CN219979513U - Wafer processing device - Google Patents

Wafer processing device Download PDF

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Publication number
CN219979513U
CN219979513U CN202321457785.6U CN202321457785U CN219979513U CN 219979513 U CN219979513 U CN 219979513U CN 202321457785 U CN202321457785 U CN 202321457785U CN 219979513 U CN219979513 U CN 219979513U
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China
Prior art keywords
water
cleaning
drying box
surface wall
drying
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CN202321457785.6U
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Chinese (zh)
Inventor
陆海彪
石蛟龙
李港辉
汤镇华
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Zhejiang Tianji Integrated Circuit Technology Co ltd
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Zhejiang Tianji Integrated Circuit Technology Co ltd
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Priority to CN202321457785.6U priority Critical patent/CN219979513U/en
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Abstract

The utility model discloses a wafer processing device, which relates to the technical field of wafer processing and comprises a drying mechanism and a cleaning mechanism; the drying mechanism comprises a drying box and a placing box, and one end of the drying box is hinged with a movable door; according to the utility model, the cleaning channel is additionally arranged, the rotating shaft is inserted into the cleaning channel, the cleaning roller is fixedly sleeved on the outer surface wall of the rotating shaft, the third motor is arranged on the outer surface wall of the cleaning channel and fixedly connected with the rotating shaft, the cleaning roller is driven to rotate by the second motor, and the water sprayed by the water pipe is combined to clean the wafer, so that the two surfaces of the wafer can be conveniently cleaned at the same time, and the cleaning efficiency is improved; the two ends of the water pipe are respectively communicated with the drying box and the water storage tank, so that the water stored in the drying box is conveniently discharged into the water storage tank, the water resource can be recycled, the filter screen is fixedly arranged at the water inlet end of the water pump, impurities in water can be conveniently filtered and washed, and the impurities are prevented from entering the water pump to block the water inlet.

Description

Wafer processing device
Technical Field
The utility model relates to the technical field of wafer processing, in particular to a wafer processing device.
Background
The wafer process is a production process, and in terms of large aspects, the wafer production comprises two steps of crystal bar manufacture and wafer manufacture, and the wafer process can be subdivided into a plurality of processes of melting, purifying, cutting, cleaning, drying and the like, wherein the cleaning and the drying are processes of wafer processing later.
However, in the prior art, after the wafer is processed and molded, attachments on the surface are cleaned by a water gun, one surface of the wafer is firstly cleaned, and then the other surface of the wafer is cleaned by reversing the wafer, so that the efficiency is low, engine oil and the like are not easy to clean, and the problem of unclean cleaning occurs.
Disclosure of Invention
The utility model aims to solve the problems that in the prior art, a water gun is usually adopted to wash attachments on the surface after the wafer is processed and molded, one surface of the wafer is washed firstly, then the other surface of the wafer is washed by reversing, the efficiency is low, engine oil and the like are not easy to clean, and the cleaning is not clean.
In order to achieve the above purpose, the present utility model adopts the following technical scheme: a wafer processing device comprises a drying mechanism and a cleaning mechanism; the drying mechanism comprises a drying box and a placing box, wherein one end of the drying box is hinged with a movable door, the bottom of the placing box is fixedly connected with a movable block, a screw is inserted into the movable block, a sliding groove is formed in the drying box, a sliding block is connected in the sliding groove in a sliding manner, and one end of the sliding block is fixedly connected with the outer surface wall of the placing box; the cleaning mechanism comprises a water storage tank and a cleaning channel, wherein a water pump is arranged in the water storage tank, the water outlet end of the water pump is fixedly communicated with a water pipe, the water pipe is arranged above the cleaning channel, two rotating shafts are inserted in the cleaning channel, cleaning rollers are fixedly sleeved on the outer surface walls of the rotating shafts, two third motors are fixedly arranged on the outer surface walls of the cleaning channel, and the output ends of the two third motors are fixedly connected with one ends of the two rotating shafts respectively.
Preferably, a first motor is fixedly arranged at the top of the drying box, and the output end of the first motor is fixedly connected with a fan wheel.
Preferably, the outer surface wall of the drying box is fixedly provided with a second motor, and the output end of the second motor is fixedly connected with one end of the screw rod.
Preferably, a heating pipe is fixedly arranged on the inner wall of the drying box, and a handle is fixedly arranged on the outer surface wall of the movable door.
Preferably, the outer surface wall of the drying box is fixedly communicated with a connecting pipe, and one end of the connecting pipe is fixedly communicated with the outer surface wall of the water storage tank.
Preferably, a filter screen is fixedly arranged at the water inlet end of the water pump, a water valve is fixedly arranged on the outer surface wall of the water pipe, a partition plate is fixedly arranged at the bottom of the cleaning channel, and the cleaning channel is fixedly inserted into the top of the drying box.
Compared with the prior art, the utility model has the advantages and positive effects that:
1. according to the utility model, the cleaning channel is additionally arranged, the rotating shaft is inserted into the cleaning channel, the cleaning roller is fixedly sleeved on the outer surface wall of the rotating shaft, the third motor is arranged on the outer surface wall of the cleaning channel and fixedly connected with the rotating shaft, the cleaning roller is driven to rotate by the second motor, and the water sprayed by the water pipe is combined to clean the wafer, so that the two surfaces of the wafer can be cleaned at the same time, and the cleaning efficiency is improved.
2. According to the utility model, the two ends of the water pipe are respectively communicated with the drying box and the water storage box, so that the water body stored in the drying box during cleaning is conveniently discharged into the water storage box, the water resource can be recycled, and the filter screen is fixedly arranged at the water inlet end of the water pump, so that impurities left in the water after cleaning can be conveniently filtered, and the impurities are prevented from entering the water pump to block the water inlet.
Drawings
Fig. 1 is a schematic perspective view of a wafer processing apparatus according to the present utility model;
FIG. 2 is a side view of a wafer processing apparatus according to the present utility model;
FIG. 3 is a schematic perspective view of a drying mechanism in a wafer processing apparatus according to the present utility model;
fig. 4 is a schematic perspective view of a cleaning mechanism in a wafer processing apparatus according to the present utility model.
Legend description: 1. a drying mechanism; 101. a drying box; 102. a movable door; 103. placing a box; 104. a movable block; 105. a screw; 106. a chute; 107. a slide block; 108. a first motor; 109. a fan wheel; 110. a second motor; 111. a connecting pipe; 112. heating pipes; 113. a handle; 2. a cleaning mechanism; 201. a water storage tank; 202. a water pump; 203. a water pipe; 204. cleaning the channel; 205. a rotating shaft; 206. a cleaning roller; 207. a third motor; 208. a water valve; 209. a filter screen; 210. a partition board.
Description of the embodiments
In order that the above objects, features and advantages of the utility model will be more clearly understood, a further description of the utility model will be rendered by reference to the appended drawings and examples. It should be noted that, without conflict, the embodiments of the present utility model and features in the embodiments may be combined with each other.
In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present utility model, however, the present utility model may be practiced otherwise than as described herein, and therefore the present utility model is not limited to the specific embodiments of the disclosure that follow.
As shown in fig. 1 to 4, the present utility model provides a wafer processing apparatus including a drying mechanism 1 and a cleaning mechanism 2; the drying mechanism 1 comprises a drying box 101 and a placing box 103, wherein one end of the drying box 101 is hinged with a movable door 102, the bottom of the placing box 103 is fixedly connected with a movable block 104, a screw 105 is inserted into the movable block 104, a sliding groove 106 is formed in the drying box 101, a sliding block 107 is connected in the sliding groove 106 in a sliding manner, and one end of the sliding block 107 is fixedly connected with the outer surface wall of the placing box 103; the cleaning mechanism 2 comprises a water storage tank 201 and a cleaning channel 204, a water pump 202 is arranged in the water storage tank 201, a water outlet end of the water pump 202 is fixedly communicated with a water pipe 203, the water pipe 203 is arranged above the cleaning channel 204, two rotating shafts 205 are inserted in the cleaning channel 204, cleaning rollers 206 are fixedly sleeved on the outer surface walls of the two rotating shafts 205, two third motors 207 are fixedly arranged on the outer surface walls of the cleaning channel 204, and output ends of the two third motors 207 are fixedly connected with one ends of the two rotating shafts 205 respectively; firstly, a proper amount of water is added into a water storage tank 201, a water pump 202 is started to pump the water in the water storage tank 201 into a water pipe 203, a wafer is placed in a cleaning channel 204 by arranging the water pipe 203 above the cleaning channel 204, a third motor 207 is started, a rotating shaft 205 is driven to rotate by the third motor 207, a cleaning roller 206 is fixedly sleeved on the outer surface wall of the rotating shaft 205, and the water flowing out of the water pipe 203 is driven by the rotation of the cleaning roller 206 to clean the wafer and falls into a placing box 103 arranged below after the wafer is cleaned.
As shown in fig. 3, a first motor 108 is fixedly installed on the top of the drying oven 101, and a fan wheel 109 is fixedly connected to the output end of the first motor 108; through the fixed mounting first motor 108 in the top of drying cabinet 101, the output fixed mounting fan wheel 109 of first motor 108 is convenient for drive fan wheel 109 rotation through the rotation of first motor 108, stirs the air in the drying cabinet 101, improves drying efficiency.
As shown in fig. 3, the outer surface wall of the drying oven 101 is fixedly provided with a second motor 110, and the output end of the second motor 110 is fixedly connected with one end of the screw 105; through the fixed mounting second motor 110 at the exterior wall of drying cabinet 101, the output of second motor 110 and the one end fixed connection of screw rod 105, the rotation that is convenient for utilize second motor 110 rotates drive screw rod 105 and rotates, adjusts the position of placing case 103.
As shown in fig. 3, a heating pipe 112 is fixedly installed on the inner wall of the drying oven 101, and a handle 113 is fixedly installed on the outer surface wall of the movable door 102; the heating pipe 112 is fixedly arranged on the inner wall of the drying box 101, so that the gas in the drying box 101 can be conveniently heated, the effect of drying wafers is achieved, and the handle 113 is fixedly arranged on the outer surface wall of the movable door 102, so that the movable door 102 can be conveniently opened, and the wafers can be taken and placed.
As shown in fig. 1 and 2, the outer surface wall of the drying box 101 is fixedly communicated with a connecting pipe 111, and one end of the connecting pipe 111 is fixedly communicated with the outer surface wall of the water storage tank 201; the two ends of the connecting pipe 111 are respectively communicated with the drying box 101 and the water storage tank 201, so that water in the drying box 101 is conveniently discharged into the water storage tank 201, and the water can be recycled.
As shown in fig. 4, a filter screen 209 is fixedly arranged at the water inlet end of the water pump 202, a water valve 208 is fixedly arranged on the outer surface wall of the water pipe 203, a partition 210 is fixedly arranged at the bottom of the cleaning channel 204, and the cleaning channel 204 is fixedly inserted into the top of the drying box 101; through the fixed mounting filter screen 209 in the income water end of water pump 202, the impurity in the filtration aquatic of being convenient for avoids great debris to be inhaled and causes the circumstances that the water inlet was blockked up, at the outward appearance wall fixed mounting water valve 208 of water pipe 203, the feeding of the control water source of being convenient for, the bottom fixed mounting baffle 210 at clearance passageway 204 again, control water flow increases the contact time of water source and wafer, the better clearance wafer of being convenient for.
Working principle: when the device is used, firstly, a proper amount of water is added into the water storage tank 201, the water pump 202 is started to pump the water in the water storage tank 201 into the water pipe 203, a wafer is placed in the cleaning channel 204 by arranging the water pipe 203 above the cleaning channel 204, the third motor 207 is started, the rotating shaft 205 is driven to rotate by the third motor 207, the cleaning roller 206 is fixedly sleeved on the outer surface wall of the rotating shaft 205, the water flowing out of the water pipe 203 is driven by the rotation of the cleaning roller 206 to clean the wafer, and the wafer falls into the placing box 103 arranged below after the wafer is cleaned; then, the heating pipe 112 fixedly arranged on the inner wall of the drying box 101 is used for heating, the wafer is dried, the fan wheel 109 is driven to rotate by the first motor 108, the drying of the wafer is accelerated, after the drying is finished, the second motor 110 is started, the sliding block 107 fixedly connected with the outer surface wall of the placing box 103 is driven to move in the sliding groove 106, the placing box 103 is moved to one end of the drying box 101, the handle 113 is pulled, the movable door 102 is opened, and the wafer is taken out.
The present utility model is not limited to the above-mentioned embodiments, and any equivalent embodiments which can be changed or modified by the technical content disclosed above can be applied to other fields, but any simple modification, equivalent changes and modification made to the above-mentioned embodiments according to the technical substance of the present utility model without departing from the technical content of the present utility model still belong to the protection scope of the technical solution of the present utility model.

Claims (6)

1. The wafer processing device is characterized by comprising a drying mechanism (1) and a cleaning mechanism (2);
the drying mechanism (1) comprises a drying box (101) and a placing box (103), wherein one end of the drying box (101) is hinged with a movable door (102), the bottom of the placing box (103) is fixedly connected with a movable block (104), a screw (105) is inserted into the movable block (104), a sliding groove (106) is formed in the drying box (101), a sliding block (107) is connected in the sliding groove (106) in a sliding manner, and one end of the sliding block (107) is fixedly connected with the outer surface wall of the placing box (103);
the cleaning mechanism (2) comprises a water storage tank (201) and a cleaning channel (204), a water pump (202) is arranged in the water storage tank (201), a water pipe (203) is fixedly communicated with the water outlet end of the water pump (202), the water pipe (203) is arranged above the cleaning channel (204), two rotating shafts (205) are inserted into the cleaning channel (204), cleaning rollers (206) are fixedly sleeved on the outer surface wall of the rotating shaft (205), two third motors (207) are fixedly arranged on the outer surface wall of the cleaning channel (204), and the output ends of the two third motors (207) are fixedly connected with one ends of the two rotating shafts (205) respectively.
2. The wafer processing apparatus according to claim 1, wherein: the top of drying cabinet (101) fixed mounting has first motor (108), the output fixedly connected with fan wheel (109) of first motor (108).
3. The wafer processing apparatus according to claim 1, wherein: the outer surface wall of the drying box (101) is fixedly provided with a second motor (110), and the output end of the second motor (110) is fixedly connected with one end of the screw rod (105).
4. The wafer processing apparatus according to claim 1, wherein: the inner wall of the drying box (101) is fixedly provided with a heating pipe (112), and the outer surface wall of the movable door (102) is fixedly provided with a handle (113).
5. The wafer processing apparatus according to claim 1, wherein: the outer surface wall of the drying box (101) is fixedly communicated with a connecting pipe (111), and one end of the connecting pipe (111) is fixedly communicated with the outer surface wall of the water storage tank (201).
6. The wafer processing apparatus according to claim 1, wherein: the water inlet end of the water pump (202) is fixedly provided with a filter screen (209), the outer surface wall of the water pipe (203) is fixedly provided with a water valve (208), the bottom of the cleaning channel (204) is fixedly provided with a baffle plate (210), and the cleaning channel (204) is fixedly inserted into the top of the drying box (101).
CN202321457785.6U 2023-06-09 2023-06-09 Wafer processing device Active CN219979513U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202321457785.6U CN219979513U (en) 2023-06-09 2023-06-09 Wafer processing device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202321457785.6U CN219979513U (en) 2023-06-09 2023-06-09 Wafer processing device

Publications (1)

Publication Number Publication Date
CN219979513U true CN219979513U (en) 2023-11-07

Family

ID=88578352

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202321457785.6U Active CN219979513U (en) 2023-06-09 2023-06-09 Wafer processing device

Country Status (1)

Country Link
CN (1) CN219979513U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN118148876A (en) * 2023-12-25 2024-06-07 无锡暖芯半导体科技有限公司 Liquid leakage preventing water pump and use method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN118148876A (en) * 2023-12-25 2024-06-07 无锡暖芯半导体科技有限公司 Liquid leakage preventing water pump and use method

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