CN219981143U - Circuit board and electronic device - Google Patents

Abstract

The present disclosure relates to a circuit board and an electronic device, the circuit board comprising: a main circuit section; the communication circuit part is used for transmitting communication signals, and is integrally formed with the main circuit part, wherein the main circuit part is electrically connected with the communication circuit part through the contact set. According to the electronic equipment, the main circuit part and the communication circuit part are integrally formed, and the contact sets are used for realizing electric connection of the main circuit part and the communication circuit part, so that the integrated design degree of the main circuit part and the communication circuit part is greatly improved, the occupied volume of the circuit board can be further reduced, and the electronic equipment is light and thin.

Description

Circuit board and electronic device

Technical Field

The disclosure relates to the technical field of wearable electronic equipment, in particular to a circuit board and electronic equipment.

Background

With the rapid development of electronic device technology, emerging wearable electronic devices such as smart watches, smart bracelets and the like are emerging. One of the advantages of wearable electronic devices is that multiple device interactions can be accomplished without being held by hand, which provides a high degree of convenience for users to interact with electronic devices.

Because the wearable electronic device has higher device interaction convenience, users often complete electronic device interaction behaviors such as opening access control, riding public transportation, electronic payment and the like through the near field communication function of the wearable electronic device. Therefore, the near field communication module becomes an indispensable module in the wearable electronic device.

Disclosure of Invention

In order to overcome the problems in the related art, the present disclosure provides a circuit board and an electronic device.

According to a first aspect of embodiments of the present disclosure, there is provided a circuit board comprising: a main circuit section; the communication circuit part is used for transmitting communication signals, and is integrally formed with the main circuit part, wherein the main circuit part is electrically connected with the communication circuit part through the contact set.

In some embodiments, the contact set includes a first contact set and a second contact set; the first contact group is arranged on the main circuit part; the second contact set is arranged on the communication circuit part, wherein the first contact set is electrically connected with the second contact set.

In some embodiments, the circuit board comprises: and the first shielding layer is arranged between the main circuit part and the communication circuit part.

In some embodiments, the main circuit portion includes: a first substrate including a first face facing away from the communication circuit portion and a second face facing toward the communication circuit portion; the first circuit layer is arranged on the first surface of the first substrate; the second circuit layer is arranged on the second surface of the first substrate and is connected with the first shielding layer in an adhesive mode; and the first cover plate is connected with the first circuit layer in an adhesive mode.

In some embodiments, the communication circuit portion includes: a second substrate including a third face facing the main circuit portion and a fourth face facing away from the main circuit portion, the third face of the second substrate being adhesively connected to the first shielding layer; a third circuit layer disposed on a fourth surface of the second substrate, the third circuit layer transmitting the communication signal; and the second cover plate is connected with the third circuit layer in an adhesive mode.

In some embodiments, the communication circuit portion includes a plurality of wires, each of the plurality of wires being disposed at the third circuit layer.

In some embodiments, the circuit board includes a via; the third circuit layer comprises a coil, and the second contact set is arranged at the line end part of the coil; the first contact set is arranged on the second circuit layer, and the projection positions of the first contact set and the second contact set on the second circuit layer correspond to each other, wherein the via hole is arranged between the first contact set and the second contact set.

In some embodiments, the circuit board comprises: the conductive piece is arranged in the through hole, one end of the conductive piece is electrically connected with the first contact set, and the other end of the conductive piece is electrically connected with the second contact set.

In some embodiments, the circuit board comprises: the second shielding layer is arranged on one surface, far away from the communication circuit part, of the first cover plate.

In some embodiments, the communication signal is a near field communication signal.

According to a second aspect of embodiments of the present disclosure, there is provided an electronic device comprising: the circuit board of any one of the first aspects.

The technical scheme provided by the embodiment of the disclosure can comprise the following beneficial effects: according to the electronic equipment, the main circuit part and the communication circuit part are integrally formed, and the contact sets are used for realizing electric connection of the main circuit part and the communication circuit part, so that the integrated design degree of the main circuit part and the communication circuit part is greatly improved, the occupied volume of the circuit board can be further reduced, and the electronic equipment is light and thin.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosure.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the disclosure and together with the description, serve to explain the principles of the disclosure.

Fig. 1 is a schematic structural view of a main circuit board according to a related art embodiment.

Fig. 2 is a table of laminated thicknesses of a main circuit board according to an embodiment of the related art.

Fig. 3 is a schematic diagram of a circuit board according to an exemplary embodiment.

Fig. 4 is a schematic diagram showing a communication circuit portion of a circuit board according to an exemplary embodiment.

Fig. 5 is a schematic diagram showing a structure of a main circuit portion of a circuit board according to an exemplary embodiment.

Fig. 6 is a table of stack thicknesses of a circuit board according to an exemplary embodiment.

Fig. 7 is a schematic diagram of an electronic device according to an exemplary embodiment.

Fig. 8 is a schematic diagram of an electronic device according to an exemplary embodiment.

Detailed Description

Reference will now be made in detail to exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, the same numbers in different drawings refer to the same or similar elements, unless otherwise indicated. The implementations described in the following exemplary examples are not representative of all implementations consistent with the present disclosure. Rather, they are merely examples of apparatus and methods consistent with some aspects of the present disclosure as detailed in the accompanying claims.

Fig. 1 is a schematic structural view of a main circuit board according to a related art embodiment. Fig. 2 is a table of laminated thicknesses of a main circuit board according to an embodiment of the related art.

In the related art, the near field communication module is stacked in a sandwich structure, and comprises a flexible circuit board provided with a near field communication coil, a ferrite layer for directional shielding signals and a double-sided adhesive layer, wherein the near field communication module is bonded and connected with a main circuit board through the double-sided adhesive layer, the structure of the main circuit board is shown in fig. 1, the main circuit board comprises a third shielding layer 101, a third cover plate 102, a first adhesive layer 103, a fourth circuit layer 104, a third substrate 105, a fifth circuit layer 106, a second adhesive layer 107, a fourth cover plate 108 and a fourth shielding layer 109 which are sequentially stacked, and the stacked thickness of the main circuit board is shown in fig. 2, and the total thickness is 145 μm. The flexible circuit board needs to be provided with pins extending to the outermost side as electrical connection parts, which makes the near field communication module to be provided as a double-layer circuit board, resulting in a larger thickness of the near field communication module. And the pins of the flexible circuit board also need to form an electric connection relation with the main circuit board in a welding mode, and the welding design needs to set corresponding avoiding spaces on the near field communication module and the main circuit board, so that the installation space required by the near field communication module is further enlarged.

In order to solve the above technical problems, according to an embodiment of the present disclosure, there is provided a circuit board including: a main circuit section; the communication circuit part is used for transmitting communication signals, and is integrally formed with the main circuit part, wherein the main circuit part is electrically connected with the communication circuit part through the contact set.

According to the electronic equipment, the main circuit part and the communication circuit part are integrally formed, and the contact sets are used for realizing electric connection of the main circuit part and the communication circuit part, so that the integrated design degree of the main circuit part and the communication circuit part is greatly improved, the occupied volume of the circuit board can be further reduced, and the electronic equipment is light and thin.

It will be appreciated that the circuit board to which the present disclosure relates may be adapted for use in any of the terminals listed below.

It is understood that a Terminal referred to in this disclosure, which may also be referred to as a Terminal device, a User Equipment (UE), a Mobile Station (MS), a Mobile Terminal (MT), etc., is a device that provides voice and/or data connectivity to a User. For example, the terminal may be a handheld device, an in-vehicle device, or the like having a wireless connection function. Currently, some examples of terminals are: a smart Phone (Mobile Phone), a pocket computer (Pocket Personal Computer, PPC), a palm top computer, a personal digital assistant (Personal Digital Assistant, PDA), a notebook computer, a tablet computer, a wearable device, or a vehicle-mounted device, etc. In addition, in the case of a vehicle networking (V2X) communication system, the terminal device may also be an in-vehicle device. It should be understood that the embodiments of the present disclosure are not limited to the specific technology and specific device configuration adopted by the terminal.

Fig. 3 is a schematic diagram of a circuit board according to an exemplary embodiment.

In some embodiments, as shown in fig. 3, the circuit board may include: a main circuit part 1 and a communication circuit part 2.

The main circuit portion 1 may be a portion in which various circuit modules are compounded in a circuit board. The main circuit portion 1 may be provided with a driving circuit that can drive the communication circuit portion 2.

The communication circuit part 2 may have a function of transmitting and receiving a communication signal, and may realize communication interaction with other electronic devices by means of a transceiver function of the communication signal.

The communication circuit portion 2 and the main circuit portion 1 may be integrally formed, and by forming the main circuit portion 1 and the communication circuit portion 2 into a multi-layer circuit board, the steps of the process flow are reduced, the process efficiency is improved, the integrated design degree of the main circuit portion 1 and the communication circuit portion 2 is greatly improved, the occupied volume of the circuit board may be further reduced, and thus the light and thin design of the electronic device is facilitated.

The main circuit portion 1 and the communication circuit portion 2 are electrically connected by a contact set, which may be a metal contact, for example. The design of electric connection between the contact sets is simpler, and the original pin design is avoided, so that the communication circuit part 2 does not need to be provided with other circuit boards for setting pins, and the design of welding connection between the contact sets is also not needed, the welding avoidance space required between the main circuit part 1 and the communication circuit part 2 is reduced, the wiring of the circuit boards is more concentrated, the occupied volume of the circuit boards can be further reduced, and the design of lightening and thinning of electronic equipment is facilitated.

Fig. 4 is a schematic diagram showing a communication circuit portion of a circuit board according to an exemplary embodiment. Fig. 5 is a schematic diagram showing a structure of a main circuit portion of a circuit board according to an exemplary embodiment.

In some embodiments, as shown in fig. 4 and 5, the contact sets may include a first contact set 15 and a second contact set 25.

The first contact group 15 may be provided to the main circuit portion 1, and the first contact group 15 may be provided to face the communication circuit portion 2, and the first contact group 15 may be electrically connected to the communication driving circuit of the main circuit portion 1.

The second contact group 25 may be provided in the communication circuit section 2, and the second contact group 25 may be electrically connected to a circuit provided in the communication circuit section 2.

The first contact group 15 may be electrically connected with the second contact group 25, so that the communication circuit part 2 may be electrically connected with the main circuit part 1 through the first contact group 15 and the second contact group 25, and the communication driving circuit of the main circuit part 1 may drive and control the communication circuit part 2 to emit a communication signal.

In some embodiments, as shown in fig. 4 and 5, the first contact set 15 may include a first input contact and a first output contact, the first output contact may output a current, the first input contact may input a current, the second contact set 25 may include a second input contact and a second output contact, the second input contact may input a current, and the second output contact may output a current.

The first output contact can be electrically connected with the second input contact, and the first input contact can be electrically connected with the second output contact, so that a complete circuit can be formed between the main circuit part 1 and the communication circuit part 2, and a normal current circulation state is maintained.

In some embodiments, as shown in fig. 3, the circuit board may include: a first shielding layer 40.

The first shielding layer 40 may be disposed between the main circuit portion 1 and the communication circuit portion 2.

The first shielding layer 40 may have a function of blocking the wireless signal from passing through the first shielding layer 40, so that the first shielding layer 40 may shield the wireless signal, and the first shielding layer 40 may shield the communication signal emitted from the communication circuit part 2, for example.

By arranging the first shielding layer 40 between the main circuit part 1 and the communication circuit part 2, communication signals sent by the communication circuit part 2 cannot pass through the first shielding layer 40 to reach the main circuit part 1, so that the interference of the communication signals sent by the communication circuit part 2 on the main circuit part 1 is reduced, the normal working operation of the main circuit part 1 is ensured, and the reliability of a circuit board is improved.

In some embodiments, the first shielding layer 40 may be a ferrite shielding layer, which has the effects of suppressing electromagnetic interference, isolating the circuit from electromagnetic signals in the environment, and further reducing electromagnetic interference suffered by the main circuit portion 1, so as to ensure normal operation of the main circuit portion 1 and improve reliability of the circuit board.

In some embodiments, as shown in fig. 3, the circuit board may include a second adhesive layer 62 and a third adhesive layer 63.

The second adhesive layer 62 may be disposed on a side of the first shielding layer 40 facing the main circuit part 1, so that the first shielding layer 40 may be adhesively connected with the main circuit part 1.

The third adhesive layer 63 may be disposed on a surface of the first shielding layer 40 facing the communication circuit part, so that the first shielding layer 40 may be adhesively connected with the communication circuit part 2.

The first shielding layer 40 may be adhesively connected to the main circuit part 1 and the communication circuit part 2 through the second adhesive layer 62 and the third adhesive layer 63, respectively, thereby fixing the first shielding layer 40. And the main circuit portion 1 and the communication circuit portion 2 may be fixedly connected by adhesion between the first shielding layer 40, the second adhesive layer 62 and the third adhesive layer 63.

In some embodiments, as shown in fig. 3, the main circuit part 1 may include: a first substrate 13, a first circuit layer 12, a second circuit layer 14, and a first cover plate 11.

The first substrate 13 may provide a setting position for the circuits of the main circuit portion 1, and the first substrate 13 may include a first face facing away from the communication circuit portion 2 and a second face facing the communication circuit portion 2.

The first circuit layer 12 may be formed of a conductive material, and the circuit is formed through an etching process, and the first circuit layer 12 may be disposed on the first side of the first substrate 13.

The second circuit layer 14 may be formed of a conductive material and a circuit is formed through an etching process, the second circuit layer 14 may be disposed on the second side of the first substrate 13, and the second circuit layer 14 may be adhesively connected to the first shielding layer 40 through the second adhesive layer 62, so that the main circuit part 1 may be connected to the first shielding layer 40.

The first cover plate 11 may cover an outer layer of the main circuit part 1, i.e., an outer layer of the circuit board, to provide a protective effect to circuits inside the circuit board.

In some embodiments, the main circuit portion 1 may further include a first adhesive layer 61, where one surface of the first adhesive layer 61 is connected with the first cover plate 11 in an adhesive manner, and the other surface of the first adhesive layer 61 may be connected with the first circuit layer 12 in an adhesive manner, so that the first cover plate 11 and the first circuit layer 12 are fixed in an adhesive manner, thereby ensuring stable connection of the main circuit portion 1.

In some embodiments, the first contact set 15 may be formed from the first circuit layer 12.

In some embodiments, as shown in fig. 3, the communication circuit part 2 may include: a second substrate 22, a third circuit layer 21, and a second cover plate 23.

The second substrate 22 may provide a setting position for the circuit of the communication circuit section 2, and the second substrate 22 may include a third face facing the main circuit section 1 and a fourth face facing away from the main circuit section 1.

The third circuit layer 21 may be formed of a conductive material, and a circuit is formed through an etching process, and the third circuit layer 21 may be disposed on the fourth surface of the second substrate 22.

By setting the circuit of the third circuit layer 21, the third circuit layer 21 can be made to have a function of transmitting a communication signal.

The third surface of the second substrate 22 may be further adhesively connected to the third adhesive layer 63, so that the communication circuit part 2 may be connected to the first shielding layer 40.

The second cover plate 23 may cover the outer layer of the communication circuit board, i.e. cover the outer layer of the circuit board, to provide protection effect for the circuits inside the circuit board.

In some embodiments, the communication circuit portion 2 may further include a fourth adhesive layer 64, one surface of the fourth adhesive layer 64 may be adhesively connected to the second cover plate 23, and the other surface of the fourth adhesive layer 64 may be adhesively connected to the third circuit layer 21, so that the second cover plate 23 and the third circuit layer 21 are adhesively fixed, and the connection stability of the communication circuit portion 2 is ensured.

In some embodiments, the second contact set 25 may be formed by the third circuit layer 21.

In some embodiments, the communication circuit part 2 may include a plurality of wirings, and the plurality of wirings may be disposed at the third circuit layer 21. Through all setting up many wirings in same circuit layer, avoid using two-layer circuit layer to lead to the great problem of communication circuit portion 2 thickness, reduced the thickness of communication circuit portion 2, promoted the integrated design degree of communication circuit portion 2, can further reduce the occupation volume of circuit board to help the frivolous design of electronic equipment.

In some embodiments, as shown in fig. 4 and 5, the circuit board may include a via 30 and a coil 211.

The coil 211 may be disposed at the third circuit layer 21, and illustratively, the coil 211 may be a circuit part formed by etching a metal structure of the third circuit layer 21, and the second contact group 25 may be disposed at a line end of the coil 211. When the coil 211 is energized, the coil 211 radiates the communication signal outwardly, and the coil 211 may also be used to receive the communication signal.

The first contact set 15 may be disposed on the second circuit layer 14, and the via 30 may be disposed between the first contact set 15 and the second contact set 25, so that the first contact set 15 and the second contact set 25 are in spatial communication, so that the first contact set 15 and the second contact set 25 are electrically connected.

The first contact group 15 may correspond to the projection position of the second contact group 25 on the second circuit layer 14, which may make the distance between the first contact group 15 and the second contact group 25 equal to the distance between the second circuit layer 14 and the third circuit layer 21, so that the via hole 30 may be disposed perpendicular to the plane of the main circuit portion 1 and the communication circuit portion 2, thereby making the length of the via hole 30 shorter, reducing the influence of the via hole 30 on the structural strength of the main circuit portion 1 and the communication circuit portion 2, and simplifying the process flow of the via hole 30.

In some embodiments, the circuit board may further include: and a conductive member.

The conductive member may be a member having conductivity, and may be disposed in the via hole 30, and one end of the conductive member may be electrically connected to the first contact group 15, and the other end of the conductive member may be electrically connected to the second contact group 25, so that the first contact group 15 may be electrically connected to the second contact group 25 through the conductive member, thereby allowing the main circuit portion 1 and the communication circuit portion 2 to be electrically connected. The communication driving circuit of the main circuit part 1 may transmit an electric signal to the second contact group 25 through the first contact group 15 and the conductive member, that is, to the communication circuit part 2, and the communication circuit part 2 may cause the coil 211 to radiate the communication signal according to the received electric signal.

In some embodiments, the conductive member may be a conductive gel, where the conductive gel is chemically stable, is less affected by temperature, and has a strong insulation property, so that the electrical communication between the first contact set 15 and the second contact set 25 is relatively stable.

In other embodiments, the conductive member may be a metal conductor, and illustratively, the conductive member may be a copper conductor, which is relatively inexpensive and mature in manufacturing process, and may reduce the production cost of the circuit board.

In some embodiments, as shown in fig. 3, the circuit board may further include: a second shielding layer 50.

The second shielding layer 50 may have a function of blocking a signal from passing through the second shielding layer 50, so that the second shielding layer 50 may shield a signal, and the second shielding layer 50 may shield a communication signal emitted from the communication circuit part 2, for example.

The second shielding layer 50 may be disposed on a side of the first cover plate 11 away from the communication circuit portion 2, i.e., the second shielding layer 50 may be disposed on a side of the circuit board away from the communication circuit portion 2. This makes it possible to radiate the communication signal emitted from the communication circuit section 2 only in a specific direction, avoiding the communication signal emitted from the communication circuit section 2 from interfering with other electronic components outside the second shielding layer 50.

In some embodiments, the communication signal may be a near field communication signal, and the near field communication technology is a short-range high-frequency radio technology, which has the advantages of fast connection, low cost, high bandwidth, low energy consumption and convenient operation, and can meet the electronic communication requirement of the user for close-range point-to-point.

Fig. 6 is a table of laminated thicknesses of a circuit board according to an exemplary embodiment, and as shown in fig. 6, the thickness of the circuit board may be 283 μm, and the thickness of the circuit board is reduced by integrally molding the main circuit part 1 and the communication circuit part 2, thereby reducing the occupied volume of the circuit board and contributing to the slim design of the electronic device.

Based on the same conception, the embodiment of the disclosure also provides electronic equipment.

The electronic device may be a notebook computer, a desktop computer, a mobile phone, a digital broadcast terminal, a messaging device, a game console, a tablet device, a medical device, a fitness device, a personal digital assistant, a translator, a wearable device such as a watch and a bracelet, and the like, and may be any electronic device with a speaker. In the following description, a smart watch is taken as an example, but the present disclosure is not limited thereto.

Fig. 7 is a schematic diagram of an electronic device according to an exemplary embodiment. Fig. 8 is a schematic diagram of an electronic device according to an exemplary embodiment.

In some embodiments, as shown in fig. 7 and 8, the electronic device may be provided with a circuit board including a main circuit portion 1 and a communication circuit portion 2, a cover plate 3, and a screen body 4.

Wherein, the screen body 4 can display image information to the user through giving out light, and the apron 3 sets up in the surface of screen body 4 and plays the guard action to the screen body 4, and the circuit board can set up in the one side that the screen body 4 is opposite to apron 3. The main circuit part 1 may be provided with circuits required for other electronic devices on the basis of being provided with a communication driving circuit, and the main circuit part 1 may also be provided with a display screen driving circuit, which may drive the screen body 4 to display an image, for example, but the present disclosure is not limited thereto, and specific circuit arrangements may be changed according to design requirements of the electronic devices.

The electronic device may include a first side and a second side, and the first side may be oriented towards other near field communication electronic devices when the user uses the near field communication function.

The second shielding layer 50 may be disposed on a side of the circuit board, which is close to the second side of the electronic device, and other electronic components of the electronic device may be disposed on a side of the second shielding layer 50, which is close to the second side of the electronic device, so that the near field communication signal sent by the communication circuit portion 2 may communicate with other electronic devices through the first side, and the second shielding layer 50 may prevent the communication signal sent by the communication circuit portion 2 from interfering with other electronic components of the electronic device, thereby ensuring operation stability of the electronic device.

According to the embodiment of the disclosure, the main circuit part 1 and the communication circuit part 2 are integrally formed, and the contact sets are used for realizing the electric connection of the main circuit part 1 and the communication circuit part 2, so that the integrated design degree of the main circuit part 1 and the communication circuit part 2 is greatly improved, the occupied volume of a circuit board can be further reduced, and the light and thin design of electronic equipment is facilitated.

It is understood that the term "plurality" in this disclosure means two or more, and other adjectives are similar thereto. "and/or", describes an association relationship of an association object, and indicates that there may be three relationships, for example, a and/or B, and may indicate: a exists alone, A and B exist together, and B exists alone. The character "/" generally indicates that the context-dependent object is an "or" relationship. The singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.

It is further understood that the terms "second," "second," and the like are used to describe various information, but such information should not be limited to these terms. These terms are only used to distinguish one type of information from another and do not denote a particular order or importance. Indeed, the expressions "second", etc. may be used entirely interchangeably. For example, the second information may also be referred to as second information, and similarly, the second information may also be referred to as second information, without departing from the scope of the present disclosure.

It will be further understood that the terms "center," "longitudinal," "transverse," "front," "rear," "upper," "lower," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like, as used herein, refer to an orientation or positional relationship based on that shown in the drawings, merely for convenience in describing the present embodiments and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operate in a particular orientation.

It will be further understood that "connected" includes both direct connection where no other member is present and indirect connection where other element is present, unless specifically stated otherwise.

It will be further understood that although operations are depicted in the drawings in a particular order, this should not be understood as requiring that such operations be performed in the particular order shown or in sequential order, or that all illustrated operations be performed, to achieve desirable results. In certain circumstances, multitasking and parallel processing may be advantageous.

Other embodiments of the disclosure will be apparent to those skilled in the art from consideration of the specification and practice of the disclosure disclosed herein. This application is intended to cover any adaptations, uses, or adaptations of the disclosure following, in general, the principles of the disclosure and including such departures from the present disclosure as come within known or customary practice within the art to which the disclosure pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the disclosure being indicated by the following claims.

It is to be understood that the present disclosure is not limited to the precise arrangements and instrumentalities shown in the drawings, and that various modifications and changes may be effected without departing from the scope thereof. The scope of the present disclosure is limited only by the scope of the appended claims.

Claims (11)

1. A circuit board, the circuit board comprising:

a main circuit section;

a communication circuit part which transmits a communication signal, the communication circuit part and the main circuit part being integrally formed,

wherein the main circuit part and the communication circuit part are electrically connected through a contact group.

2. The circuit board of claim 1, wherein the circuit board is configured to,

the contact set comprises a first contact set and a second contact set;

the first contact group is arranged on the main circuit part;

the second contact set is arranged on the communication circuit part,

wherein the first contact set is electrically connected with the second contact set.

3. The circuit board of claim 2, wherein the circuit board comprises:

and the first shielding layer is arranged between the main circuit part and the communication circuit part.

4. A circuit board according to claim 3, wherein the main circuit portion comprises:

a first substrate including a first face facing away from the communication circuit portion and a second face facing toward the communication circuit portion;

the first circuit layer is arranged on the first surface of the first substrate;

the second circuit layer is arranged on the second surface of the first substrate and is connected with the first shielding layer in an adhesive mode; and

and the first cover plate is connected with the first circuit layer in an adhesive mode.

5. The circuit board of claim 4, wherein the communication circuit section comprises:

a second substrate including a third face facing the main circuit portion and a fourth face facing away from the main circuit portion, the third face of the second substrate being adhesively connected to the first shielding layer;

a third circuit layer disposed on a fourth surface of the second substrate, the third circuit layer transmitting the communication signal; and

and the second cover plate is connected with the third circuit layer in an adhesive mode.

6. The circuit board of claim 5, wherein the circuit board is further configured to,

the communication circuit part comprises a plurality of wires, and the wires are arranged on the third circuit layer.

7. The circuit board of claim 5, wherein the circuit board is further configured to,

the circuit board comprises a via hole;

the third circuit layer comprises a coil, and the second contact set is arranged at the line end part of the coil;

the first contact group is arranged on the second circuit layer, and corresponds to the projection position of the second contact group on the second circuit layer,

the via hole is arranged between the first contact set and the second contact set.

8. The circuit board of claim 7, wherein the circuit board comprises:

the conductive piece is arranged in the through hole, one end of the conductive piece is electrically connected with the first contact set, and the other end of the conductive piece is electrically connected with the second contact set.

9. The circuit board of claim 4, wherein the circuit board comprises:

the second shielding layer is arranged on one surface, far away from the communication circuit part, of the first cover plate.

10. The circuit board of claim 1, wherein the circuit board is configured to,

the communication signal is a near field communication signal.

11. An electronic device, comprising:

the circuit board of any one of claims 1 to 10.