CN219981003U - Double-spigot structure of bone conduction earphone - Google Patents

Double-spigot structure of bone conduction earphone Download PDF

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Publication number
CN219981003U
CN219981003U CN202321142858.2U CN202321142858U CN219981003U CN 219981003 U CN219981003 U CN 219981003U CN 202321142858 U CN202321142858 U CN 202321142858U CN 219981003 U CN219981003 U CN 219981003U
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China
Prior art keywords
glue
concave part
bone conduction
bin body
spigot structure
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CN202321142858.2U
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Chinese (zh)
Inventor
谢嗣海
张中林
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Dongguan Liesheng Electronic Co Ltd
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Dongguan Liesheng Electronic Co Ltd
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Priority to CN202321142858.2U priority Critical patent/CN219981003U/en
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Abstract

The utility model relates to the technical field of bone conduction earphone assembly, in particular to a double-spigot structure of bone conduction earphone, which comprises a first bin body and a second bin body, wherein the first bin body and the second bin body are connected to form a bin body; the bulge is inserted into the concave part, a glue storage gap for storing external glue is formed between the bulge and the inner wall of the concave part, and one side, close to the inside of the bin body, of the concave part is provided with at least one glue overflow channel communicated with the inside of the bin body. According to the utility model, the protruding part is inserted into the concave part, the outer side of the concave part is abutted against the protruding part, so that one side of the surface of the bin body is sealed, and redundant glue in the spigot structure is stored in the glue storage gap, so that the problem that excessive glue is injected into the concave part to cause the glue to overflow to one side of the surface of the bin body, and the bin body is difficult to clean is well solved.

Description

Double-spigot structure of bone conduction earphone
Technical Field
The utility model relates to the technical field of assembly of bone conduction headphones, in particular to a double-spigot structure of a bone conduction headphone.
Background
The propagation principle of the bone conduction earphone is to convert digital audio into vibration signals, and sound is transmitted to auditory nerves through the skull of a human body. The bone conduction earphone does not pass through ear structures such as eardrum and the like in the process of sound transmission, so that the stimulation and the injury to the eardrum caused by wearing the earphone for a long time are avoided, and the hearing injury is reduced.
Bone conduction headphones generally include two housings, one for housing a battery compartment of a battery and the other for housing a control compartment of a circuit board. For convenient assembly, the bin body is generally divided into a first bin body and a second bin body, a spigot structure is arranged at the joint of the first bin body and the second bin body, the spigot structure generally comprises a protruding part and a recessed part which are matched, glue is applied to the recessed part, the protruding part is connected with the recessed part, and the first bin body and the second bin body are bonded and formed to form the bin body, so that the purposes of dust prevention and water prevention of the bin body are achieved. However, too much glue is applied to the concave part, and the glue overflows to the inner side and the outer side of the bin body along the joint of the first bin body and the second bin body, so that the glue overflows to one side of the bin body surface and is difficult to clean, the appearance of the bin body is affected, and therefore, the improvement is necessary.
Disclosure of Invention
The utility model aims to provide a double-spigot structure of a bone conduction earphone, which aims at overcoming the defect that excessive glue is injected into a concave part in the prior art to cause excessive glue injection to one side of a bin surface, so that cleaning is difficult, and solves the problems that excessive glue is injected into the bin surface to cause excessive glue injection to one side of the bin surface and cleaning is difficult because the outer side of the concave part is abutted with the convex part to cause sealing of one side of the bin surface.
In order to achieve the above object, the dual spigot structure of the bone conduction earphone comprises a spigot structure arranged at the joint of a first bin body and a second bin body, wherein the first bin body and the second bin body are connected through the spigot structure to form a bin body, the spigot structure comprises a concave part and a convex part, the convex part is inserted into the concave part, at least the outer side of the concave part is abutted with the convex part, an inclined surface is arranged on one side surface of the convex part, facing the inner side wall of the concave part, and a glue hiding gap is formed between the inclined surface and the inner side wall surface of the concave part.
Preferably, a plurality of abutting blocks are arranged in the concave part at intervals transversely, and the abutting blocks are abutted against the top of the convex part.
Preferably, the inclined surface is formed by the thickness of the upper end of the boss being smaller than the thickness of the lower end of the boss.
Preferably, an outer side wall of the concave part is provided with a glue hiding inclined plane, and the glue hiding inclined plane and the convex part form a glue hiding space.
Preferably, the inclined surface is provided with a plurality of positioning blocks at intervals, and the positioning blocks are abutted against the inner side walls of the concave parts.
Preferably, the positioning block comprises an inclined guide surface and a vertical abutting surface extending downwards from the inclined guide surface, when the protruding portion is inserted into the recessed portion, the inner wall of the recessed portion is close to the vertical abutting surface along the inclined guide surface, the protruding portion is fixedly inserted into the recessed portion, and the vertical abutting surface abuts against the inner wall of the recessed portion.
Preferably, the height of the inner side wall of the concave part is lower than that of the outer side wall of the concave part to form a glue overflow port, and the glue storage gap is communicated with the inside of the bin body through the glue overflow port.
Preferably, one side of the protruding part is provided with a glue overflow guiding groove corresponding to the glue overflow opening.
Preferably, the overflow guiding groove comprises a vertical guiding surface and an inclined guiding surface bent from the vertical guiding surface.
Preferably, the inner side of the protruding portion is provided with opposite inserting ribs at intervals, the inner side wall of the recessed portion is provided with inserting blocks, and the inserting blocks are in interference with the opposite inserting ribs.
The utility model has the beneficial effects that: according to the utility model, the protruding part is inserted into the recessed part, the outer side of the recessed part is abutted against the protruding part, so that one side of the surface of the bin body is sealed, and the excessive glue in the spigot structure is stored in the glue storage gap, so that the problem that the excessive glue in the recessed part overflows to one side of the surface of the bin body and is difficult to clean is well solved.
Drawings
Fig. 1 is a schematic structural view of the present utility model.
Fig. 2 is a schematic cross-sectional view of the present utility model.
Fig. 3 is a schematic view of a partial structure of the concave portion and the convex portion of the present utility model.
Fig. 4 is a schematic partial structure of the boss of the present utility model.
Fig. 5 is a schematic structural view of a recess portion according to the present utility model.
Fig. 6 is a schematic view of the structure of the boss of the present utility model.
The reference numerals include:
1. a first bin; 2. a second bin; 3. a recessed portion; 31. an abutment block; 32. inserting blocks; 4. a boss; 40. hiding the adhesive inclined plane; 41. an inclined surface; 42. a positioning block; 421. a sloped guide surface; 422. a vertical abutment surface; 43. overflow guiding gutter; 431. a vertical guide surface; 432. inclined guide surfaces; 44. reversely inserting the bone; 5. a glue hiding gap; 6. a glue storage space; 7. and a glue overflow port.
Detailed Description
The present utility model will be described in detail below with reference to the accompanying drawings.
As shown in fig. 1 to 6, the dual spigot structure of the bone conduction earphone of the utility model comprises a spigot structure arranged at the joint of a first bin body 1 and a second bin body 2, wherein the first bin body 1 and the second bin body 2 are connected through the spigot structure to form a bin body, the spigot structure comprises a concave part 3 and a convex part 4, the convex part 4 is inserted into the concave part 3, at least the outer side of the concave part 3 is abutted with the convex part 4, so that one side of the bin body surface is sealed, and glue is prevented from overflowing to one side of the bin body surface. The bulge 4 is provided with inclined plane 41 towards one side surface of the inside wall of the concave part 3, and a glue storage gap 5 is formed between the inclined plane 41 and the inside wall surface of the concave part 3, and excessive glue in the spigot structure is stored through the glue storage gap 5, so that excessive glue is prevented from being injected into the concave part, and the glue overflows to one side of the bin surface.
When the novel plastic storage bin is used, the protruding portion 4 is inserted into the recessed portion 3, the outer side of the recessed portion 3 is abutted to the protruding portion 4, one side of the bin body surface is sealed, redundant glue in the spigot structure is stored in the glue storage gap 5, and the problem that excessive glue is injected into the recessed portion to enable the glue to overflow to one side of the bin body surface and be difficult to clean is well solved.
A plurality of abutting blocks 31 are transversely arranged in the concave part 3 at intervals, the abutting blocks 31 are abutted against the tops of the convex parts 4, the tops of the convex parts 4 are kept at a certain distance from the concave part 3, the space of the glue hiding gap 5 is increased, and redundant glue in the spigot structure is convenient to store.
The thickness of the upper end of the protruding portion 4 of this embodiment is smaller than that of the lower end of the protruding portion 4 to form an inclined surface 41, so that a glue storage gap 5 is formed between the inclined surface 41 and the inner side wall surface of the recessed portion 3.
The outer side wall of the recess 3 in this embodiment is provided with a glue hiding inclined plane 40, and the glue hiding inclined plane 40 and the protrusion 4 form a glue hiding space 6, so as to prevent excessive glue in the spigot structure from overflowing to one side of the bin surface through the contact position between the outer side wall of the recess 3 and the protrusion 4.
The inclined surface 41 of this embodiment is provided with a plurality of locating pieces 42 at intervals, and locating piece 42 is contradicted with the inside wall of depressed part 3, makes bellying 4 through locating piece 42 and the inside wall butt of depressed part 3, makes bellying 4 be fixed in the depressed part 3 to when making first storehouse body 1 and second storehouse body 2 pass through tang structure connection formation storehouse body, the structure of the storehouse body is more firm.
The positioning block 42 of the present embodiment includes a slant guiding surface 421 and a vertical abutting surface 422 extending vertically downward from the slant guiding surface 421, when the protrusion 4 is inserted into the recess 3, the inner wall of the recess 3 approaches the vertical abutting surface 422 along the slant guiding surface 421, the protrusion 4 is inserted and fixed into the recess 3, and the vertical abutting surface 422 abuts against the inner wall of the recess 3, so that the protrusion 4 abuts against the inner wall of the recess 3 through the positioning block 42. The bulge 4 is abutted with the concave part 3, so that the problem that the bin body is easy to collapse due to excessive glue in the spigot structure and the pressing of the spigot structure is avoided.
The height H1 of the inner side wall of the concave part 3 of the embodiment is lower than the height H2 of the outer side wall of the concave part 3 to form a glue overflow opening 7, the glue storage gap 5 is communicated with the inner part of the bin body through the glue overflow opening 7, and redundant glue in the spigot structure overflows to the inner part of the bin body through the glue overflow opening 7, so that excessive glue stored in the glue storage gap 5 is avoided.
One side of the protruding part 4 of the embodiment is provided with a glue overflow guiding groove 43 corresponding to the glue overflow opening 7, and glue can better overflow to the inside of the bin body through the glue overflow guiding groove 43.
The glue overflow guiding groove 43 of the embodiment includes a vertical guiding surface 431 and an inclined guiding surface 432 bent from the vertical guiding surface 431, and the glue overflows into the bin body through the vertical guiding surface 431 and the inclined guiding surface 432, so that the glue overflows into the bin body along the inner wall of the glue overflow opening 7, and the glue is prevented from adhering to the parts in the bin body.
In practical use, when the included angle a1 between the vertical guide surface 431 and the inclined guide surface 432 is 125 °, the excessive glue in the glue storage structure flows into the bin body 3 more smoothly.
The inside interval of protruding portion 4 of this embodiment is provided with anti-bone 44 that inserts, and the inside wall of depressed part 3 is provided with the inserted block 32, and the inserted block 32 contradicts with anti-bone 44, makes the structural strength of the storehouse body higher, prevents that the storehouse body middle part from becoming flat.
The foregoing is merely exemplary of the present utility model, and those skilled in the art should not be considered as limiting the utility model, since modifications may be made in the specific embodiments and application scope of the utility model in light of the teachings of the present utility model.

Claims (10)

1. The utility model provides a two tang structures of bone conduction earphone, is including setting up in the tang structure of first storehouse body (1) and the junction of second storehouse body (2), and first storehouse body (1) and second storehouse body (2) pass through tang structural connection forms the storehouse body, its characterized in that: the spigot structure comprises a concave part (3) and a convex part (4), the convex part (4) is inserted into the concave part (3), at least the outer side of the concave part (3) is in butt joint with the convex part (4), an inclined surface (41) is arranged on one side surface of the inner side wall of the concave part (3) towards the convex part (4), and a glue storage gap (5) is formed between the inclined surface (41) and the inner side wall surface of the concave part (3).
2. The dual spigot structure of a bone conduction headset of claim 1 wherein: a plurality of abutting blocks (31) are arranged in the concave part (3) at intervals transversely, and the abutting blocks (31) are abutted to the tops of the convex parts (4).
3. The dual spigot structure of a bone conduction headset of claim 1 wherein: the thickness of the upper end of the protruding part (4) is smaller than that of the lower end of the protruding part (4) to form the inclined surface (41).
4. The dual spigot structure of a bone conduction headset of claim 1 wherein: the outer side wall of the concave part (3) is provided with a glue hiding inclined plane (40), and the glue hiding inclined plane (40) and the convex part (4) form a glue hiding space (6).
5. The dual spigot structure of a bone conduction headset of claim 1 wherein: the inclined surface (41) is provided with a plurality of positioning blocks (42) at intervals, and the positioning blocks (42) are abutted against the inner side wall of the concave part (3).
6. The dual spigot structure of a bone conduction headset of claim 5 wherein: the locating piece (42) includes inclined guide face (421) and from inclined guide face (421) perpendicularly downwardly extending's perpendicular butt face (422), protruding portion (4) insert when depressed part (3), the inner wall of depressed part (3) is followed inclined guide face (421) are close to perpendicular butt face (422), protruding portion (4) are pegged graft and are fixed in depressed part (3), perpendicular butt face (422) with the inside wall of depressed part (3) is contradicted.
7. The dual spigot structure of a bone conduction headset of claim 1 wherein: the height H1 of the inner side wall of the concave part (3) is lower than the height H2 of the outer side wall of the concave part (3) to form a glue overflow opening (7), and the glue storage gap (5) is communicated with the inside of the bin body through the glue overflow opening (7).
8. The dual spigot structure of a bone conduction headset of claim 7 wherein: one side of the bulge (4) is provided with a glue overflow diversion trench (43) corresponding to the glue overflow opening (7).
9. The dual spigot structure of a bone conduction headset of claim 8 wherein: the overflow guide groove (43) comprises a vertical guide surface (431) and an inclined guide surface (432) bent from the vertical guide surface (431).
10. The dual spigot structure of a bone conduction headset of claim 1 wherein: the inner side of the protruding portion (4) is provided with opposite inserting ribs (44) at intervals, the inner side wall of the recessed portion (3) is provided with inserting blocks (32), and the inserting blocks (32) are in interference with the opposite inserting ribs (44).
CN202321142858.2U 2023-05-12 2023-05-12 Double-spigot structure of bone conduction earphone Active CN219981003U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202321142858.2U CN219981003U (en) 2023-05-12 2023-05-12 Double-spigot structure of bone conduction earphone

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202321142858.2U CN219981003U (en) 2023-05-12 2023-05-12 Double-spigot structure of bone conduction earphone

Publications (1)

Publication Number Publication Date
CN219981003U true CN219981003U (en) 2023-11-07

Family

ID=88586730

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202321142858.2U Active CN219981003U (en) 2023-05-12 2023-05-12 Double-spigot structure of bone conduction earphone

Country Status (1)

Country Link
CN (1) CN219981003U (en)

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