CN219966761U

CN219966761U - Heat dissipation mechanism of diamond laser cutting machine

Info

Publication number: CN219966761U
Application number: CN202320868859.9U
Authority: CN
Inventors: 余斌; 余海粟; 朱轶方; 陆骁莹
Original assignee: Hangzhou Chaoran Diamond Co ltd
Current assignee: Hangzhou Chaoran Diamond Co ltd
Priority date: 2023-04-18
Filing date: 2023-04-18
Publication date: 2023-11-07
Anticipated expiration: 2033-04-18

Abstract

The utility model discloses a heat dissipation mechanism of a diamond laser cutting machine, which relates to the technical field of diamond laser cutting and comprises a shell, wherein a shell end cover is rotationally connected to the shell, a cavity is formed in the shell, a first copper plate for placing diamond is fixedly connected to the shell, a second copper plate corresponding to the first copper plate in position is fixedly connected to the shell end cover, a first cooling cavity is arranged below the first copper plate, a water tank is arranged in the cavity, a second cooling cavity is arranged behind the second copper plate, a pumping mechanism is connected between the water tank and the first cooling cavity, and a circulation mechanism is communicated between the first cooling cavity and the second cooling cavity; according to the utility model, when cutting is performed, the diamond can be continuously cooled, after cutting is completed, the cut can be simultaneously cooled by covering the end cover, cooling water for cooling can absorb waste heat during processing to raise the temperature, and when the cut is cooled, the temperature of the water for cooling is gradually from high to low, so that the temperature of the diamond is steadily lowered.

Description

Heat dissipation mechanism of diamond laser cutting machine

Technical Field

The utility model relates to the technical field of diamond laser cutting, in particular to a heat dissipation mechanism of a diamond laser cutting machine.

Background

In the diamond industry, cutting is a very important step, and this link directly determines the specification and quality of diamond products. As the most hard material on earth today, diamond is typically trimmed and plastic by laser cutting.

At present, diamond cutting is to fix one surface of a single diamond to a workbench, and the fixing structure on the workbench is used for fixing the position of the diamond. But a lot of heat is generated when cutting with a laser. The natural cooling speed in the air is slower, and the cooling of the diamond by cold water directly leads to the rapid decrease of the diamond temperature, which is easy to cause the damage of products.

The patent of the publication No. CN217370989U, a laser cutting heat dissipation bearing platform, uses a copper bearing platform, the diamond is adsorbed on the bearing platform through a vacuum chuck, and flowing cooling water is led under the bearing platform to indirectly cool the diamond.

Disclosure of Invention

In order to solve at least one technical problem mentioned in the background art, the utility model aims to provide a heat dissipation mechanism of a diamond laser cutting machine, which can provide continuous cooling for diamond when cutting is performed, can simultaneously cool a cutting position by covering an end cover after cutting is completed, and cooling water for cooling can absorb waste heat during processing to raise temperature, and the temperature of water for cooling is gradually reduced from high to low when the cutting is cooled, so that the temperature of the diamond is steadily reduced.

In order to achieve the above purpose, the present utility model provides the following technical solutions:

the utility model provides a cooling mechanism of diamond laser cutting machine, includes the shell, rotate on the shell and be connected with the shell end cover, be equipped with the cavity in the shell, fixedly connected with places the first copper of diamond on the shell, fixedly connected with on the shell end cover with the second copper that first copper position corresponds, first copper below is equipped with first cooling chamber, install the water tank in the cavity, second copper rear is equipped with the second cooling chamber, the water tank with be connected with pumping mechanism between the first cooling chamber, first cooling chamber with the intercommunication has circulation mechanism between the second cooling chamber.

Further, the water pumping mechanism comprises a water pump arranged above the water tank, a water inlet of the water pump is communicated with the water tank, and a water outlet of the water pump is communicated with a water inlet of the first cooling cavity.

Further, the circulating mechanism comprises a water inlet pipe and a water outlet pipe, one end of the water inlet pipe is communicated with the water outlet of the first cooling cavity, the other end of the water inlet pipe is communicated with the water inlet of the second cooling cavity, one end of the water outlet pipe is communicated with the water outlet of the second cooling cavity, and the other end of the water outlet pipe is communicated with the water tank.

Furthermore, an avoidance groove for placing the water inlet pipe and the water outlet pipe is formed in the first copper plate.

Further, a vacuum pump is arranged in the cavity, a vacuum chuck is arranged on the first copper plate, and the vacuum pump is communicated with the vacuum chuck.

Compared with the prior art, the utility model has the beneficial effects that: according to the utility model, continuous cooling can be provided for the diamond when cutting is performed, the cut can be cooled simultaneously by covering the end cover after cutting is completed, cooling water for cooling can absorb waste heat during processing to raise the temperature, and the water temperature for cooling is gradually from high to low when the cut is cooled, so that the temperature of the diamond is steadily lowered.

Drawings

FIG. 1 is a schematic diagram of the overall structure of the present utility model;

FIG. 2 is a rear structural schematic view of the present utility model;

FIG. 3 is a schematic view of the internal structure of the present utility model;

FIG. 4 is an enlarged schematic view of a partial structure of the present utility model;

FIG. 5 is an enlarged schematic view of a partial structure of the present utility model;

FIG. 6 is an enlarged schematic view of the internal structure of the cooler of the present utility model;

FIG. 7 is an internal block diagram of the present utility model;

in the figure: 11. a housing; 12. a housing end cap; 13. a hinge; 14. a first copper plate; 15. a second copper plate; 16. a cavity; 17. a water tank; 18. an avoidance groove; 19. a first cooling chamber; 20. a vacuum chuck; 21. a vacuum pump; 22. a water inlet pipe; 23. a water outlet pipe; 24. a second cooling chamber; 25. a water pumping mechanism; 26. a circulation mechanism; 27. and (3) a water pump.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely, and it is apparent that the described embodiments are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

Referring to fig. 1, 2 and 3, the present embodiment provides a heat dissipation mechanism of a diamond laser cutting machine, including a housing 11, a housing end cover 12 is rotatably connected to the housing 11, a cavity 16 is provided in the housing 11, a first copper plate 14 for placing diamond is fixedly connected to the housing 11, a second copper plate 15 corresponding to the first copper plate 14 is fixedly connected to the housing end cover 12, wherein the position corresponds to the position, when the housing end cover 12 covers the housing 11, the first copper plate 14 is attached to the second copper plate 15, a vacuum pump 21 is installed in the cavity 16, a vacuum chuck 20 is installed on the first copper plate 14, and the vacuum pump 21 is communicated with the vacuum chuck 20.

The diamond to be cut is placed above the vacuum chuck 20, the vacuum pump 21 is started, the diamond is firmly fixed in the first copper plate 14 by the vacuum chuck 20 through suction, the temperature is reduced, after the cutting is completed, the upper part of the shell 11 is covered by the handheld shell end cover 12, and the cutting position is reduced by water used for cooling in the shell end cover 12.

Referring to fig. 3 and 4, a first cooling cavity 19 is disposed below the first copper plate 14, a water tank 17 is installed in the cavity 16, a second cooling cavity 24 is disposed behind the second copper plate 15, and a water pumping mechanism 25 is connected between the water tank 17 and the first cooling cavity 19;

the water pumping mechanism 25 comprises a water pump 27 arranged above the water tank 17, and a water inlet of the water pump 27 is communicated with the water tank 17. The water outlet of the water pump 27 is communicated with the water inlet of the first cooling cavity 19.

When cutting the diamond, the part in contact with the first copper plate 14 needs to be cooled, at the moment, the water in the water tank 17 is pumped by the first water inlet pipe driven by the water pump, and the water is pumped into the first cooling cavity 19 along the first water inlet pipe, and as the first copper plate 14 is a copper product, heat is quickly conducted to the water in the first cooling cavity 19, so that the diamond is cooled.

Referring to fig. 5, 6 and 7, a circulation mechanism 26 is communicated between the first cooling chamber 19 and the second cooling chamber 24, the circulation mechanism 26 includes a water inlet pipe 22 for communicating the first cooling chamber 19 with the second cooling chamber 24, a water outlet pipe 23 is communicated between the second cooling chamber 24 and the water tank 17, and an avoiding groove 18 for placing the water inlet pipe 22 and the water outlet pipe 23 is formed in the first copper plate 14.

After cutting is completed, the shell end cover 12 is required to be buckled on the shell 11, the cutting part of the diamond is cooled, at this time, water which has absorbed most heat in the first cooling cavity 19 gradually flows into the second cooling cavity 24 through the water inlet pipe 22, after the shell end cover 12 is buckled on the shell, the positions of the diamond notch and overheating on the second copper plate 15 are cooled in the second cooling cavity 24, after the water is fully filled in the second cooling cavity 24, the water is discharged into the water tank 17 along the water outlet pipe 23, and the water is always circulated, so that the water temperature is not too low, and the diamond is damaged.

It will be evident to those skilled in the art that the utility model is not limited to the details of the foregoing illustrative embodiments, and that the present utility model may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. The present embodiments are, therefore, to be considered in all respects as illustrative and not restrictive, the scope of the utility model being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.

Claims

1. The utility model provides a heat dissipation mechanism of diamond laser cutting machine, includes shell (11), rotate on shell (11) and be connected with shell end cover (12), be equipped with cavity (16), its characterized in that in shell (11): the novel diamond cooling device is characterized in that a first copper plate (14) for placing diamond is fixedly connected to the shell (11), a second copper plate (15) corresponding to the first copper plate (14) is fixedly connected to the shell end cover (12), a first cooling cavity (19) is arranged below the first copper plate (14), a water tank (17) is installed in the cavity (16), a second cooling cavity (24) is arranged behind the second copper plate (15), a water pumping mechanism (25) is connected between the water tank (17) and the first cooling cavity (19), and a circulating mechanism (26) is communicated between the first cooling cavity (19) and the second cooling cavity (24).

2. A heat dissipation mechanism for a diamond laser cutting machine according to claim 1, wherein the water pumping mechanism (25) comprises a water pump (27) mounted above the water tank (17), a water inlet of the water pump (27) is communicated with the water tank (17), and a water outlet of the water pump (27) is communicated with a water inlet of the first cooling cavity (19).

3. The heat dissipation mechanism of a diamond laser cutting machine according to claim 1, wherein the circulation mechanism (26) comprises a water inlet pipe (22) and a water outlet pipe (23), one end of the water inlet pipe (22) is communicated with the water outlet of the first cooling cavity (19), the other end of the water inlet pipe (22) is communicated with the water inlet of the second cooling cavity (24), one end of the water outlet pipe (23) is communicated with the water outlet of the second cooling cavity (24), and the other end of the water outlet pipe (23) is communicated with the water tank (17).

4. A heat dissipation mechanism for a diamond laser cutting machine according to claim 3, wherein the first copper plate (14) is provided with a avoiding groove (18) into which the water inlet pipe (22) and the water outlet pipe (23) are placed.

5. The heat dissipation mechanism of a diamond laser cutting machine according to claim 1, wherein a vacuum pump (21) is installed in the cavity (16), a vacuum chuck (20) is installed on the first copper plate (14), and the vacuum pump (21) is communicated with the vacuum chuck (20).