130 is of an annular non-hollowed step structure, so that the strength of the connecting frame can be effectively improved, displacement difference between the voice coil 134 and the dome frame 131 is avoided, the displacement utilization rate is improved, and the sensitivity of the loudspeaker 100 is improved.

Example two

Referring to fig. 8 to 13, fig. 8 is a schematic diagram of the overall structure of a speaker 100 according to the second embodiment, fig. 9 is a schematic diagram of the exploded structure of the speaker 100 shown in fig. 8, and fig. 10 to 13 are schematic diagrams of different cross-sectional structures of the speaker 100 according to the second embodiment.

In the second embodiment, the upper diaphragm 132 and the lower diaphragm 133 in the vibration system 130 are hollow annular diaphragms, the lower diaphragm 133 is located at the periphery of the upper diaphragm 132, the outer circumference of the lower diaphragm 133 is greater than the outer circumference of the upper diaphragm 132, the inner circumference of the lower diaphragm 133 may be greater than or less than the outer circumference of the upper diaphragm 132, and the first ring-folded portion 1321 of the upper diaphragm 132 and the second ring-folded portion 1331 of the lower diaphragm 133 are separately disposed in the thickness direction.

As shown in fig. 9 to 13, in the second embodiment, the vertical projection areas of the upper magnet 121, the magnetic conductive plate 122 and the lower magnet 123 on the first substrate 1111 of the upper basin frame 111 are equal in the magnetic circuit system 120, and the upper magnet 121, the magnetic conductive plate 122 and the lower magnet 123 are located in the central region of the accommodating cavity 160.

In one example, referring to the sectional views shown in fig. 10 to 12, if the dome frame 131 includes a connection portion 1313, an upper step portion 1311 connected inside the connection portion 1313, and a lower step portion 1312 connected outside the connection portion 1313, the voice coil 134 may be wound around the outer periphery of the magnetic plate 122, the bottom surface of the upper step portion 1311 of the dome frame 131 may be connected with the top surface of the voice coil 134 or the inner side wall of the dome frame 131 may be connected with the outer side wall of the voice coil 134, the top surface of the upper step portion 1311 may be connected with the bottom surface of the first inner ring portion 1323 of the upper diaphragm 132, and the top surface of the first outer ring portion 1322 of the upper diaphragm 132 may be connected with the first substrate 1111. The top surface of the lower step portion 1312 of the dome frame 131 is connected to the bottom surface of the second inner ring portion 1332 of the lower diaphragm 133 or the bottom surface of the lower step portion 1312 is connected to the top surface of the second inner ring portion 1332, the bottom surface of the second outer ring portion 1333 of the lower diaphragm 133 is connected to the top surface of the second peripheral edge 1122 of the lower frame 112, and the bottom surface of the lower step portion 1312 is opposite to the second substrate 1121 with a certain gap therebetween.

It can be understood that, the voice coil 134 can drive the dome frame 131 to vibrate during moving, and the dome frame 131 can drive the upper diaphragm 132 and the lower diaphragm 133 to vibrate, so as to drive the air in the front cavity of the speaker 100 to vibrate and sound, and the height of the gap between the bottom surface of the lower step portion 1312 and the second substrate 1121 should be greater than the height required by the dome frame 131 to vibrate up and down along the thickness direction of the speaker 100.

Further, in this example, if the ceramic bowl 124 is disposed in the clamping slot 11211 of the lower basin frame 112, the voice coil 134 may be disposed in the magnetic gap 125 between the extension portion 1242 of the ceramic bowl 124 and the magnetic conductive plate 122, the outer sidewall of the extension portion 1242 of the ceramic bowl 124 is opposite to the inner sidewall of the connection portion 1313 of the dome frame 131, and a certain gap is formed between the outer sidewall of the extension portion 1242 and the inner sidewall of the connection portion 1313, so as to avoid friction with the ceramic bowl 124 when the dome frame 131 vibrates up and down. Meanwhile, the top surface of the extension part 1242 is opposite to the bottom surface of the upper step part 1311 of the dome frame 131, and a certain gap is also provided between the top surface of the extension part 1242 and the bottom surface of the upper step part 1311, and the height of the gap should be greater than that required when the dome frame 131 vibrates up and down in the thickness direction of the speaker 100.

The inner side wall of the connection portion 1313 faces the side surface of the magnetic circuit 120, and the outer side wall of the connection portion 1313 faces away from the magnetic circuit 120.

In other examples, referring to the cross-sectional view shown in fig. 13, if the dome frame 131 includes an upper step 1311 and a lower step 1312 connected to the bottom of the connection portion 1313, the bottom surface of the upper step 1311 and the bottom surface of the lower step 1312 may be at the same level, the top surface of the upper step 1311 and the top surface of the voice coil 134 may be at the same level or the top surface of the upper step 1311 may be higher than the top surface of the voice coil 134, and the inner sidewall of the upper step 1311 may be connected to the outer sidewall of the voice coil 134, and the bottom surface of the first inner ring portion 1323 of the upper diaphragm 132 may be connected to the top surface of the upper step 1311; the top surface of the lower step portion 1312 of the dome frame 131 is connected to the bottom surface of the second inner ring portion 1332 of the lower diaphragm 133 or the bottom surface of the lower step portion 1312 is connected to the top surface of the second inner ring portion 1332, the bottom surface of the second outer ring portion 1333 of the lower diaphragm 133 is connected to the top surface of the second peripheral edge 1122 of the lower frame 112, and the bottom surface of the lower step portion 1312 is opposite to the second substrate 1121 with a certain gap therebetween.

In the second embodiment, as shown in fig. 10, the first ring-folded portion 1321 of the upper diaphragm 132 has a semi-arc structure recessed toward the second substrate 1121, and the bottom surface of the first ring-folded portion 1321 is opposite to the top surface of the lower step portion 1312 of the dome frame 131 and has a certain gap between the top surface of the first inner ring-folded portion 1323 of the upper diaphragm 132 and the first substrate 1111 of the upper frame 111.

It should be noted that, if the first ring portion 1321 of the upper diaphragm 132 is configured as an upwardly concave semi-arc structure, a required gap height between the top surface of the upper diaphragm 132 and the first substrate 1111 of the upper frame 111 includes an upwardly concave height and a vibration height of the upper diaphragm 132, so as to increase the thickness of the speaker 100. In the second embodiment of the present application, the first ring portion 1321 of the upper diaphragm 132 is recessed downward, so that the height of the gap between the top surface of the upper diaphragm 132 and the first substrate 1111 of the upper frame 111 can be reduced, so that the gap only needs to satisfy the vibration height of the upper diaphragm 132, and the thickness of the speaker 100 can be further reduced.

In the second embodiment, the first outer ring portion 1322 of the upper diaphragm 132 may be directly and fixedly connected to the first substrate 1111 of the upper frame 111, or may be fixedly connected to the first substrate 1111 through the connection plate 140.

In an example, the first substrate 1111 is provided with a through hole 11111, and the area of the through hole 11111 may be larger than the vertical projection area of the upper diaphragm 132 on the first substrate 1111, that is, the circumference of the through hole 11111 is larger than the circumference of the outer ring of the upper diaphragm 132, so as to provide a positioning window for mounting the vibration system 130 and the magnetic circuit system 120 when the speaker 100 is assembled, and then the upper diaphragm 132 may be fixedly connected to the first substrate 1111 through the connection plate 140.

Specifically, as shown in fig. 10, an annular connection plate 140 may be disposed on an inner sidewall of the first substrate 1111, a central region of the connection plate 140 has a hollow structure, and the hollow structure of the connection plate 140 is communicated with the hollow structure of the upper diaphragm 132, an outer ring region of a top surface of the connection plate 140 is connected with the inner sidewall of the first substrate 1111, an inner ring region of the top surface of the connection plate 140 is opposite to the through hole 11111, then the first outer ring portion 1322 of the upper diaphragm 132 may be connected with a bottom surface of the connection plate 140, and a top surface of the upper magnet 121 in the magnetic circuit 120 may pass through the hollow structure of the connection plate 140.

Further, as shown in fig. 10 and 13, when the cover plate 113 is clamped at the through hole 11111 formed in the first substrate 1111, in order to improve the connection strength between the first substrate 1111 and the cover plate 113 and fix the upper diaphragm 132 on the upper frame 111, the inner ring area of the top surface of the connecting plate 140 may be connected with the inner side wall of the cover plate 113, that is, the connecting plate 140 is located at the connection between the first substrate 1111 and the cover plate 113, and the top surface of the upper magnet 121 in the magnetic circuit 120 may pass through the hollow structure of the connecting plate 140 and be fixedly connected with the inner side wall of the cover plate 113.

In this example, the first outer ring portion 1322 and the first inner ring portion 1323 of the upper diaphragm 132 may have a certain height difference therebetween, specifically, as shown in fig. 10 and 13, the height of the first outer ring portion 1322 may be greater than the height of the first inner ring portion 1323, and the height of the bottom surface of the connection plate 140 may be greater than the height of the first inner ring portion 1323; or the height of the first outer ring portion 1322 may be smaller than the height of the first inner ring portion 1323, and the height of the bottom surface of the connection plate 140 may be smaller than the height of the first inner ring portion 1323. The first outer ring portion 1322 and the first inner ring portion 1323 of the upper diaphragm 132 may also be at the same level, and accordingly, the bottom surface of the connecting plate 140 and the top surface of the first inner ring portion 1323 are at the same level.

By way of example and not limitation, the first base plate 1111, the cover plate 113, and the first outer ring portion 1322 may be fixedly coupled to the connection plate 140 by bonding or welding.

In other examples, as shown in fig. 11, if the area of the through hole 11111 formed in the first substrate 1111 is larger than the vertical projection area of the magnetic circuit system 120 on the first substrate 1111 and smaller than the outer ring area of the upper diaphragm 132, or as shown in fig. 12, the first substrate 1111 is not provided with the through hole 11111, the top surface of the first outer ring portion 1322 of the upper diaphragm 132 may be fixedly connected with the inner side wall of the first substrate 1111, and the height of the first outer ring portion 1322 may be larger than the height of the first inner ring portion 1323. If the through hole 11111 is clamped with the cover plate 113 or the cover plate 113 is disposed on the outer sidewall of the first substrate 1111 and covers the through hole 11111, the top surface of the upper magnet 121 in the magnetic circuit system 120 is fixedly connected with the inner sidewall of the cover plate 113. If the through hole 11111 is not formed in the first substrate 1111, the top surface of the upper magnet 121 in the magnetic circuit system 120 is fixedly connected to the inner sidewall of the first substrate 1111.

In the second embodiment, the second ring 1331 of the lower diaphragm 133 may have a semi-arc structure with a downward recess or a semi-arc structure with an upward recess. As shown in fig. 10, if the second ring-shaped portion 1331 is recessed upward, the height of the gap between the top surface of the second ring-shaped portion 1331 and the first substrate 1111 should be greater than the vibration height of the lower diaphragm 133. If the second ring portion 1331 is recessed downward, the height of the gap between the bottom surface of the second ring portion 1331 and the second substrate 1121 should be greater than the vibration height of the lower diaphragm 133. The height of the gap between the top surface of the second ring-folded portion 1331 of the lower diaphragm 133 and the bottom surface of the connection plate 140 or the first substrate 1111 of the upper frame 111 should be greater than the vibration height of the lower diaphragm 133.

Alternatively, the second inner ring 1332 and the second outer ring 1333 of the lower diaphragm 133 may be at the same level, and the top surface of the lower step 1312 of the dome frame 131 and the top surface of the second peripheral edge 1122 of the lower basin frame 112 may be at the same level. The second inner ring portion 1332 and the second outer ring portion 1333 of the lower diaphragm 133 may also be at different levels, for example, the height of the second inner ring portion 1332 relative to the second substrate 1121 is greater than the height of the second outer ring portion 1333 relative to the second substrate 1121, or the height of the second inner ring portion 1332 relative to the second substrate 1121 is less than the height of the second outer ring portion 1333 relative to the second substrate 1121.

Referring to the schematic cross-sectional structure of the speaker 100 shown in fig. 10 to 13, the housing 210 of the speaker 100 may be shaped as a matrix, the first peripheral edge 1112 of the upper frame 111 includes a first sidewall 11121 disposed obliquely with respect to the first substrate 1111 and three second sidewalls 11122 disposed vertically with respect to the first substrate 1111, and when the upper frame 111 is covered with the lower frame 112, the bottom surface of the second sidewall 11122 is opposite to the top surface of the second peripheral edge 1122 of the lower frame 112, and the inner side surface of the first sidewall 11121 is connected to the outer side surface of the second peripheral edge 1122. The second ring-folding portion 1331 of the lower diaphragm 133 has a partial area fixedly disposed on the top surface of the second peripheral edge 1122 of the lower frame 112 and opposite to the sound outlet 1113 formed in the first side wall 11121, and other areas in the second ring-folding portion 1331 are fixedly disposed between the bottom surface of the second side wall 11122 and the top surface of the second peripheral edge 1122 of the lower frame 112.

It should be noted that, based on the speaker 100 provided with the connection plate 140 shown in fig. 10 and 13, the upper frame 111, the connection plate 140, the upper diaphragm 132, the dome skeleton 131, and the lower diaphragm 133 may collectively enclose a sealed front cavity in the speaker 100. Based on the speaker 100 shown in fig. 11 and 12, which is not provided with the connection plate 140, the upper frame 111, the upper diaphragm 132, the dome skeleton 131, and the lower diaphragm 133 may collectively enclose a sealed front cavity of the speaker 100. The sealed front cavity in the loudspeaker 100 is communicated with the sound outlet 1113 formed on the first peripheral edge 1112 of the upper basin frame 111, so that the vibration of the vibration system 130 can be balanced, the generation of noise is reduced, and the sound quality of the loudspeaker 100 is improved.

According to the speaker 100 provided in the second embodiment of the present application, the vibration system 130 is enclosed around the magnetic circuit system 120, so that the upper limit of the thickness of the speaker 100 is the sum of the thicknesses of the magnetic circuit system 120 and the housing 110 or the sum of the thicknesses of the vibration system 130 and the housing 110, thereby reducing the thickness of the speaker 100. The upper vibrating diaphragm 132 and the lower vibrating diaphragm 133 in the vibrating system 130 are also separately arranged in the thickness direction, and the annular folding direction of the upper vibrating diaphragm 132 is downward, so that the height space occupied by the first annular folding portion 1321 can be further reduced, meanwhile, the vibrating system 130 in the loudspeaker 100 and the upper basin frame 111 can be jointly enclosed into a sealed front cavity, the double annular vibrating diaphragms arranged up and down are beneficial to reducing the rolling vibration phenomenon caused by front-rear air pressure imbalance under the ultra-thin thickness, reducing noise generated by vibration imbalance, and further improving the tone quality and stability of the loudspeaker 100. The integral type ball top skeleton 131 in vibration system 130 is annular non-fretwork step structure, can effectively promote the intensity of connecting the skeleton, avoids producing displacement difference between voice coil 134 and the ball top skeleton 131, and ball top skeleton 131 both possesses ball top function, can vibrate the sound production under the drive of voice coil 134, possesses the function of transmission displacement again, drives vibrating diaphragm 132 and lower vibrating diaphragm 133 vibration sound production, can increase vibration area of vibration system 130, improves the displacement utilization ratio, and then promotes the sensitivity of speaker 100.

An exemplary process flow of assembling the speaker 100 according to the embodiment of the present application will be described below with reference to the process flow chart of assembling the speaker 100 shown in fig. 14, taking the schematic diagram of the explosion structure of the speaker 100 shown in fig. 9 as an example. The assembly process of the speaker 100 mainly includes the steps of:

step one, the voice coil 134, the lead wire 135 and the lower frame 112 are connected to form a first assembly.

Specifically, the leads 135 provided at both ends of the voice coil 134 may be respectively passed through the two through holes 11212 provided in the lower frame 112.

And step two, connecting the dome skeleton 131 with the lower vibrating diaphragm 133 to form a second assembly.

For example, the top surface of the lower step portion 1312 of the dome frame 131 may be fixedly coupled with the bottom surface of the second inner ring portion 1332 of the lower diaphragm 133 by welding or bonding.

And thirdly, assembling the second assembly body with the first assembly body to form a third assembly body.

For example, the top surface of the voice coil 134 may be fixedly coupled to the bottom surface of the upper stepped portion 1311 of the dome frame 131 by welding or bonding, and the bottom surface of the second outer ring portion 1333 of the lower diaphragm 133 may be fixed to the top surface of the second peripheral edge 1122 of the lower frame 112.

And step four, connecting the upper basin frame 111, the connecting plate 140 and the upper vibrating diaphragm 132 to form a fourth assembly.

For example, the connection plate 140 may be fixed to the inner sidewall of the upper frame 111 by welding or bonding, and the top surface of the first outer ring portion 1322 of the upper diaphragm 132 may be fixed to the bottom surface of the connection plate 140.

And fifthly, connecting the upper magnet 121, the magnetic conduction plate 122 and the lower magnet 123 with the porcelain bowl 124 to form a fifth assembly.

For example, the upper magnet 121, the magnetic conductive plate 122, and the lower magnet 123, which are stacked, may be adhered to the inner sidewall of the bottom plate 1241 of the porcelain bowl 124.

Step six, the third assembly is used as positioning reference, the fourth assembly and the fifth assembly are assembled with the third assembly, and the cover plate 113 is arranged on the upper basin frame 111 to form the loudspeaker 100.

Illustratively, the upper frame 111 of the fourth assembly is covered on the top of the lower frame 112, and the bottom surface of the first inner ring portion 1323 of the upper diaphragm 132 of the fourth assembly is fixedly connected to the top surface of the upper step portion 1311 of the dome frame 131 of the third assembly. The fifth assembly passes through the clamping groove 11211 formed on the second substrate 1121 of the lower basin frame 112, so that the ceramic bowl 124 is clamped in the clamping groove 11211, and the voice coil 134 in the third assembly is placed in the magnetic gap 125 between the ceramic bowl 124 and the lower magnet 123, and the extension part 1242 of the ceramic bowl 124 is located between the connection part 1313 of the dome frame 131 and the voice coil 134. Finally, the cover 113 is fixed at the through hole 11111 of the upper frame 111 by welding or bonding, and the inner sidewall of the cover 113 is bonded to the top surface of the connection plate 140, thereby forming the speaker 100.

Based on the speaker 100 provided in the foregoing embodiment of the present application, the present application further provides an electronic device 200, and fig. 15 is a schematic diagram of the overall structure of the electronic device 200 provided in the embodiment of the present application. As shown in fig. 15, the electronic device 200 includes a housing 210 and the speaker 100 provided in any of the foregoing embodiments, and the speaker 100 is accommodated in the housing 210.

In one example, at least one sound outlet hole 211 is formed in the housing 210, and each sound outlet hole 211 is in communication with a sound outlet hole 1113 formed in the speaker 100, so that sound emitted by the speaker 100 is sequentially transmitted to the outside of the electronic device 200 through the sound outlet holes 1113 and the sound outlet holes 211.

Optionally, the casing 210 may further include an acoustic pipe 220, where the acoustic pipe 220 is used to communicate with the acoustic hole 211 and the acoustic hole 1113 on the speaker 100, so that the sound emitted by the speaker 100 is transmitted to the outside of the electronic device 200 through the acoustic hole 1113, the acoustic pipe 220, and the acoustic hole 211 in sequence.

Further, the electronic device 200 further includes a driving module 230, two electrodes of the driving module 230 are used for being connected to two leads 135 in the speaker 100 in a one-to-one correspondence, and the driving module 230 can transmit the output audio electric signal to the voice coil 134 in the speaker 100 through the leads 135.

Illustratively, the driver module 230 may be an audio electrical signal output circuit.

By way of example, and not limitation, the electronic device 200 may be an electronic product with sound playing function such as a cell phone, tablet computer, notebook computer, wearable device, etc. The wearable device can be an intelligent bracelet, an intelligent watch, an intelligent head display, intelligent glasses and the like.

It should be noted that the structure illustrated in the embodiment of the present application does not constitute a specific limitation of the electronic device 200. In other embodiments of the application, electronic device 200 may include more or fewer components than shown, or certain components may be combined, or certain components may be separated, or different arrangements of components.

The foregoing is merely illustrative of the present application, and the present application is not limited thereto, and any person skilled in the art will readily recognize that variations or substitutions are within the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims

1. A loudspeaker, comprising: a housing (110), a magnetic circuit system (120) and a vibration system (130);

The vibration system (130) includes: a dome frame (131), an upper diaphragm (132), a lower diaphragm (133) and a voice coil (134);

the dome frame (131) is of a stepped annular hollow structure, and the upper vibrating diaphragm (132), the lower vibrating diaphragm (133) and the voice coil (134) are of annular hollow structures;

the voice coil (134) and the upper vibrating diaphragm (132) are connected with an upper step part (1311) of the dome frame (131), and the lower vibrating diaphragm (133) is connected with a lower step part (1312) of the dome frame (131);

the magnetic circuit (120) is arranged in the voice coil (134) in a penetrating mode, the ball top framework (131), the upper vibrating diaphragm (132) and the lower vibrating diaphragm (133) are of a hollow structure, the top of the magnetic circuit (120) is connected with the top of the shell (110), and the bottom of the magnetic circuit (120) is connected with the bottom of the shell (110).

2. The speaker of claim 1, wherein a top surface of the voice coil (134) is connected to a bottom surface of the upper step (1311), and a bottom surface of the upper diaphragm (132) is connected to a top surface of the upper step (1311).

3. The speaker of claim 1, wherein an outer sidewall of the voice coil (134) is connected to an inner sidewall of the upper stepped portion (1311), and a bottom surface of the upper diaphragm (132) is connected to a top surface of the upper stepped portion (1311).

4. The speaker of claim 1, wherein the upper step (1311) is provided inside the lower step (1312).

5. The speaker according to any one of claims 2 to 4, wherein the dome frame (131) is of an integrally formed structure, and a bottom surface of the upper step portion (1311) is higher than a bottom surface of the lower step portion (1312).

6. The speaker according to claim 1, wherein the magnetic circuit system (120) includes an upper magnet (121), a magnetically conductive plate (122), and a lower magnet (123) that are stacked;

the upper magnet (121) is connected with the top of the shell (110), and the lower magnet (123) is connected with the bottom of the shell (110).

7. The loudspeaker of claim 6, wherein the magnetic circuit system (120) further comprises a porcelain bowl (124), the porcelain bowl (124) being disposed at a bottom of the housing (110);

the porcelain bowl (124) comprises a bottom plate (1241), and an extension part (1242) extending towards the top of the shell (110) is arranged on the bottom plate (1241);

the upper magnet (121), the magnetic conductive plate (122) and the lower magnet (123) are stacked on the bottom plate (1241);

a magnetic gap (125) is formed between the extension part (1242) and the upper magnet (121), the magnetic conduction plate (122) and the lower magnet (123), and the voice coil (134) is arranged in the magnetic gap (125).

8. The loudspeaker of claim 7, wherein a clamping groove (11211) is formed in the bottom of the housing (110), and the porcelain bowl (124) is disposed in the clamping groove (11211).

9. The speaker of claim 6, wherein an area of the upper magnet (121) is smaller than an area of the magnetically permeable plate (122);

the upper diaphragm (132) includes: a first ring-folded portion (1321), a first inner ring portion (1323) provided inside the first ring-folded portion (1321), and a first outer ring portion (1322) provided outside the first ring-folded portion (1321);

the first ring folding part (1321) is of an arc-shaped structure which is recessed towards the top of the shell (110);

the bottom surface of the first inner ring part (1323) is connected to the top surface of the magnetic conductive plate (122), and the bottom surface of the first outer ring part (1322) is connected to the top surface of the upper step part (1311).

10. The loudspeaker of claim 1, wherein the upper diaphragm (132) comprises: a first ring-folded portion (1321), a first inner ring portion (1323) provided inside the first ring-folded portion (1321), and a first outer ring portion (1322) provided outside the first ring-folded portion (1321);

the first ring folding part (1321) is of an arc-shaped structure which is recessed towards the bottom of the shell (110);

The bottom surface of the first inner ring part (1323) is connected to the top surface of the upper step part (1311), and the top surface of the first outer ring part (1322) is connected to the top of the housing (110).

11. The speaker according to claim 9 or 10, characterized in that the first inner ring portion (1323) is located at the same level as the first outer ring portion (1322) or that the height of the first inner ring portion (1323) relative to the first collar portion (1321) is smaller than the height of the first outer ring portion (1322) relative to the first collar portion (1321).

12. The loudspeaker according to claim 1, wherein the lower diaphragm (133) comprises: a second ring-folded portion (1331), a second inner ring portion (1332) provided inside the second ring-folded portion (1331), and a second outer ring portion (1333) provided outside the second ring-folded portion (1331);

the bottom surface of the second inner ring part (1332) is connected with the top surface of the lower step part (1312), and the bottom surface of the second outer ring part (1333) is connected with the side surface of the shell (110).

13. The speaker of claim 12, wherein the second collar portion (1331) is an arcuate structure recessed toward a top of the housing (110) or a bottom of the housing (110).

14. The loudspeaker of claim 1, wherein the housing (110) comprises: an upper basin frame (111) and a lower basin frame (112);

the upper basin frame (111) covers the lower basin frame (112) and forms a containing cavity (160) of the loudspeaker (100) with the lower basin frame (112);

the magnetic circuit system (120) and the vibration system (130) are arranged in the accommodating cavity (160).

15. The loudspeaker of claim 14, wherein the upper frame (111) comprises a first base plate (1111);

the first substrate (1111) is provided with a through hole (11111), the through hole (11111) is opposite to the hollow structure of the upper vibrating diaphragm (132), and the area of the through hole (11111) is larger than or equal to the vertical projection area of the magnetic circuit system (120) on the first substrate (1111).

16. The loudspeaker of claim 15, wherein the loudspeaker (100) further comprises a connection plate (140);

the connecting plate (140) is of an annular hollow structure, and the area of the through hole (11111) is larger than or equal to the vertical projection area of the upper vibrating diaphragm (132) on the first substrate (1111);

the top surface of connecting plate (140) with the top surface of casing (110) is connected, the bottom surface of connecting plate (140) with the top surface of last vibrating diaphragm (132) is connected.

17. The loudspeaker according to claim 15 or 16, wherein the loudspeaker (100) further comprises a cover plate (113), the cover plate (113) being arranged at the through hole (11111).

18. The loudspeaker of claim 15, wherein the first base plate (1111) is provided with a first peripheral edge (1112) extending towards the lower frame (112);

the first surrounding edge (1112) is provided with a sound outlet hole (1113), and the sound outlet hole (1113) is used for guiding out sound generated in the accommodating cavity (160) from the loudspeaker (100).

19. The loudspeaker of claim 14, wherein the loudspeaker (100) further comprises a lead (135);

the lower basin frame (112) is provided with a perforation (11212);

one end of the lead wire (135) is connected with the voice coil (134), and the other end of the lead wire penetrates out of the through hole (11212) to be connected with the driving module (230).

20. An electronic device, comprising: a housing (210) and a loudspeaker (100) according to any one of claims 1 to 19, the loudspeaker (100) being accommodated within the housing (210).

21. The electronic device according to claim 20, wherein the housing (210) is provided with a sound outlet (211);

The sound outlet hole (211) communicates with the sound outlet hole (1113) of the speaker (100).

22. The electronic device of claim 20 or 21, further comprising a drive module (230);

the drive module (230) is connected with a lead wire (135) of the loudspeaker (100), and the drive module (230) is used for providing audio electric signals for a voice coil (134) of the loudspeaker (100) through the lead wire (135).