CN219919515U - A help high heat dissipation panel beating guide rail frame of drawing formula for PCBA board - Google Patents

Abstract

The utility model discloses a pull-up type high-heat-dissipation sheet metal guide rail frame for a PCBA board, which comprises a guide rail assembly and a heat dissipation assembly, wherein the heat dissipation assembly is connected with two ends of the guide rail assembly in the inner length direction, the inner top surface or/and the bottom surface of the guide rail assembly comprise a plurality of guide rail bodies, and a first heat dissipation hole is formed between every two adjacent guide rail bodies. The utility model has the beneficial effects that: the heat dissipation path is increased, the whole dead weight is lightened, and the whole heat dissipation effect is good.

Description

A help high heat dissipation panel beating guide rail frame of drawing formula for PCBA board

Technical Field

The utility model relates to the field of communication equipment, in particular to a guide rail frame for a PCBA board.

Background

PCBA (Printed Circuit Board Assembly, printed board assembly) board is the supporter of electronic component, can be applied to different industrial sites, along with the demand complicacy of development project, manufacturing process tends to the circuit board of higher node number, and the increase of components and parts not only makes PCBA board dead weight increase, still leads to whole calorific capacity to improve by a wide margin, if can not dispel the heat in time, can cause electronic component's short circuit, causes the direct loss to the enterprise. Therefore, a need exists for rapid heat dissipation during operation of the PCBA board.

At present, PCBA board guide rails are roughly divided into two types: nylon guide rail and aluminium groove guide rail. The nylon guide rail has good toughness and wear resistance, good rebound resilience and light installation, but has weaker bearing capacity, poor heat resistance and poor stability in the transportation process, and the high-heating PCBA plate even fails in operation; the aluminum groove guide rail has good reliability and strong bearing capacity, but has larger whole body and can increase dead weight. Therefore, the heat resistance and the good bearing capacity are required to be simultaneously considered in the material model selection, and the weight reduction is realized on the basis.

Publication number: CN109917873a, a sheet metal machine case structure of external plug-in heat dissipation module, sheet metal machine case structure includes: the sheet metal case body and the external heat dissipation module are fixed through guide rails; wherein, the heat dissipation module includes: the module panel, the PCB board, the shell and the radiator; the radiator is connected with the PCB and is pressed on the main heating element of the PCB; the PCB and the radiator are fixedly connected with the module panel; the shell is a metal sheet metal part and is provided with two guide rail grooves, and the shell is fixed on the radiator; the sheet metal case main body comprises a case shell, and 2 riveting positioning columns are respectively riveted up and down on the contact surface of the rear part of the case shell and the heat dissipation module and serve as guide rail mechanisms of the heat dissipation module. But the device is narrow in space between two adjacent board card modules, and heat can not be well dispersed, so that a plurality of PCBA boards with large heating value can not be placed at the same time.

The information disclosed in this background section is only for enhancement of understanding of the general background of the utility model and should not be taken as an acknowledgement or any form of suggestion that this information has been made as prior art that is well known to a person of ordinary skill in the art.

Disclosure of Invention

The technical problems to be solved by the utility model are as follows: how to solve the problem of poor heat dissipation of the guide rail structure in the prior art.

The utility model solves the technical problems by the following technical means:

a help high heat dissipation panel beating guide rail frame for PCBA board, including guide rail assembly, radiator unit connects guide rail assembly inside length direction's both ends, guide rail assembly's inside top surface or/and bottom surface include a plurality of guide rail bodies, adjacent offer first louvre between the guide rail body.

When the novel PCBA assembly is used, the heat dissipation assembly and the PCBA assembly are pushed into the guide rail assembly and then fixed, the top end and the bottom end of each PCBA board are positioned and fixed through the guide rail body, so that a small gap can be reserved between adjacent PCBA boards, heat dissipation is facilitated, and furthermore, a first heat dissipation hole is formed between the guide rail bodies, so that heat dissipation can be carried out on each PCBA board on one hand, and weight reduction can be realized on the other hand; finally, the heat dissipation is enhanced through the heat dissipation components at the two ends; according to the utility model, through the design of the guide rail body and the second heat dissipation holes, in particular, the heat dissipation path is increased for the PCBA board positioned in the middle position, the whole dead weight is lightened, the surface wind speed of the heat dissipation component flowing through the PCBA board is accelerated, the heat dissipation effect is enhanced, and the whole heat dissipation effect is good.

Preferably, the guide rail assembly is of a rectangular cavity structure with an opening on the side surface, bolt connecting holes are formed in the top and the bottom of the opening end of the guide rail assembly, two ends of the guide rail assembly comprise second through radiating holes, and the second radiating holes are communicated with the radiating assembly.

After the heat dissipation assembly and the PCBA assembly are pushed into the guide rail assembly, the heat dissipation assembly is fixed through bolt connection holes at the top and the bottom, stability is guaranteed, heat generated by the PCBA assembly is taken out through the second heat dissipation holes by the heat dissipation assembly, and heat dissipation effect is improved.

Preferably, the guide rail assembly comprises a side plate, a first guide rail plate and a second guide rail plate, wherein the first guide rail plate and the second guide rail plate are arranged in parallel up and down, and two ends of the first guide rail plate and two ends of the second guide rail plate are connected through the side plate.

The first guide rail plate and the second guide rail plate both play a role in guiding, wherein the second guide rail plate is also used as a bearing piece, so that the thickness of the second guide rail plate is larger than that of the first guide rail plate, and the strength requirement is met.

Preferably, the bottom surface of the first guide rail plate and the top surface of the second guide rail plate comprise a plurality of guide rail bodies, and the guide rail bodies of the first guide rail plate and the guide rail bodies of the second guide rail plate vertically correspond.

Preferably, the guide rail body is formed by stamping a die, splayed openings extending towards two sides are formed at two ends of the guide rail body, the guide rail body is arranged in a matrix, and the first heat dissipation holes are arranged in a matrix.

The tip of guide rail body is the splayed opening, in being favorable to PCBA board to insert the guide rail body, the guide rail body evenly arranges with first louvre and does benefit to the heat dissipation even.

Preferably, the side plate further comprises a plurality of third heat dissipation holes, and the third heat dissipation holes are located on the outer sides of the second heat dissipation holes.

Preferably, the top of the side plate is connected with the first guide rail plate through bolts or screws, and the bottom of the side plate is connected with the second guide rail plate through bolts or screws.

Preferably, the edges of the first guide rail plate and the second guide rail plate are bent towards the direction far away from the guide rail body to form a side line flange.

The edge flange is contacted with the bottom surface of the case to play a role of auxiliary support.

Preferably, the heat dissipation assembly comprises a fan panel, a first connection shell, a second connection shell and a fan, wherein one side of the first connection shell connected with the second connection shell is connected with the fan panel, and the fan is connected in a fan installation cavity formed after the first connection shell is connected with the second connection shell.

Preferably, the first connection shell and the second connection shell each comprise a fan through hole identical to the fan and a plurality of heat dissipation assisting holes, the fan through holes correspond to the fan, and the heat dissipation assisting holes are located on the outer sides of the fan through holes.

The heat dissipation assembly is modularized, and is convenient to directly take out from the guide rail assembly for cleaning, maintenance or replacement.

The utility model has the advantages that:

(1) When the novel PCBA assembly is used, the heat dissipation assembly and the PCBA assembly are pushed into the guide rail assembly and then fixed, the top end and the bottom end of each PCBA board are positioned and fixed through the guide rail body, so that a small gap can be reserved between adjacent PCBA boards, heat dissipation is facilitated, and furthermore, a first heat dissipation hole is formed between the guide rail bodies, so that heat dissipation can be carried out on each PCBA board on one hand, and weight reduction can be realized on the other hand; finally, the heat dissipation is enhanced through the heat dissipation components at the two ends; according to the utility model, through the design of the guide rail body and the second heat dissipation holes, in particular, the heat dissipation path is increased for the PCBA board positioned in the middle position, the whole dead weight is lightened, the surface wind speed of the heat dissipation component flowing through the PCBA board is accelerated, the heat dissipation effect is enhanced, and the whole heat dissipation effect is good;

(2) The heat dissipation assembly and the PCBA assembly are fixed through bolt connecting holes at the top and the bottom after being pushed into the guide rail assembly, so that stability is guaranteed, heat generated by the PCBA assembly is brought out by the second heat dissipation holes by the heat dissipation assembly, and the heat dissipation effect is improved;

(3) The first guide rail plate and the second guide rail plate both play a role in guiding, wherein the second guide rail plate also serves as a bearing piece, so that the thickness of the second guide rail plate is larger than that of the first guide rail plate, and the strength requirement is met;

(4) The end part of the guide rail body is provided with a splayed opening, so that the PCBA board can be inserted into the guide rail body, and the guide rail body and the first radiating holes are uniformly arranged, so that uniform heat dissipation is facilitated;

(5) The edge flange is contacted with the bottom surface of the case to play a role of auxiliary support;

(6) The heat dissipation assembly is modularized, so that the heat dissipation assembly can be conveniently and directly taken out of the guide rail assembly for cleaning, maintenance or replacement;

(7) The guide rail frame has the advantages of no concave or convex integral appearance and simple structure.

Drawings

FIG. 1 is a schematic diagram of a pull-up type high heat dissipation sheet metal guide rail rack for a PCBA board according to an embodiment of the utility model;

fig. 2 is a schematic structural view of a rail assembly 1 according to an embodiment of the present utility model;

FIG. 3 is a schematic view of a side plate according to an embodiment of the present utility model;

FIG. 4 is a schematic view of a second rail plate according to an embodiment of the present utility model;

FIG. 5 is a schematic diagram of a heat dissipating assembly according to an embodiment of the present utility model;

FIG. 6 is a side view of a heat dissipating assembly according to an embodiment of the present utility model;

FIG. 7 is a schematic view of the structure of a first connection housing according to an embodiment of the present utility model;

reference numerals in the drawings:

1. a guide rail assembly; 11. a side plate; 111. a first connection hole; 112. a second heat radiation hole; 113. a third heat radiation hole; 114. a second connection hole; 115. a third connection hole; 12. a first rail plate; 13. a second rail plate; 131. a guide rail body; 132. a first heat radiation hole; 133. a side line flange; 134. a fourth connection hole; 135. a fifth connection hole; 136. a sixth connection hole;

2. a heat dissipation assembly; 21. a fan panel; 22. a first connection housing; 221. a fan through hole; 222. a fan fixing hole; 223. a heat dissipation assisting hole; 23. a second connection housing; 24. a fan; 25. a handle; 26. a fan pull-out aid;

3. PCBA components.

Detailed Description

For the purpose of making the objects, technical solutions and advantages of the embodiments of the present utility model more apparent, the technical solutions in the embodiments of the present utility model will be clearly and completely described in the following in conjunction with the embodiments of the present utility model, and it is apparent that the described embodiments are some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

Embodiment one:

as shown in FIG. 1, the pull-up type high heat dissipation sheet metal guide rail frame for the PCBA plate comprises a guide rail assembly 1, a heat dissipation assembly 2 and a PCBA assembly 3.

As shown in fig. 2, the rail assembly 1 includes a side plate 11, a first rail plate 12, and a second rail plate 13; the number of the side plates 11 is two, the first guide rail plate 12 is arranged at the upper part, the second guide rail plate 13 is arranged at the lower part, the first guide rail plate 12 and the second guide rail plate 13 are symmetrically arranged along the horizontal plane, and the structures of the first guide rail plate 12 and the second guide rail plate 13 are basically the same; the first guide rail plate 12 and the second guide rail plate 13 are connected with the top and bottom of the side plate 11 through countersunk screws, as shown in fig. 1, the guide rail assembly 1 forms a rectangular cavity structure with front and rear side surfaces open, one side is selected to be a push-in end, the heat dissipation assembly 2 and the PCBA assembly 3 are fixed through bolts after being pushed into the guide rail assembly 1 by the push-in end, and finally are basically flush with the front side and the rear side of the guide rail assembly 1, as shown in fig. 1, the whole guide rail frame is of a rectangular module structure, and the whole appearance is free of concave, convex and simple in structure.

As shown in fig. 3, the side plate 11 includes a first connection hole 111, a second heat dissipation hole 112, a third heat dissipation hole 113, a second connection hole 114, and a third connection hole 115; the number of the first connecting holes 111 is three, the first connecting holes are uniformly formed in the top end of the side plate 11, and the side plate 11 is connected with the end part of the first guide rail plate 12 through the first connecting holes 111 and countersunk screws; the second heat dissipation holes 112 are two round holes, are symmetrically arranged along the vertical plane and correspond to the positions of the heat dissipation components 2; the third heat dissipation holes 113 are a plurality of waist-shaped holes, and the third heat dissipation holes 113 are arranged in a straight line and are positioned below the second heat dissipation holes 112; the bottom of the side plate 11 is provided with a Z-shaped folded edge, a plurality of second connecting holes 114 are uniformly arranged on a horizontal plate of the Z-shaped folded edge, and the second connecting holes 114 are used for being fixed with a chassis to be assembled through countersunk screws; the plurality of third connecting holes 115 are uniformly formed in the vertical plate of the Z-shaped folded edge, and the side plate 11 is screw-coupled to the end portion of the second rail plate 13 through the third connecting holes 115.

In this embodiment, the first rail plate 12 and the second rail plate 13 have substantially the same structure, and therefore, this embodiment will be described taking the second rail plate 13 as an example.

As shown in fig. 4, the second rail plate 13 includes a rail body 131, a first heat radiation hole 132, a side line flange 133, a fourth connection hole 134, a fifth connection hole 135, and a sixth connection hole 136; the second guide rail plate 13 is a sheet metal part, the guide rail body 131 is made by stamping through a die, the guide rail body 131 is of a symmetrical structure, a PCBA plate insertion space is formed in the middle of the guide rail body 131, and splayed openings are formed at two ends of the guide rail body 131, so that the PCBA plate can be conveniently inserted; in this embodiment, the guide rail bodies 131 are arranged in a 2*9 matrix; the first heat dissipation holes 132 are formed in two sides of the guide rail body 131, and the first heat dissipation holes 132 increase heat dissipation paths of each PCBA board on one hand, so that heat dissipation effects are improved, and on the other hand, weight reduction can be achieved. The guide rail body 131 and the first heat dissipation holes 132 are uniformly arranged to facilitate uniform heat dissipation.

The first guide rail plate 12 and the second guide rail plate 13 all play the guiding role, wherein the second guide rail plate 13 is further used as a bearing, the whole thickness is 2mm, the first guide rail plate 12 is used as a guide piece, the whole thickness is 1mm, and weight reduction is realized on the premise of meeting the strength.

In this embodiment, the bottom surface of the first rail plate 12 and the top surface of the second rail plate 13 include a plurality of rail bodies 131, and the rail bodies 131 of the first rail plate 12 and the rail bodies 131 of the second rail plate 13 are located vertically in correspondence, that is: the guide rail body 131 of the first guide rail plate 12 is used for fixing the top end of the PCBA board, and the guide rail body 131 of the second guide rail plate 13 is used for fixing the bottom end of the PCBA board.

The second guide rail plate 13 is a rectangular plate, four edges of the second guide rail plate are bent downwards and inwards to form four edge flanges 133, a plurality of fourth connecting holes 134 are formed in the edge flanges 133 in the length direction, and the fourth connecting holes 134 are used for being connected with the heat dissipation assembly 2 and the PCBA assembly 3 through bolts; the side line flange 133 in the width direction thereof is provided with a plurality of fifth coupling holes 135, and the fifth coupling holes 135 are for bolting with the third coupling holes 115 of the side plates 11. The second guide rail plate 13 is further provided with a plurality of sixth connecting holes 136 for connecting with press riveting studs of the chassis; at this time, the edge flange 133 contacts the bottom surface of the cabinet, and serves as an auxiliary support.

Wherein, PCBA subassembly 3 includes a plurality of parallel superimposed PCBA boards, and PCBA board's top and bottom are equipped with the connecting hole that corresponds the position with fourth connecting hole 134, and PCBA board's bottom includes helps to pull out the ware.

When the embodiment is used, the heat dissipation assembly 2 and the PCBA assembly 3 are pushed into the guide rail assembly 1 from one side of the guide rail assembly 1, the top ends of the heat dissipation assembly 2 and the PCBA assembly 3 are fixed with the first guide rail plate 12 through bolts, the bottom ends of the heat dissipation assembly 2 and the PCBA assembly 3 are fixed with the second guide rail plate 13 through bolts, the stability of connection is guaranteed, and the top ends and the bottom ends of the PCBA plates are fixed in a positioning way through the guide rail body 131; after the PCBA plates are clamped with the guide rail bodies 131, small gaps can be reserved between adjacent PCBA plates, heat dissipation is facilitated, and furthermore, first heat dissipation holes 132 are formed between the guide rail bodies 131, so that heat dissipation can be performed on each PCBA plate on one hand, and weight reduction can be achieved on the other hand.

When the PCBA assembly 3 works, the heat dissipation assemblies 2 at the two ends bring out the heat generated by the PCBA assembly 3 from the second heat dissipation holes 112, so that the heat dissipation effect is improved. If the PCBA assembly 3 and the heat dissipation assembly 2 are required to be taken out, firstly unscrewing screws at the top and bottom ends of the heat dissipation assembly 2 and the PCBA assembly 3, and then poking a pulling-out assisting device to pull out the heat dissipation assembly 2 and the PCBA assembly 3.

In this embodiment, through the design of the guide rail body 131 and the first heat dissipation hole 132, in particular, the PCBA board located in the middle position increases the heat dissipation path, the overall dead weight is reduced, the surface wind speed flowing through the PCBA board is accelerated by the heat dissipation component 2, the heat dissipation effect is enhanced, and the overall heat dissipation effect is good.

Embodiment two;

as shown in fig. 5 and 6, in this embodiment, based on the first embodiment, the heat dissipating assembly 2 includes a fan panel 21, a first connection housing 22, a second connection housing 23, a fan 24, a handle 25, and a fan pull-out aid 26;

the first connection housing 22 and the second connection housing 23 have substantially the same structure, and the first connection housing 22 is taken as an example in this embodiment.

As shown in fig. 7, the first connection housing 22 includes a fan through hole 221, a fan fixing hole 222, and a heat-dissipating auxiliary hole 223;

two circular fan through holes 221 are formed in the middle of the first connecting shell 22, the positions of the fan through holes 221 correspond to those of the second radiating holes 112, four fan fixing holes 222 are formed in the periphery of the fan through holes 221, and the fan fixing holes 222 are used for being connected with the fan 24 through bolts; the left and right ends of the first connection shell 22 are provided with folds, the second connection shell 23 is also provided with folds, and the folds of the first connection shell 22 wrap the folds of the second connection shell 23 and are fixed through bolts; the upper part of the first connection shell 22 is connected with a supporting beam with a rectangular cross section, the lower part of the first connection shell is also connected with a supporting beam with a rectangular cross section, the supporting beam at the lower part is provided with a through auxiliary radiating hole 223, and the auxiliary radiating hole 223 corresponds to the third radiating hole 113 in position.

As shown in fig. 5, after the first connection housing 22 is connected with the second connection housing 23, the fan panel 21 is fixed together with it by bolts; the fan panel 21 is connected with a handle 25 and a fan pull-out aid 26, the handle 25 is used for pulling the heat radiation assembly 2, and the fan pull-out aid 26 is used for enhancing the connection between the heat radiation assembly 2 and the guide rail assembly 1.

The heat dissipation assembly 2 is modularized, and is convenient to directly take out from the guide rail assembly 1 for cleaning, maintenance or replacement. If the heat dissipation assembly 2 needs to be taken out, the screws for connecting the heat dissipation assembly 2 and the guide rail assembly 1 are unscrewed, then the fan pulling-out aid 26 is pulled, and the heat dissipation assembly 2 can be pulled out through the handle 25.

In this embodiment, the heat generated by the work of the PCBA board is dissipated as soon as possible by the fan 24, so as to increase the heat dissipation speed.

The above embodiments are only for illustrating the technical solution of the present utility model, and are not limiting; although the utility model has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present utility model.

Claims (10)

1. A help high heat dissipation panel beating guide rail frame for PCBA board, its characterized in that includes guide rail assembly, radiator unit connects guide rail assembly inside length direction's both ends, guide rail assembly's inside top surface or/and bottom surface include a plurality of guide rail bodies, adjacent offer first louvre between the guide rail body.

2. The pull-up type high heat dissipation sheet metal guide rail frame for a PCBA board according to claim 1, wherein the guide rail assembly is a rectangular cavity structure with an open side, bolt connection holes are provided at the top and bottom of the open end of the guide rail assembly, two ends of the guide rail assembly comprise second heat dissipation holes penetrating through the guide rail assembly, and the second heat dissipation holes are communicated with the heat dissipation assembly.

3. The pull-up type high heat dissipation sheet metal guide rail rack for a PCBA board according to claim 2, wherein the guide rail assembly comprises a side plate, a first guide rail board and a second guide rail board, the first guide rail board and the second guide rail board are arranged in parallel up and down, and two ends of the first guide rail board and the second guide rail board are connected by the side plate.

4. A pull-up type high heat dissipation sheet metal guide rail frame for a PCBA board according to claim 3, wherein the bottom surface of the first guide rail board and the top surface of the second guide rail board comprise a plurality of guide rail bodies, and the guide rail bodies of the first guide rail board vertically correspond to the guide rail bodies of the second guide rail board.

5. The pull-up type high heat dissipation sheet metal guide rail frame for the PCBA board according to claim 1 or 4, wherein the guide rail body is formed by stamping a die, two ends of the guide rail body are splayed openings extending to two sides, the guide rail body is arranged in a matrix, and the first heat dissipation holes are arranged in a matrix.

6. A pull-up high heat sink sheet metal rail holder for a PCBA board as recited in claim 3, wherein the side plate further includes a plurality of third heat sink holes, the third heat sink holes being located outside the second heat sink holes.

7. A pull-up type high heat dissipation sheet metal rail holder for a PCBA board according to claim 3, wherein the top of the side plate is bolted or screwed to the first rail plate and the bottom of the side plate is bolted or screwed to the second rail plate.

8. The pull-up type high heat dissipation sheet metal guide rail frame for a PCBA board according to claim 3, wherein the edges of the first guide rail board and the second guide rail board are bent in a direction away from the guide rail body to form a side line flange.

9. The pull-up type high heat dissipation sheet metal guide rail frame for a PCBA board according to claim 1, wherein the heat dissipation component comprises a fan panel, a first connection housing, a second connection housing, and a fan, wherein one side of the first connection housing connected with the second connection housing is connected with the fan panel, and the fan is connected in a fan installation cavity formed after the first connection housing is connected with the second connection housing.

10. The pull-up type high heat dissipation sheet metal guide rail frame for a PCBA board according to claim 9, wherein the first connection housing and the second connection housing each comprise a fan through hole identical to a fan and a plurality of heat dissipation assisting holes, the fan through hole corresponds to the fan, and the heat dissipation assisting holes are located outside the fan through hole.