CN219981127U

CN219981127U - Main board module of ultrasonic equipment and ultrasonic equipment

Info

Publication number: CN219981127U
Application number: CN202321191677.9U
Authority: CN
Inventors: 陈艳娇; 胡锐; 秦俊杰; 陈文涛
Original assignee: Shenzhen Mindray Bio Medical Electronics Co Ltd
Current assignee: Shenzhen Mindray Bio Medical Electronics Co Ltd
Priority date: 2023-05-17
Filing date: 2023-05-17
Publication date: 2023-11-07
Anticipated expiration: 2033-05-17

Abstract

The main board module of the ultrasonic equipment comprises a main board assembly and a protection assembly, wherein the main board assembly comprises a circuit substrate and a circuit component; the protective component comprises a first protective piece and a second protective piece, wherein the first protective piece plays a role in preventing static electricity, the second protective piece and the first protective piece enclose a containing cavity, and the main board component is arranged in the containing cavity; the first protection piece is provided with an adapting structure which is adapted to the outline of the corresponding circuit component, and the adapting structure is used for accommodating and covering the corresponding circuit component or exposing the corresponding circuit component to the protection component. By utilizing the structural relation of the adaptation structure and the contour form adaptation of the circuit components, the anti-static and shielding protection of the main board assembly is realized, the whole weight of the main board module can be effectively reduced, and the complex structural form of the main board assembly can be adapted, so that the whole structure of the main board module is more compact and the occupied space is smaller.

Description

Main board module of ultrasonic equipment and ultrasonic equipment

Technical Field

The utility model relates to the technical field of medical equipment, in particular to a main board module of ultrasonic equipment and the ultrasonic equipment.

Background

In the modularized design of the main board component of the ultrasonic medical equipment, a sheet metal protection structural member in the form of a box body is generally additionally arranged, the main board component is accommodated and placed by utilizing a large volume space of the box body structural member, and the whole-area protection of the main board component is realized, so that the damage of sensitive devices in the main board component due to electrostatic breakdown can be avoided, and meanwhile, the corresponding electronic components can be prevented from being collided and extruded due to the exposure state. However, the added sheet metal box structural member also makes the main board module heavier and larger in overall size, and occupies larger structural space when the main board module is assembled and applied.

Disclosure of Invention

The utility model mainly solves the technical problem of providing the main board module of the ultrasonic equipment with compact structure and small occupied space and the ultrasonic equipment using the main board module.

According to a first aspect, in one embodiment, there is provided a main board module of an ultrasonic apparatus for being mounted in a main chassis of the ultrasonic apparatus, the main board module including:

the mainboard assembly comprises a circuit substrate and a plurality of circuit components, wherein the circuit components are arranged on the circuit substrate; and

the protection assembly comprises a first protection piece and a second protection piece, wherein the first protection piece plays a role of preventing static electricity, the second protection piece and the first protection piece enclose a containing cavity, and the main board assembly is arranged in the containing cavity in a mode that the circuit component faces the first protection piece;

the first protection piece is provided with a plurality of adapting structures corresponding to the circuit components, the adapting structures are adapted to the outline of the corresponding circuit components, at least one of the adapting structures can accommodate and cover the corresponding circuit components, and at least one other adapting structure can enable the corresponding circuit components to be exposed out of the protection assembly.

In one embodiment, the plurality of adapting structures include a cavity structure and an opening structure, and the cavity structure is disposed on the inner surface of the first protection piece and is used for accommodating and covering the corresponding circuit components; the opening structure penetrates through the first protection piece and is used for enabling the corresponding circuit components to be exposed out of the protection assembly.

In one embodiment, the motherboard assembly further comprises a connection harness connected with the circuit component, and the first guard further comprises a routing structure and/or a wire clamping structure; wherein:

the wiring structure is arranged at the outline edge of the first protection piece and is used for accommodating at least one part of the connecting wire harness so that the connecting wire harness can be wired along a preset path; the wire clamping structure is arranged on the first protection piece along the wiring track of the connecting wire harness and is used for fixing the connecting wire harness on the first protection piece.

In one embodiment, the circuit further comprises a heat dissipation assembly, wherein at least one of the plurality of circuit components is connected with the heat dissipation assembly; the heat dissipation assembly is arranged outside the protection assembly and used for dissipating heat generated by the corresponding circuit components.

In one embodiment, the plurality of circuit components include at least one heat source module, the at least one heat source module includes a CPU module and/or a GPU module, and the heat source module is exposed to the protection component through the corresponding adapting structure;

the heat dissipation assembly comprises a first heat dissipation piece and a medium pipeline, and the first heat dissipation piece is in contact connection with the heat source module; the medium pipeline is communicated with the first heat dissipation piece and is used for enabling cooling liquid to flow through the first heat dissipation piece so as to carry away heat generated by the heat source module.

In one embodiment, the first guard further has a blocking structure disposed on an outer surface of the first guard for blocking the intrusion of the cooling liquid into the accommodating chamber.

In one embodiment, the second protection member has a hollow structure, and the hollow structure is used for dissipating heat generated by the circuit substrate assembly.

In one embodiment, the first protective member comprises a mask portion and a surrounding wall portion, the surrounding wall portion is arranged around and connected with the mask portion, and the adapting structure is arranged on the mask portion and/or the surrounding wall portion; the second guard and the enclosure wall portion are abutted against each other to enclose the accommodating chamber between the first guard and the second guard;

or (b)

The second guard includes a bottom plate portion and a surrounding wall portion disposed around and contiguous with the bottom plate portion; the first guard and the surrounding wall portion are abutted against each other so as to enclose the accommodating chamber between the first guard and the second guard.

In one embodiment, the first guard further has a first mounting structure, the circuit substrate has a second mounting structure, and the second guard has a third mounting structure and a fourth mounting structure; wherein:

the first mounting structure is connected with the third mounting structure in an alignment manner so as to fix the first protection piece and the second protection piece; the second mounting structure is connected with the fourth mounting structure in an alignment mode so as to fix the main board assembly and the second protection piece.

In one embodiment, the first guard is an integrally formed structure of an insulating plastic material or a metallic material;

or the first protection piece is of an integrated structure made of plastic materials, and an antistatic layer is arranged on the surface of the first protection piece.

In one embodiment, the antistatic layer includes a metal plating layer disposed on an outer surface of the first guard.

According to a second aspect, in one embodiment, there is provided a main board module of an ultrasonic apparatus for being mounted in a main cabinet of the ultrasonic apparatus, the main board module including:

the protection assembly comprises a first protection piece which plays a role of preventing static electricity, the first protection piece is arranged in a mode of covering the main board assembly in a manner of facing the circuit components, the first protection piece is provided with a plurality of adapting structures corresponding to the circuit components, and the adapting structures are adapted to the outline of the corresponding circuit components; at least one of the plurality of adapting structures can accommodate and cover the corresponding circuit component, and at least another of the plurality of adapting structures can enable the corresponding circuit component to be exposed out of the protection component.

In one embodiment, the first guard is configured to be connectable to a wall of the main chassis to enclose a receiving chamber between the first guard and the wall of the main chassis, and the main board assembly is disposed in the receiving chamber in such a manner that the circuit component faces the first guard.

In one embodiment, the motherboard assembly further comprises a connection harness connected with the circuit component, and the first protection piece has a wiring structure and/or a wire clamping structure; wherein:

the wiring structure is arranged at the contour edge of the first protection piece and is used for accommodating at least one part of the connecting wire harness so that the connecting wire harness is routed along a preset track; the wire clamping structure is arranged on the first protection piece along the wiring track of the connecting wire harness and is used for fixing the connecting wire harness on the first protection piece.

In one embodiment, the circuit component further comprises a heat dissipation assembly, wherein a plurality of circuit components comprise at least one heat source module, and the heat source module is exposed to the protection assembly through the corresponding adapting structure;

the heat dissipation assembly comprises a first heat dissipation piece and a medium pipeline, and the first heat dissipation piece is in contact connection with the heat source module; the medium pipeline is communicated with the first heat dissipation piece and is used for enabling cooling liquid to flow through the first heat dissipation piece so as to carry away heat generated by the heat source module;

the first guard also has a blocking structure disposed on an outer surface of the first guard for blocking the cooling liquid from entering the main board assembly.

or the first protection piece is of an integrally formed structure of plastic materials, and an antistatic layer is arranged on the surface of the first protection piece.

According to a third aspect, in one embodiment, there is provided an ultrasound apparatus including an ultrasound host, a display device, and an operation device, the display device and the operation device being provided to the ultrasound host; the ultrasonic host comprises a host case and a main board module arranged in the host case, wherein the main board module adopts the main board module in the first aspect or the second aspect.

The main board module of the ultrasonic equipment according to the embodiment comprises a main board assembly and a protection assembly, wherein the main board assembly comprises a circuit substrate and a circuit component; the protective component comprises a first protective piece and a second protective piece, wherein the first protective piece plays a role in preventing static electricity, the second protective piece and the first protective piece enclose a containing cavity, and the main board component is arranged in the containing cavity; the first protection piece is provided with an adapting structure which is adapted to the outline of the corresponding circuit component, and the adapting structure is used for accommodating and covering the corresponding circuit component or exposing the corresponding circuit component to the protection component. By utilizing the structural relation of the adaptation structure and the contour form adaptation of the circuit components, the anti-static and shielding protection of the main board assembly is realized, the whole weight of the main board module can be effectively reduced, and the complex structural form of the main board assembly can be adapted, so that the whole structure of the main board module is more compact and the occupied space is smaller.

Drawings

Fig. 1 is an exploded view of a motherboard module with a heat dissipation assembly omitted.

Fig. 2 is a schematic structural diagram of a first protection member in a motherboard module according to an embodiment.

Fig. 3 is a schematic diagram of a structure of an antistatic layer in a motherboard module according to an embodiment.

Fig. 4 is a schematic structural diagram of a second protection member in a motherboard module according to an embodiment.

Fig. 5 is an exploded view of an embodiment of an ultrasound device with the protective assembly omitted from the main housing.

Fig. 6 is a structural reference schematic diagram of an ultrasound device of an embodiment.

In the figure:

10. a main board assembly; 11. a circuit substrate; 11a, a second mounting structure; 12. a circuit component; 13. connecting the wire harness;

21. a first guard; 21a, a cell cavity structure; 21b, an open structure; 21c, a wiring structure; 21d, a wire clamping structure; 21e, a blocking structure; 21f, a mask portion; 21g, a surrounding wall portion; 22. a second guard; 22a, a hollowed-out structure; 22b, a third mounting structure; 22c, a fourth mounting structure; 23. an antistatic layer;

30. a heat dissipation assembly; 31. a first heat sink; 32. a medium conduit; 33. a second heat sink; 40. a main chassis; A. an ultrasonic host; B. a display device; C. an operating device.

Detailed Description

The utility model will be described in further detail below with reference to the drawings by means of specific embodiments. Wherein like elements in different embodiments are numbered alike in association. In the following embodiments, numerous specific details are set forth in order to provide a better understanding of the present utility model. However, one skilled in the art will readily recognize that some of the features may be omitted, or replaced by other elements, materials, or methods in different situations. In some instances, related operations of the present utility model have not been shown or described in the specification in order to avoid obscuring the core portions of the present utility model, and may be unnecessary to persons skilled in the art from a detailed description of the related operations, which may be presented in the description and general knowledge of one skilled in the art.

Furthermore, the described features, operations, or characteristics of the description may be combined in any suitable manner in various embodiments. Also, various steps or acts in the method descriptions may be interchanged or modified in a manner apparent to those of ordinary skill in the art. Thus, the various orders in the description and drawings are for clarity of description of only certain embodiments, and are not meant to be required orders unless otherwise indicated.

The numbering of the components itself, e.g. "first", "second", etc., is used herein merely to distinguish between the described objects and does not have any sequential or technical meaning. The term "coupled" as used herein includes both direct and indirect coupling (coupling), unless otherwise indicated.

Referring to fig. 1-6, one embodiment provides an ultrasound device, such as a medical ultrasound device, that can detect and image a patient with ultrasound signals to assist a physician in medical diagnosis and treatment. Specifically, the ultrasonic apparatus includes an ultrasonic main body a, a display device B, an operation device C, and other functional members existing as needed.

The ultrasonic host A is used as one of important components of ultrasonic equipment and is mainly used for processing ultrasonic echo signals and generating ultrasonic images; the ultrasonic host a is generally formed by combining a host case 40, a transmitter case, a receiver case, a probe board case and the like, and corresponding functional modules are also configured in each case, for example, a main board module and the like are configured in the host case 40. The display device B and the operation device C are arranged on the ultrasonic host A and are respectively and electrically connected with the ultrasonic host A, and the display device B (such as a display and the like) is used for displaying ultrasonic images so as to assist doctors in medical diagnosis; the user can control the ultrasonic device through the operation device C (such as an operation panel and the like).

The main board module and related structures are mainly described below, and other constituent components in the ultrasonic equipment can refer to the prior art; referring to fig. 1 to 5, the main board module is disposed in a main chassis 40, and includes a main board assembly 10 and a protection assembly; the following is a detailed description.

Referring to fig. 1 and 5, a motherboard assembly 10 includes a circuit substrate 11 and a plurality of circuit components 12; the circuit component 12 may be understood as a related component that implements a preset function of the motherboard assembly, for example, a central processing unit (CPU module), a graphics processing unit (GPU module), a diode, a capacitor, a resistor, a connector, or a collection of individual devices or partial devices; the plurality of circuit components 12 are disposed on the same surface side of the circuit substrate 11, and for convenience of distinction and description, a surface of the circuit substrate 11 on which the circuit components 12 are disposed is defined as a front surface of the motherboard assembly 10.

Referring to fig. 1 to 4, the guard assembly includes a first guard 21 and a second guard 22; wherein, the first protection piece 21 is an integrally formed structure (such as injection molding, 3D printing molding, etc.) made of plastic material; an antistatic layer 23 is disposed on the surface of the first protective member 21, and the antistatic layer 23 may be a film or sheet of a related material capable of playing an antistatic role (such as conducting static electricity or adsorbing static electricity), for example, a metal plating film; the second protection member 22 is a structural body made of a metal material, and the first protection member 21 and the second protection member 22 are disposed opposite to each other so as to enclose a structural space with a certain volume therebetween (for convenience of distinction and description, the structural space is defined as a receiving chamber), and the main board assembly 10 is received and installed in the receiving chamber, and the front side (or the circuit component 12) of the main board assembly 10 is located on the side facing the first protection member 21, that is, the second protection member 21 mainly covers and protects the main board assembly 10 from the back side thereof.

Meanwhile, a plurality of adapting structures corresponding to the plurality of circuit components 12 are formed on the first protection member 21, and according to the type, the use mode, the arrangement position and the like of the circuit components 12, the adapting structures may be in one-to-one correspondence with the circuit components 12, or one adapting structure may be corresponding to the plurality of circuit components 12; and the adaptation structure is arranged to adapt to the contour of the corresponding circuit component 12.

For example, in terms of some circuit components 12 (such as capacitive resistor, connector for connecting between devices of the motherboard assembly itself, etc.), for antistatic and protection, the part of the circuit components 12 needs to be covered by a protection assembly, so the corresponding adapting structure may be a cavity structure 21a concavely arranged on the inner surface side of the first protection member 21 (i.e. the side of the first protection member 21 facing the motherboard assembly 10); after the motherboard assembly 10 is installed in the accommodating cavity, at least a portion of the circuit component 12 (e.g., a portion protruding from the front surface of the circuit substrate 12) can be embedded into the corresponding cavity structure 21a by using the structural relationship that the cavity profile of the cavity structure 21a is adapted or matched with the external profile of the circuit component 12, so that the circuit component 12 is accommodated and covered by the cavity structure 21 a.

For example, as for other circuit components 12 (such as a CPU module, a connector in a motherboard assembly for connecting with other functional modules, etc.), for use requirements (such as a requirement for connecting with other functional modules/devices of an ultrasonic apparatus, a requirement for heat dissipation as a heat source in the motherboard assembly 10, a requirement for dismounting it from the circuit substrate 11 in a plugging manner, etc.), the part of the circuit components 12 needs to be exposed to the protection assembly, so the corresponding adapting structure may be an opening structure 21b disposed through the first protection member 21 and/or a notch structure disposed at the contour edge of the first protection member 21; after the main board assembly 10 is installed in the accommodating chamber, the part of the circuit components can be exposed out of the protection assembly by utilizing the structural relationship that the outline shape of the opening structure 21b is matched with the outline shape of the corresponding circuit components 12.

One of the main board components is a sheet metal structure of some of the prior art, in which the size of the accommodating space is generally larger than the external size of the main board component 10, for example, the main board component 10 is integrally accommodated in a square box body, which generally results in a larger external size (e.g. volume) of the main board module, so that the main board module needs to occupy a larger space in the main board box 40.

Compared to the existing modularized motherboard assembly (i.e., motherboard module), in the embodiment of the utility model, the overall structure of the first protection member 21 and the front side structure of the motherboard assembly 10 can be more matched by using the adapting relationship between the adapting structure (such as the slot cavity structure 21a and the opening structure 21 b) on the first protection member 21 and the outline of the circuit component 21.

Specifically, due to the differences in the specific types, shape and dimensions, arrangement positions, application manners of the circuit components 12, the positions of different areas on the front side of the motherboard assembly 10 may show up in a rugged structure, and after the motherboard assembly 10 is covered by the first protection member 21, the structure of the first protection member 21 or the entire motherboard module is substantially the same as or identical to the structure of the front side of the motherboard assembly 10, that is, the first protection member 21 can shield the motherboard assembly 10 closer to or close to the circuit substrate 11. Therefore, the overall dimension of the main board module can be effectively reduced, the structure of the main board module is more compact and stable, and favorable conditions are created for the disassembly and assembly application of the main board module.

Secondly, a second protective piece 22 made of metal materials is combined with a first protective piece 21 which is provided with an antistatic layer 23 on the surface and integrally formed by plastic materials to form a protective assembly so as to prevent static electricity and protect the structure of the main board assembly 10; on the one hand, the characteristic of higher structural strength of the second protection member 22 can be utilized as a structural assembly carrier of the first protection member 21 and the motherboard assembly 10, which is beneficial to enhancing the structural stability of the entire motherboard module; meanwhile, by utilizing the characteristic that the material of the first protection piece 21 is lighter, the whole weight of the main board module can be effectively reduced, and the light weight design of the main board module is realized. On the other hand, compared with the existing sheet metal protective structural member, in the embodiment of the utility model, based on the characteristic that the first protective member 21 is made of plastic material, various complex structures (namely, adapting structures) can be integrally formed on the first protective member 21 by means of injection molding, 3D printing and other technological means, so that the structural shape of the first protective member 21 or the whole protective assembly is more matched with that of the main board assembly 10; moreover, the structural form of the protection component (such as the first protection piece 21 in particular) is easier to realize or mold, and the manufacturing and using costs are lower.

In another embodiment, the first protection member 21 may also be an integrally formed structure of an insulating plastic material, so as to achieve an antistatic effect by virtue of the characteristics of the insulating plastic material itself; such as antistatic acrylic material (i.e., organic glass), polyvinyl chloride material (i.e., PVC), polycarbonate material (i.e., PC), polyethylene terephthalate material (i.e., PET), etc. Of course, with respect to some motherboard assemblies 10 having relatively simple structures, the first guard 21 may also be an integrally formed structure of metallic material.

In other embodiments, the second guard 22 may be omitted; for example, the main board assembly 10 is mounted on the first protection member 21 to construct a main board module, and other areas of the main board assembly 10 except for the back side thereof are protected against static electricity and shielding by the first protection member 21; in use, the motherboard module is installed in the mainframe box 40 by using the connection relationship between the first protection member 21 or the motherboard assembly 10 and the wall of the mainframe box 40 (in this case, the housing chamber for housing the motherboard assembly 10 is defined between the first protection member 21 and the wall of the mainframe box 40).

Of course, in some embodiments, the second protection member 22 may also be made of plastic material and provided with an antistatic layer 23 on the surface, so as to construct an entire protection component based on the plastic material to meet different application requirements.

In one embodiment, referring to fig. 1 and 2, the motherboard assembly 10 further includes a connection harness 13, and the connection harness 13 may be a wire harness or a flexible circuit board connected between related circuit components 12, or may be a related cable for physically connecting the motherboard assembly 10 with other functional modules in the main chassis 40.

Correspondingly, the first protection piece 21 is also integrally formed with a wiring structure 21c and a wire clamping structure 21d; the trace structure 21c may be a groove body structure extending along a preset track, for example, a groove cavity disposed on the inner surface side of the first guard 21 along the contour edge of the first guard 21; the corresponding connection wire harnesses 13 can be accommodated and arranged by means of the wiring structure 21c, so that the messy distribution of the connection wire harnesses 13 is effectively avoided, the regular wiring of the connection wire harnesses 13 is realized, and the connection wire harnesses 13 can be orderly arranged between related circuit components 12 or led out from the preset part of the protection assembly.

The wire clamping structure 21d may be a buckle structure, a via structure, or the like, which are arranged at intervals along the wiring trace of the connection harness 13, and is mainly used for fixing the connection harness 13 to the first protection member 21, so as to avoid the influence on the overall structure of the motherboard module caused by the connection harness 13 being separated from the arrangement trace.

In other embodiments, the routing structure 21c and the wire clamping structure 21b may be alternatively arranged according to actual needs, or other suitable structures may be used to route, arrange, fix, etc. the connection harness 13, which will not be described herein.

In one embodiment, referring to fig. 1, 2 and 5, the motherboard module further includes a heat dissipation assembly 30, where the heat dissipation assembly 30 is disposed in an external space of the protection assembly, and is mainly used for dissipating heat of heat generating devices (such as the circuit components 21 of the CPU module, the GPU module, etc., and for convenience of distinction and description, the circuit components 21 are defined as heat source modules); in particular, the heat source module is exposed to the protective component arrangement through the corresponding adapting structure (in particular, the opening structure 21 a); and the heat dissipation assembly 30 includes a first heat dissipation element 31, a medium pipe 32 and a second heat dissipation element 33.

The first heat dissipation element 31 is in contact with the heat source module, for example, one surface of the first heat dissipation element 31 is in contact with and attached to the heat source module; the second heat dissipation element 33 may be a cold exhaust system (such as a fluid pump, a radiator fan, etc.) disposed in the main case 40, and the medium pipeline 32 is connected between the first heat dissipation element 31 and the second heat dissipation element 33, and is mainly used for flowing a cooling liquid (such as cooling water) through the first heat dissipation element 31, so as to carry away heat generated by the heat source module or the motherboard assembly 10.

Correspondingly, a blocking structure 21e is integrally formed on the first protection member 21, and the blocking structure 21e may be a plurality of baffle structures or protruding structures disposed on the outer surface of the first protection member 21, so that the cooling liquid can be prevented from being accidentally splashed to the motherboard assembly 10 (for example, from invading into the accommodating space) to cause the motherboard assembly 10 to generate a short circuit.

In fig. 5, the CPU module or the GPU module is taken as an example to schematically illustrate the correspondence between the heat source module and the heat dissipation assembly. In addition, in some embodiments, the second heat dissipation element 33 or the second heat dissipation element 33 and the medium pipeline 32 are not part of the motherboard module, and may be a functional element that is used in cooperation with the first heat dissipation element 31 when the motherboard module is applied.

In other embodiments, the heat dissipation assembly 30 may be used to dissipate heat from the motherboard assembly 10 in an air-cooled manner, for example, the heat dissipation assembly 30 may be constructed by a radiator and a fan, the radiator has a first surface in heat-conducting contact with the heat source module and a second surface opposite to the first surface, and the second surface of the heat dissipation member 30 is provided with heat dissipation fins, so that the heat dissipation area of the heat dissipation member 30 is enlarged by the heat dissipation fins, and the air flow is driven to flow through the radiator by the fan, thereby realizing air-cooled heat dissipation.

In one embodiment, referring to fig. 1 to 4, the first guard 21 has a cover structure generally including a mask portion 21f and a surrounding wall portion 21g; the mask portion 21f may be understood as a structural portion of the first protection member 21 facing the front surface of the main board assembly 10, and the surrounding wall portion 21g is disposed around and connected to the mask portion 21f, and it may be understood that the surrounding wall portion 21g is a structural portion of the first protection member 21 facing the side surface of the main board assembly 10 or the contour edge of the circuit board 11; suitably, the second guard 22 has a generally flat plate-like structure as a whole, and when embodied, the second guard 22 may be formed by cutting and stamping a sheet metal blank; the second prevention piece 22 and the surrounding wall portion 21g of the first prevention piece 21 are abutted against each other, so that an accommodation space is enclosed between the first prevention piece 21 and the second prevention piece 22. The wiring structure 21c, the wire clamping structure 21d, the blocking structure 21e, and the adapting structures such as the slot cavity structure 21a and the opening structure 21b may be formed on the mask portion 21f and/or the surrounding wall portion 21g according to the installation position and the installation form of the corresponding circuit component 12 on the circuit substrate 11.

In some embodiments, the second protection member 22 may also be provided with a hollow structure 22a, so that air can flow in the protection assembly or the accommodating space by means of the hollow structure 22a, thereby enhancing the heat dissipation effect of the motherboard assembly 10.

In other embodiments, the second guard 22 may also be configured with reference to the structural form of the first guard 21, that is: the second guard 22 includes a bottom plate portion and a surrounding wall portion disposed around and contiguous with the bottom plate portion, thereby configuring the second guard 22 to form a box having a contour shape substantially an opening in a top surface; the first protection element 21 can be provided in a manner that is suitable for protecting the motherboard assembly 10 from static electricity and from being covered. In this way, by virtue of the abutting relationship between the peripheral wall portions of the first protection member 21 and the second protection member 22, a receiving chamber can be defined between the first protection member 21 and the second protection member 22.

In one embodiment, referring to fig. 1, 2 and 4, the first guard 21 is further integrally formed with a first mounting structure (not shown), the circuit substrate 11 is provided with a second mounting structure (not shown), and the second guard 22 is provided with a third mounting structure 22b and a fourth mounting structure 22c; the number of each mounting structure may be set to be plural, and may be distributed at intervals along the contour edge of the corresponding member; wherein, the first mounting structure and the third mounting structure 22b are in one-to-one correspondence and are in alignment connection so as to fix the first protection piece 21 and the second protection piece 22; the second mounting structures are in one-to-one correspondence with and aligned with the fourth mounting structures 22c, so as to fix the motherboard assembly 10 and the second guard 22.

In specific implementation, the first mounting structure may be a through hole structure penetrating through the first guard 21, or may be a blind hole structure disposed on the inner surface side of the first guard 21; the second mounting structure may be a through-hole structure provided through the circuit substrate 11, and the third mounting structure 22b may be a screw hole structure provided through the second guard 22, and the fourth mounting structure 22c may be a support column (the support column having a screw hole structure) provided to an inner surface of the second guard 22; thus, on one hand, the first guard 21 and the motherboard assembly 10 can be quickly locked on the second guard 22 by using hardware connectors such as screws; on the other hand, by selecting the structural form or the height position of the third mounting structure 22b and the fourth mounting structure 22c, the motherboard assembly 10 can be locked to the second protection member 22 in a manner similar to hanging, so as to create structural conditions for heat dissipation of the motherboard assembly 10.

In other embodiments, the first protection member 21, the second protection member 22 and the motherboard assembly 10 may be combined and connected in other suitable manners, which will not be described herein.

The foregoing description of the utility model has been presented for purposes of illustration and description, and is not intended to be limiting. Several simple deductions, modifications or substitutions may also be made by a person skilled in the art to which the utility model pertains, based on the idea of the utility model.

Claims

1. A motherboard module of an ultrasound device for installation within a main chassis of the ultrasound device, the motherboard module comprising:

2. The motherboard module as recited in claim 1, wherein a plurality of said mating structures include a pocket structure and an opening structure, said pocket structure being disposed on an inner surface of said first guard for receiving and covering a corresponding said circuit component; the opening structure penetrates through the first protection piece and is used for enabling the corresponding circuit components to be exposed out of the protection assembly.

3. The motherboard module of claim 1, wherein the motherboard assembly further comprises a connection harness connected to the circuit component, the first guard further having a routing structure and/or a card-line structure; wherein:

4. The motherboard module of claim 1, further comprising a heat sink assembly to which at least one of a plurality of said circuit components is connected; the heat dissipation assembly is arranged outside the protection assembly and used for dissipating heat generated by the corresponding circuit components.

5. The motherboard module of claim 4, wherein a plurality of said circuit components include at least one heat source module, said at least one heat source module including a CPU module and/or a GPU module, said heat source module being exposed to said protective assembly through a corresponding said mating structure;

6. The motherboard module of claim 5, wherein said first guard further has a blocking structure disposed on an outer surface of said first guard for blocking cooling liquid from entering said receiving cavity.

7. The motherboard module of claim 1, wherein said second guard has a hollowed-out structure for dissipating heat generated by said circuit substrate assembly.

8. The motherboard module of claim 1, wherein the first guard comprises a mask portion and a perimeter wall portion, the perimeter wall portion being disposed around and contiguous with the mask portion, the adapter structure being disposed on the mask portion and/or the perimeter wall portion; the second guard and the enclosure wall portion are abutted against each other to enclose the accommodating chamber between the first guard and the second guard;

or (b)

9. The motherboard module of claim 8, wherein said first guard further has a first mounting structure, said circuit substrate has a second mounting structure, said second guard has a third mounting structure and a fourth mounting structure; wherein:

10. The motherboard module of any one of claims 1-9, wherein the first guard is an integrally formed structure of an insulating plastic material or a metallic material;

11. The motherboard module of claim 10, wherein said antistatic layer comprises a metal plating layer disposed on an outer surface of said first guard.

12. A motherboard module of an ultrasound device for installation within a main chassis of the ultrasound device, the motherboard module comprising:

13. The motherboard module of claim 12, wherein the first guard is configured to be attachable to a wall of the main chassis to enclose a receiving cavity therebetween, the motherboard assembly disposed within the receiving cavity with the circuit component facing the first guard.

14. The motherboard module as recited in claim 12 wherein a plurality of said mating structures include a pocket structure and an opening structure, said pocket structure being disposed on an inner surface of said first guard for receiving and covering a corresponding said circuit component; the opening structure penetrates through the first protection piece and is used for enabling the corresponding circuit components to be exposed out of the protection assembly.

15. The motherboard module of claim 12, wherein said motherboard assembly further comprises a connection harness connected to said circuit component, said first guard having a routing structure and/or a card-line structure; wherein:

16. The motherboard module of claim 12, further comprising a heat sink assembly, wherein a plurality of said circuit components include at least one heat source module, said heat source module being exposed to said protective assembly through a corresponding said mating structure;

17. The motherboard module of any one of claims 12-16, wherein the first guard is an integrally formed structure of an insulating plastic material or a metallic material;

18. The motherboard module of claim 17, wherein said antistatic layer comprises a metal plating disposed on an outer surface of said first guard.

19. The ultrasonic equipment is characterized by comprising an ultrasonic host, a display device and an operation device, wherein the display device and the operation device are arranged on the ultrasonic host; wherein the ultrasonic host comprises a host case and a main board module arranged in the host case, and the main board module adopts the main board module as claimed in any one of claims 1 to 18.