CN219972521U - Chromium electroplating toxic gas induced draft mechanism - Google Patents

Chromium electroplating toxic gas induced draft mechanism Download PDF

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Publication number
CN219972521U
CN219972521U CN202320654340.0U CN202320654340U CN219972521U CN 219972521 U CN219972521 U CN 219972521U CN 202320654340 U CN202320654340 U CN 202320654340U CN 219972521 U CN219972521 U CN 219972521U
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China
Prior art keywords
screw rod
frame
suction
fixedly connected
chromium
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CN202320654340.0U
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Chinese (zh)
Inventor
房子棪
房兴忠
苗健
朱梅义
张业华
房立军
李波
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Shandong Zouping Xingzhong Glossy Cylinder Co ltd
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Shandong Zouping Xingzhong Glossy Cylinder Co ltd
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Priority to CN202320654340.0U priority Critical patent/CN219972521U/en
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Publication of CN219972521U publication Critical patent/CN219972521U/en
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Abstract

The utility model discloses an electroplating chromium poisonous gas suction mechanism which comprises an electroplating bath, wherein the electroplating bath is positioned on the inner side of a mounting frame, the mounting frame is provided with a motor, the output end of the motor is fixedly connected with a screw rod a, the screw rod a is connected with a screw rod b through belt transmission, the screw rod b is in threaded connection with a side suction frame b, the side suction frame b is provided with a side suction frame a, the inner side of the mounting frame is fixedly connected with a connecting plate b, the connecting plate b is fixedly connected with a bracket, the bracket is provided with a hydraulic cylinder, the hydraulic cylinder is provided with a suction hood, the suction hood is provided with a net rack, the net rack is provided with a mist condensation plate, and the mist condensation plate is positioned on the inner side of a semiconductor refrigerating sheet. The heights of the side suction rack and the suction hood can be adjusted according to the height of the electroplating bath and the use requirement; the electroplating liquid can be recovered by matching the semiconductor refrigerating sheet, the mist condensation plate, the recovery frame and the like.

Description

Chromium electroplating toxic gas induced draft mechanism
Technical Field
The utility model relates to an electro-chrome toxic gas air suction mechanism, in particular to an electro-chrome toxic gas air suction mechanism, and belongs to the technical field of electro-chrome.
Background
Electroplated hard chromium is generally applied to the surface of the product grade of the mold. In general, the iron and steel parts are plated with black chromium, copper plating or nickel plating is mostly used as a bottom plating layer, and the high-grade products often use a copper, nickel-opalescent chromium and black chromium combined plating layer as a protective decorative plating layer. The copper alloy parts can be directly plated with black chromium through pretreatment such as degreasing, pickling and the like, and the high-grade products are plated with nickel as a bottom plating layer and then plated with black chromium, so that the protective and decorative effects are better.
The prior art electroplated chromium has the following disadvantages: 1. the air suction device is fixed in position after being arranged on the electroplating bath, and cannot be adjusted in height according to the heights or the use requirements of different electroplating baths, so that the use is inconvenient; 2. chromic acid and the like volatilize in the air during the electroplating process, harm the human body and cause the loss of the electroplating solution, so the improvement is made to solve the above problems.
Disclosure of Invention
The utility model aims to solve the problems and provide an electroplating chromium toxic gas suction mechanism which can adjust the heights of a side suction frame and a suction hood according to the height of an electroplating bath and the use requirement; the electroplating liquid can be recovered by matching the semiconductor refrigerating sheet, the mist condensation plate, the recovery frame and the like.
The utility model realizes the purpose through the following technical scheme, the chromium electroplating toxic gas induced draft mechanism comprises an electroplating bath, wherein the electroplating bath is positioned at the inner side of a mounting frame, a motor is mounted on the mounting frame, the output end of the motor is fixedly connected with a screw rod a, the screw rod a is connected with a screw rod b through belt transmission, the screw rod b is in threaded connection with a side draft frame b, the side draft frame b is provided with a side draft frame a, the inner side of the mounting frame is fixedly connected with a connecting plate b, the connecting plate b is fixedly connected with a bracket, the bracket is provided with a hydraulic cylinder, the hydraulic cylinder is provided with an induced draft cover, the induced draft cover is provided with a net rack, the net rack is provided with a mist condensation plate, and the mist condensation plate is positioned at the inner side of a semiconductor refrigerating sheet.
Preferably, the top end of the mounting frame is fixedly connected with a connecting plate a, and the screw rod a is positioned in front of the screw rod b.
Preferably, the screw a and the screw b are both in threaded connection with a sliding block, and the sliding block is fixedly connected with a side suction frame b.
Preferably, an exhaust fan is installed in the net rack, and the exhaust fan is located at the outer side of the radiating fin.
Preferably, the radiating fin is provided with a semiconductor refrigerating fin, and the fog condensation plate is positioned on the inner side of the air suction cover.
Preferably, the air suction cover is internally and fixedly connected with a recovery frame, and the recovery frame is positioned below the mist condensation plate.
The beneficial effects of the utility model are as follows:
1. the heights of the side suction rack and the suction hood can be adjusted according to the height of the electroplating bath and the use requirement; when the height of the electroplating bath is higher, a motor is started in the mounting frames on two sides of the electroplating bath, the motor rotates to drive the connected screw rod a to rotate, the screw rod a rotates to drive the screw rod b connected with the belt to rotate, the screw rod a and the screw rod b are in threaded connection with the sliding block on the outer side of the side suction frame b, namely, the screw rod rotates to drive the connected sliding block to move upwards along the screw rod, the sliding block moves upwards to drive the connected side suction frame b to move upwards, the side suction frame b is connected with the side suction frame a, the side suction frame a can be driven to move upwards synchronously, toxic gas generated on the side of the electroplating bath can be sucked after being fixed, the connecting plate b is mounted on the inner side of the mounting frame, the support is mounted on the outer side of the connecting plate b, the hydraulic cylinder on the support extends to drive the connected suction cover to move downwards, the suction cover continuously moves downwards to be close to the upper side of the electroplating bath, conversely, the motor rotates to drive the connected side suction frame to move downwards to the outer side of the upper side of the lower electroplating bath, the toxic gas generated on the outer side of the side suction frame can be sucked, and the side suction frame and the suction cover can adapt to the electroplating bath with different heights.
2. The semiconductor refrigerating sheet, the mist condensation plate, the recovery rack and the like can be matched to recover the electroplating solution; the induced draft cover is located the top of plating bath, induced draft subassembly starts the back and carries out the extraction to the air of plating bath top during electroplating, volatilized chromic acid fog when lasting the extraction in-process electroplates moves up along the air and gets into in the induced draft cover, chromic acid fog moves up and a plurality of fog condensation boards of induced draft cover inboard contact, the semiconductor refrigeration piece circular telegram, when the electric current passes through, will produce heat transfer between the semiconductor refrigeration piece both ends, the heat transfer in the quick air of fog condensation board that pastes with the semiconductor refrigeration piece gives the semiconductor refrigeration piece, the fin that the semiconductor refrigeration piece is connected can absorb the heat and dispel the heat, the air extraction fan of rack internal installation can be continuously carried out the extraction to fin department air, can make the semiconductor refrigeration piece have better refrigeration effect, fog condensation board department temperature is lower, chromic acid fog that carries in the air, electroplating solution etc. condense water droplet, water droplet condensation is followed fog condensation board slope whereabouts and is retrieved in the recovery frame, accessible semiconductor refrigeration piece is cooled to fog condensation board department, thereby retrieve electroplating solution etc. in the air.
Drawings
FIG. 1 is a schematic view of the overall structure of the present utility model;
FIG. 2 is a schematic view of the present utility model in whole and in partial section;
FIG. 3 is a schematic view of a top view of the present utility model in semi-section;
fig. 4 is an enlarged view of the utility model at a in fig. 2.
In the figure: 1. a connecting plate a; 2. a connecting plate b; 3. a side suction frame a; 4. a mounting frame; 5. plating bath; 6. a bracket; 7. an air suction cover; 8. a slide block; 9. a side suction frame b; 10. a screw a; 11. a belt; 12. a motor; 13. a hydraulic cylinder; 14. a screw b; 15. a net rack; 16. a mist condensation plate; 17. a semiconductor refrigeration sheet; 18. a recovery rack; 19. a heat sink; 20. and (5) an exhaust fan.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
Embodiment 1 referring to fig. 1-4, an electro-chrome toxic gas suction mechanism comprises an electro-chrome plating bath 5, wherein the electro-chrome plating bath 5 is positioned at the inner side of a mounting frame 4, a control panel is arranged at the outer side of the mounting frame 4, a motor 12 is installed on the mounting frame 4, the mounting frame 4 can fix the position of the motor 12, a screw a10 is fixedly connected at the output end of the motor 12, the motor 12 rotates to drive a connected screw a10 to rotate, the screw a10 is connected with a screw b14 through a belt 11 in a transmission manner, belt pulleys are installed at the screw a10 and the screw b14, the screw b14 rotates to drive the screw b14 connected with the belt 11 to rotate, a side suction frame b9 is connected with the screw b14 in a threaded manner, the side suction frame b9 is installed with a side suction frame a3, the side suction frame b9 moves to drive the connected side suction frame a3 to move, suction pipes are arranged at the outer sides of the side suction frame a3 and the side suction frame b9, the air at the position of the electroplating bath 5 at the inner side can be extracted, a connecting plate b2 is fixedly connected at the inner side of the mounting frame 4, the connecting plate b2 is fixed between the two mounting frames 4, a bracket 6 is fixedly connected at the connecting plate b2, the connecting plate b2 can fix the position of the bracket 6, the bracket 6 is in an L-shaped structure, a hydraulic cylinder 13 is arranged at the bracket 6, the bracket 6 can fix the position of the hydraulic cylinder 13, an air suction cover 7 is arranged at the hydraulic cylinder 13, the outer side of the air suction cover 7 is connected with an air suction assembly such as a fan through a pipeline, the hydraulic cylinder 13 stretches out and draws back to drive the connected air suction cover 7 to move downwards or upwards, a net rack 15 is arranged at the air suction cover 7, the joint of the net rack 15 and the air suction cover 7 is sealed, toxic gas can be avoided overflowing, a mist condensation plate 16 is arranged at the net rack 15, the mist condensation plate 16 is positioned at the inner side of a semiconductor refrigeration sheet 17, the semiconductor refrigeration sheet 17 is positioned at the inner side of a heat insulation pad, the insulation pad is located between the heat sink 19 and the mist plate 16.
Specifically, the top end of the mounting frame 4 is fixedly connected with a connecting plate a1, the connecting plate a1 is fixed at the top end of the mounting frame 4 and can fix the position of a screw rod, and the screw rod a10 is positioned in front of the screw rod b 14.
Specifically, the rack 15 is internally provided with an air suction fan 20, the rack 15 can fix the position of the air suction fan 20, the air suction fan 20 is positioned at the outer side of the cooling fin 19, and the air suction fan 20 can suck air at the cooling fin 19.
Specifically, the semiconductor cooling fin 17 is mounted on the heat sink 19, the heat sink 19 can dissipate heat from the semiconductor cooling fin 17, and the mist condensation plate 16 is located inside the suction hood 7.
Specifically, the suction hood 7 is fixedly connected with a recovery frame 18, the recovery frame 18 can recover the electroplating solution at the mist condensation plate 16, a recovery pipe (not shown in the figure) is connected below the recovery frame 18 to collect the electroplating solution, and the recovery frame 18 is positioned below the mist condensation plate 16.
Example 2: referring to fig. 2-3, the difference between the present embodiment and embodiment 1 is that: the screw rod a10 and the screw rod b14 are in threaded connection with the sliding block 8, the screw rod a1 and the screw rod b14 rotate to drive the sliding block 8 to move up and down, the sliding block 8 is fixedly connected with the side suction frame b9, and the sliding block 8 moves to drive the connected side suction frame b9 to move.
When the electroplating bath 5 is in use, when the height of the electroplating bath 5 is higher, the motor 12 in the mounting frame 4 at the two sides of the electroplating bath 5 is started, the motor 12 rotates to drive the connected screw rod a10 to rotate, the screw rod a10 rotates to drive the screw rod b14 connected with the belt 11 to rotate, the screw rod a10 and the screw rod b14 are both in threaded connection with the sliding block 8 at the outer side of the side suction frame b9, namely, the screw rod rotates to drive the connected sliding block 8 to move upwards along the screw rod, the sliding block 8 moves upwards to drive the connected side suction frame b9 to move upwards, the side suction frame b9 is connected with the side suction frame a3, the side suction frame a3 can be driven to synchronously move upwards, after the side suction frame is fixed, toxic gas generated at the side edge of the electroplating bath 5 can be sucked, the connecting plate b2 is arranged at the inner side of the mounting frame 4, the bracket 6 is arranged at the outer side of the connecting plate b2, the hydraulic cylinder 13 on the bracket 6 extends to drive the connected suction cover 7 to move downwards, the suction cover 7 continuously moves downwards to be close to the upper side of the electroplating bath 5, conversely, the motor 12 is reversed, the side suction frame connected with the motor is driven to move downwards to the outer side above the shorter electrolytic tank, toxic gas generated on the outer side of the side suction frame can be sucked, the side suction frame and the suction hood 7 are adjusted in position and then are electroplated, the side suction frame is used for sucking air around the electroplating tank 5 in the electroplating process, the suction hood 7 is positioned above the electroplating tank 5, the suction assembly is started and then the air above the electroplating tank 5 is sucked, chromic acid mist volatilized in the electroplating process continuously moves upwards along with the air into the suction hood 7, the chromic acid mist moves upwards to be contacted with a plurality of mist condensation plates 16 on the inner side of the suction hood 7, heat transfer is generated between two ends of the semiconductor refrigeration plates 17 when the semiconductor refrigeration plates 17 are electrified, the mist condensation plates 16 attached to the semiconductor refrigeration plates 17 can rapidly transfer heat in the air to the semiconductor refrigeration plates 17, the cooling fin 19 that semiconductor refrigeration piece 17 connects can absorb the heat and dispel the heat, and the air extraction fan 20 of rack 15 internally mounted starts sustainable to carry out the extraction to cooling fin 19 department air, can make semiconductor refrigeration piece 17 have better refrigeration effect, and fog condensation board 16 department temperature is lower, and the chromic acid fog, the plating solution etc. that carry in the air condense into the water droplet, and the water droplet is condensed into big water droplet and is followed fog condensation board 16 slope landing and retrieve in the frame 18.
It will be evident to those skilled in the art that the utility model is not limited to the details of the foregoing illustrative embodiments, and that the present utility model may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. The present embodiments are, therefore, to be considered in all respects as illustrative and not restrictive, the scope of the utility model being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present disclosure describes embodiments, not every embodiment is provided with a separate embodiment, and that this description is provided for clarity only, and that the disclosure is not limited to the embodiments described in detail below, and that the embodiments described in the examples may be combined as appropriate to form other embodiments that will be apparent to those skilled in the art.

Claims (6)

1. The utility model provides an electroplating chromium poisonous gas induced draft mechanism, includes plating bath (5), its characterized in that: plating bath (5) are located the inboard of mounting bracket (4), motor (12) are installed to mounting bracket (4), output fixedly connected with screw rod a (10) of motor (12), screw rod a (10) are connected with screw rod b (14) through belt (11) transmission, screw rod b (14) threaded connection has side suction frame b (9), side suction frame a (3) are installed to side suction frame b (9), inboard fixedly connected with connecting plate b (2) of mounting bracket (4), connecting plate b (2) fixedly connected with support (6), pneumatic cylinder (13) are installed to support (6), suction hood (7) are installed to pneumatic cylinder (13), rack (15) are installed to suction hood (7), fog condensation board (16) are installed to rack (15), fog condensation board (16) are located the inboard of semiconductor refrigeration piece (17).
2. The chromium-plated toxic gas suction mechanism according to claim 1, wherein: the top end of the mounting frame (4) is fixedly connected with a connecting plate a (1), and the screw rod a (10) is positioned in front of the screw rod b (14).
3. The chromium-plated toxic gas suction mechanism according to claim 1, wherein: the screw rod a (10) and the screw rod b (14) are in threaded connection with a sliding block (8), and the sliding block (8) is fixedly connected with a side suction frame b (9).
4. The chromium-plated toxic gas suction mechanism according to claim 1, wherein: an exhaust fan (20) is arranged in the net rack (15), and the exhaust fan (20) is positioned on the outer side of the radiating fin (19).
5. The chromium plating toxic gas suction mechanism according to claim 4, wherein: the cooling fin (19) is provided with a semiconductor refrigerating fin (17), and the mist condensation plate (16) is positioned on the inner side of the air suction cover (7).
6. The chromium-plated toxic gas suction mechanism according to claim 1, wherein: the air suction cover (7) is internally and fixedly connected with a recovery frame (18), and the recovery frame (18) is positioned below the fog condensation plate (16).
CN202320654340.0U 2023-03-29 2023-03-29 Chromium electroplating toxic gas induced draft mechanism Active CN219972521U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202320654340.0U CN219972521U (en) 2023-03-29 2023-03-29 Chromium electroplating toxic gas induced draft mechanism

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202320654340.0U CN219972521U (en) 2023-03-29 2023-03-29 Chromium electroplating toxic gas induced draft mechanism

Publications (1)

Publication Number Publication Date
CN219972521U true CN219972521U (en) 2023-11-07

Family

ID=88584422

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202320654340.0U Active CN219972521U (en) 2023-03-29 2023-03-29 Chromium electroplating toxic gas induced draft mechanism

Country Status (1)

Country Link
CN (1) CN219972521U (en)

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