CN219972526U - Multifunctional wafer electroplating mechanism - Google Patents
Multifunctional wafer electroplating mechanism Download PDFInfo
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- CN219972526U CN219972526U CN202321202449.7U CN202321202449U CN219972526U CN 219972526 U CN219972526 U CN 219972526U CN 202321202449 U CN202321202449 U CN 202321202449U CN 219972526 U CN219972526 U CN 219972526U
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- groove body
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- 238000009713 electroplating Methods 0.000 title claims abstract description 66
- 238000009434 installation Methods 0.000 claims abstract description 101
- 239000007788 liquid Substances 0.000 claims abstract description 46
- 238000010438 heat treatment Methods 0.000 claims abstract description 20
- 238000007747 plating Methods 0.000 claims description 20
- 238000012544 monitoring process Methods 0.000 claims description 14
- 210000005056 cell body Anatomy 0.000 claims description 12
- 230000005587 bubbling Effects 0.000 claims description 8
- 230000001681 protective effect Effects 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 6
- 238000007599 discharging Methods 0.000 abstract description 3
- 239000012530 fluid Substances 0.000 description 5
- 230000000712 assembly Effects 0.000 description 3
- 238000000429 assembly Methods 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
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- Electroplating Methods And Accessories (AREA)
Abstract
The utility model discloses a multifunctional wafer electroplating mechanism which comprises an outer installation groove body, wherein an inner installation groove body is arranged in the outer installation groove body, an electroplating anode component is arranged in the inner installation groove body, an electroplating cathode component is arranged between the two electroplating anode components in the inner installation groove body, an auxiliary installation component is arranged on one side of the inner installation groove body in the outer installation groove body, a filter component is arranged on the auxiliary installation component, a heating component is arranged on one side of the auxiliary installation component, an electroplating liquid circulating and conveying power component is arranged outside the outer installation groove body, an electroplating liquid discharging component is arranged at the bottom of the outer installation groove body, and a swinging mechanism is arranged on one side of the outer installation groove body, which is far away from the auxiliary installation component. The wafer electroplating mechanism of the technical scheme is ingenious in structural design, strong in practicability, reasonable in space utilization and high in production efficiency, electroplating quality of a wafer is effectively guaranteed by the wafer electroplating mechanism, and meanwhile, electroplating efficiency of the wafer is improved.
Description
Technical Field
The utility model relates to the technical field of wafer electroplating, in particular to a multifunctional wafer electroplating mechanism.
Background
The Wafer (Wafer) is a silicon Wafer used for manufacturing a silicon semiconductor integrated circuit, and is called a Wafer because of its circular shape, a layer of conductive metal is electroplated on the Wafer, and the conductive metal layer is processed to manufacture a conductive circuit.
Disclosure of Invention
The utility model aims to solve the problems, and designs a multifunctional wafer electroplating mechanism.
The multifunctional wafer electroplating mechanism comprises an outer installation groove body, an inner installation groove body is arranged in the outer installation groove body, electroplating anode assemblies are arranged in the inner installation groove body, an electroplating cathode assembly is arranged between the two electroplating anode assemblies in the inner installation groove body, an auxiliary installation assembly is arranged on one side of the inner installation groove body in the outer installation groove body, a filter assembly is arranged on the auxiliary installation assembly, a heating assembly is arranged on one side of the filter assembly, an electroplating liquid circulating and conveying power assembly is arranged outside the outer installation groove body, an electroplating liquid discharging assembly is arranged at the bottom of the outer installation groove body, and a swinging mechanism is arranged on one side of the outer installation groove body, which is far away from the auxiliary installation assembly.
As a further description of the technical scheme, the auxiliary installation component comprises an auxiliary installation plate arranged on one side of the installation inner groove body and positioned on the installation outer groove body, a filter component is arranged on the auxiliary installation plate, a heating component is arranged on one side of the filter component and positioned on the auxiliary installation plate, and a liquid level monitoring component is arranged between the filter component and the heating component and positioned on the auxiliary installation plate.
As a further description of the present solution, the filter assembly includes a filter disposed on the auxiliary mounting plate, and the fluid level monitoring assembly includes a fluid level gauge disposed on the auxiliary mounting plate between the filter assembly and the heating assembly.
As a further description of the technical solution, the heating assembly includes a heater disposed on the auxiliary mounting plate, and a temperature monitoring module is disposed on the heater.
As a further description of the technical scheme, the electroplating solution circulating and conveying power assembly comprises a circulating pump arranged outside the outer tank body, a liquid inlet of the circulating pump is provided with a circulating liquid inlet pipeline, and a liquid outlet of the circulating pump is provided with a circulating liquid outlet pipeline.
As further description of the technical scheme, the circulating liquid inlet pipeline is connected with the top of the outer side wall of the installation outer tank body, the circulating liquid outlet pipeline is connected with the bottom of the outer side wall of the installation outer tank body, the circulating liquid inlet pipeline is provided with a liquid inlet control valve, and the circulating liquid outlet pipeline is provided with a liquid outlet control valve.
As a further description of the technical scheme, a protective gas inlet is arranged on one side of the installation outer tank body above the circulating liquid inlet pipeline.
As further description of the technical scheme, the swinging mechanism comprises a swinging control motor arranged on one side of the outer installation groove body, which is far away from the auxiliary installation component, wherein the output end of the swinging control motor is provided with a swinging connecting bracket, and the swinging connecting bracket is provided with an electroplating cathode component.
As a further description of the technical scheme, the electroplating solution discharge assembly comprises a discharge pipeline arranged at the bottom of the outer tank body, and a discharge valve is arranged on the discharge pipeline.
As a further description of the technical scheme, a bubbling pipe is arranged below the installation inner tank body in the installation outer tank body, a uniform flow component is arranged above the bubbling pipe, and the uniform flow component is arranged below the installation inner tank body.
The wafer electroplating mechanism has the beneficial effects that the wafer electroplating mechanism is ingenious in structural design, strong in practicability, reasonable in space utilization and high in production efficiency, the electroplating quality of a wafer is effectively guaranteed by using the wafer electroplating mechanism, and the electroplating efficiency of the wafer is improved.
Drawings
FIG. 1 is a schematic view of the overall structure of the present utility model;
FIG. 2 is a schematic diagram of the structure of the rocking mechanism of the present utility model;
fig. 3 is a schematic view of the installation structure of the shielding gas inlet of the present utility model.
In the figure, 1, an outer groove body is installed; 2. installing an inner groove body; 3. electroplating an anode assembly; 4. electroplating a cathode assembly; 5. an auxiliary mounting assembly; 6. a filter assembly; 7. a heating assembly; 8. the power assembly is used for circularly conveying the electroplating solution; 9. a plating solution discharge assembly; 10. a rocking mechanism; 11. an auxiliary mounting plate; 12. a liquid level monitoring assembly; 13. a filter; 14. a liquid level gauge; 15. a heater; 16. a circulation pump; 17. a circulating liquid inlet pipe; 18. a circulating liquid outlet pipeline; 19. a liquid inlet control valve; 20. a liquid outlet control valve; 21. a shielding gas inlet; 22. a swing control motor; 23. swinging the connecting bracket; 24. a discharge conduit; 25. a discharge valve; 26. a bubbling tube.
Detailed Description
Firstly, the design of the utility model is initially described, the traditional wafer electroplating equipment has complex structure and larger occupied space, various functions are realized by independently configuring the auxiliary grooves, and the traditional electroplating equipment has low production efficiency and poor stability, so that the electroplating quality and the yield of the wafer are poor, and therefore, the utility model designs the multifunctional wafer electroplating mechanism.
The utility model will be described in detail below with reference to the accompanying drawings, and as shown in fig. 1-3, the multifunctional wafer electroplating mechanism comprises an outer installation groove body 1, an inner installation groove body 2 is arranged in the outer installation groove body 1, an electroplating anode assembly 3 is arranged in the inner installation groove body 2, and an electroplating cathode assembly 4 is arranged between the two electroplating anode assemblies 3 in the inner installation groove body 2.
In order to be convenient for install filter component 6 be provided with auxiliary installation component 5 in the installation outer cell body 1 is located installation internal cell body 2 one side, be provided with filter component 6 on the auxiliary installation component 5 be provided with heating element 7 on the auxiliary installation component 5 be located filter component 6 one side.
The auxiliary installation assembly 5 will be described in detail below, the auxiliary installation assembly 5 includes an auxiliary installation plate 11 disposed on the installation outer tank 1 and located on one side of the installation inner tank 2, a filter assembly 6 is disposed on the auxiliary installation plate 11, a heating assembly 7 is disposed on one side of the filter assembly 6 on the auxiliary installation plate 11, and a liquid level monitoring assembly 12 is disposed between the filter assembly 6 and the heating assembly 7 on the auxiliary installation plate 11.
The filter assembly 6 will be described in detail below, said filter assembly 6 comprising a filter 13 arranged on an auxiliary mounting plate 11, and the fluid level monitoring assembly 12 will be described below, said fluid level monitoring assembly 12 comprising a fluid level gauge 14 arranged on the auxiliary mounting plate 11 between the filter assembly 6 and the heating assembly 7.
The heating assembly 7 will be described below, and the heating assembly 7 includes a heater 15 provided on the auxiliary mounting plate 11, and a temperature monitoring module is provided on the heater 15 in order to facilitate monitoring of the heating temperature of the plating solution.
In order to facilitate the circulation of the plating solution, a plating solution circulation and delivery power assembly 8 is arranged outside the installation outer tank body 1, the plating solution circulation and delivery power assembly 8 will be described in detail below, the plating solution circulation and delivery power assembly 8 comprises a circulation pump 16 arranged outside the installation outer tank body 1, a liquid inlet of the circulation pump 16 is provided with a circulation solution inlet pipe 17, and a liquid outlet of the circulation pump 16 is provided with a circulation solution outlet pipe 18.
The circulating liquid inlet pipeline 17 is connected with the top of the outer side wall of the outer installation groove body 1, the circulating liquid outlet pipeline 18 is connected with the bottom of the outer side wall of the outer installation groove body 1, the circulating liquid inlet pipeline 17 is provided with a liquid inlet control valve 19, and the circulating liquid outlet pipeline 18 is provided with a liquid outlet control valve 20.
In order to facilitate the discharge of the plating solution in the installation outer tank 1, a plating solution discharge assembly 9 is provided at the bottom of the installation outer tank 1, and the plating solution discharge assembly 9 will be described in detail below, the plating solution discharge assembly 9 includes a discharge pipe 24 provided at the bottom of the installation outer tank 1, and a discharge valve 25 is provided on the discharge pipe 24.
In order to facilitate swinging of the electroplating cathode assembly 4, a swinging mechanism 10 is arranged on the side, away from the auxiliary installation assembly 5, of the installation outer tank body 1, and the swinging mechanism 10 will be described in detail below, the swinging mechanism 10 comprises a swinging control motor 22 arranged on the side, away from the auxiliary installation assembly 5, of the installation outer tank body 1, an output end of the swinging control motor 22 is provided with a swinging connecting bracket 23, and the swinging connecting bracket 23 is provided with the electroplating cathode assembly 4.
In order to facilitate the entry of shielding gas during the electroplating process, a shielding gas inlet 21 is arranged on the side of the installation outer tank body 1 above the circulating liquid inlet pipeline 17.
In order to facilitate the electroplating solution in the installation outer tank body 1 to enter the installation inner tank body 2, a bubbling pipe 26 is arranged below the installation inner tank body 2 in the installation outer tank body 1, a uniform flow component is arranged above the bubbling pipe 26, and the uniform flow component is arranged below the installation inner tank body 2.
The specific structure of the present utility model is described in detail above, and the working principle of the present utility model will be described below: the wafer is placed on the electroplating cathode assembly 4, outside plating solution enters the outer groove body 1 through the filtering assembly 6 and is heated through the heating assembly 7, the temperature monitoring module monitors the temperature of the plating solution, the liquid level of the outer groove body 1 is monitored through the liquid level monitoring assembly 12, then the plating solution enters the inner groove body 2 through the bubbling pipe 26 and the uniform flow assembly, the circulation of the plating solution is controlled through the circulating pump 16, shielding gas enters from the shielding gas inlet 21, the swinging frame is driven to swing through the swinging control motor 22, the electroplating cathode assembly 4 is driven to swing, the electroplating operation is completed, after the electroplating operation is completed, the plating solution is discharged through the plating solution discharging assembly 9, the wafer electroplating mechanism of the technical scheme is ingenious in structural design, the practicability is high, the space utilization is reasonable, the production efficiency is high, the electroplating quality of the wafer is effectively guaranteed by using the wafer electroplating mechanism, and the electroplating efficiency of the wafer is also improved.
The above technical solution only represents the preferred technical solution of the present utility model, and some changes that may be made by those skilled in the art to some parts of the technical solution represent the principles of the present utility model, and the technical solution falls within the scope of the present utility model.
Claims (10)
1. The utility model provides a multifunctional wafer electroplating mechanism, its characterized in that, including installation outer cell body (1), be provided with installation inside cell body (2) in installation outer cell body (1), be provided with electroplating anode assembly (3) in the installation inside cell body (2), be provided with electroplating cathode assembly (4) between two electroplating anode assembly (3) in the installation inside cell body (2), be provided with auxiliary installation component (5) in being located installation inside cell body (2) one side in installation outer cell body (1), be provided with filter unit (6) on auxiliary installation component (5), be located on auxiliary installation component (5) filter unit (6) one side is provided with heating element (7), installation outer cell body (1) outside is provided with electroplating solution circulation and carries power component (8), installation outer cell body (1) bottom is provided with electroplating solution discharge assembly (9), installation outer cell body (1) are kept away from auxiliary installation component (5) one side is provided with swing mechanism (10).
2. The multifunctional wafer electroplating mechanism according to claim 1, wherein the auxiliary mounting assembly (5) comprises an auxiliary mounting plate (11) arranged on the outer mounting groove body (1) and positioned on one side of the inner mounting groove body (2), a filter assembly (6) is arranged on the auxiliary mounting plate (11), a heating assembly (7) is arranged on the auxiliary mounting plate (11) and positioned on one side of the filter assembly (6), and a liquid level monitoring assembly (12) is arranged on the auxiliary mounting plate (11) and positioned between the filter assembly (6) and the heating assembly (7).
3. The multifunctional wafer plating mechanism according to claim 2, characterized in that the filter assembly (6) comprises a filter (13) arranged on an auxiliary mounting plate (11), and the liquid level monitoring assembly (12) comprises a liquid level meter (14) arranged on the auxiliary mounting plate (11) between the filter assembly (6) and the heating assembly (7).
4. The multifunctional wafer plating mechanism according to claim 2, characterized in that the heating assembly (7) comprises a heater (15) arranged on an auxiliary mounting plate (11), the heater (15) being provided with a temperature monitoring module.
5. The multifunctional wafer electroplating mechanism according to claim 2, wherein the electroplating solution circulating and conveying power assembly (8) comprises a circulating pump (16) arranged outside the installation outer tank body (1), a liquid inlet of the circulating pump (16) is provided with a circulating solution inlet pipeline (17), and a liquid outlet of the circulating pump (16) is provided with a circulating solution outlet pipeline (18).
6. The multifunctional wafer electroplating mechanism according to claim 5, wherein the circulating liquid inlet pipeline (17) is connected with the top of the outer side wall of the outer installation groove body (1), the circulating liquid outlet pipeline (18) is connected with the bottom of the outer side wall of the outer installation groove body (1), a liquid inlet control valve (19) is arranged on the circulating liquid inlet pipeline (17), and a liquid outlet control valve (20) is arranged on the circulating liquid outlet pipeline (18).
7. The multifunctional wafer electroplating mechanism according to claim 6, wherein a protective gas inlet (21) is arranged on one side of the installation outer tank body (1) above the circulating liquid inlet pipeline (17).
8. The multifunctional wafer electroplating mechanism according to claim 1, wherein the swinging mechanism (10) comprises a swinging control motor (22) arranged on one side of the installation outer groove body (1) far away from the auxiliary installation component (5), the output end of the swinging control motor (22) is provided with a swinging connecting bracket (23), and the swinging connecting bracket (23) is provided with an electroplating cathode component (4).
9. The multifunctional wafer plating mechanism according to claim 1, characterized in that the plating solution discharge assembly (9) comprises a discharge pipe (24) provided at the bottom of the mounting outer tank body (1), and a discharge valve (25) is provided on the discharge pipe (24).
10. The multifunctional wafer electroplating mechanism according to claim 1, wherein a bubbling pipe (26) is arranged below the installation inner tank body (2) in the installation outer tank body (1), a uniform flow component is arranged above the bubbling pipe (26), and the uniform flow component is arranged below the installation inner tank body (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321202449.7U CN219972526U (en) | 2023-05-18 | 2023-05-18 | Multifunctional wafer electroplating mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321202449.7U CN219972526U (en) | 2023-05-18 | 2023-05-18 | Multifunctional wafer electroplating mechanism |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219972526U true CN219972526U (en) | 2023-11-07 |
Family
ID=88594659
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321202449.7U Active CN219972526U (en) | 2023-05-18 | 2023-05-18 | Multifunctional wafer electroplating mechanism |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219972526U (en) |
-
2023
- 2023-05-18 CN CN202321202449.7U patent/CN219972526U/en active Active
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| GR01 | Patent grant |