CN219917144U

CN219917144U - Tin ball chip connecting base

Info

Publication number: CN219917144U
Application number: CN202321167263.2U
Authority: CN
Inventors: 卢髦
Original assignee: Jialian Technology Shanghai Co ltd
Current assignee: Jialian Technology Shanghai Co ltd
Priority date: 2023-05-15
Filing date: 2023-05-15
Publication date: 2023-10-27
Anticipated expiration: 2033-05-15

Abstract

The utility model discloses a solder ball chip connecting base which is characterized by comprising a plastic base (301) and a plurality of connecting terminals (401), wherein the top of the plastic base is uniformly provided with a plurality of positioning columns (601); a plurality of pin holes (3011) which are uniformly distributed are formed in the plastic base (301); the plurality of connecting terminals (401) are uniformly arranged in the plurality of pin holes (3011) in a penetrating manner and respectively extend out from the top and the bottom of the plastic base (301). According to the tin ball chip connecting base disclosed by the utility model, the tin ball (102) can be effectively prevented from shifting in the buckling process of the chip (101), so that the stable connection between the tin ball (102) and the connecting terminal (401) is ensured.

Description

Tin ball chip connecting base

Technical Field

The utility model belongs to the technical field of chip connection, and particularly relates to a solder ball chip connection base.

Background

As shown in fig. 1 and 2, in the conventional chip connector, the contact point of the terminal (201) is higher than the plastic surface, and the chip (101) is buckled and then contacts with the contact point of the terminal (201) to form a connection path, but when the chip type using the structure is a BGA (solder ball matrix), the chip (101) can deviate in the buckling process, so that the contact between the circular section of the solder ball (102) and the circular section of the terminal (201) is unstable, and the problem of contact deviation is easy to occur.

Disclosure of Invention

The utility model aims to provide a solder ball chip connecting base.

The utility model provides a solder ball chip connecting base, which comprises a plastic base (301) and a plurality of connecting terminals (401), wherein the top of the plastic base is uniformly provided with a plurality of positioning columns (601); a plurality of pin holes (3011) which are uniformly distributed are formed in the plastic base (301); the plurality of connecting terminals (401) are uniformly arranged in the plurality of pin holes (3011) in a penetrating manner and respectively extend out from the top and the bottom of the plastic base (301).

Preferably, the positioning posts (601) are arranged between every two pin holes (3011) along the longitudinal direction of the plastic base (301).

Preferably, a barrier post (901) is arranged between every two positioning posts (601) along the longitudinal direction of the plastic base (301); the positioning posts (601) and the barrier posts (901) around the pin holes (3011) enclose a storage space (501).

Preferably, a connecting rib (801) is arranged between each positioning column (601) and each barrier column (901); one end of the connecting rib (801) is fixed with one side of the positioning column (601), and the other end of the connecting rib is fixed with one side of the barrier column (901).

Preferably, the top of the connecting terminal (401) is lower than the top of the positioning column (601).

Preferably, the positioning post (601) and the barrier post (901) are both block-shaped.

According to the tin ball chip connecting base provided by the utility model, the tin balls (102) of the chip (101) are positioned and limited through the positioning column (601), so that the tin balls (102) can be effectively prevented from shifting in the buckling process of the chip (101), and the stable connection between the tin balls (102) and the connecting terminals (401) is ensured.

Drawings

FIG. 1 is a partial schematic view of a prior art connector according to the background of the utility model;

FIG. 2 is a partial schematic view of a prior art connector according to the background of the utility model after contact with solder balls;

FIG. 3 is a schematic diagram of a partial structure of a solder ball chip connecting base according to the present utility model after the solder ball chip connecting base contacts a solder ball;

FIG. 4 is a schematic view of a top partial first view angle structure of a solder ball chip connection pad according to the present utility model;

FIG. 5 is a schematic diagram of a partial enlarged structure of the top of the solder ball chip connection base according to the present utility model;

FIG. 6 is a schematic view of a front partial cross-sectional structure of a solder ball chip connection pad according to the present utility model;

FIG. 7 is a schematic view of a front partial cross-sectional structure of a solder ball chip connecting base according to the present utility model after the solder ball chip connecting base contacts a solder ball;

fig. 8 is a schematic perspective view of a solder ball chip connection base according to the present utility model;

fig. 9 is a schematic top view of a solder ball chip connection base according to the present utility model.

Detailed Description

For the purpose of making the objects, technical solutions and advantages of the embodiments of the present utility model more apparent, the technical solutions of the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model, and it is apparent that the described embodiments are some embodiments of the present utility model, but not all embodiments of the present utility model. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

As shown in fig. 3-9, the solder ball chip connection base provided in this embodiment includes a plastic base 301 with a plurality of positioning posts 601 uniformly arranged on the top and a plurality of connection terminals 401; a plurality of pin holes 3011 which are uniformly distributed are formed in the plastic base 301; the connection terminals 401 are uniformly inserted into the pin holes 3011 and respectively protrude from the top and bottom of the plastic base 301. Those skilled in the art will understand that the positioning and limiting of the solder balls 102 of the chip 101 by the positioning posts 601 can effectively prevent the solder balls 102 from being shifted during the fastening process of the chip 101, so as to ensure stable connection between the solder balls 102 and the connection terminals 401. Those skilled in the art will appreciate that the top of connection terminals 401 are connected to solder balls 102 and the bottom of connection terminals 401 are connected to PCB test board 701.

Further, the positioning posts 601 are disposed between every two pin holes 3011 along the longitudinal direction of the plastic base 301. Those skilled in the art can understand that there are 1 positioning posts 601 beside each solder ball 102 to position the solder balls 102, so as to prevent the solder balls 102 from being deviated after being buckled, and thus improve the connection stability of the solder ball chip connection base provided in the embodiment.

Further, a barrier column 901 is disposed between every two of the positioning columns 601 along the longitudinal direction of the plastic base 301; the positioning posts 601 and the barrier posts 901 around the pin holes 3011 enclose a storage space 501. As can be appreciated by those skilled in the art, the periphery of each pin hole 3011 forms a receiving space 501 for receiving the solder ball 102 through two barrier posts 901 and two positioning posts 601, so that the solder ball 102 can be wrapped in the receiving space 501, the solder ball 102 can be effectively protected, and the solder ball 102 can be further prevented from being skewed and offset in the pressing process, thereby further improving the connection stability and safety of the chip 101 and the connection terminal 401.

Further, a connecting rib 801 is disposed between each positioning post 601 and each barrier post 901; one end of the connecting rib 801 is fixed to one side of the positioning column 601, and the other end is fixed to one side of the barrier column 901. Those skilled in the art will appreciate that the positioning post 601 and the barrier post 901 are connected together by the connecting rib 801, so that deformation of the positioning post 601 and the barrier post 901 caused by downward extrusion of the solder ball 102 can be prevented, and further, the possibility of offset of the solder ball 102 can be prevented.

Further, the top of the connection terminal 401 is lower than the top of the positioning post 601. Those skilled in the art will appreciate that the positioning posts 601 can support the chip 101 during the pressing process of the chip 101, so as to avoid the terminal deformation caused by the overvoltage and protect the terminal from damage caused by excessive pressing.

Further, the positioning posts 601 and the barrier posts 901 are both block-shaped.

Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present utility model, and are not limiting; although the utility model has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present utility model.

Claims

1. The solder ball chip connecting base is characterized by comprising a plastic base (301) and a plurality of connecting terminals (401), wherein the top of the plastic base is uniformly provided with a plurality of positioning columns (601); a plurality of pin holes (3011) which are uniformly distributed are formed in the plastic base (301); the plurality of connecting terminals (401) are uniformly arranged in the plurality of pin holes (3011) in a penetrating manner and respectively extend out from the top and the bottom of the plastic base (301).

2. The solder ball chip connection mount according to claim 1, wherein the positioning posts (601) are disposed between every two pin holes (3011) along the longitudinal direction of the plastic mount (301).

3. The solder ball chip connection base according to claim 2, wherein a barrier post (901) is arranged between every two positioning posts (601) along the longitudinal direction of the plastic base (301); the positioning posts (601) and the barrier posts (901) around the pin holes (3011) enclose a storage space (501).

4. A solder ball chip connection mount according to claim 3, wherein a connection rib (801) is provided between each of the positioning posts (601) and the barrier posts (901); one end of the connecting rib (801) is fixed with one side of the positioning column (601), and the other end of the connecting rib is fixed with one side of the barrier column (901).

5. The solder ball chip connection pad of claim 4, wherein the top of the connection terminal (401) is lower than the top of the positioning post (601).

6. The solder ball die attach mount of claim 5, wherein said positioning posts (601) and said barrier posts (901) are each block-shaped.