CN219917110U - Open wafer box adapter and semiconductor wafer conveying device - Google Patents
Open wafer box adapter and semiconductor wafer conveying device Download PDFInfo
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- CN219917110U CN219917110U CN202321353381.2U CN202321353381U CN219917110U CN 219917110 U CN219917110 U CN 219917110U CN 202321353381 U CN202321353381 U CN 202321353381U CN 219917110 U CN219917110 U CN 219917110U
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 15
- 230000007246 mechanism Effects 0.000 claims abstract description 54
- 238000009434 installation Methods 0.000 claims abstract description 13
- 230000000903 blocking effect Effects 0.000 claims description 21
- 238000010276 construction Methods 0.000 claims description 2
- 235000012431 wafers Nutrition 0.000 abstract description 84
- 238000000034 method Methods 0.000 description 7
- 239000000463 material Substances 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000001960 triggered effect Effects 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 210000000078 claw Anatomy 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000008093 supporting effect Effects 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
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Abstract
The utility model provides an open wafer box adapter and a semiconductor wafer conveying device, wherein the adapter comprises: the adapter body, the upper surface of the adapter body is used for placing the open wafer box; the adapter body is provided with a plurality of first mounting holes and second mounting holes which are vertically communicated; the position of the first mounting hole corresponds to the position of the sensor on the loading platform, and the position of the second mounting hole corresponds to the position of the information sensor on the loading platform; the first trigger mechanisms are arranged in the first mounting holes; the second trigger mechanisms are selectively installed in the second installation holes, and the installation number and the installation positions of the second trigger mechanisms are related to the types of the wafers loaded in the current open wafer box; after the open wafer cassette is placed on the adapter, the first trigger mechanism and the second trigger mechanism are moved downward under pressure to trigger the presence sensor and the information sensor.
Description
Technical Field
The utility model relates to the technical field of semiconductor manufacturing equipment, in particular to an open wafer box adapter and a semiconductor wafer conveying device.
Background
In semiconductor processing, fragile wafers typically need to be transported and stored in a wafer cassette; because the wafer processing procedures are complex and various, and the specifications of wafers such as different thicknesses, warpage, materials and the like are also various, the wafer boxes for loading are usually designed into different patterns and specifications according to different processing requirements and wafer compasses. In addition, the loading platform for placing the wafer cassette is constrained by the semiconductor industry standard to be of a closed wafer cassette design, and the open wafer cassette cannot be directly placed on the loading platform for use. Therefore, a device is needed to transfer the bottom surface of the open wafer cassette and the upper surface of the loading table, and the loading table is assisted to identify the type of the wafer cassette, so that different wafer picking actions can be conveniently executed for different types of wafer cassettes.
In the conventional method, an adapter is provided at the bottom of the open wafer cassette to assist in using the open wafer cassette. The conventional adapter used at present has a chute and a claw installed on the lower surface to connect with a standard loading table; the upper surface is provided with a plurality of pressing sensors according to the bottom surface characteristics of the wafer box and then connected to a printed circuit board arranged in the adapter, and an extension net wire on the printed circuit board is connected to the loading table for wafer box identification; the circuit board identifies the type of the wafer cassette by pressing the trigger condition of the sensor.
At present, the conventional identification method on the market has a large space requirement on the bottom of the adapter, electrical components such as a circuit board, wires and the like are also required to be installed, pins on the circuit board are required to be edited and defined, and a network cable is required to be connected from the adapter to the loading table.
In addition, conventional adapters have limited identification capability for different types of wafer cassettes. The traditional mode is to lay a plurality of sensors on the surface of the adapter to press and identify whether the placement condition of the wafer box is normal or not, and further to distinguish the type of the wafer box by adding the sensors with different characteristic identification through different characteristics of the bottom of the wafer box. If the bottom features of cassettes a and B are different, the conventional method requires that the sensor 1 be disposed in the area other than the intersection of the bottom features to identify the unique features of cassette a (or B), then cassette a (or B) triggers more sensors than cassette B (or a). The method has the problem that when wafers with different thicknesses, warpage and materials are loaded in the wafer boxes with the same bottom surface characteristics, the type of the currently loaded wafer cannot be identified through the wafer box presence sensor on the traditional adapter.
Therefore, how to optimize the adapter with the open wafer cassette type identification function to make the adapter have stronger applicability is a problem that needs to be solved at present.
Disclosure of Invention
The utility model aims to provide an open type wafer box adapter and a semiconductor wafer conveying device, which can solve the problem that the traditional adapter is inconvenient to identify the type of a wafer box and the problem that the type of a currently loaded wafer cannot be identified for the wafer boxes with the same bottom surface characteristics.
In order to achieve the above object, the present utility model provides an open wafer cassette adapter for placement on a front end module loading platform of a semiconductor wafer handling device, the adapter comprising:
the adapter body, the upper surface of the said adapter body is used for placing the said open wafer box;
the adapter body is provided with a plurality of first mounting holes and second mounting holes which are vertically communicated; the position of the first mounting hole corresponds to the position of the sensor on the loading platform, and the position of the second mounting hole corresponds to the position of the information sensor on the loading platform;
the first trigger mechanisms are arranged in the first mounting holes;
a second trigger mechanism selectively installed in the second installation hole, the number and the installation position of the second trigger mechanism being related to the type of the wafer loaded in the open wafer cassette at present;
after the open wafer cassette is placed on the adapter, the first trigger mechanism and the second trigger mechanism are moved downward under pressure to trigger the presence sensor and the information sensor.
In an alternative, the lower surface of the adapter body has a blocking member, the first trigger mechanism and the second trigger mechanism are identical in structure, and the first trigger mechanism includes:
the triggering part penetrates through the first mounting hole, the upper end of the triggering part protrudes out of the upper surface of the adapter body, and the lower end of the triggering part penetrates through the blocking part;
and the elastic component is positioned in the first mounting hole, one end of the elastic component is propped against the blocking component, and the other end of the elastic component is propped against the upper part of the triggering component, so that the triggering component is in an upward lifted state.
In an alternative, the triggering component includes: a pin cap and a pin;
the pin passes through the blocking part and the first mounting hole;
the pin cap is in threaded connection with the pin or the pin cap is in threaded connection with the pin through a screw.
In an alternative scheme, the elastic component is a spring and sleeved on the periphery of the pin.
In an alternative, the blocking component and the adapter body are in an integral structure, or the blocking component is a blocking piece arranged on the lower surface of the adapter body.
In an alternative, the adapter further comprises: and the clamping jaw is arranged below the adapter body and used for being mutually locked with the clamping mechanism of the loading platform.
In an alternative, the adapter further comprises: and the guide blocks are distributed on the upper surface of the adapter body and are used for spatially positioning the open wafer box.
In an alternative, the adapter further comprises: and the positioning blocks are distributed on the lower surface of the adapter body and are used for being matched with the positioning support posts of the loading platform.
In an alternative, the adapter further comprises: and the antenna is arranged on the upper surface of the adapter body and is used for reading the radio frequency signals of the radio frequency signal generator on the wafer box.
The utility model also provides a semiconductor wafer conveying device, which comprises: as with the open cassette adapter and loading platform described above, the open cassette adapter is removably attached to the top of the loading platform.
The utility model has the beneficial effects that:
the open wafer box adapter can realize the existence recognition and the type recognition of the wafer box according to the triggering conditions of the existence sensor and the information sensor on the loading table. By utilizing a purely mechanical structure, the sensor can be triggered to identify the type by direct placement, so that the installation of electric elements such as a circuit board, wires and the like on an adapter is avoided, and the operation is simple and the cost is saved. When the wafer box is used, the number and the positions of the second trigger mechanisms arranged on the adapter are changed, so that the trigger condition of the information sensor can be changed, the use flexibility is greatly increased, the number of the types of the wafer boxes can be simultaneously distinguished, and the wafer boxes with the same bottom surface characteristics and different functions (wafers with different thicknesses, warpage and materials are loaded inside the wafer boxes with the same bottom surface characteristics) can be distinguished.
Drawings
The foregoing and other objects, features and advantages of the utility model will be apparent from the following more particular descriptions of exemplary embodiments of the utility model as illustrated in the accompanying drawings wherein like reference numbers generally represent like parts throughout the exemplary embodiments of the utility model.
FIG. 1 is a schematic view of the top surface structure of an adapter according to an embodiment of the present utility model;
FIG. 2 is a schematic view of the lower surface structure of an adapter according to an embodiment of the present utility model;
FIG. 3 is a schematic view of an interactive surface of a loading platform according to an embodiment of the present utility model;
fig. 4 is a schematic view of the first trigger mechanism at the A-A plane in fig. 2.
FIG. 5 is a schematic diagram of sensor triggering when a cassette is loaded in accordance with one embodiment of the present utility model.
FIG. 6 is a schematic diagram of sensor triggering when a cassette is loaded in accordance with another embodiment of the present utility model.
FIG. 7 is a schematic view of an embodiment of the present utility model after the loading platform, the adapter and the open cassette are assembled together.
Reference numerals illustrate:
1-an adapter body; 2-a guide block; 3-a first trigger mechanism; 31-presence sensor; 32-a baffle; 33-an elastic member; 34-pin cap; 35-pins; 36-screws; 4-antennas; 511-a second mounting hole; 512-second mounting holes; 513-second mounting holes; 514-a second mounting hole; 521-information sensor; 522-an information sensor; 523-information sensor; 524-information sensor; 61-positioning blocks; 62-positioning the support column; 71-clamping jaw; 72-clamping mechanism; 8-an open wafer cassette; 9-an open wafer cassette; 10-a second trigger mechanism.
Detailed Description
The utility model is described in further detail below with reference to the drawings and the specific examples. The advantages and features of the present utility model will become more apparent from the following description and drawings, however, it should be understood that the inventive concept may be embodied in many different forms and is not limited to the specific embodiments set forth herein. The drawings are in a very simplified form and are to non-precise scale, merely for convenience and clarity in aiding in the description of embodiments of the utility model.
It will be understood that when an element or layer is referred to as being "on," "adjacent," "connected to," or "coupled to" another element or layer, it can be directly on, adjacent, connected, or coupled to the other element or layer, or intervening elements or layers may be present. In contrast, when an element is referred to as being "directly on," "directly adjacent to," "directly connected to," or "directly coupled to" another element or layer, there are no intervening elements or layers present. It will be understood that, although the terms first, second, third, etc. may be used herein to describe various elements, components, regions, layers and/or sections, these elements, components, regions, layers and/or sections should not be limited by these terms. These terms are only used to distinguish one element, component, region, layer or section from another element, component, region, layer or section. Thus, a first element, component, region, layer or section discussed below could be termed a second element, component, region, layer or section without departing from the teachings of the present utility model.
Spatially relative terms, such as "under," "below," "beneath," "under," "above," "over," and the like, may be used herein for ease of description to describe one element or feature's relationship to another element or feature as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use and operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements or features described as "under" or "beneath" other elements would then be oriented "on" the other elements or features. Thus, the exemplary terms "below" and "under" may include both an upper and a lower orientation. The device may be otherwise oriented (rotated 90 degrees or other orientations) and the spatially relative descriptors used herein interpreted accordingly.
The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the utility model. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms "comprises" and/or "comprising," when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof. As used herein, the term "and/or" includes any and all combinations of the associated listed items.
Example 1
Referring to fig. 1 to 7, the present embodiment provides an open wafer cassette adapter for placement on a front end module loading platform of a semiconductor wafer handling device, the adapter comprising:
the adapter body, the upper surface of the adapter body is used for placing the open wafer box;
the adapter body is provided with a plurality of first mounting holes and second mounting holes which are vertically communicated; the position of the first mounting hole corresponds to the position of the sensor on the loading platform, and the position of the second mounting hole corresponds to the position of the information sensor on the loading platform;
the first trigger mechanisms are arranged in the first mounting holes;
the second trigger mechanisms are selectively installed in the second installation holes, and the installation number and the installation positions of the second trigger mechanisms are related to the types of the wafers loaded in the current open wafer box;
after the open wafer cassette is placed on the adapter, the first trigger mechanism and the second trigger mechanism are moved downward under pressure to trigger the presence sensor and the information sensor.
Specifically, in the present embodiment, the loading platform is provided with 3 positioning posts 62, the clamping mechanism 72, 3 presence sensors 31, and 4 information sensors (information sensor 521, information sensor 522, information sensor 523, and information sensor 524). The adapter is detachably connected to the loading platform. The adapter body is provided with 3 first mounting holes, 4 second mounting holes (second mounting holes 511, 512, 513 and 514), the loading platform is provided with 3 presence sensors 31, and 3 first triggering mechanisms 3 and 3 presence sensors 31 are in one-to-one correspondence. The triggering of different information sensors when placing the wafer cassette is achieved by selecting 4 second mounting holes at different positions to mount the second triggering structure 10 (in fig. 1, the second triggering structure 10 is mounted at the position of the second mounting hole 512, and the second triggering structure is not mounted in the rest 3 second mounting holes).
Referring to fig. 5 and 6, the bottom surface features of the cassettes 8 in fig. 5 and 9 in fig. 6 may be the same or different (both distinguishable). In order to distinguish between two different wafer cassettes, in fig. 5, when the adaptor is docked to the wafer cassette 8, the second trigger mechanism 3 is mounted at the position of the second mounting hole 512 on the adaptor body 1; in fig. 6, when the adaptor is docked to the wafer cassette 9, the second trigger mechanism 3 is mounted at the same time at the positions of the second mounting holes 511 and 512 on the adaptor body 1. When the wafer cassette is placed, the wafer cassette 8 in fig. 5 presses down one second trigger mechanism 3 to trigger one information sensor on the loading platform, and the wafer cassette 9 in fig. 6 presses down two second trigger mechanisms 3 to trigger two information sensors, so that different operation procedures can be implemented on the wafer cassette 8 and the wafer cassette 9 according to different trigger conditions of the information sensors according to the built-in procedures of the loading platform. A schematic view of the structure of the loading platform, the adapter and the open cassette assembled together is shown in fig. 7.
In this embodiment, the lower surface of the adapter body 1 has a blocking member, and the first trigger mechanism and the second trigger mechanism are identical in structure, and the first trigger mechanism includes: a trigger member passing through the first mounting hole, the upper end of which protrudes from the upper surface of the adapter body 1, and the lower end of which passes through the blocking member; and the elastic component is positioned in the first mounting hole, one end of the elastic component is propped against the blocking component, the other end of the elastic component is propped against the upper part of the triggering component, the whole first triggering mechanism is clamped on the blocking component by the triggering component and the elastic component, and the elastic component is in a compressed state, so that the triggering component is in an upward-lifted state.
Referring to fig. 4, in the present embodiment, the blocking member is a blocking piece 32 mounted on the lower surface of the adapter body 1. In other embodiments, the blocking member and the adapter body may be of unitary construction. In this embodiment, the triggering part includes: a pin cap 34 and a pin 35; the pin 35 passes through the blocking piece 32 and the first mounting hole, and the pin cap 34 is connected with the pin 35 by a screw 36. In other embodiments, the pin cap 34 and the pin 35 may also be directly threaded. In this embodiment, the elastic member 33 is a spring and is fitted around the outer periphery of the pin 35. The spring as the elastic component has the advantages of low cost, simple structure and small occupied space. In other embodiments, the elastic member 33 may not be a spring, as long as it can exert an upward force on the pin 35 to pull the pin when the cassette is not placed. When the elastic parts are springs, the number of the elastic parts can be 3 or 4, and the elastic parts are arranged around the pin. The first trigger mechanism/second trigger mechanism is supported on the stopper 32 by the supporting action of the elastic member 33 after being compressed, and the pin cap 34 is projected from the upper surface of the adapter body 1. When a cassette is placed on the adaptor, the cassette presses down the first trigger mechanism/second trigger mechanism to protrude downward, triggering the presence sensor 31 and the information sensor. When the cassette is removed, the first trigger mechanism/second trigger mechanism is reset by the elastic member 33.
Referring to fig. 3, in this embodiment, the adapter further includes: a clamping jaw 71, provided below the adapter body 1, for interlocking with a clamping mechanism 72 of the loading platform (the clamping jaw 71 is hooked with the clamping mechanism 72 to clamp the adapter); the 4 guide blocks 2 are distributed on the upper surface of the adapter body 1 and are used for spatially positioning the open wafer box; 3 positioning blocks 61 distributed on the lower surface of the adapter body 1 for cooperating with 3 positioning posts 62 of the loading platform for positioning the adapter on the loading platform; and the antenna is arranged on the upper surface of the adapter body 1 and is used for reading the radio frequency signals of the radio frequency signal generator on the wafer box.
According to the embodiment, the sensor on the loading platform is triggered by using the first trigger mechanism/the second trigger mechanism which are pressed down mechanically in a manner of pressing down the wafer box by gravity, so that the condition that the type of the wafer box is identified in a manner of additionally installing additional sensors, circuit boards and wires on the adapter in the traditional method is avoided, and the manufacturing cost of the adapter is reduced; the adapter is directly placed on the loading platform without communicating with the loading platform by using a network cable connection adapter like the traditional adapter, and the operation method of the adapter is simplified.
In addition, regardless of the bottom surface characteristics of the wafer box, the trigger condition can be changed by directly changing the installation condition of the second trigger mechanism on the adapter (16 trigger modes are theoretically available when 4 second installation holes exist), and different operation programs are executed through different trigger conditions, so that the function of the information sensor on the standard loading platform is fully played. By using the adapter, as long as the program corresponding to different wafer boxes in the semiconductor industry is modularized, the sensor trigger condition on the loading platform is matched with the program module according to the requirement when in use, so that the adapter can be put into use, and the convenience and interchangeability are greatly improved.
Another embodiment of the present utility model provides a semiconductor wafer handling device, including the above open-type wafer cassette adapter and a loading platform, wherein the open-type wafer cassette adapter is detachably connected above the loading platform.
The above description is only illustrative of the preferred embodiments of the present utility model and is not intended to limit the scope of the present utility model, and any alterations and modifications made by those skilled in the art based on the above disclosure shall fall within the scope of the appended claims.
Claims (10)
1. An open cassette adapter for placement on a front end module loading platform of a semiconductor wafer handling device, the adapter comprising:
the upper surface of the adapter body is used for placing the open wafer box;
the adapter body is provided with a plurality of first mounting holes and second mounting holes which are vertically communicated; the position of the first mounting hole corresponds to the position of the sensor on the loading platform, and the position of the second mounting hole corresponds to the position of the information sensor on the loading platform;
the first trigger mechanisms are arranged in the first mounting holes;
a second trigger mechanism selectively installed in the second installation hole, the number and the installation position of the second trigger mechanism being related to the type of the wafer loaded in the open wafer cassette at present;
after the open wafer cassette is placed on the adapter, the first trigger mechanism and the second trigger mechanism are moved downward under pressure to trigger the presence sensor and the information sensor.
2. The open cassette adapter of claim 1, wherein a lower surface of the adapter body has a blocking feature, the first trigger mechanism and the second trigger mechanism being identical in structure, the first trigger mechanism comprising:
the triggering part penetrates through the first mounting hole, the upper end of the triggering part protrudes out of the upper surface of the adapter body, and the lower end of the triggering part penetrates through the blocking part;
and the elastic component is positioned in the first mounting hole, one end of the elastic component is propped against the blocking component, and the other end of the elastic component is propped against the upper part of the triggering component, so that the triggering component is in an upward lifted state.
3. The open cassette adapter of claim 2, wherein the trigger component comprises: a pin cap and a pin;
the pin passes through the blocking part and the first mounting hole;
the pin cap is in threaded connection with the pin or the pin cap is in threaded connection with the pin through a screw.
4. The open cassette adapter as recited in claim 3, wherein the resilient member is a spring that is sleeved around the outer periphery of the pin.
5. The open cassette adapter of claim 2, wherein the blocking member is of unitary construction with the adapter body or the blocking member is a flap mounted to a lower surface of the adapter body.
6. The open cassette adapter as recited in claim 1, wherein the adapter further comprises: and the clamping jaw is arranged below the adapter body and used for being mutually locked with the clamping mechanism of the loading platform.
7. The open cassette adapter as recited in claim 1, wherein the adapter further comprises: and the guide blocks are distributed on the upper surface of the adapter body and are used for spatially positioning the open wafer box.
8. The open cassette adapter as recited in claim 1, wherein the adapter further comprises: and the positioning blocks are distributed on the lower surface of the adapter body and are used for being matched with the positioning support posts of the loading platform.
9. The open cassette adapter as recited in claim 1, wherein the adapter further comprises: and the antenna is arranged on the upper surface of the adapter body and is used for reading the radio frequency signals of the radio frequency signal generator on the wafer box.
10. A semiconductor wafer carrier apparatus, comprising: the open cassette adapter and loading bay of any of claims 1-9, the open cassette adapter removably coupled over the loading bay.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321353381.2U CN219917110U (en) | 2023-05-30 | 2023-05-30 | Open wafer box adapter and semiconductor wafer conveying device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321353381.2U CN219917110U (en) | 2023-05-30 | 2023-05-30 | Open wafer box adapter and semiconductor wafer conveying device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219917110U true CN219917110U (en) | 2023-10-27 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321353381.2U Active CN219917110U (en) | 2023-05-30 | 2023-05-30 | Open wafer box adapter and semiconductor wafer conveying device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219917110U (en) |
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2023
- 2023-05-30 CN CN202321353381.2U patent/CN219917110U/en active Active
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