CN219976681U - Air conditioner substrate and air conditioner - Google Patents

Abstract

The utility model provides an air conditioner substrate and an air conditioner, and relates to the technical field of air conditioners. The air conditioner substrate includes: the base plate body sets up master control circuit and communication compatible circuit on the base plate body, and communication compatible circuit includes communication compatible terminal. The air conditioner substrate is connected with the external communication circuit module through the communication compatible terminal. The main control circuit determines the type of the accessed external communication circuit module according to the signal access state of the communication compatible terminal, and performs data interaction with external equipment according to the supported communication protocol type of the accessed external communication circuit module. The problems of redundancy of the existing substrate air conditioner model and poor universality and expansibility are solved.

Description

Air conditioner substrate and air conditioner

Technical Field

The utility model relates to the technical field of air conditioners, in particular to an air conditioner substrate and an air conditioner.

Background

With the continuous development of the smart home market, the application requirements of various smart home appliances are increasing. Therefore, many users use a centralized controller to centralized control all intelligent home in the home, and the air conditioner is one of important home appliances in the home, and the level of intellectualization is continuously upgraded.

In the related art, adapting an air-conditioning substrate to different communication protocols may result in the air-conditioning substrate having a plurality of different models, so that the air-conditioning substrate becomes very redundant, which may result in unnecessary costs and resource waste.

Disclosure of Invention

The embodiment of the utility model provides an air conditioner substrate and an air conditioner, and aims to solve the problems of redundancy of the existing substrate air conditioner model and poor universality and expansibility.

In order to solve the technical problems, the utility model is realized as follows:

in a first aspect, an embodiment of the present utility model provides an air conditioner substrate, including:

a substrate body;

a main control circuit and a communication compatible circuit arranged on the substrate body;

the communication compatible circuit comprises a communication compatible terminal, and the communication compatible circuit is connected with an external communication circuit module through the communication compatible terminal, wherein the communication compatible terminal is connected with the external communication circuit module in a plugging mode, and the type of the external communication circuit module at least comprises a HOMEBUS protocol communication module and a MODBUS protocol communication module.

The technical scheme provided by the embodiment of the utility model at least has the following beneficial effects: firstly, the air conditioner substrate can be connected with various external communication circuit modules of different types by arranging the communication compatible terminal, has better universality and expansibility, and meets the requirements of different users. The air conditioner substrate provided by the embodiment of the utility model can be automatically adapted according to the type of the external communication circuit module, so that the types of main board models can be reduced, and the inventory cost is reduced. And secondly, the external communication circuit module can be automatically identified and connected by configuring the main control circuit and the communication compatible circuit. Therefore, automatic control can be realized, inconvenience brought by manual operation is avoided, and the use experience of a user is improved. Finally, the air conditioner substrate can automatically select a corresponding communication protocol to exchange data according to the type of the accessed external communication circuit module. Therefore, communication failure or data transmission errors caused by mismatching of communication protocols can be avoided, and the reliability and stability of communication are improved.

In some embodiments, the communication-compliant terminals include a first communication-compliant terminal and a second communication-compliant terminal, a first pin of the first communication-compliant terminal is connected with a REDE pin of the master circuit, a second pin of the first communication-compliant terminal is connected with a COM-485 pin of the master circuit, a third pin of the first communication-compliant terminal is connected with a +5v pin, a fourth pin of the first communication-compliant terminal is connected with a ground pin, a first pin of the second communication-compliant terminal is connected with an INT pin of the master circuit, a second pin of the second communication-compliant terminal is connected with an ACLK pin of the master circuit, a third pin of the second communication-compliant terminal is connected with a TXD pin of the master circuit, and a fourth pin of the second communication-compliant terminal is connected with a RXD pin of the master circuit.

In some embodiments, the MODBUS protocol communication module comprises: the first main control chip, the first pin of first main control chip is connected with the one end concurrent connection of first resistance and second resistance, the other end and the +5V contact pin of first resistance are connected, the other end and the base of first triode of second resistance are connected, the collecting electrode of first triode is connected with the base of second triode, the base of second triode with MODBUS protocol communication module's RXD contact pin is connected, the second pin and the third pin concurrent connection of first main control chip back with MODBUS protocol communication module's 485RE/DE contact pin is connected, the fourth pin of first main control chip the TXD contact pin of MODBUS protocol communication module is connected.

In some embodiments, the first main control chip has a chip model number of ISL81487LIBZ.

In some embodiments, the MODBUS protocol communication module further comprises a third party communication interface, the third party communication interface of the MODBUS protocol communication module is connected with the third party centralized controller, the 485RE/DE pin of the MODBUS protocol communication module is plugged with the first contact of the first communication compatible terminal, the +5v pin of the MODBUS protocol communication module is plugged with the fourth contact of the first communication compatible terminal, the TXD pin of the MODBUS protocol communication module is plugged with the third contact of the second communication compatible terminal, and the RXD pin of the MODBUS protocol communication module is plugged with the fourth contact of the second communication compatible terminal.

In some embodiments, the HOMEBUS protocol communication module comprises: the first pin of the second main control chip is connected with one end of a third resistor and one end of a fourth resistor in a common point mode, the other end of the third resistor is connected with a +5V contact pin, the other end of the fourth resistor is connected with the positive electrode of a first diode group, the negative electrode of the first diode group is connected with the base electrode of a third triode, the collector electrode of the third triode is connected with the base electrode of a fourth triode, the fourth triode and the emitting electrode of the third triode are grounded, the collector electrode of the fourth triode is connected with the INT contact pin and the RXD contact pin of the HOMEBUS protocol communication module in a common point mode, the second pin of the second main control chip is connected with the collector electrode of a fifth triode, the base electrode of the fifth triode is connected with the collector electrode of a sixth triode, the base electrode of the sixth triode is connected with the TXD contact pin of the HOMEBUS protocol communication module, the collector electrode of the fifth triode is connected with the collector electrode of the seventh triode, and the base electrode of the HOMEBUS protocol communication module is connected with the base electrode of the HOMEACLK protocol communication module.

In some embodiments, the second master chip is MS1192.

In some embodiments, the HOMEBUS protocol communication module further comprises a third party communication interface, the third party communication interface of the HOMEBUS protocol communication module is connected with a third party centralized controller, the +5v pin of the HOMEBUS protocol communication module is plugged with the fourth contact of the first communication compatible terminal, the INT pin of the MODBUS protocol communication module is plugged with the first contact of the second communication compatible terminal, the ACLK pin of the HOMEBUS protocol communication module is plugged with the second contact of the second communication compatible terminal, the TXD pin of the HOMEBUS protocol communication module is plugged with the third contact of the second communication compatible terminal, and the RXD pin of the HOMEBUS protocol communication module is plugged with the fourth contact of the second communication compatible terminal.

In some embodiments, the master control circuit determines that the type of the accessed external communication circuit module is a HOMEBUS protocol communication module when detecting that the first pin of the first communication compatible terminal is not accessed with an enable signal and the first pin and the second pin of the second communication compatible terminal are accessed with the enable signal; or alternatively, the first and second heat exchangers may be,

and under the condition that the first pin of the first communication compatible terminal is detected to be connected with an enabling signal, and the third pin and the fourth pin of the second communication compatible terminal are also connected with the enabling signal, determining that the type of the connected external communication circuit module is a MODBUS protocol communication module.

In a second aspect, an embodiment of the present utility model provides an air conditioner, including: the air conditioner substrate provided in the first aspect. The beneficial effects of the air conditioner are the same as those of the air conditioner substrate provided in the first aspect of the present utility model, and are not described herein.

Drawings

In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, it being obvious that the drawings in the following description are only some embodiments of the utility model, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

FIG. 1 is a schematic diagram of a control interaction of a smart home in an embodiment of the utility model;

FIG. 2 is a schematic diagram of a third party centralized controller interacting with an air conditioner in an embodiment of the present utility model;

FIG. 3 is a schematic diagram of another control interaction between a third party centralized controller and an air conditioner according to an embodiment of the present utility model;

FIG. 4 is a schematic diagram of a functional module of a conventional air conditioning substrate according to an embodiment of the present utility model;

FIG. 5 is a schematic diagram of functional modules of an air conditioner substrate according to an embodiment of the present utility model;

fig. 6 is a circuit connection diagram of a communication compatible terminal and an air conditioner substrate in an embodiment of the present utility model;

FIG. 7 is a circuit diagram of a MODBUS protocol communication module in an embodiment of the utility model;

FIG. 8 is a schematic diagram illustrating connection between a MODBUS protocol communication module and a communication compatible terminal according to an embodiment of the present utility model;

fig. 9 is a circuit diagram of a HOMEBUS protocol communication module in an embodiment of the present utility model;

fig. 10 is a schematic diagram illustrating connection between a HOMEBUS protocol communication module and a communication compatible terminal in an embodiment of the present utility model;

fig. 11 is a logic flow diagram of a master control circuit determining an external communication circuit module type to be accessed in an embodiment of the present utility model.

Reference numerals: 50. a substrate body; 501. a communication compatible circuit; 502. a main control circuit; 503. an execution circuit; 504. a chip peripheral circuit; 505. an analog quantity acquisition circuit; 506. and a digital quantity acquisition circuit.

Detailed Description

Embodiments of the present utility model will be described in detail below with reference to the accompanying drawings.

In the description of the present utility model, it should be understood that the terms "center," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like indicate orientations or positional relationships based on the orientation or positional relationships shown in the drawings, merely to facilitate describing the present utility model and simplify the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present utility model.

The terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present utility model, unless otherwise indicated, the meaning of "a plurality" is two or more.

In the description of the present utility model, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art.

In describing some embodiments, the expression "connected" and its derivatives may be used. For example, the term "connected" may be used in describing some embodiments to indicate that two or more elements are in direct physical or electrical contact with each other. The embodiments disclosed herein are not necessarily limited to the disclosure herein.

The use of "adapted" or "configured to" herein is meant to be an open and inclusive language that does not exclude devices adapted or configured to perform additional tasks or steps.

In the circuit provided by the embodiment of the present disclosure, "nodes" do not represent actually existing components, but represent junction points of related electrical connections in the circuit diagram, that is, the nodes are equivalent nodes of the junction points of the related electrical connections in the circuit diagram.

As described in the background art, since the conventional air conditioning substrate usually has a communication circuit for exchanging data with an external device, the air conditioning substrate is usually cured on the air conditioning substrate body, and thus each type of air conditioning substrate can only support a specific certain communication protocol, for example: supporting the HOMEBUS protocol, MODBUS protocol, CAN protocol, etc. Therefore, in order to adapt the air-conditioning substrate to different communication protocols, the air-conditioning substrate may be caused to generate a plurality of different models, so that the air-conditioning substrate becomes very redundant, which may cause unnecessary cost and resource waste. In addition, if it is required to produce a plurality of different air-conditioning substrates during the production process, the production cost and time are increased.

In the use process of the smart home, as shown in fig. 1, a user issues a control instruction through a third-party centralized controller to control various types of smart home, such as air conditioner control. The third-party centralized controller is used for issuing control instructions, and is a common mode of modern intelligent home control. The intelligent home equipment management system can perform unified centralized management and control on various different types of intelligent home equipment, so that convenience and usability of the intelligent home system are improved. The control instruction issued by the third-party centralized controller can comprise various control modes, such as timing control, scene control, voice control, manual control and the like. The control modes can be flexibly configured and combined according to the requirements of users, so that more personalized and intelligent control experience is realized. Meanwhile, linkage control among a plurality of intelligent household devices can be realized through the third-party centralized controller. For example, it may be provided that when the intelligent door lock is opened, the air conditioner may be automatically opened, thereby improving home safety and convenience. The linkage control can be configured and managed through the third-party centralized controller, so that the control experience is more intelligent and efficient.

In the process of controlling the intelligent home by the user through the third-party centralized controller, the user does not know the type of the air conditioner which needs to be purchased and is matched with the communication protocol supported by the third-party centralized controller, so that two situations can occur in the process of configuring after the purchase, the first situation is that the communication protocol supported by the air conditioner purchased by the user can be matched with the communication protocol supported by the third-party centralized controller adopted by the user, and the third-party centralized controller directly performs data interaction with the air conditioner according to the data shown in fig. 2. The second case is that the communication protocol supported by the air conditioner purchased by the user is not matched with the communication protocol supported by the third-party centralized controller adopted by the user, and then the third-party centralized controller needs to be added to support the data interaction of the third-party centralized controller and the air conditioner according to the data shown in fig. 3.

As an example, if the communication protocol supported by the third-party centralized controller is a MODBUS protocol and the communication protocol supported by the air conditioner is a HOMEBUS protocol, in a data uploading stage, the air conditioner transmits a HOMEBUS protocol data packet generated by the third-party centralized controller to the protocol converter in a data interaction process between the third-party centralized controller and the air conditioner, the protocol converter converts the HOMEBUS protocol data packet into a MODBUS protocol data packet, then transmits the MODBUS protocol data packet to the third-party centralized controller, and in an instruction issuing stage, the third-party centralized controller transmits the MODBUS protocol data packet carrying a control instruction to the protocol converter. Then, the protocol converter converts the MODBUS protocol data packet carrying the control instruction into a HOMEBUS protocol data packet, and finally, the HOMEBUS protocol data packet is sent to the air conditioner.

In view of this problem, the inventors have proposed the technical idea of the present utility model: by changing the communication circuit solidified in the traditional air conditioner substrate into a communication compatible circuit capable of being assembled and disassembled in a modularized mode, the universality of the air conditioner substrate is greatly improved. In the use process, a user only needs to plug in the target protocol circuit module according to the needs of the user, the air conditioner substrate can automatically identify and carry out protocol configuration, and the protocol converter is not required to be additionally added, so that the time cost and financial cost of the user can be greatly reduced.

Based on this, some embodiments of the present utility model provide an air conditioner substrate and an air conditioner, and by improving the air conditioner substrate, an air conditioner substrate compatible with various communication circuits is provided, and the air conditioner substrate and the air conditioner are described below.

As shown in fig. 4, fig. 4 is a schematic diagram of a functional module of a conventional air conditioner substrate, which includes an execution circuit, a main control circuit, an analog quantity acquisition circuit, a digital quantity acquisition circuit, a chip peripheral circuit and a communication circuit.

The communication circuit is cured on the air conditioning substrate, thus resulting in the air conditioning substrate often supporting only one type of communication protocol.

As shown in fig. 5, fig. 5 is a schematic diagram of functional modules of an air conditioner substrate according to the present utility model, the air conditioner substrate includes a substrate body 50, and a communication compatible circuit 501, a main control circuit 502, an execution circuit 503, a chip peripheral circuit 504, an analog quantity acquisition circuit 505 and a digital quantity acquisition circuit 506, which are disposed on the substrate body 50 and are composed of a plurality of electronic components. The substrate body 50 is, for example, a PCB (Printedcircuit boards, printed circuit board), and a circuit is disposed in the substrate body 50. Illustratively, the plurality of electronic components include capacitive, resistive, triode, chip, relay, etc., each of which may be coupled, for example, by a trace in the PCB. The communication compatible circuit 501 is used for controlling and monitoring the running state of the air conditioner, so that a user can remotely control and monitor the air conditioner through the third-party centralized controller, the main control circuit 502 is used for identifying an external communication circuit module accessed by the communication compatible circuit 501, and the utility model mainly expands and introduces the communication compatible circuit 501 and the main control circuit 502.

In some embodiments, the communication-compliant circuit 501 includes a communication-compliant terminal through which the communication-compliant circuit is connected with an external communication circuit module.

The communication compatible terminal is an interface for connecting the external communication circuit module and the communication compatible circuit, and the communication compatible terminal is usually designed in a standardized way so as to ensure that the communication compatible terminal can be matched with air conditioner substrates of different models. And factors such as stability, reliability, interference resistance and the like of signal transmission need to be considered. The following principle is followed for a communication compatible terminal: standardization of communication interfaces. The communication compatible terminal should employ a standard communication interface, such as RS485, CAN, MODBUS, etc. communication protocols, to connect and communicate with various communication devices. In order to improve the stability of signal transmission, the problems of signal loss, interference and the like are prevented. The communication compatible terminals should employ high quality interfaces and lines and employ anti-interference measures such as shielding, filtering, etc. techniques to improve the reliability and stability of the signals.

In some embodiments, the types of external communication circuit modules include at least a HOMEBUS protocol communication module and a MODBUS protocol communication module.

In this embodiment, the external communication circuit module may include a plurality of different types of communication protocol modules, such as HOMEBUS and MODBUS. The communication protocol modules can be used for realizing intelligent interconnection and linkage control of the air conditioner and other equipment.

The HOMEBUS protocol communication module is a communication protocol special for the household field, and can realize intelligent interconnection between household devices. Through HOMEBUS protocol communication module, the air conditioner can carry out coordinated control with other household equipment, realizes intelligent environmental control.

The MODBUS protocol communication module is a universal serial communication protocol. The MODBUS protocol communication module can realize communication between the air conditioning system and other equipment so as to realize automatic control and monitoring. The types of the external communication circuit modules can comprise a HOMEBUS protocol communication module and a MODBUS protocol communication module so as to realize linkage control and monitoring of the air conditioner and other household equipment and automation equipment.

Besides the HOMEBUS protocol communication module and the MODBUS protocol communication module, the external communication circuit module of the air conditioning system can also comprise other types of communication protocol modules so as to meet different application scenes and requirements.

As an example, the Zigbee protocol communication module is a low power consumption, short distance communication protocol based on wireless technology, and is commonly used in the fields of smart home, smart medical care, and the like. Through the Zigbee protocol communication module, the air conditioning system can be in wireless linkage control with other intelligent devices. WiFi and Bluetooth communication modules are also commonly used communication protocol modules, and can realize communication and control between an air conditioning system and mobile equipment such as a smart phone, a tablet personal computer and the like. Through software such as mobile phone App, the user can carry out remote control and monitoring to the air conditioner anytime and anywhere. Therefore, the types of the external communication circuit module not only comprise the HOMEBUS protocol communication module and the MODBUS protocol communication module, but also can comprise other types of communication protocol modules so as to meet different application scenes and requirements.

In some embodiments, the communication-compatible terminals include a first communication-compatible terminal and a second communication-compatible terminal.

In this embodiment, as shown in fig. 6, fig. 6 is a circuit connection diagram of a communication compatible terminal and an air conditioner substrate, that is, an internal pin connection schematic diagram of the communication compatible terminal, wherein the first communication compatible terminal is a CN303 terminal, the second communication compatible terminal is a CN303-1 terminal, in fig. 6, a first pin of CN303 is connected to a REDE pin of a master circuit, a second pin of CN303 is connected to a COM-485 pin of the master circuit, a third pin of CN303 is connected to a +5v pin, a fourth pin of CN303 is connected to a ground pin, a first pin of CN303-1 is connected to an INT pin of the master circuit, a second pin of CN303-1 is connected to an ACLK pin of the master circuit, a third pin of CN303-1 is connected to a TXD pin of the master circuit, and a fourth pin of CN303-1 is connected to an RXD pin of the master circuit.

The CN303 terminal is a four-pin terminal, and the first, second, third, and fourth pins are connected to the REDE, COM-485, +5v, and ground of the main control circuit, respectively. The REDE pin is used for indicating the communication state, the COM-485 pin is used for data transmission of communication, the +5v pin provides power supply required by a communication circuit, and the grounding end is the grounding point of the circuit.

Next, the CN303-1 terminal is also a four-pin terminal, and the first, second, third, and fourth pins inside the terminal are connected to the INT, ACLK, TXD and RXD terminals of the master circuit, respectively. The INT pin is used for interrupt control, the ACLK pin is used for providing a clock signal, the TXD pin is used for transmitting data, and the RXD pin is used for receiving data.

The connection mode of the two communication compatible terminals is to realize communication between the air conditioner substrate and the external communication circuit module. The external communication circuit module may transmit and receive data through COM-485 and TXD/RXD pins according to different communication protocols, such as MODBUS, HOMEBUS, etc., while the substrate monitors and controls communication status and interrupts by connecting to REDE and INT pins. The ACLK pin provides a clock signal to ensure synchronization and stability of the communication.

In some embodiments, the external communication circuit module is connected to the air conditioner substrate by plugging.

When the external circuit module needs to be connected, the corresponding interface end on the external communication circuit module can be inserted into the corresponding positions of the two communication compatible terminals CN303-1 and CN303 so as to realize the electrical connection between the module and the substrate.

In the use process of the air conditioner, the communication circuit module may malfunction or need to be updated due to long-term operation or other reasons, and at the moment, the replacement can be completed by only pulling out the original module and then inserting a new module. Compared with the traditional welding connection mode, the plug-in type connection can greatly save maintenance and replacement time, avoids the risk of loosening and disconnection of the welding connection caused by heat, vibration and other factors, and is safer and more reliable. And through plug-in connection, air conditioner manufacturer can also select different grade type communication circuit module to match according to different market demands and product location in a flexible way. If a customer needs to implement a specific communication protocol or function, the manufacturer can replace the appropriate communication circuit module, avoiding the risk of poor user experience caused by the problem of incompatibility of the communication protocols and the like.

In some embodiments, the MODBUS protocol communications module comprises: the first main control chip is provided with an ISL81487LIBZ chip model, a first pin of the first main control chip is connected with one ends of a first resistor and a second resistor in a common point mode, the other end of the first resistor is connected with a +5V pin, the other end of the second resistor is connected with a base electrode of a first triode, a collector electrode of the first triode is connected with a base electrode of a second triode, a base electrode of the second triode is connected with an RXD pin of a MODBUS protocol communication module, a second pin of the first main control chip is connected with a 485RE/DE pin of the MODBUS protocol communication module after being connected in parallel with a third pin, and a TXD pin of a fourth pin of the first main control chip is connected with the MODBUS protocol communication module.

It should be noted that, as shown in fig. 7, the first main control chip is IC1, and its chip model is ISL81487libz, and the sl81487libz is an RS-485/RS-422 transceiver chip integrated with multiple protection and detection functions. The first pin (RO pin) is connected with one end of a first resistor (R4) and one end of a second resistor (R6) in a common point manner, the other end of the first resistor (R4) is connected with a +5V pin, the second resistor (R6) is connected with a base of a first triode (Q2), a collector of the first triode (Q2) is connected with one end of a resistor R3 and a base of a second triode (Q1) in a common point manner, an emitter of the first triode (Q2) and an emitter of the second triode (Q1) are connected with the ground in parallel, the other end of the resistor R3 is connected with a +5V pin, a collector of the second triode (Q1) is connected with a RXD pin, a resistor branch is connected between the collector of the second triode (Q1) and the RXD end in parallel, the resistor R2 is connected with the resistor R1 in series with a light emitting diode (LED 1) in sequence, a second pin (RE pin) and a third pin (DE pin) of a master control chip IC1 are connected with 485/DE pin after being connected in parallel, and the fourth pin (DI pin) of the master control chip IC1 is connected with one end of the resistor R8 in a common point manner, and the other end of the resistor R8 is connected with the +5V pin. The fifth pin (GND pin) of the main control chip IC1 is grounded.

The RO pin is the received data output pin, and is connected in series with resistor R4 and resistor R6 to form a voltage divider for adjusting the received signal to the correct level range. The two resistors R4 and R6 are used to form part of a voltage divider to adjust the signal output by the RO pin to the correct level range.

The Q2 transistor acts as an amplifier to amplify the signal output from the RO pin and transmit the signal to the RXD terminal. The R3 resistor is used for protecting the Q2 triode, and limits the voltage in the circuit to be within the range which the Q2 triode can bear. The Q1 triode is used for controlling the sending of data, and when the main control chip outputs data, the main control chip transmits signals to the TXD terminal. The RXD port is used to receive data and signals received from the RO pin and Q2 transistor are transmitted to the port. Resistor R2, resistor R1 and LED1: these elements constitute an indicator light circuit, the LED1 is used to indicate the status of the data transmission, and the resistors R2 and R1 are used to limit the current of the LED 1. The RE/DE end is used for controlling the sending and receiving of data, and the RE pin and the DE pin of the main control chip are connected to the port in parallel. The DI pin is a data input pin of the main control chip, and when the main control chip needs to send data, the data is transmitted to the TXD terminal from the pin. The GND pin is used for grounding, which is the common ground of the circuit, ensuring that the potential between the elements is the same.

In some embodiments, as further shown in fig. 7, the MODBUS protocol communication module further includes a third party communication interface, and the third party communication interface of the MODBUS protocol communication module is connected to the third party central controller.

In this embodiment, the sixth pin (pin a) of the first main control chip IC1 is connected with the 2 pin of the third party communication interface (CN 1) to form a 485-a communication line, and the seventh pin (pin B) of the first main control chip IC1 is connected with the 1 pin of the third party communication interface (CN 1) to form a 485-B communication line. The third party communication interface is an external interface connected with the MODBUS protocol communication module, and can be connected with the third party centralized controller through pins of the interface to perform data communication with the third party centralized controller. In the MODBUS protocol communication module, pins A and B of the first main control chip IC1 transmit and receive data with a third party centralized controller through a third party communication interface. In this way, the third-party centralized controller can exchange data with the air conditioner through the MODBUS protocol communication module.

As shown in fig. 8, fig. 8 is a schematic connection diagram of the MODBUS protocol communication module and the communication compatible terminal, that is, a schematic connection diagram of the MODBUS protocol communication module and the outside, the 485RE/DE pin of the MODBUS protocol communication module is plugged with the outside of the first pin of the CN303 terminal, the +5v pin of the MODBUS protocol communication module is plugged with the fourth contact of the CN303 terminal, the TXD pin of the MODBUS protocol communication module is plugged with the third contact of the CN303-1 terminal, and the RXD pin of the MODBUS protocol communication module is plugged with the fourth contact of the CN303-1 terminal.

In some embodiments, the HOMEBUS protocol communication module comprises: the second main control chip, the chip model of second main control chip is MS1192, the first pin of second main control chip is connected with the one end co-point of third resistance and fourth resistance, the other end and the +5V contact pin of third resistance are connected, the other end and the positive pole of first diode group of fourth resistance are connected, the negative pole of first diode group is connected with the base of third triode, the collecting electrode of third triode is connected with the base of fourth triode, the projecting pole ground of fourth triode and third triode, the collecting electrode of fourth triode is connected with the INT contact pin and the RXD contact pin co-point of HOMEBUS protocol communication module, the second pin of second main control chip is connected with the collecting electrode of fifth triode, the base of fifth triode is connected with the collecting electrode of sixth triode, the base of sixth triode is connected with the TXD contact pin of HOMEBUS protocol communication module, the base of fifth triode is connected with the collecting electrode of seventh triode, the collecting electrode of seventh triode is connected with the ACBUS protocol communication module.

As shown IN fig. 9, the second main control chip is an IC2, the chip model of which is MS1192, the first pin (OUT pin) is connected with one end of the third resistor (R15) and one end of the fourth resistor (R11) IN a common point manner, the other end of the fourth resistor (R11) is connected with the +5v pin, the other end of the third resistor (R15) is connected with the positive electrode of the first diode group (VD 1), the negative electrode of the first diode group (VD 1) is connected with the base electrode of the third transistor (Q4), the collector electrode of the third transistor (Q4) is connected with the base electrode of the fourth transistor (Q3), the emitters of the fourth transistor (Q3) and the third transistor (Q4) are grounded, the collector electrode of the fourth transistor (Q3) is connected with the INT end and the RXD end IN a common point manner, the second pin (IN pin) of the second main control chip is connected with the collector electrode of the fifth transistor (Q6), the connection of the fifth transistor (Q6) with the base electrode of the sixth transistor (Q8), the base electrode of the sixth transistor (Q8) is connected with the base electrode of the fifth transistor (Q9).

The first pin (OUT pin) of the IC2 is connected to one ends of the resistor R15 and the resistor R11 as an output pin. The other pin of the resistor R11 is connected to a +5V power supply terminal for supplying voltage. The other pin of the resistor R15 is connected to the positive electrode of the first diode group (VD 1) to supply current to VD 1. The negative electrode of the first diode group (VD 1) is connected to the base electrode of the third triode (Q4) to control the current of the triode Q4. The collector of the third transistor (Q4) is connected to the base of the fourth transistor (Q3), controlling the current of the transistor Q3. The emitters of the fourth triode (Q3) and the third triode (Q4) are grounded to provide a loop. The collector of the fourth triode (Q3) is connected to the INT terminal and the RXD terminal and outputs signals. The second pin (IN pin) of the second main control chip is connected to the collector of the fifth triode (Q6) as an input pin. The base of the fifth transistor (Q6) is connected to the collector of the sixth transistor (Q8) and controls the current of the transistor Q8. The base of the sixth transistor (Q8) is connected to the TXD terminal and receives the signal. The base of the fifth transistor (Q6) is connected to the collector of the seventh transistor (Q9), controlling the current of the transistor Q9. The base of the seventh transistor (Q9) is connected to the ACLK terminal for receiving the signal.

In some embodiments, the HOMEBUS protocol communication module further comprises a third party communication interface, the third party communication interface of the HOMEBUS protocol communication module being connected to a third party central controller.

It should be noted that, a connection schematic diagram of the second main control chip and the third party communication interface CN3 is shown in fig. 9, and the present utility model is not described in detail.

As shown in fig. 10, fig. 10 is a schematic connection diagram of the HOMEBUS protocol communication module and the communication compatible terminal, that is, a schematic connection diagram of the HOMEBUS protocol communication module and the external connection, in which the +5v end of the HOMEBUS protocol communication module is plugged with the fourth contact of the CN303 terminal, the INT end of the MODBUS protocol communication module is plugged with the first contact of the CN303-1 terminal, the ACLK end of the HOMEBUS protocol communication module is plugged with the second contact of the CN303-1 terminal, the TXD end of the HOMEBUS protocol communication module is plugged with the third contact of the CN303-1 terminal, and the RXD end of the HOMEBUS protocol communication module is plugged with the fourth contact of the CN303-1 terminal.

In some embodiments, the master circuit is further configured to: under the condition that the first pin of the first communication compatible terminal is not connected with an enabling signal, and the first pin and the second pin of the second communication compatible terminal are connected with the enabling signal, determining that the type of the connected external communication circuit module is a HOMEBUS protocol communication module; or alternatively, the first and second heat exchangers may be,

and under the condition that the first pin of the first communication compatible terminal is detected to be connected with an enabling signal, and the third pin and the fourth pin of the second communication compatible terminal are also connected with the enabling signal, determining that the type of the connected external communication circuit module is a MODBUS protocol communication module.

In this embodiment, the main control circuit determines the type of the external communication circuit module according to the signal access state of the communication compatible terminal, and performs data interaction with the external device according to the communication protocol type supported by the external communication circuit module. As shown in fig. 11, the master circuit may automatically identify the type of the accessed communication circuit module according to different combinations of enable signals, and when the first pin of the first communication compatible terminal (CN 303) is not accessed to the enable signal and the first pin and the second pin of the second communication compatible terminal (CN 303-1) are accessed to the enable signal, the master circuit may automatically determine that the type of the accessed communication circuit module is a HOMEBUS protocol communication module. When the first pin of the first communication compatible terminal (CN 303) is connected to the enable signal, and the third pin and the fourth pin of the second communication compatible terminal (CN 303-1) are also connected to the enable signal, the master control circuit automatically determines that the type of the connected communication circuit module is a MODBUS protocol communication module. The implementation of this function requires detection and judgment by the relevant circuitry in the master control circuitry. When the combination of the enabling signals is detected to meet the conditions, the circuit outputs corresponding control signals so as to realize the correct configuration and control of different types of communication circuit modules.

As an example, the state of the enable signal may be detected by one logic gate circuit. For example, an AND gate may be used to detect whether the first pin of CN303 and the first pin of CN303-1 are simultaneously engaged with an enable signal. If both pins are "enabled", the output of the AND gate goes "high". An encoder circuit is then required to convert the communication protocol type corresponding to the condition to a corresponding control signal output. For example, a 4-to-2 encoder circuit may be used to correspond both HOMEBUS and MODBUS protocol types to two input ports of the encoder, respectively. When the AND gate circuit outputs a high level, the encoder outputs a corresponding control signal according to the state of the input port of the encoder so as to realize correct configuration and control. Finally, the control signal needs to be passed through appropriate amplification and buffering circuitry to ensure signal quality and power before being transmitted to the corresponding pins of the communication circuit module.

The type of the accessed communication circuit module can be flexibly determined by detecting the wiring condition of different communication compatible terminals, and the trouble of manually setting or replacing hardware is avoided.

Some embodiments of the present disclosure also provide an air conditioner including the air conditioner substrate as described above.

Since the air conditioner includes the air conditioner substrate as described above, the same technical effect as the air conditioner substrate can be produced, noise produced by the air conditioner substrate can be eliminated, and thus quality of the air conditioner and use experience of a user can be improved.

Although the utility model is described herein in connection with various embodiments, other variations to the disclosed embodiments can be understood and effected by those skilled in the art in practicing the claimed utility model, from a study of the drawings, the disclosure, and the appended claims. In the claims, "comprising"

The word "comprising" does not exclude other elements or steps, and "a" or "an" does not exclude a plurality. A single processor or other unit may fulfill the functions of several items recited in the claims. The mere fact that certain measures are recited in mutually different dependent claims does not indicate that a combination of these measures cannot be used to advantage.

Although the utility model has been described in connection with specific features and embodiments thereof, it will be apparent that various modifications and combinations can be made without departing from the spirit and scope of the utility model. Accordingly, the specification and drawings are merely exemplary illustrations of the present utility model as defined in the appended claims and are considered to cover any and all modifications, variations, combinations, or equivalents that fall within the scope of the utility model. It will be apparent to those skilled in the art that various modifications and variations can be made to the present utility model without departing from the spirit or scope of the utility model. Thus, it is intended that the present utility model also include such modifications and alterations insofar as they come within the scope of the appended claims or the equivalents thereof.

The foregoing is merely illustrative of specific embodiments of the present utility model, and the scope of the present utility model is not limited thereto, but any changes or substitutions within the technical scope of the present utility model should be covered by the scope of the present utility model. Therefore, the protection scope of the present utility model should be subject to the protection scope of the claims.

Claims (10)

1. An air conditioner substrate, characterized in that the air conditioner substrate comprises:

a substrate body;

a main control circuit and a communication compatible circuit arranged on the substrate body;

the communication compatible circuit comprises a communication compatible terminal, and the communication compatible circuit is connected with an external communication circuit module through the communication compatible terminal, wherein the communication compatible terminal is connected with the external communication circuit module in a plugging mode, and the type of the external communication circuit module at least comprises a HOMEBUS protocol communication module and a MODBUS protocol communication module.

2. The air conditioner substrate of claim 1, wherein the communication-compliant terminals include a first communication-compliant terminal and a second communication-compliant terminal, a first pin of the first communication-compliant terminal is connected to a REDE pin of the master circuit, a second pin of the first communication-compliant terminal is connected to a COM-485 pin of the master circuit, a third pin of the first communication-compliant terminal is connected to a +5v pin, a fourth pin of the first communication-compliant terminal is connected to a ground pin, a first pin of the second communication-compliant terminal is connected to an INT pin of the master circuit, a second pin of the second communication-compliant terminal is connected to an ACLK pin of the master circuit, a third pin of the second communication-compliant terminal is connected to a TXD pin of the master circuit, and a fourth pin of the second communication-compliant terminal is connected to a RXD pin of the master circuit.

3. The air conditioner substrate according to any one of claims 1-2, wherein the MODBUS protocol communication module comprises: the first main control chip, the first pin of first main control chip is connected with the one end concurrent connection of first resistance and second resistance, the other end and the +5V contact pin of first resistance are connected, the other end and the base of first triode of second resistance are connected, the collecting electrode of first triode is connected with the base of second triode, the base of second triode with MODBUS protocol communication module's RXD contact pin is connected, the second pin and the third pin concurrent connection of first main control chip back with MODBUS protocol communication module's 485RE/DE contact pin is connected, the fourth pin of first main control chip the TXD contact pin of MODBUS protocol communication module is connected.

4. The air conditioner substrate of claim 3, wherein the first main control chip has a chip model number ISL81487LIBZ.

5. The air conditioner substrate of claim 3, wherein the MODBUS protocol communication module further comprises a third party communication interface, the third party communication interface of the MODBUS protocol communication module is connected with a third party central controller, a 485RE/DE pin of the MODBUS protocol communication module is plugged with a first contact of a first communication compatible terminal, a +5v pin of the MODBUS protocol communication module is plugged with a fourth contact of the first communication compatible terminal, a TXD pin of the MODBUS protocol communication module is plugged with a third contact of a second communication compatible terminal, and a RXD pin of the MODBUS protocol communication module is plugged with a fourth contact of the second communication compatible terminal.

6. The air conditioning substrate according to any one of claims 1-2, wherein the HOMEBUS protocol communication module comprises: the first pin of the second main control chip is connected with one end of a third resistor and one end of a fourth resistor in a common point mode, the other end of the third resistor is connected with a +5V contact pin, the other end of the fourth resistor is connected with the positive electrode of a first diode group, the negative electrode of the first diode group is connected with the base electrode of a third triode, the collector electrode of the third triode is connected with the base electrode of a fourth triode, the fourth triode and the emitting electrode of the third triode are grounded, the collector electrode of the fourth triode is connected with the INT contact pin and the RXD contact pin of the HOMEBUS protocol communication module in a common point mode, the second pin of the second main control chip is connected with the collector electrode of a fifth triode, the base electrode of the fifth triode is connected with the collector electrode of a sixth triode, the base electrode of the sixth triode is connected with the TXD contact pin of the HOMEBUS protocol communication module, the collector electrode of the fifth triode is connected with the collector electrode of the seventh triode, and the base electrode of the HOMEBUS protocol communication module is connected with the base electrode of the HOMEACLK protocol communication module.

7. The air conditioner substrate of claim 6, wherein the second main control chip has a chip model number MS1192.

8. The air conditioner substrate of claim 6, wherein the HOMEBUS protocol communication module further comprises a third party communication interface, the third party communication interface of the HOMEBUS protocol communication module is connected to a third party central controller, the +5v pin of the HOMEBUS protocol communication module is plugged with the fourth contact of the first communication compatible terminal, the INT pin of the MODBUS protocol communication module is plugged with the first contact of the second communication compatible terminal, the ACLK pin of the HOMEBUS protocol communication module is plugged with the second contact of the second communication compatible terminal, the TXD pin of the HOMEBUS protocol communication module is plugged with the third contact of the second communication compatible terminal, and the RXD pin of the HOMEBUS protocol communication module is plugged with the fourth contact of the second communication compatible terminal.

9. The air conditioner substrate according to claim 1, wherein the main control circuit determines that the type of the accessed external communication circuit module is a HOMEBUS protocol communication module when detecting that the first pin of the first communication compatible terminal is not accessed with the enable signal and that the first pin and the second pin of the second communication compatible terminal are accessed with the enable signal; or alternatively, the first and second heat exchangers may be,

and under the condition that the first pin of the first communication compatible terminal is detected to be connected with an enabling signal, and the third pin and the fourth pin of the second communication compatible terminal are also connected with the enabling signal, determining that the type of the connected external communication circuit module is a MODBUS protocol communication module.

10. An air conditioner comprising the air conditioner substrate as set forth in any one of claims 1 to 9.