CN219997120U - A temperature generating device and terminal testing equipment - Google Patents

Abstract

The embodiment of the application provides a temperature generating device and terminal test equipment. The accommodating cavity of the box body can be internally provided with a piece to be tested, and the heating part and the refrigerating part of the temperature change assembly can respectively emit heat and absorb heat to the interior of the accommodating cavity, so that the high-low temperature adjustment of the interior of the accommodating cavity is realized. The air curtain generated by the air curtain component cuts off the inner and outer air flow of the opening of the box body, reduces the heat exchange between the inner and outer parts of the box body, and forms a semi-open high-low temperature groove structure. Under the high-low temperature environment formed by the temperature generating device, a user can perform man-machine interaction operation on the to-be-detected piece in the box body, the actual use scene of the user at high and low temperatures is better simulated, and the test scene is relatively close to the actual use scene. The temperature generating device can be fixed on the mobile vehicle, and the camera to be detected can move along with the mobile vehicle, so that scene shooting is realized. The simulated finger piece stretches into the accommodating cavity from the opening of the box body, so that the operation of a user on the touch display screen to be tested can be simulated, and whether the touch display screen has faults at high and low temperatures can be judged.

Description

A temperature generating device and terminal testing equipment

Technical field

The embodiments of the present application relate to the technical field of high and low temperature environment testing, and in particular, to a temperature generating device and terminal testing equipment.

Background technique

Conventional devices can be tested in high and low temperature environments (such as -20°C to 60°C) using traditional temperature chamber testing devices to evaluate the performance of the devices under high and low temperatures. The traditional thermostat test device includes a box body, a glass movable door, a refrigeration device and a heating device. The glass movable door is opened and closed on the box body. Place the component to be tested inside the box, close the glass movable door, and start the cooling device or heating device to achieve cooling or heating, creating a high and low temperature environment in the box. The traditional thermostat testing device is large in size and heavy in weight.

In high and low temperature environments, during human-computer interaction between users and terminals (such as mobile phones, tablets, etc.), the terminal may experience failure of screen touch or display, camera or flash. When testing terminals in high and low temperature environments in a traditional thermostat test device, the glass movable door needs to be closed to keep the terminal in a closed box. Users cannot perform human-computer interaction operations on the terminal through the glass movable door, making it difficult to simulate well. Actual usage scenarios of users under high and low temperatures, such as human hands touching the screen, screen display, taking pictures, etc.

Utility model content

Embodiments of the present application provide a temperature generating device and terminal testing equipment, which solve the problem that traditional thermostat testing devices are difficult to better simulate users' actual usage scenarios under high and low temperatures.

The embodiments of this application adopt the following technical solutions:

In a first aspect, embodiments of the present application provide a temperature generating device, including a box, a temperature change component and an air curtain component. The box body has a communicating receiving cavity and an opening, and the receiving cavity can accommodate the piece to be tested. The temperature change component has a heating part and a cooling part. The heating part and/or the cooling part are arranged toward the inside of the accommodation cavity. The heating part is used to release heat from the inside of the accommodation cavity, and the cooling part is used to absorb heat from the inside of the accommodation cavity. The air curtain assembly is used to generate an air curtain at the opening to isolate the internal air flow of the containing cavity from the external air flow of the box.

In the temperature generating device provided by the embodiment of the present application, the object to be tested can be placed in the accommodation cavity of the box, and the heating part and the cooling part of the temperature change component can respectively release and absorb heat inside the accommodation cavity, thereby achieving control of the inside of the accommodation cavity. high and low temperature adjustment. The air curtain generated by the air curtain assembly blocks the airflow inside and outside the box opening, reduces the heat exchange inside and outside the box, and forms a semi-open high and low temperature trough structure, which effectively avoids condensation on the glass movable door of the traditional thermostat test device. , to ensure the cooling effect of the refrigeration part or the heating effect of the heating part. In the high and low temperature environment formed by the temperature generating device, when the device under test is a terminal, the user can perform human-computer interaction on the terminal in the box, which can better simulate the actual usage scenarios of users at high and low temperatures, such as human hands touching the screen, screen Display, photography, etc., the test scene is relatively close to the actual usage scene.

In an optional implementation, the box can be made into a minimum size of a stacked structure of two or three pieces to be tested. The receiving cavity of the box can only accommodate the parts to be tested. Compared with traditional thermostat testing devices, the box in the temperature generating device of the embodiment of the present application can be made smaller.

In an optional implementation, a carrier platform is detachably installed in the box, and the carrier platform is used to fix the component to be tested. It can quickly make the housing cavity of the box reach the target temperature, reduce the realization time of high and low temperature environments, and improve test efficiency.

In an optional implementation, the carrier is plate-shaped, and the carrier is detachably installed on the inner bottom surface of the box. The plate-shaped carrier occupies less space in the accommodation cavity, allowing the box to be made smaller. It is also convenient for the parts to be tested to be placed on the carrier.

In an optional implementation method, semiconductor refrigeration pieces or vortex tubes are used as temperature-changing components. These methods are miniaturized heat exchange methods. The size of the box body and the temperature change component can be set smaller, and the temperature change component and the box body are arranged adjacently, so that the overall structure of the temperature generating device is smaller and compact.

In an optional implementation, the temperature change component includes a first semiconductor refrigeration piece and a second semiconductor refrigeration piece. The first semiconductor refrigeration piece has a first hot end and a first cold end arranged oppositely, and the second semiconductor refrigeration piece has The second hot end and the second cold end are arranged oppositely. The first hot end serves as the heating part and is disposed toward the inside of the accommodating cavity. The second cold end serves as the cooling part and is disposed toward the inside of the accommodating cavity.

When heating is required, direct current is supplied to the first semiconductor refrigeration chip, and the first hot end releases heat to heat up the interior of the accommodation cavity. When refrigeration is required, direct current is supplied to the second semiconductor refrigeration chip, and the second cold end absorbs heat to cool down the interior of the accommodation cavity.

In an optional implementation, the carrier can be set to have a larger heat exchange area, and both the first hot end of the first semiconductor refrigeration piece and the second cold end of the second semiconductor refrigeration piece can be in contact with the carrier, Good heat conduction is formed between the first semiconductor refrigeration piece and the carrier, and between the second semiconductor refrigeration piece and the carrier, and a predetermined high and low temperature environment is quickly formed in the accommodation cavity.

In an optional implementation, the temperature change component includes a first semiconductor refrigeration piece. The first semiconductor refrigeration piece has a first hot end and a first cold end arranged oppositely. The first hot end serves as the heating part, and the first cold end The first hot end and the first cold end are selectively disposed toward the inside of the accommodation cavity.

According to the demand for heating or cooling in the accommodation cavity, changing the direction of the direct current flowing into the first semiconductor refrigeration piece can achieve heating or cooling on the end of the first semiconductor refrigeration piece facing the accommodation cavity.

In an optional implementation, the carrier can be set to have a larger heat exchange area, and one end of the first semiconductor refrigeration piece facing the accommodation cavity can be in contact with the carrier, forming a gap between the first semiconductor refrigeration piece and the carrier. Good heat conduction quickly forms a predetermined high and low temperature environment in the housing cavity.

In an optional implementation, the temperature change component includes a vortex tube, a first channel, a second channel, a first control valve and a second control valve. The vortex tube has an input end, a hot air end and a cold air end that are connected to each other. The input end is used to introduce compressed air, the hot air end is used to output hot air, and the cold air end is used to output cold air. The hot gas end and the accommodation cavity are connected through a first channel, a first control valve is provided on the first channel, and the first channel serves as the heating part. The cold air end and the accommodation cavity are connected through a second channel, a second control valve is provided on the second channel, and the second channel serves as the refrigeration part.

The compressed air is introduced into the input end of the vortex tube, the hot air end outputs hot air, and the cold air end outputs cold air. When heating is required, the first control valve is opened to allow the hot air output from the hot air end to enter the accommodation cavity through the first channel, and the second control valve is adjusted to prevent the cold air output from the cold air end from entering the accommodation cavity to heat the interior of the accommodation cavity. When cooling is required, the second control valve is opened to allow the cold air output from the cold air end to enter the accommodation cavity through the second channel, and the first control valve is adjusted to prevent the hot air output from the hot air end from entering the accommodation cavity, thereby cooling the interior of the accommodation cavity.

In an optional implementation, the air curtain assembly is located outside the box, the box has a pipeline, the first port of the pipeline is connected to the output end of the air curtain assembly, and the second port of the pipeline is disposed toward the opening.

The dry air flow generated by the air curtain assembly can be sent into the opening of the box through the pipeline to isolate the air flow inside and outside the box, reduce the heat exchange inside and outside the box, and reduce the entry of external air moisture into the box.

In an optional implementation, the second port can be disposed toward the center of the opening, so that the compressed air coming out of the second port can cover the opening.

In an optional implementation, multiple second ports can be arranged in an annular shape on the inner wall of the opening, so that the air curtain coming out of the second port can better cover the opening of the box to isolate the air flow inside the box from the outside. Air flow reduces heat exchange inside and outside the box.

In some embodiments, the box has an air duct connected to the accommodation cavity, and the temperature generating device further includes a ventilation component, and the air outlet end of the ventilation component is connected to the air duct.

The air flow generated by the ventilation component enters the interior of the accommodation cavity through the air duct. The air flow sent into the accommodation cavity can make the heat distribution inside the accommodation cavity more uniform and better simulate the actual high and low temperature environment.

In an optional implementation, the box has a thermal insulation layer. The insulation layer is provided so that the box has a better thermal insulation effect, and the outer wall of the box is close to the outside temperature.

In an optional implementation, the box also has a reinforcing layer outside the thermal insulation layer, which can improve the structural strength.

In an optional implementation, a temperature sensor is provided in the box for measuring the internal temperature of the accommodation cavity. The actual temperature inside the accommodation cavity is measured by a temperature sensor, so that the temperature variable component can be adjusted to cool or heat the inside of the accommodation cavity to achieve the target temperature.

In an optional implementation manner, the temperature sensor is electrically connected to the processor, and the processor is electrically connected to the temperature variable component. The temperature sensor, processor and temperature change components are combined to form a closed-loop temperature control system to maintain the internal temperature of the box at the target temperature.

In an optional implementation, a humidity sensor is provided in the box for measuring the internal humidity of the accommodation cavity. The humidity in the accommodation cavity can be detected by a humidity sensor, and based on the humidity, it can be determined whether the fog inside the accommodation cavity has disappeared.

In a second aspect, embodiments of the present application provide terminal testing equipment, which includes a mobile vehicle and the above-mentioned temperature generating device. The temperature generating device can be fixed on the mobile vehicle.

The terminal test equipment provided by the embodiment of the present application adopts the above-mentioned temperature generating device. The entire temperature generating device can be set relatively small, which facilitates fixing the temperature generating device on the mobile vehicle. When the device to be tested is a camera or a terminal with a camera, the device to be tested is set on the temperature generating device and can move with the mobile vehicle. It can take photos and videos of different test objects indoors and outdoors to achieve scene-based shooting. Compared with the camera in the traditional thermostat test device that shoots through the glass movable door, the camera in the terminal test equipment of this application directly shoots the external test object through the opening of the box, realizing the functional effect test of camera photography and video, and more Really simulate the user's photography scene.

In an optional implementation, a movable component is also included. The movable component has a movable end with multiple degrees of freedom of movement. The movable component is installed on a mobile vehicle, and the temperature generating device can be fixed on the movable end. The temperature generating device is installed on the movable end to facilitate fixing the temperature generating device on the mobile vehicle and adjust the position and orientation of the camera in the temperature generating device.

In a third aspect, embodiments of the present application provide a terminal testing equipment, including a simulated finger piece and the above-mentioned temperature generating device. The simulated finger piece can extend into the accommodation cavity to contact the component under test in the accommodation cavity.

The terminal test equipment provided by the embodiment of the present application uses the above-mentioned temperature generating device. When the object to be tested is a touch display screen, a simulated finger piece is extended into the containing cavity from the opening of the box to click or slide the touch display screen. Simulate the user's operation on the touch screen, observe the display effect of the touch screen during human-computer interaction, and determine whether the touch screen is faulty.

In an optional implementation, a moving component is also included. The moving component has a moving end with multiple degrees of freedom. The simulated finger piece is installed on the moving end, and the moving end is used to drive the simulated finger piece to move. The mobile component drives the movement of the simulated finger piece to simulate the user's click or slide operation on the touch display when using the terminal.

In an optional implementation, a display vision sensor is also included, the display vision sensor and the simulated finger piece are relatively fixedly arranged, and the display vision sensor is used to photograph the piece to be tested. When the object to be tested is a display screen, the display effect of the display screen can be obtained more accurately through the display vision sensor.

Description of the drawings

Figure 1 is a schematic structural diagram of a temperature generating device provided by an embodiment of the present application;

Figure 2 is a schematic structural diagram of the temperature generating device of Figure 1 during terminal testing;

Figure 3 is a schematic structural diagram of the semiconductor refrigeration chip in the temperature generating device of Figure 1;

Figure 4 is a schematic structural diagram of a temperature generating device provided by another embodiment of the present application;

Figure 5 is a schematic structural diagram of a temperature generating device provided by another embodiment of the present application;

Figure 6 is a schematic structural diagram of the vortex tube in the temperature generating device of Figure 5;

Figure 7 is a schematic structural diagram of the terminal testing equipment provided by the embodiment of the present application;

Figure 8 is a schematic structural diagram of a terminal testing device provided by another embodiment of the present application.

Detailed ways

In order to make the technical problems, technical solutions and beneficial effects to be solved by this application more clear, this application will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present application and are not used to limit the present application. Although the description of the present application will be introduced in conjunction with some embodiments, this does not mean that the features of the application are limited to this embodiment. On the contrary, the purpose of introducing the application in conjunction with the embodiments is to cover other options or modifications that may be extended based on the claims of the application. In order to provide an in-depth understanding of the application, the following description contains many specific details. The application may be implemented without these details. Furthermore, some specific details will be omitted from the description in order to avoid confusing or obscuring the focus of the present application. It should be noted that, as long as there is no conflict, the embodiments and features in the embodiments of this application can be combined with each other.

It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

It should be understood that in the description of the embodiments of the present application, it should be noted that, unless otherwise clearly stated and limited, the terms "installation" and "connection" should be understood in a broad sense. For example, "connection" may be detachable. The ground connection can also be a non-detachable connection; it can be a direct connection or an indirect connection through an intermediate medium. The terms "length", "width", "top", "bottom", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", The orientation or positional relationship indicated by "inside", "outer", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the device or element referred to must have Specific orientations, construction and operation in specific orientations and therefore should not be construed as limitations on the application.

In addition, the terms “first” and “second” are used for descriptive purposes only and cannot be understood as indicating or implying relative importance or implicitly indicating the quantity of indicated technical features. Therefore, features defined as "first" and "second" may explicitly or implicitly include one or more of these features. In the description of this application, "plurality" means two or more than two, unless otherwise explicitly and specifically limited.

In the embodiment of this application, "and/or" is just an association relationship describing associated objects, indicating that there can be three relationships, for example, A and/or B, which can mean: A alone exists, and A and A exist simultaneously. B, there are three situations of B alone. In addition, the character "/" in this article generally indicates that the related objects are an "or" relationship.

Reference in this specification to "one embodiment" or "some embodiments" or the like means that a particular feature, structure or characteristic described in connection with the embodiment is included in one or more embodiments of the application. Therefore, the phrases "in one embodiment", "in some embodiments", "in other embodiments", "in other embodiments", etc. appearing in different places in this specification are not necessarily References are made to the same embodiment, but rather to "one or more but not all embodiments" unless specifically stated otherwise. The terms “including,” “includes,” “having,” and variations thereof all mean “including but not limited to,” unless otherwise specifically emphasized.

When conducting high and low temperature tests on terminals in a traditional thermostat test device, the glass movable door needs to be closed to keep the terminal in a closed box to prevent heat exchange inside and outside the box and ensure the cooling effect of the refrigeration device or the heating of the heating device. Effect. When the temperature difference between the inside and outside of the box is large, condensation may occur on the closed glass movable door, which will affect the test of the device to be tested. For example, the device under test is a terminal with a camera, and the camera needs to shoot a standard picture card located outside the box through a closed glass door. If there is condensation on the glass door, it will affect the camera's field of view and affect the camera's shooting test. Moreover, the camera needs to pass through the closed glass door. The glass transmits light and has light refraction, which will affect the image acquired by the camera and affect the camera's shooting test. Using a traditional thermostat test device to test the terminal in high and low temperature environments, users cannot perform human-computer interaction on the terminal through the glass movable door, and it is difficult to simulate the actual usage scenarios of users under high and low temperatures.

Referring to FIG. 1 , an embodiment of the present application provides a temperature generating device 100 , including a box 10 , a temperature change component 20 and an air curtain component 30 . The box 10 has a communicating chamber 11 and an opening 12 , and the chamber 11 can accommodate the object to be tested 1 . The temperature change component 20 has a heating part 20a and a cooling part 20b. The heating part 20a and/or the cooling part 20b are arranged toward the inside of the accommodation cavity 11. The heating part 20a is used to release heat into the accommodation cavity 11, and the cooling part 20b is used to Heat is absorbed into the accommodation cavity 11 . The air curtain assembly 30 is used to generate an air curtain 31 at the opening 12 (as shown by the dotted arrow in FIG. 1 ), so as to isolate the internal air flow of the accommodation cavity 11 from the external air flow of the box 10 .

Among them, the device under test 1 can be various terminals, especially terminals with human-machine interaction functions, or terminals sensitive to temperature, such as mobile phones (such as straight screen mobile phones, folding screen mobile phones, etc.), tablet computers, and e-book readers. , netbooks, personal digital assistants, wearable devices (such as wearable watches), cameras 1a, fingerprint sensors, proximity light sensors, 3D structured light sensors, etc. Using the temperature generating device 100 of the embodiment of the present application, various terminals can perform performance tests in high and low temperature environments, such as touch, display, photography, charging, etc. For temperature-sensitive terminals, performance testing can be performed at different temperatures.

The heating part 20a and the cooling part 20b of the temperature change assembly 20 can respectively release heat and absorb heat inside the accommodation cavity 11, thereby forming a high and low temperature environment inside the accommodation cavity 11. For example, the high and low temperature range formed by the temperature variable component 20 can be [-20°C, 60°C]. The specific range is not limited and can be set as needed. Among them, the low-temperature test of the piece to be tested 1 is more important.

For example, referring to Figure 2, the device under test 1 is a camera 1a or a terminal with a camera 1a. Before testing, the device to be tested 1 is placed in the accommodation cavity 11 of the box 10 with the camera 1a facing the opening 12 of the box 10 , and the standard chart 2 is set outside the opening 12 of the box 10 . During the test, the air curtain assembly 30 is opened to generate an air curtain 31 at the opening 12 , and the temperature change assembly 20 is opened to adjust the internal temperature of the accommodation cavity 11 to the target temperature. In a high or low temperature environment, make the camera 1a shoot the standard chart 2. By comparing the image obtained by the camera 1a with the standard chart 2, you can judge the accuracy of the color accuracy, sharpness, color temperature and other parameters of the image obtained by the camera 1a. degree. It can avoid the condensation on the glass movable door of the traditional thermostat test device that affects the test of the camera 1a. The camera 1a does not need to be affected by the light refraction of the glass movable door, and the shooting test effect of the camera 1a is closer to the actual use scene. When setting the automatic flash on camera 1a, you can observe whether the flash is turned on normally in high and low temperature environments.

For example, referring to Figure 1, the device under test 1 is a terminal with a touch display screen 1b. Before testing, the terminal is placed in the accommodation cavity 11 of the box 10 and the touch display screen 1 b faces the opening 12 of the box 10 . During the test, the air curtain assembly 30 is opened to generate an air curtain 31 at the opening 12 , and the temperature change assembly 20 is opened to adjust the internal temperature of the accommodation chamber 11 to the target temperature. In a high or low temperature environment, the tester can extend his hand into the accommodation cavity 11 through the opening 12 and click or slide the touch screen 1b with his finger to observe the display effect of the touch screen 1b during human-computer interaction and make judgments. Is there any problem with the touch screen 1b under high and low temperatures?

In the temperature generating device 100 provided by the embodiment of the present application, the object to be tested 1 can be placed in the accommodation cavity 11 of the box 10, and the heating part 20a and the cooling part 20b of the temperature change component 20 can respectively dissipate heat and heat the inside of the accommodation cavity 11. It absorbs heat to realize high and low temperature adjustment inside the accommodation cavity 11 . The air curtain 31 generated by the air curtain assembly 30 blocks the air flow inside and outside the opening 12 of the box 10, reduces the heat exchange inside and outside the box 10, and forms a semi-open high and low temperature trough structure, effectively avoiding the glass movable door of the traditional thermostat test device. In case of condensation, the cooling effect of the refrigeration part 20b or the heating effect of the heating part 20a is ensured. In the high and low temperature environment formed by the temperature generating device 100, when the device under test 1 is a terminal, the user can perform human-computer interaction operations on the terminal in the box 10, which can better simulate the user's actual usage scenarios at high and low temperatures, such as touching by human hands. Control the screen, screen display, take pictures, etc. The test scenario is relatively close to the actual usage scenario.

When arranging the box 10, refer to Figure 1. The box 10 may be set in a rectangular parallelepiped or other shape. The minimum size of the box 10 can be a stacked structure of two or three pieces to be tested 1 . The receiving cavity 11 of the box 10 only needs to be able to put the piece to be tested 1 . For example, if the object 1 to be tested is a mobile phone, the box 10 can be made into a size of a stacked structure of two or three mobile phones. Compared with traditional thermostat testing devices, the box 10 in the temperature generating device 100 of the embodiment of the present application can be made smaller.

In some embodiments, referring to FIG. 1 , a carrier 50 is detachably installed in the box 10 , and the carrier 50 is used to fix the device under test 1 .

Before the high and low temperature environment test of the piece to be tested 1 is carried out, the stage 50 is first subjected to conventional high or low temperature treatment to make the stage 50 change the temperature quickly, and then the stage 50 is placed in the box 10, and the piece to be tested is 1 is fixed on the stage 50, which can quickly make the accommodation cavity 11 of the box 10 reach the target temperature, reduce the time to achieve high and low temperature environments, and improve the testing efficiency. The carrier 50 can be made of solid metal (such as copper, aluminum), graphene or other materials to facilitate heat conduction between the temperature-changing component 20 , the carrier 50 and the device under test 1 .

There are various detachable connection methods between the carrier 50 and the box 10, such as buckles, fasteners (such as screws), magnetic adsorption, etc.

A clamp for fixing the piece to be tested 1 may be provided on the stage 50 , and the clamp may be a buckle or other form.

Exemplarily, the carrier 50 is plate-shaped, and the carrier 50 is detachably installed on the inner bottom surface of the box 10. The plate-shaped carrier 50 occupies less space in the accommodation cavity 11, so that the box 10 can be made smaller. , which also facilitates placing the device under test 1 on the carrier 50 . In addition, the carrier 50 can be configured in other shapes. The carrier 50 can be disposed at other locations inside the box 10 .

There are many optional implementation methods when setting the temperature change component 20 . The temperature generating device 100 in the embodiment of the present application uses a semiconductor refrigeration piece or a vortex tube as the temperature change component 20. These methods are miniaturized heat exchange methods. The size of the box 10 and the temperature change component 20 can be set smaller, and the temperature change component 20 and the box 10 can be set adjacent to each other, so that the overall structure of the temperature generating device 100 is smaller and compact. Compared with the traditional thermostat testing device, the overall size and weight of the temperature generating device 100 in the embodiment of the present application are greatly reduced, achieving miniaturization and lightweight of the temperature generating device 100 .

Referring to Figure 1, the first implementation of the temperature change component 20 is a plurality of semiconductor refrigeration sheets: the temperature change component 20 includes a first semiconductor refrigeration sheet 21 and a second semiconductor refrigeration sheet 22. The first semiconductor refrigeration sheet 21 has an oppositely arranged semiconductor refrigeration sheet. The first hot end 21a and the first cold end 21b, the second semiconductor refrigeration piece 22 has a second hot end 22a and a second cold end 22b arranged oppositely, the first hot end 21a serves as the heating part 20a and faces the inside of the accommodation cavity 11 The second cold end 22b serves as the refrigeration part 20b and is disposed toward the inside of the accommodation cavity 11 .

The semiconductor refrigeration chip utilizes the Peltier effect of semiconductor materials (such as bismuth telluride). When direct current passes through a galvanic couple formed by two different semiconductor materials in series, heat can be absorbed and released at both ends of the galvanic couple, respectively. Cooling and heating. By changing the polarity of the DC current, heating or cooling can be achieved on the same end of the same semiconductor refrigeration chip.

Referring to FIG. 3 , each semiconductor refrigeration chip includes two spaced ceramic chips 211 , an N-type semiconductor 212 and a P-type semiconductor 213 located between the two ceramic chips 211 , and a plurality of guide bars 214 . N-type semiconductors 212 and P-type semiconductors 213 are arranged in a staggered manner, and adjacent N-type semiconductors 212 and P-type semiconductors 213 are connected in series through a conductive bar 214 to form a galvanic couple. When an N-type semiconductor 212 and a P-type semiconductor 213 form a galvanic couple, a DC current is connected to the circuit, and energy transfer occurs; the current flows from the N-type semiconductor 212 to the corresponding ceramic piece 211 at the P-type semiconductor 213 to absorb heat. , the ceramic piece 211 becomes the cold end 21b; the heat flows from the P-type semiconductor 213 to the corresponding ceramic piece 211 at the N-type semiconductor 212 to release heat, and the ceramic piece 211 becomes the hot end 21a. When the logarithm of the N-type semiconductor 212 and the P-type semiconductor 213 is determined, the heat absorption rate and heat release rate of the semiconductor refrigeration chip can be achieved by changing the magnitude of the direct current. The semiconductor refrigeration chip can be driven by a conventional semiconductor refrigeration chip drive circuit to adjust the magnitude and direction of the direct current, thereby realizing the rise and fall of the temperature inside the accommodation cavity 11 .

In this embodiment, referring to FIG. 1 , a first semiconductor refrigeration piece 21 and a second semiconductor refrigeration piece 22 are configured. The first hot end 21 a of the first semiconductor refrigeration piece 21 serves as the heating portion 20 a and is disposed toward the inside of the accommodation cavity 11 , the second cold end 22b of the second semiconductor refrigeration piece 22 serves as the refrigeration part 20b and is disposed toward the inside of the accommodation cavity 11 . When heating is required, direct current is supplied to the first semiconductor refrigeration chip 21, and the first hot end 21a dissipates heat to heat up the inside of the accommodation cavity 11. When cooling is required, direct current is supplied to the second semiconductor refrigeration chip 22, and the second cold end 22b absorbs heat to cool down the interior of the accommodation cavity 11.

When the first semiconductor refrigeration piece 21 is installed, the first cold end 21b faces the external environment of the box 10 to reduce the impact on the internal heat of the accommodation cavity 11. For example, the first semiconductor refrigeration piece 21 is embedded in the box 10 and the first The cold end 21b is arranged facing away from the accommodation cavity 11 .

When disposing the second semiconductor refrigeration piece 22, the second hot end 22a can face the external environment of the box 10 to reduce the impact on the internal heat of the accommodation cavity 11. For example, the second semiconductor refrigeration piece 22 is embedded in the box 10 and the third The two hot ends 22a are arranged facing away from the accommodation cavity 11 .

When the stage 50 is disposed in the box 10, the stage 50 can be set to have a larger heat exchange area. The first hot end 21a of the first semiconductor refrigeration piece 21 and the second cold end 22b of the second semiconductor refrigeration piece 22 are both It can be in contact with the carrier 50, so that good heat conduction is formed between the first semiconductor refrigeration piece 21 and the carrier 50, and between the second semiconductor refrigeration piece 22 and the carrier 50, and a predetermined height is quickly formed in the accommodation cavity 11. Low temperature environment.

Referring to Figure 4, the second implementation of the temperature change component 20 is a single semiconductor refrigeration piece: the temperature change component 20 includes a first semiconductor refrigeration piece 21, and the first semiconductor refrigeration piece 21 has an oppositely arranged first hot end 21a and a first The cold end 21b and the first hot end 21a serve as the heating part 20a, and the first cold end 21b serves as the cooling part 20b. The first hot end 21a and the first cold end 21b are selectively arranged toward the inside of the accommodation cavity 11.

According to the demand for heating or cooling in the accommodation cavity 11, by changing the direction of the direct current flowing into the first semiconductor refrigeration piece 21, heating or cooling can be achieved on the end of the first semiconductor refrigeration piece 21 facing the accommodation cavity 11. When heating is required, as shown in Figure 3, direct current in a predetermined direction is passed through the first semiconductor refrigeration chip 21. The end facing the accommodation cavity 11 is the first hot end 21a, which can release heat into the accommodation cavity 11. When cooling is required, direct current in the opposite direction is supplied to the first semiconductor refrigeration piece 21, and the end facing the accommodating cavity 11 will be converted into a first cold end 21b, which can absorb heat into the accommodating cavity 11. The heat absorption rate and heat release rate of the semiconductor refrigeration chip can be achieved by changing the magnitude of the direct current.

When the carrier 50 is arranged in the box 10, the carrier 50 can be set to have a larger heat exchange area. The end of the first semiconductor refrigeration piece 21 facing the accommodation cavity 11 can be in contact with the carrier 50. When the first semiconductor refrigeration piece 21 is Good heat conduction is formed between 21 and the stage 50, and a predetermined high and low temperature environment is quickly formed in the accommodation cavity 11.

Referring to Figures 5 and 6, the third implementation method of the temperature change component 20 is a vortex tube 23: the temperature change component 20 includes a vortex tube 23, a first channel 24, a second channel 25, a first control valve 26 and a second control valve. Valve 27. The vortex tube 23 has an input end 23a, a hot air end 23b and a cold air end 23c that are connected to each other. The input end 23a is used to introduce compressed air, the hot air end 23b is used to output hot air, and the cold air end 23c is used to output cold air. The hot gas end 23b and the accommodation cavity 11 are connected through a first channel 24. A first control valve 26 is provided on the first channel 24, and the first channel 24 serves as the heating part 20a. The cold air end 23c and the accommodation cavity 11 are connected through a second passage 25. The second passage 25 is provided with a second control valve 27, and the second passage 25 serves as the refrigeration part 20b.

The vortex tube 23 is a refrigeration and heating element that uses compressed air, also called a devil freezing tube. Compressed air is introduced into the input end 23a of the vortex tube 23, and the high-speed air flow generates a vortex in the vortex tube 23 to separate the cold and hot air flows. The cold air end 23c of the vortex tube 23 will eject cold air to achieve cooling, and the hot air end 23b will eject The hot air is emitted to achieve heating. The vortex tube 23 can convert the compressed air into hot air and cold air. The hot air can reach a maximum temperature of 127℃ and the cold air can reach a minimum temperature of -46℃.

In this embodiment, a vortex tube 23, a first channel 24, a second channel 25, a first control valve 26 and a second control valve 27 are configured. Compressed air is introduced into the input end 23a of the vortex tube 23 and the hot air end 23b. The hot air is output, and the cold air terminal 23c outputs cold air. When heating is required, the first control valve 26 is opened so that the hot air output by the hot air end 23b enters the accommodation cavity 11 through the first channel 24, and the second control valve 27 is adjusted so that the cold air output by the cold air end 23c does not enter the accommodation cavity 11. As a result, the inside of the accommodation cavity 11 is heated. By changing the opening of the first control valve 26, the intake amount of hot gas can be adjusted to change the heating rate.

When cooling is required, the second control valve 27 is opened so that the cold air output by the cold air end 23c enters the accommodation cavity 11 through the second channel 25, and the first control valve 26 is adjusted so that the hot air output by the hot air end 23b does not enter the accommodation cavity 11, thereby The inside of the accommodation cavity 11 is cooled down. By changing the opening of the second control valve 27, the intake amount of cold air can be adjusted to change the cooling rate.

The vortex tube 23 is driven by cheap compressed air and has a simple structure and high reliability. The compressed air required for the vortex tube 23 can be provided by the air curtain assembly 30 , that is, the compressed air provided by the air curtain assembly 30 can form an air curtain 31 at the opening 12 of the box 10 , and the compressed air can also drive the vortex tube 23 to work. The air curtain assembly 30 and the input end 23a of the vortex tube 23 may be connected through a third channel 28.

The vortex tube 23 , the first channel 24 , the second channel 25 , the first control valve 26 and the second control valve 27 may be provided outside the box 10 . The vortex tube 23 can be spaced apart from the box body 10 , or the vortex tube 23 and the box body 10 can be relatively fixedly arranged.

When setting up the first control valve 26 and the second control valve 27, a solenoid valve can be used. The solenoid valve can adjust the direction, flow rate, speed and other parameters of the fluid medium. The solenoid valve can cooperate with a predetermined circuit to achieve expected control.

When setting up the first channel 24 and the second channel 25, the box 10 has two through holes 13, and a pipe body can be fixed at the two through holes 13 respectively, so that the pipe body and the inner wall of the through hole 13 are sealed, and each pipe The body forms a channel.

In some embodiments, referring to Figure 1, the air curtain assembly 30 is located outside the box 10. The box 10 has a pipeline 14. The first port 141 of the pipeline 14 is connected to the output end of the air curtain assembly 30, and the first port 141 of the pipeline 14 is connected to the output end of the air curtain assembly 30. The two ports 142 are arranged toward the opening 12 .

The dry air flow generated by the air curtain assembly 30 can be sent into the opening 12 of the box 10 through the pipeline 14, so as to isolate the air flow inside and outside the box 10, reduce the heat exchange inside and outside the box 10, and reduce the entry of external air moisture into the box 10. When a high or low temperature environment is formed in the box 10 , the user can reach out or use an object to operate the device under test 1 in the box 10 , simulating the user's actual usage scenario at high or low temperatures. The air curtain assembly 30 can be a compressed air blower or an air compressor, both of which can provide dry compressed air.

When arranging the second port 142 of the pipeline 14 , referring to FIG. 1 , the second port 142 can be disposed toward the center of the opening 12 so that the compressed air coming out of the second port 142 can cover the opening 12 . One or more second ports 142 may be provided. When multiple second ports 142 are provided, the multiple second ports 142 can be arranged in an annular shape on the inner wall of the opening 12 so that the air curtain 31 coming out of the second ports 142 can better cover the opening 12 of the box 10 . The internal air flow and external air flow of the box 10 are separated to reduce the heat exchange between the inside and outside of the box 10 .

In some embodiments, referring to FIG. 1 , the box 10 has an air duct 15 that is connected with the accommodation cavity 11 . The temperature generating device 100 also includes a ventilation component 40 . The air outlet end 41 of the ventilation component 40 is in contact with the air duct 15 . connect.

The air flow generated by the ventilation assembly 40 enters the inside of the accommodation cavity 11 through the air duct 15. The air flow sent into the accommodation cavity 11 can make the heat distribution inside the accommodation cavity 11 more uniform and better simulate the actual high and low temperature environment. Ventilation assembly 40 may be a fan or other ventilation device. The ventilation component 40 and the box body 10 may be arranged at intervals, or the ventilation component 40 and the box body 10 may be relatively fixedly arranged.

In some embodiments, referring to FIG. 1 , the box 10 has a thermal insulation layer 16 . The thermal insulation layer 16 is provided so that the box 10 has a better thermal insulation effect, and the outer wall of the box 10 is close to the outside temperature. The thermal insulation layer 16 can be a polyurethane rigid foam layer, an ultra-fine glass fiber cotton layer, or the like. The box body 10 also has a reinforcement layer provided outside the heat insulation layer 16 to improve the structural strength. The reinforcement layer can be a metal layer or a plastic layer.

In some embodiments, referring to FIG. 1 , a temperature sensor 61 is provided in the box 10 for measuring the internal temperature of the containing cavity 11 . The actual temperature inside the accommodation cavity 11 is measured by the temperature sensor 61, so that the temperature variable component 20 can be adjusted to cool or heat the inside of the accommodation cavity 11 to reach the target temperature.

In some embodiments, the temperature sensor 61 is electrically connected to the processor, and the processor is electrically connected to the temperature change component 20 . The temperature sensor 61, the processor and the temperature change component 20 are combined to form a closed-loop temperature control system to maintain the internal temperature of the box 10 at the target temperature, which is a conventional temperature adjustment technology. The temperature sensor 61 measures the actual temperature inside the accommodation cavity 11. The processor calculates the actual temperature obtained by the temperature sensor 61 and the preset target temperature to determine whether cooling or heating is required to drive the semiconductor refrigeration chip to the inside of the accommodation cavity 11. Cooling or heating is performed, or the vortex tube 23 and the control valve are driven to input cold air for cooling or hot air for heating into the accommodation cavity 11, so that the temperature inside the accommodation cavity 11 is maintained at the target temperature.

In some embodiments, based on the actual temperature obtained by the temperature sensor 61 and the preset target temperature, the need for cooling or heating is manually determined, and the direct current size and direction of the semiconductor refrigeration chip are manually adjusted to cause the semiconductor refrigeration chip to carry out internal heating of the accommodation cavity 11 . Cooling or heating, or manually adjusting the vortex tube 23 and the control valve to input cold air for cooling or hot air for heating into the accommodation cavity 11, so that the temperature inside the accommodation cavity 11 tends to the target temperature.

In some embodiments, referring to FIG. 1 , a humidity sensor 62 is provided in the box 10 for measuring the internal humidity of the accommodation cavity 11 . The humidity in the accommodation cavity 11 can be detected by the humidity sensor 62, and whether the fog inside the accommodation cavity 11 has disappeared can be determined based on the humidity. When there is no fog, the high and low temperature environment test of the device to be tested 1 is started to improve the test accuracy of the device to be tested 1.

Referring to FIG. 7 , an embodiment of the present application provides a terminal testing equipment, which includes a mobile vehicle 200 and the above-mentioned temperature generating device 100 . The temperature generating device 100 can be fixed on the mobile vehicle 200 .

The terminal test equipment provided by the embodiment of the present application uses the above-mentioned temperature generating device 100. The entire temperature generating device 100 can be set relatively small, which facilitates fixing the temperature generating device 100 on the mobile vehicle 200. Referring to Figure 1, when the device to be tested 1 is a camera 1a or a terminal with a camera 1a, the device to be tested 1 is located on the temperature generating device 100, can move with the mobile vehicle 200, and can take photos of different test objects indoors and outdoors. and photography to achieve scene-based shooting. Compared with the camera in the traditional thermostat test device that shoots through the glass movable door, the camera 1a in the terminal test equipment of the present application directly shoots the external test object through the opening 12 of the box 10, realizing the camera 1a's photo and video functions. The effect test more realistically simulates the user’s photography scene. Moreover, the camera 1a installed in the temperature generating device 100 can realize testing in the entire focal range (including wide angle and telephoto).

In some embodiments, the mobile vehicle 200 may be an automated guided vehicle (AGV), which may be called an AGV car. AGV cars are equipped with electromagnetic or optical automatic navigation devices and can travel along prescribed navigation paths. The mobile vehicle 200 can also be other transport vehicles.

In some embodiments, referring to Figure 7, a movable component 300 is also included. The movable component 300 has a movable end 301 with multiple degrees of freedom of movement. The movable component 300 is installed on the mobile vehicle 200, and the temperature generating device 100 can be fixed on the movable end 301. . The movable end 301 with multiple degrees of freedom can move in three linear directions and three rotational directions. Installing the temperature generating device 100 on the movable end 301 facilitates fixing the temperature generating device 100 on the mobile vehicle 200 and adjusting the position and orientation of the camera 1a in the temperature generating device 100.

For example, the movable component 300 can be an automated equipment such as a robotic arm. The end of the robotic arm is the movable end 301 with multi-degree of freedom movement. The temperature generating device 100 can be clamped and fixed by the end of the robotic arm. This solution facilitates fixing the temperature generating device 100 on the movable component 300 and facilitates adjusting the position and orientation of the camera 1a in the temperature generating device 100.

Referring to FIG. 8 , an embodiment of the present application provides a terminal testing equipment, including a simulated finger piece 400 and the above-mentioned temperature generating device 100 . The simulated finger piece 400 can extend into the accommodation cavity 11 to contact the device under test 1 in the accommodation cavity 11 . .

Among them, when the device under test 1 touches the display screen 1b, the contact head 401 of the simulated finger part 400 can be made of conductive material, so that when the contact head 401 contacts the touch display screen 1b of the terminal, it can click or slide like a real finger. Control the display screen 1b to achieve the triggering effect.

The terminal test equipment provided by the embodiment of the present application uses the above-mentioned temperature generating device 100. When the object 1 to be tested is a touch display 1b, a simulated finger piece 400 is used to extend into the accommodating cavity 11 from the opening 12 of the box 10 to click. Or slide the touch screen 1b to simulate the user's operation on the touch screen 1b, observe the display effect of the touch screen 1b during human-computer interaction, and determine whether the touch screen 1b is faulty under high and low temperatures.

In some embodiments, referring to Figure 8, a moving component 500 is also included. The moving component 500 has a moving end 501 with multiple degrees of freedom. The simulated finger piece 400 is installed on the moving end 501. The moving end 501 is used to drive the simulated finger piece 400. sports.

The moving component drives the movement of the simulated finger piece 400 to simulate the user's clicking or sliding operation on the touch display screen 1b when using the terminal. For example, the mobile terminal 501 with multiple degrees of freedom of movement can move along three straight directions, thereby simulating the user's click or sliding operation on the touch display screen 1b. The mobile component 500 can be a conventional three-dimensional mobile platform, and the mobile terminal 501 can move in three directions: X, Y, and Z.

In some embodiments, referring to FIG. 8 , a display vision sensor 600 is also included. The display vision sensor 600 and the simulated finger piece 400 are relatively fixedly arranged. The display vision sensor 600 is used to photograph the piece to be tested 1 . When the object 1 under test is a display screen 1 b, the display effect of the display screen 1 b can be obtained more accurately through the display vision sensor 600 .

For example, the display vision sensor 600 can be a color accuracy meter. The color accuracy meter can distinguish the degree of difference between the color presented by the display screen 1b and the actual color. The smaller the difference, the more accurate the color of the display screen 1b, thereby accurately inspecting the color. The display status of display screen 1b in high and low temperature environments. Display vision sensor 600 may also be of other types.

Finally, it should be noted that the above are only specific implementation modes of the present application, but the protection scope of the present application is not limited thereto. Any changes or substitutions within the technical scope disclosed in the present application shall be covered by this application. within the scope of protection applied for. Therefore, the protection scope of this application should be subject to the protection scope of the claims.

Claims (12)

1. A temperature generating device, characterized in that it includes: a box, a temperature change component and an air curtain component; The box has a communicating accommodation cavity and an opening, and the accommodation cavity can accommodate the piece to be tested; The temperature change component has a heating part and a cooling part. The heating part and/or the cooling part are arranged toward the inside of the accommodation cavity. The heating part is used to release heat to the inside of the accommodation cavity. The refrigeration part is used to absorb heat from the inside of the accommodation cavity; The air curtain assembly is used to generate an air curtain at the opening to isolate the internal air flow of the accommodation cavity from the external air flow of the box. 2. The temperature generating device according to claim 1, characterized in that a carrying platform is detachably installed in the box, and the carrying platform is used to fix the piece to be tested. 3. The temperature generating device according to claim 1, wherein the temperature change component includes a first semiconductor refrigeration piece and a second semiconductor refrigeration piece, and the first semiconductor refrigeration piece has a first hot end arranged oppositely. and a first cold end, the second semiconductor refrigeration piece has a second hot end and a second cold end arranged oppositely, the first hot end serves as the heating part and is arranged toward the inside of the accommodation cavity, the The second cold end serves as the refrigeration part and is disposed toward the inside of the accommodation cavity; Or, the temperature change component includes a first semiconductor refrigeration piece, the first semiconductor refrigeration piece has a first hot end and a first cold end arranged oppositely, the first hot end serves as the heating part, and the The first cold end serves as the refrigeration part, and the first hot end and the first cold end are selectively disposed toward the inside of the accommodation cavity. 4. The temperature generating device according to claim 1, wherein the temperature change component includes a vortex tube, a first channel, a second channel, a first control valve and a second control valve; The vortex tube has an input end, a hot air end and a cold air end that are connected to each other. The input end is used to pass in compressed air, the hot air end is used to output hot air, and the cold air end is used to output cold air; The hot gas end and the accommodation cavity are connected through the first channel, a first control valve is provided on the first channel, and the first channel serves as a heating part; The cold air end and the accommodation cavity are connected through the second channel, a second control valve is provided on the second channel, and the second channel serves as a refrigeration part. 5. The temperature generating device according to any one of claims 1 to 4, characterized in that the air curtain assembly is located outside the box, the box has a pipeline, and the first port of the pipeline It is connected to the output end of the air curtain assembly, and the second port of the pipeline is disposed toward the opening. 6. The temperature generating device according to any one of claims 1 to 4, characterized in that the box has an air duct, the air duct is connected to the accommodation cavity, and the temperature generating device further includes a ventilation assembly, the air outlet end of the ventilation assembly is connected to the air duct. 7. The temperature generating device according to any one of claims 1 to 4, characterized in that the box has a temperature insulation layer; And/or, a temperature sensor is provided in the box for measuring the internal temperature of the accommodation cavity; And/or, a humidity sensor is provided in the box for measuring the internal humidity of the accommodation cavity; And/or, the air curtain assembly includes a compressed blower or air compressor. 8. A terminal testing equipment, characterized in that it includes a mobile vehicle and the temperature generating device according to any one of claims 1 to 7, and the temperature generating device can be fixed on the mobile vehicle. 9. The terminal test equipment according to claim 8, further comprising a movable component, the movable component has a movable end with multiple degrees of freedom movement, the movable component is installed on the mobile vehicle, and the temperature The generating device can be fixed on the movable end. 10. A terminal testing equipment, characterized in that it includes a simulated finger piece and a temperature generating device as claimed in any one of claims 1 to 7, the simulated finger piece being able to extend into the accommodation cavity to contact the Accommodate the test piece in the cavity. 11. The terminal testing equipment according to claim 10, further comprising a moving component, the moving component has a moving end with multiple degrees of freedom movement, the simulated finger piece is installed on the moving end, and the The mobile terminal is used to drive the simulated finger piece to move. 12. The terminal test equipment according to claim 10 or 11, further comprising a display vision sensor, the display vision sensor and the simulated finger piece are relatively fixedly arranged, the display vision sensor is used to photograph the Parts to be tested.