CN219918697U - Miniaturized power module structure - Google Patents
Miniaturized power module structure Download PDFInfo
- Publication number
- CN219918697U CN219918697U CN202321055962.8U CN202321055962U CN219918697U CN 219918697 U CN219918697 U CN 219918697U CN 202321055962 U CN202321055962 U CN 202321055962U CN 219918697 U CN219918697 U CN 219918697U
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- CN
- China
- Prior art keywords
- insulating
- circuit board
- power module
- pin
- metal pins
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- 238000005538 encapsulation Methods 0.000 claims abstract description 28
- 238000007789 sealing Methods 0.000 claims abstract description 28
- 239000002184 metal Substances 0.000 claims abstract description 27
- 230000003014 reinforcing effect Effects 0.000 claims description 13
- 238000004806 packaging method and process Methods 0.000 claims description 10
- 230000017525 heat dissipation Effects 0.000 claims description 8
- 229920002635 polyurethane Polymers 0.000 claims description 7
- 239000004814 polyurethane Substances 0.000 claims description 7
- 238000001125 extrusion Methods 0.000 claims description 3
- 239000012212 insulator Substances 0.000 claims description 3
- 230000000149 penetrating effect Effects 0.000 claims description 3
- 230000000903 blocking effect Effects 0.000 claims 2
- 230000002787 reinforcement Effects 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 description 7
- 230000000694 effects Effects 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- 238000013461 design Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 238000007792 addition Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Landscapes
- Connector Housings Or Holding Contact Members (AREA)
Abstract
The utility model discloses a miniaturized power module structure, which comprises an encapsulation shell, an insulating sealing plate, two metal pins, a printed circuit board and a miniature transformer, wherein two pin terminal columns are fixedly arranged on one side of the printed circuit board, the interiors of two pin connecting holes are movably connected with the two metal pins, one ends of the two metal pins are fixedly provided with the terminal connecting columns, the two terminal connecting columns are assembled and connected with the corresponding pin terminal columns.
Description
Technical Field
The utility model relates to the technical field of power modules, in particular to a miniaturized power module structure.
Background
The current miniaturized pin type module power supply mainly comprises an insulating shell, a circuit board, a device group, a transformer and a pin group.
The patent number CN202123072486.4 discloses a power module, which adopts an arrangement mode to enable a module power supply with the same volume to have higher power density or a module power supply with the same power density to have smaller volume, but the research of the utility model finds that the power module has the defect of being inconvenient for replacing pins, and the pins after welding cannot be in error in the production process, otherwise, the power module cannot be normally used, and the miniaturized power module has small size, high processing precision requirement and quite inconvenient processing.
Disclosure of Invention
The present utility model is directed to a miniaturized power module structure to solve the above-mentioned problems.
In order to achieve the above purpose, the present utility model provides the following technical solutions: the utility model provides a miniaturized power module structure, includes encapsulation shell body, insulating shrouding, two metal pins, printed circuit board and miniature transformer, the opening part and the insulating shrouding grafting of encapsulation shell body one end are connected, the internally mounted of encapsulation shell body has circuit board encapsulation seat, the one end and the printed circuit board fixed connection of circuit board encapsulation seat, the middle part and the miniature transformer of printed circuit board are connected, one side fixed mounting of printed circuit board has two pin terminal post, two pin terminal post's one end fixed mounting has pin connecting sleeve, two pin connecting holes have been seted up to the inboard of insulating shrouding grafting connection, two pin connecting hole's inside and two metal pin swing joint, two metal pin's one end fixed mounting has the terminal spliced pole, two terminal spliced pole and corresponding pin terminal post assembly connection, the inside movable mounting of encapsulation shell body has the reinforcing ring frame, the one end fixed mounting of reinforcing ring frame has two connection insulator bars, two the connection insulator spindle all is connected with circuit board encapsulation seat, two pin terminal post's one side fixed mounting has two pin connecting sleeve, two pin connecting hole's one side has two spacing peg-ends to be connected with the limit stop lever, two spacing between the front and one side of encapsulation shell body and two side has the spacing through-hole.
Preferably, the top and bottom of the packaging shell are fixedly provided with reinforced heat dissipation grooves, and dustproof heat dissipation windows are arranged on the other side of the front face and the other side of the back face of the packaging shell.
Preferably, two conical insulating sleeves are fixedly arranged at one end of the insulating sealing plate, and the two conical insulating sleeves are connected with the two metal pins in a penetrating mode.
Preferably, the ends of the two metal pins are fixedly provided with insulating baffle plates, and the two insulating baffle plates are in contact connection with the two pin connecting holes.
Preferably, the outer wall of the insulating sealing plate is fixedly connected with a polyurethane waterproof sheet, and the polyurethane waterproof sheet is connected with the inner wall of the packaging shell body in an extrusion mode.
Preferably, an auxiliary sealing ring is fixedly arranged at the other end of the reinforcing ring frame, and the auxiliary sealing ring is in contact connection with the end part of the insulating sealing plate.
The utility model has the technical effects and advantages that:
(1) According to the miniaturized power module structure, the pin terminal post, the pin connecting sleeve, the insulating baffle plate, the terminal connecting post and the pin connecting hole are arranged, the sectional design is adopted, the metal pins are physically connected with the pin terminal post through the terminal connecting post, so that the electrical connection between the metal pins and the printed circuit board is realized, the whole structure is convenient to detach, and in the process of production and assembly, the structure can be quickly abutted without adopting a welding instrument, so that the structure is very convenient, the production precision requirement of a power module is reduced, and the production efficiency is greatly improved; through setting up spacing through-hole and spacing stock, can improve the intensity that encapsulation shell body and insulating shrouding are connected, can not take place the separation easily, and set up reinforcing ring frame, connect insulating rod and auxiliary sealing ring, improved the connection leakproofness and the overall structure intensity of encapsulation shell body of the installation convenience of circuit board encapsulation seat.
Drawings
Fig. 1 is a schematic perspective view of the present utility model.
Fig. 2 is a schematic view of the internal structure of the package outer case of the present utility model.
Fig. 3 is a schematic view of a partial structure of fig. 2 according to the present utility model.
In the figure: 1. packaging the outer shell; 2. an insulating sealing plate; 3. a metal pin; 4. a tapered insulating sleeve; 5. a limit long rod; 6. dustproof heat dissipation window; 7. reinforcing the heat dissipation groove; 8. a circuit board packaging seat; 9. a printed circuit board; 10. a micro transformer; 11. pin terminal posts; 12. the pin is connected with the sleeve; 13. an insulating baffle; 14. a terminal connection post; 15. pin connection holes; 16. polyurethane waterproof sheet; 17. reinforcing the ring frame; 18. connecting an insulating rod; 19. an auxiliary sealing ring; 20. and limiting the through holes.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
The utility model provides a miniaturized power supply module structure as shown in fig. 1-3, which comprises an encapsulation shell 1, an insulating sealing plate 2, two metal pins 3, a printed circuit board 9 and a miniature transformer 10, wherein the opening at one end of the encapsulation shell 1 is in plug connection with the insulating sealing plate 2, a circuit board encapsulation seat 8 is arranged in the encapsulation shell 1, one end of the circuit board encapsulation seat 8 is fixedly connected with the printed circuit board 9, the middle part of the printed circuit board 9 is connected with the miniature transformer 10, one side of the printed circuit board 9 is fixedly provided with two pin terminal columns 11, one end of the two pin terminal columns 11 is fixedly provided with a pin connection sleeve 12, the inner side of the insulating sealing plate 2 in plug connection is provided with two pin connection holes 15, the inner parts of the two pin connection holes 15 are movably connected with the two metal pins 3, one end of the two metal pins 3 is fixedly provided with a terminal connection post 14, the two terminal connection posts 14 are in assembly connection with the corresponding pin terminal columns 11, the inner part of the encapsulation shell 1 is movably provided with a reinforcing ring frame 17, one end of the reinforcing ring frame 17 is fixedly provided with two connection rods 18, one side of the insulating rods 18 is fixedly connected with the corresponding pin terminal connection posts 18, one side of the insulating rods 18 is connected with the two end of the corresponding limiting stop bars 20, and the limiting stop bars 20 are arranged between the two side of the insulating rods 5 and the sealing plate 2, and the limiting stop bars 5 are connected with one side of the limiting plates 5.
In this embodiment, the top and bottom ends of the package housing 1 are fixedly provided with reinforcing heat dissipation grooves 7, and the other sides of the front and back sides of the package housing 1 are provided with dust-proof heat dissipation windows 6. The purpose of this arrangement is to increase the heat transfer efficiency of the package housing 1 itself.
In this embodiment, two tapered insulating sleeves 4 are fixedly installed at one end of the insulating sealing plate 2, and the two tapered insulating sleeves 4 are connected with the two metal pins 3 in a penetrating manner. The purpose of this arrangement is to increase the tightness of the connection of the two metal pins 3.
In this embodiment, the end portions of the two metal pins 3 are fixedly provided with insulating stoppers 13, and the two insulating stoppers 13 are in contact connection with the two pin connection holes 15. The purpose of this arrangement is to prevent the metal pins 3 from being pulled out.
In this embodiment, the outer wall of the insulating sealing plate 2 is fixedly connected with a polyurethane waterproof sheet 16, and the polyurethane waterproof sheet 16 is in extrusion connection with the inner wall of the packaging outer shell 1. The purpose of setting like this is to reduce the connection clearance, improves the water-proof effects, avoids inside short circuit that intakes.
In this embodiment, the other end of the reinforcing ring frame 17 is fixedly provided with an auxiliary sealing ring 19, and the auxiliary sealing ring 19 is in contact connection with the end of the insulating sealing plate 2. The purpose of this arrangement is to improve the tightness of the package housing 1.
The working principle of the utility model is as follows: during the equipment, install the inside of encapsulation shell 1 with circuit board encapsulation seat 8 through strengthening ring frame 17, install two pin connecting hole 15 departments with two metal pins 3 again, utilize insulating separation blade 13 to increase spacing effect, be connected insulating shrouding 2 and encapsulation shell 1, and then make two terminal spliced pole 14 and the pin terminal post 11 assembly connection that corresponds, connect two spacing through-holes 20 through spacing stock 5, increase joint strength. The utility model adopts a sectional design, the metal pins 3 are physically connected with the pin terminal posts 11 through the terminal connecting posts 14, so that the electric connection between the metal pins 3 and the printed circuit board 9 is realized, the whole is convenient to detach, and when in production and assembly, the metal pins can be quickly abutted without adopting a welding instrument, thereby being very convenient, reducing the production precision requirement of a power supply module and greatly improving the production efficiency;
the utility model can improve the connection strength of the packaging shell body 1 and the insulating sealing plate 2 by arranging the limiting through hole 20 and the limiting long rod 5, and can not be easily separated, and the mounting convenience of the circuit board packaging seat 10, the connection tightness of the packaging shell body 1 and the overall structural strength are improved by arranging the reinforcing ring frame 17, the connecting insulating rod 18 and the auxiliary sealing ring 19.
What is not described in detail in this specification is prior art known to those skilled in the art. The specific embodiments described herein are offered by way of example only to illustrate the spirit of the utility model. Those skilled in the art may make various modifications or additions to the described embodiments or substitutions thereof without departing from the spirit of the utility model or exceeding the scope of the utility model as defined in the accompanying claims.
Claims (6)
1. The miniaturized power module structure comprises an encapsulation shell body (1), an insulating sealing plate (2), two metal pins (3), a printed circuit board (9) and a miniature transformer (10), and is characterized in that an opening at one end of the encapsulation shell body (1) is in plug connection with the insulating sealing plate (2), a circuit board encapsulation seat (8) is mounted in the encapsulation shell body (1), one end of the circuit board encapsulation seat (8) is fixedly connected with the printed circuit board (9), the middle part of the printed circuit board (9) is connected with the miniature transformer (10), two pin terminal columns (11) are fixedly mounted at one side of the printed circuit board (9), pin connecting sleeves (12) are fixedly mounted at one ends of the pin terminal columns (11), two pin connecting holes (15) are formed in the inner side of the plug connection of the insulating sealing plate (2), two pin connecting holes (15) are movably connected with the two metal pins (3), terminal connecting columns (14) are fixedly mounted at one ends of the two metal pins (3), two terminal connecting columns (17) are correspondingly mounted on the inner side of the reinforcement ring frame (17), two connect insulator spindle (18) all with circuit board encapsulation seat (8) are connected, spacing through-hole (20) have all been seted up to one side on the front of encapsulation shell body (1) and one side on the back, two install spacing stock (5) between spacing through-hole (20), spacing stock (5) alternate with insulating shrouding (2) and be connected.
2. The miniaturized power module structure according to claim 1, wherein the top and bottom ends of the package housing (1) are fixedly provided with reinforcing heat dissipation grooves (7), and dustproof heat dissipation windows (6) are installed on the other side of the front surface and the other side of the back surface of the package housing (1).
3. The miniaturized power module structure according to claim 1, characterized in that one end of the insulating sealing plate (2) is fixedly provided with two conical insulating sleeves (4), and the two conical insulating sleeves (4) are connected with the two metal pins (3) in a penetrating way.
4. The miniaturized power module structure according to claim 1, characterized in that the ends of both the metal pins (3) are fixedly provided with insulating blocking pieces (13), and both the insulating blocking pieces (13) are in contact connection with both pin connection holes (15).
5. The miniaturized power module structure according to claim 1, wherein the outer wall of the insulating sealing plate (2) is fixedly connected with a polyurethane waterproof sheet (16), and the polyurethane waterproof sheet (16) is connected with the inner wall of the packaging outer shell (1) in an extrusion mode.
6. The miniaturized power module structure according to claim 1, characterized in that the other end of the reinforcing ring frame (17) is fixedly provided with an auxiliary sealing ring (19), and the auxiliary sealing ring (19) is in contact connection with the end part of the insulating sealing plate (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321055962.8U CN219918697U (en) | 2023-04-27 | 2023-04-27 | Miniaturized power module structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321055962.8U CN219918697U (en) | 2023-04-27 | 2023-04-27 | Miniaturized power module structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219918697U true CN219918697U (en) | 2023-10-27 |
Family
ID=88438046
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321055962.8U Active CN219918697U (en) | 2023-04-27 | 2023-04-27 | Miniaturized power module structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219918697U (en) |
-
2023
- 2023-04-27 CN CN202321055962.8U patent/CN219918697U/en active Active
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| GR01 | Patent grant | ||
| GR01 | Patent grant |