CN219927143U - Hot melt adhesive composite aluminum alloy and copper profile structure - Google Patents
Hot melt adhesive composite aluminum alloy and copper profile structure Download PDFInfo
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- CN219927143U CN219927143U CN202123177843.3U CN202123177843U CN219927143U CN 219927143 U CN219927143 U CN 219927143U CN 202123177843 U CN202123177843 U CN 202123177843U CN 219927143 U CN219927143 U CN 219927143U
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- Prior art keywords
- hot melt
- melt adhesive
- aluminum alloy
- layer
- adhesive
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- 239000004831 Hot glue Substances 0.000 title claims abstract description 41
- 229910000838 Al alloy Inorganic materials 0.000 title claims abstract description 30
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 30
- 239000002131 composite material Substances 0.000 title claims abstract description 28
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 19
- 239000010949 copper Substances 0.000 title claims abstract description 19
- 239000010410 layer Substances 0.000 claims abstract description 48
- 239000011889 copper foil Substances 0.000 claims abstract description 11
- 239000002184 metal Substances 0.000 abstract description 21
- 238000000034 method Methods 0.000 abstract description 14
- 230000008569 process Effects 0.000 abstract description 9
- 239000000853 adhesive Substances 0.000 abstract description 6
- 230000001070 adhesive effect Effects 0.000 abstract description 6
- 239000012790 adhesive layer Substances 0.000 abstract description 6
- 238000005452 bending Methods 0.000 abstract description 5
- 238000012545 processing Methods 0.000 abstract description 5
- 238000004026 adhesive bonding Methods 0.000 abstract description 3
- 238000005034 decoration Methods 0.000 abstract description 3
- 230000007547 defect Effects 0.000 abstract description 3
- 229910001092 metal group alloy Inorganic materials 0.000 abstract description 2
- 229910052751 metal Inorganic materials 0.000 description 19
- 239000002905 metal composite material Substances 0.000 description 10
- 238000013329 compounding Methods 0.000 description 8
- 239000000463 material Substances 0.000 description 7
- 238000004880 explosion Methods 0.000 description 6
- 238000005096 rolling process Methods 0.000 description 6
- 239000000758 substrate Substances 0.000 description 5
- 238000005253 cladding Methods 0.000 description 4
- 239000002360 explosive Substances 0.000 description 4
- 229920013636 polyphenyl ether polymer Polymers 0.000 description 4
- 239000003054 catalyst Substances 0.000 description 3
- 238000009826 distribution Methods 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- 230000008859 change Effects 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 238000009966 trimming Methods 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 238000009513 drug distribution Methods 0.000 description 1
- 238000004049 embossing Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 239000012948 isocyanate Substances 0.000 description 1
- 150000002513 isocyanates Chemical class 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920006380 polyphenylene oxide Polymers 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 238000010008 shearing Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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- Laminated Bodies (AREA)
Abstract
The utility model relates to a hot melt adhesive composite aluminum alloy and copper profile structure which is characterized by comprising a first copper foil layer (1), a second hot melt adhesive layer (2) and a third aluminum alloy plate layer (3); the second hot melt adhesive layer (2) is selected from PA hot melt adhesive, TPU hot melt adhesive or EVA hot melt adhesive. The technical scheme product can be used in the decoration field, and the copper metal and aluminum alloy section bar composite material is adopted, so that the resource can be greatly saved, and the use requirement and the ornamental requirement can be met on the basis of reducing the cost. Meanwhile, the technical defects that in the prior art, reactive double-component structural adhesive is adopted for adhesive bonding, the operation process difficulty is high, the adhesive can release a large amount of harmful gas, the processing resistance degree after bonding is low, and particularly the adhesive layer is easy to fall off and separate in the stamping and bending use process are overcome.
Description
Technical Field
The utility model relates to the technical field of decorative materials, in particular to a hot melt adhesive composite aluminum alloy and copper profile structure.
Background
The metal compounding mainly adopts explosion rolling compounding, glue bonding and the like, and mainly achieves the anti-corrosion performance, improves the mechanical strength, improves the service performance of products, the functionality of the products and the like on the premise of reducing the cost and saving the resources. In particular in the decoration field, the high-grade metal and functional economic section composite material is adopted, so that the resources can be greatly saved, and the use requirement and the ornamental requirement can be met on the basis of reducing the cost. The aluminum alloy and copper composite is generally a reactive double-component structural adhesive.
In the prior art, aiming at the technical problems of metal material compounding, according to different materials, different combinations, material application and the like, various technical schemes are developed in a targeted manner, wherein the metal material compounding method is also related.
The utility model discloses a method for controlling the combination of a layered metal composite board substrate and a composite board, which is disclosed in the patent application of publication No. CN102489867B, and comprises the following steps: 1. determining the material, performance and size specification of the base plate and the compound plate; 2. selecting a plurality of groups of explosion composite technological parameters and a chemical distribution mode; 3. respectively establishing a plurality of finite element models for explosive cladding of the layered metal composite plates; 4. respectively applying load to the finite element models of the explosive cladding of the layered metal composite plates and generating a plurality of finite element solver files; 5. correcting and solving the finite element solver files respectively to obtain a plurality of solving results; 6. analyzing a plurality of solving results respectively and determining a group of explosion composite technological parameters and a prescription distribution mode by combining orthogonal tests; 7. and carrying out explosive cladding of the layered metal composite plate according to the determined explosive cladding process parameters and the drug distribution mode. The utility model has reasonable design and high practical value, and can improve the yield of the layered metal composite board, shorten the production period and reduce the production cost. According to the technical scheme, an explosion compounding technical means is mainly adopted, a plurality of finite element models of the explosion compounding of the layered metal composite plates are established, the compounding process is controlled, a plurality of solving results are respectively analyzed, and a group of explosion compounding technological parameters and medicine distribution modes are determined by combining orthogonal tests.
The utility model discloses a rolling method for improving the bonding strength of a bimetal composite plate, which relates to the technical field of bimetal composite plate rolling and specifically comprises the steps of S1 and metal plate preheating; s2, embossing tooth grooves; s3, rolling the composite board, S4, cooling and trimming. According to the rolling method for improving the bonding strength of the bimetal composite plate, two metal plates are heated and tooth grooves are stamped on the joint surfaces of the two metal plates, one surfaces of the two metal plates with the tooth grooves are mutually jointed and are mutually meshed based on the tooth grooves, the two metal plates are more tightly jointed together based on expansion of joint areas, meanwhile, the two metal plates are welded through heating, so that the bonding strength of connection between the two metal plates is improved, the service life of a finished bimetal composite plate obtained after rolling and trimming is prolonged while the advantages of the two metal plates are achieved, and the metal plates are prevented from falling off after long-term use. According to the scheme, the problem of composite strength is solved by technical means of tooth slot engagement, metal plate fusion welding and the like.
The utility model patent application of the publication No. CN1240538 entitled metal composite sheet material, which is a layered product comprising a thin metal sheet material as a substrate and a panel, is characterized in that a polyphenylene oxide intermediate plate having both sides respectively infiltrated in the substrate and the panel is buried between the substrate and the panel. The metal plate and the polyphenyl ether intermediate plate mutually penetrate molecules on the surface layers of the metal plate and the polyphenyl ether intermediate plate through isocyanate catalyst and iron powder as a cocatalyst, are recombined to generate structural change, the catalyst completely penetrates into the metal plate and the polyphenyl ether intermediate plate, an independent bonding layer does not exist between the metal plate and the polyphenyl ether intermediate plate, and an enough external force is required to be applied to separate the metal composite plate. The metal composite board has physical and mechanical performance indexes such as boiling water resistance, bending strength, shearing strength, 180-degree peeling strength, temperature difference resistance, thermal expansion coefficient, thermal deformation temperature and the like which are obviously superior to those of the common aluminum-plastic composite board, and has outstanding advantages in fireproof and environmental protection aspects. According to the technical scheme, the metal plate and the middle plate are mutually penetrated through the surface molecules of the metal plate and the middle plate through the catalyst and the cocatalyst, structural change occurs, and effective combination of the substrate and the panel is achieved.
The glue adhesion in the existing metal composite field generally adopts a reactive double-component structural adhesive, the operation process difficulty is high, a large amount of harmful gas is released by the glue for a while, the processing resistance degree after adhesion is low, and particularly the adhesive layer is easy to fall off and separate in the stamping and bending use process. The application range is small due to difficult processing, and the method has no wide application market.
Disclosure of Invention
In order to overcome the defects of the prior art, one aim of the utility model is to provide a hot melt adhesive composite aluminum alloy and copper profile structure; the adhesive layer is used for solving the problems that a large amount of harmful gases are released in the prior art, the processing resistance degree is low after the adhesive layer is stuck, and particularly the adhesive layer is easy to fall off and separate in the stamping and bending use process.
The utility model discloses a hot melt adhesive composite aluminum alloy and copper profile structure, which is realized by the following technical scheme.
The hot melt adhesive composite aluminum alloy and copper profile structure comprises a first copper foil layer, a second hot melt adhesive layer and a third aluminum alloy plate layer;
the hot melt adhesive composite aluminum alloy and copper profile structure is used for the processable materials in the fields of door and window profile engineering, guardrails, lamps, furniture and the like.
Further, in the technical scheme, in the hot melt adhesive composite aluminum alloy and copper profile structure:
the thickness of the first copper foil layer is 0.02-0.1mm, the thickness of the second hot melt adhesive layer is 0.015-0.03mm, and the thickness of the third aluminum alloy plate layer is 1.0-3.0mm;
preferably, the first layer is copper foil layer with the thickness of 0.05-0.08mm, the second layer is hot melt adhesive layer with the thickness of 0.02-0.025mm, and the third layer is aluminum alloy plate layer with the thickness of 1.5-2.5mm;
more preferably, the first layer is copper foil layer with the thickness of 0.06-0.08mm, the second layer is hot melt adhesive layer with the thickness of 0.022mm, and the third layer is aluminum alloy plate layer with the thickness of 1.8-2.0mm;
the aluminum alloy and copper profile structure disclosed by the utility model is processed by hot melt adhesive in a hot-pressing composite mode.
Further, the hot melt adhesive is selected from one of PA hot melt adhesive, TPU hot melt adhesive and EVA hot melt adhesive.
The technical scheme of the utility model has the beneficial effects that: the technical scheme product can be used in the decoration field, and the copper metal and aluminum alloy section bar composite material is adopted, so that the resource can be greatly saved, and the use requirement and the ornamental requirement can be met on the basis of reducing the cost. Meanwhile, the technical defects that in the prior art, reactive double-component structural adhesive is adopted for adhesive bonding, the operation process difficulty is high, the adhesive can release a large amount of harmful gas, the processing resistance degree after bonding is low, and particularly the adhesive layer is easy to fall off and separate in the stamping and bending use process are overcome.
In order to make the objects and technical solutions of the embodiments of the present utility model more clear, the technical solutions of the embodiments of the present utility model will be clearly and completely described below in conjunction with examples of embodiments of the present utility model. It will be apparent that the embodiments described are some, but not all embodiments of the utility model. All other embodiments, which are made by one of ordinary skill in the art without creative effort, based on the described embodiments of the present utility model are within the protection scope of the present utility model.
Drawings
FIG. 1 is a schematic cross-sectional view of a product according to the utility model.
Reference numerals
1 a first copper foil layer; 2 a second layer of hot melt adhesive layer; 3 a third aluminum alloy sheet layer.
Detailed Description
The technical scheme of the utility model is further described below through specific examples.
FIG. 1 is a schematic cross-sectional view of a hot melt adhesive compounded aluminum alloy and copper profile structure according to the utility model, and as shown in the figure, the hot melt adhesive compounded aluminum alloy and copper profile structure comprises a first copper foil layer 1, a second hot melt adhesive layer 2 and a third aluminum alloy plate layer 3; wherein the thickness of the first layer is 0.08mm, the thickness of the second layer is 0.022mm, and the thickness of the third layer is 1.8mm; the hot melt adhesive is EVA hot melt adhesive.
The technical scheme is that the hot melt adhesive composite aluminum alloy and copper profile structure is used in the fields of door and window profile engineering, guardrails, lamps, furniture and the like.
The embodiments of the present utility model have been further described above with reference to specific examples, which are intended to be illustrative of the present utility model and not limiting. The above-mentioned embodiments are merely illustrative of the preferred embodiments of the present utility model, and are not intended to limit the technical concept and scope of the present utility model, and various modifications and improvements made by those skilled in the art should fall within the scope of the present utility model without departing from the design concept of the present utility model.
Claims (3)
1. The hot melt adhesive composite aluminum alloy and copper profile structure is characterized by comprising a first copper foil layer (1), a second hot melt adhesive layer (2) and a third aluminum alloy plate layer (3); the second hot melt adhesive layer (2) is selected from PA hot melt adhesive, TPU hot melt adhesive or EVA hot melt adhesive; the thickness of the first copper foil layer (1) is 0.02-0.1mm, the thickness of the second hot melt adhesive layer (2) is 0.015-0.03mm, and the thickness of the third aluminum alloy plate layer (3) is 1.0-3.0mm.
2. The hot melt adhesive composite aluminum alloy and copper profile structure according to claim 1, wherein the thickness of the first copper foil layer (1) is 0.05-0.08mm; the thickness of the second layer of hot melt adhesive layer (2) is 0.02-0.025mm; the thickness of the third aluminum alloy plate layer (3) is 1.5-2.5mm.
3. The hot melt adhesive composite aluminum alloy and copper profile structure according to claim 2, wherein the thickness of the first copper foil layer (1) is 0.06-0.08mm; the thickness of the second layer of hot melt adhesive layer (2) is 0.022mm; the thickness of the third aluminum alloy plate layer (3) is 1.8-2.0mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123177843.3U CN219927143U (en) | 2021-12-15 | 2021-12-15 | Hot melt adhesive composite aluminum alloy and copper profile structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123177843.3U CN219927143U (en) | 2021-12-15 | 2021-12-15 | Hot melt adhesive composite aluminum alloy and copper profile structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219927143U true CN219927143U (en) | 2023-10-31 |
Family
ID=88493201
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202123177843.3U Active CN219927143U (en) | 2021-12-15 | 2021-12-15 | Hot melt adhesive composite aluminum alloy and copper profile structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219927143U (en) |
-
2021
- 2021-12-15 CN CN202123177843.3U patent/CN219927143U/en active Active
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