CN219915690U - Wafer bearing table and chip detection mechanism - Google Patents

Abstract

The utility model discloses a wafer carrying table and a chip detection mechanism, wherein the wafer carrying table is provided with a carrying end face for attaching a chip carrier film, the wafer carrying table is provided with a ring groove, and the ring groove surrounds a circle along the peripheral edge of the carrying end face _， The chip carrier is characterized in that the chip carrier is provided with a first exhaust hole, the first exhaust hole is communicated with the annular groove and is used for exhausting gas in the annular groove when the chip carrier is attached to the bearing end face. The technical scheme solves the technical problem that the carrier film is adsorbed unevenly in the chip detection processSurgical problems.

Description

Wafer bearing table and chip detection mechanism

Technical Field

The utility model relates to the technical field of chip testing, in particular to a chip bearing table and a chip detection mechanism.

Background

In the LED chip testing process, the chip is generally required to be fixed on the chip bearing table in a vacuum adsorption mode, and then the chip electrode is electrified through the test probe, so that the chip emits light, and meanwhile, the spectrum of the chip is analyzed through the light receiving component to judge whether the chip is good or not.

In the prior vacuum adsorption structure, when a chip is attached to a carrying platform through a carrier film, air is always remained between the carrier film and the carrying platform and cannot be discharged, and the carrier film cannot be completely attached to the carrying platform, so that the surface of the carrier film is not smooth enough; therefore, the carrying platform is required to carry out long-time vacuum adsorption on the carrier film for a long time so as to extract residual air, which easily causes the tensile deformation of the chip carrier film, and further causes the change of the chip position on the carrier film, so that the test cannot be normally carried out.

Disclosure of Invention

The utility model mainly aims to provide a wafer carrying table and aims to solve the technical problem of uneven adsorption of a carrier film in the chip detection process.

In order to achieve the above objective, the present utility model provides a wafer carrier, which has a carrier end surface for attaching a chip carrier, wherein a ring groove is formed on the wafer carrier, the ring groove surrounds a circle along the peripheral edge of the carrier end surface, the wafer carrier is provided with a first exhaust hole, the first exhaust hole is communicated with the ring groove, and is used for exhausting gas in the ring groove when the chip carrier is attached to the carrier end surface.

Optionally, the side wall of the ring groove is perpendicular to the bearing end surface.

Optionally, the wafer carrier includes:

the base station is provided with a first exhaust hole;

the supporting table is arranged on the base table, the top surface of the supporting table is used as the bearing end surface, and the side wall of the supporting table is perpendicular to the bearing end surface; and

the first annular body is arranged on the base table, is arranged at intervals with the supporting table, and surrounds the supporting table along the circumferential direction of the supporting table for a circle, and the annular groove is formed by the first annular body, the supporting table and the base table together.

Optionally, the first exhaust hole is communicated with the bottom of the ring groove.

Optionally, the piece bearing platform further comprises a second annular body, wherein the second annular body is arranged on the annular groove and surrounds the supporting platform to position the supporting platform.

Optionally, the inner side wall of the second annular body and the outer side wall of the supporting table have a gap, the second annular body is provided with a second exhaust hole, one end of the second exhaust hole is communicated with the first exhaust hole, and the other end of the second exhaust hole extends to the inner side wall of the first annular body.

Optionally, a top surface of the support table is higher than a top surface of the first annular body; and/or the bearing piece platform comprises a gasket, wherein the gasket is embedded in the annular groove and surrounds the annular groove along the circumferential direction of the annular groove for adjusting the volume of the annular groove.

Optionally, a third exhaust hole is formed in the supporting table, and the third exhaust hole penetrates through the top surface and the bottom surface of the supporting table.

Optionally, a plurality of third exhaust holes are formed, and the plurality of third exhaust holes are arranged around the center of the supporting table; and/or the first exhaust holes are formed in a plurality, and the first exhaust holes are arranged at intervals along the circumferential direction of the supporting table.

The utility model also provides a chip detection mechanism, which comprises:

the chip bearing table is used for adsorbing the chip to be detected; a kind of electronic device with high-pressure air-conditioning system

The detection probe is arranged above the chip bearing table and is used for detecting the chip to be detected on the chip bearing table.

In the technical scheme of the utility model, the wafer bearing platform is provided with a bearing end surface, and the bearing end surface is used for placing a carrier film with a chip for testing; the wafer bearing table is also provided with an annular groove, and the annular groove surrounds the circumference of the bearing end surface for a circle; in addition, the wafer bearing table is also provided with a first exhaust hole which is communicated with the ring groove. In the chip testing process, the carrier film provided with the chip can be attached to the bearing end face, the edge of the carrier film seals the opening of the annular groove, at the moment, the first exhaust hole can exhaust air in the annular groove, the carrier film seals the opening of the annular groove, the air pressure in the annular groove is gradually reduced, the carrier film is pressed into the annular groove under the action of atmospheric pressure, the carrier film is stretched flat on the bearing end face, the air between the carrier film and the bearing end face can enter the annular groove through the edge of the bearing end face and is exhausted through the first exhaust hole, so that the flatness of the carrier film after being adsorbed is ensured, and the adsorption stability of the carrier film is also improved.

Drawings

In order to more clearly illustrate the embodiments of the present utility model or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, and it is obvious that the drawings in the following description are only some embodiments of the present utility model, and other drawings may be obtained according to the structures shown in these drawings without inventive effort for a person skilled in the art.

FIG. 1 is a schematic exploded view of an embodiment of a wafer carrier of the present utility model;

FIG. 2 is a schematic cross-sectional view of an embodiment of a wafer carrier of the present utility model;

FIG. 3 is an enlarged view of a portion of FIG. 2 at A;

FIG. 4 is a partial enlarged view at B in FIG. 2;

fig. 5 is a schematic partial cross-sectional view of an embodiment of the wafer carrier of the present utility model.

Reference numerals illustrate:

reference numerals	Name of the name	Reference numerals	Name of the name
				100	Base station	200	Supporting table
300	First annular body	400	Second annular body
				500	Gasket ring	600	Carrier film
700	Support ring	110	First exhaust hole
				120	Second exhaust hole	210	Third exhaust hole

The achievement of the objects, functional features and advantages of the present utility model will be further described with reference to the accompanying drawings, in conjunction with the embodiments.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all embodiments of the utility model. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

It should be noted that all directional indicators (such as up, down, left, right, front, and rear … …) in the embodiments of the present utility model are merely used to explain the relative positional relationship, movement, etc. between the components in a particular posture (as shown in the drawings), and if the particular posture is changed, the directional indicator is changed accordingly.

In the present utility model, unless specifically stated and limited otherwise, the terms "connected," "affixed," and the like are to be construed broadly, and for example, "affixed" may be a fixed connection, a removable connection, or an integral body; can be mechanically or electrically connected; either directly or indirectly, through intermediaries, or both, may be in communication with each other or in interaction with each other, unless expressly defined otherwise. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances.

In addition, if there is a description of "first", "second", etc. in the embodiments of the present utility model, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In addition, the meaning of "and/or" as it appears throughout includes three parallel schemes, for example "A and/or B", including the A scheme, or the B scheme, or the scheme where A and B are satisfied simultaneously. In addition, the technical solutions of the embodiments may be combined with each other, but it is necessary to base that the technical solutions can be realized by those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should be considered to be absent and not within the scope of protection claimed in the present utility model.

In the existing chip test structure, chips are often required to be placed on a special carrier film and are adsorbed on a carrier table for testing through the carrier film, the carrier film is often guaranteed to be tightly attached to the carrier table in a vacuum adsorption mode, however, in the existing structure, the vacuum adsorption is often used for enabling the periphery of the carrier film to be quickly attached and sealed with the carrier table, air is often remained in the middle area of the carrier film and cannot be effectively removed, and the carrier film is not smooth enough after being adsorbed, so that the effect of chip test is affected.

In order to solve the above technical problems, the present utility model provides a wafer carrier, which has a carrier end surface for attaching a chip carrier 600, wherein a ring groove is formed on the wafer carrier, the ring groove surrounds a circle along the circumference of the carrier end surface, a first exhaust hole 110 is formed on the wafer carrier, the first exhaust hole 110 is communicated with the ring groove, and is used for exhausting gas in the ring groove when the chip carrier 600 is attached to the carrier end surface; the side wall of the ring groove is perpendicular to the bearing end surface, and the first exhaust hole 110 is communicated with the bottom of the ring groove.

In the technical scheme of the utility model, the wafer bearing platform is provided with a bearing end surface, and the bearing end surface is used for placing a carrier film 600 with a chip for testing; the wafer bearing table is also provided with an annular groove, and the annular groove surrounds the circumference of the bearing end surface for a circle; in addition, the wafer supporting platform is further provided with a first exhaust hole 110, and the first exhaust hole 110 is communicated with the ring groove. In the chip testing process, the carrier film 600 provided with the chip can be attached to the bearing end face, the edge of the carrier film 600 seals the opening of the ring groove, at the moment, the first exhaust hole 110 can exhaust air in the ring groove out of the ring groove, the air pressure in the ring groove is gradually reduced because the carrier film 600 seals the opening of the ring groove, the carrier film 600 is pressed into the ring groove under the action of atmospheric pressure, the carrier film 600 is stretched flat on the bearing end face, the air between the carrier film 600 and the bearing end face can enter the ring groove through the edge of the bearing end face and is exhausted through the first exhaust hole 110, so that the flatness of the carrier film 600 after being adsorbed is ensured, and the adsorption stability of the carrier film 600 is also improved.

Specifically, as shown in fig. 1 to 3, a carrying end surface may be disposed on the carrying platform, the carrying end surface may be circular or rectangular to adapt to carrier films 600 with different shapes and specifications, a ring groove with an opening at the upper part is circumferentially disposed at the edge of the carrying end surface, and the ring groove separates the carrying end surface from other areas of the carrying platform; in addition, in order to facilitate the exhaust, the ring groove is further provided with a first exhaust hole 110, a first end of the first exhaust hole 110 is communicated with the space in the ring groove, and a second end of the first exhaust hole can extend to the edge of the wafer bearing platform along the direction deviating from the bearing end surface. In practical tests, the carrier film 600 carrying the chip can be placed on the carrying end surface, the edge area of the carrier film 600 can cover the opening of the ring groove and seal the ring groove, at this time, an annular vacuum cavity is formed inside the ring groove, and the vacuum cavity is communicated with the outside through the first exhaust hole 110 arranged in the ring groove; when the carrier film 600 is adsorbed, the second end of the first exhaust hole 110 may be connected to a vacuum pumping device, at this time, air in the vacuum cavity is drawn out through the first exhaust hole 110, a negative pressure environment is formed in the vacuum cavity, because the carrier film 600 has flexibility, a portion of the carrier film 600 fastened in an opening area of the ring groove is pressed into the ring groove under the action of atmospheric pressure, and because the ring groove is arranged around the bearing end surface, the carrier film 600 will be stretched on the bearing end surface under the pressing action, at this time, air between the carrier film 600 and the bearing end surface enters the ring groove to be discharged through the edge of the bearing end surface, and as the negative pressure in the vacuum cavity increases and the air between the carrier film 600 and the bearing end surface is continuously discharged, the carrier film 600 will be gradually attached to the bearing end surface. In this technical scheme, through seting up the annular at the terminal surface periphery that bears, make carrier film 600 can carry out preliminary flat on the one hand for carrier film 600 and the subsides of bearing the terminal surface are attached, on the other hand also provide the escape path for carrier film 600 and the air between the terminal surface that bears, have improved carrier film 600 absorptive roughness to the reliability of chip test has been improved. In addition, in order to further ensure the smooth escape of air between the carrier film 600 and the carrier end surface, the side wall of the ring groove can be perpendicular to the carrier end surface, so that the carrier film 600 cannot be attached to the side wall of the ring groove prematurely in the adsorption process, and the air can smoothly enter the vacuum cavity of the ring groove after leaving the edge of the carrier end surface, so that the carrier film 600 is more easily and completely attached to the carrier end surface. In order to ensure the smoothness of the air extraction in the vacuum chamber, the first vent hole 110 can be opened at the bottom of the ring groove, so that the first vent hole 110 is not blocked too early when the carrier film 600 is pressed into the ring groove, thereby ensuring the smoothness of the air extraction and being beneficial to improving the adsorption effect of the carrier film 600.

Further, the wafer carrier includes:

a base 100 provided with a first exhaust hole 110;

the supporting table 200 is arranged on the base table 100, the top surface of the supporting table 200 is used as a bearing end surface, and the side wall of the supporting table 200 is perpendicular to the bearing end surface; and

the first annular body 300 is disposed on the base 100, the first annular body 300 and the support table 200 are disposed at intervals, and the first annular body 300, the support table 200 and the base 100 together form a ring groove around the support table 200.

Specifically, as shown in fig. 1 to 4, in the present embodiment, the wafer carrying platform includes a base 100, the base 100 is a circular plate-shaped structural member, a supporting platform 200 is further disposed on the base 100, and the supporting platform 200 is a circular plate-shaped structural member; for convenience in detection, the center position on the base 100 is provided with a light hole, the support table 200 is arranged at the light hole and is coaxially arranged with the light hole, the support table 200 can be made of transparent materials such as glass, the upper end surface of the support table 200 is a plane, the plane is used as a bearing end surface of the bearing table, in actual use, the carrier film 600 can be placed on the upper end surface of the support table 200, detection equipment can be arranged below the base 100, the light detection equipment can be coaxially arranged with the light hole, and light rays emitted during chip testing can be projected onto the detection equipment through the light hole, so that chip detection is realized. In addition, the base 100 is further provided with a first annular body 300, the first annular body 300 is protruding on the base 100 and is located on the same side end surface of the base 100 as the supporting table 200, in this embodiment, the first annular body 300 and the base 100 may be integrally formed, the first annular body 300 is disposed around the supporting table 200 and is disposed at a certain distance from the outer peripheral surface of the supporting table 200, so that the annular groove is formed by surrounding the first annular body 300, the base 100 and the supporting table 200; in addition, the first vent hole 110 is opened on the base 100, one end of the second vent hole extends to the bottom of the groove, and the other end extends to the outer side surface of the base 100.

Further, the wafer carrier further includes a second annular body 400, where the second annular body 400 is disposed around the ring groove and around the support table 200 to position the support table 200. As shown in fig. 2 to 4, in order to facilitate the assembly of the base 100 and the support 200, the support further comprises a second annular body 400, wherein the second annular body 400 can be arranged at the bottom of the annular groove and extends around the periphery of the support 200, so that an annular step structure can be formed at the inner side of the second annular body 400, the support 200 can be embedded in the annular step, and the support 200 is limited by the annular step structure, thereby ensuring the stable assembly of the support 200 and the base 100 and facilitating the positioning of the support 200 on the base 100.

Further, the second annular body 400 has a gap between the inner sidewall and the outer sidewall of the support table 200, the second annular body 400 is provided with a second exhaust hole 120, one end of the second exhaust hole 120 is communicated with the first exhaust hole 110, and the other end extends to the inner sidewall of the first annular body 300.

Specifically, as shown in fig. 3, in order to further enhance the adsorption effect of the carrier on the carrier 600, in this embodiment, a gap may be disposed between the inner side wall of the second annular body 400 and the outer side wall of the support table 200, that is, a gap fit is formed between the second annular body 400 and the support table 200, in addition, a second exhaust hole 120 is disposed on the second annular body 400, the second exhaust hole 120 may extend along a direction perpendicular to the outer side surface of the support table 200, one end of the second exhaust hole 120 may be connected to the first exhaust hole 110, and the other end may extend toward one side of the support table 200 and extend to the inner side wall of the second annular body 400. In this way, in the adsorption process of the carrier film 600, as the vacuum pumping continues, the carrier film 600 is gradually pressed into the ring groove, the carrier film 600 is gradually attached to the side wall and the bottom of the ring groove, which will cause the first exhaust hole 110 to be blocked, and the air in the ring groove and between the carrier film 600 and the bearing end surface will stop being pumped out; at this time, since the material of the carrier film 600 has a certain elasticity, the carrier film 600 will not be completely adhered to the inner wall of the ring groove at the corner position of the bottom and the side wall of the ring groove, that is, at the junction area of the second annular body 400 and the supporting table 200, the carrier film 600 will form a cavity with the second annular body 400 and the supporting table 200, in this scheme, due to the existence of the second exhaust hole 120 and the clearance fit between the second annular body 400 and the supporting table 200, the air in the cavity can enter into the first exhaust hole 110 through the clearance and the second exhaust hole 120 and continue to be exhausted, under this action, the carrier film 600 will continue to receive the downward pressure towards the clearance, so that the carrier film 600 will be continuously stretched and stretched, thereby further improving the adhering effect of the carrier film 600 on the carrier film table. In addition, in order to increase the adsorption speed of vacuum adsorption, the sidewall of the second exhaust hole 120 facing the ring groove may be provided with an opening, and the opening may be communicated with the bottom of the ring groove, so that the opening is provided to enlarge the exhaust channel, thereby increasing the air exhausting speed in the ring groove and increasing the adsorption efficiency of the carrier film 600.

Further, the top surface of the support table 200 is higher than the top surface of the first annular body 300; and/or the bearing piece platform comprises a gasket 500, wherein the gasket 500 is embedded in the annular groove and surrounds the annular groove along the circumferential direction of the annular groove for adjusting the volume of the annular groove.

Specifically, in the existing chip testing field, in order to facilitate taking, placing and transferring of the carrier film 600, the carrier film 600 is often attached to the support ring 700, and taking, placing and transferring of the carrier film 600 are realized by taking, placing and transferring the support ring 700, in order to improve the adsorption effect of this type of structure, in this technical scheme, the top surface of the support table 200 may be higher than the top surface of the first annular body 300, that is, the bearing end surface may be higher than the height of the first annular body 300, so, when the carrier film 600 is transferred onto the bearing end surface, the bearing end surface will first contact the carrier film 600, a certain distance will be spaced between the support ring 700 and the first annular body 300 at the periphery of the carrier film 600, and the support ring 700 will descend under the action of gravity, and in this process, most of air between the carrier film 600 and the bearing end surface is also gradually attached and extruded, so that the carrier film 600 is primarily stretched, and the subsequent vacuum adsorption is facilitated.

In addition, as shown in fig. 5, in order to adapt to the carrier films 600 with different materials and thicknesses, the carrier table is further provided with a gasket 500, the gasket 500 may be an annular structural member, and the cross-sectional dimension of the annular groove and the size of the vacuum cavity can be adjusted by placing the gasket 500 in the annular groove, so that the pressure during adsorption and the deformation amount during adsorption of the carrier films 600 are adjusted, the adaptation to the carrier films 600 with different specifications is realized, and the universality of the carrier table is improved.

Further, the support table 200 is provided with a third vent hole 210, and the third vent hole 210 penetrates through the top surface and the bottom surface of the support table 200. As shown in fig. 2, 3 and 5, in order to further improve the adhesion effect of the carrier film 600, the support table 200 may be provided with a third air vent 210, and the third air vent 210 may extend along a direction perpendicular to the carrying end surface and penetrate through the support table 200, and by providing the third air vent 210, in the adsorption process of the carrier film 600, air between the carrier film 600 and the carrying end surface may escape through the third air vent 210, thereby further improving the adhesion degree between the carrier film 600 and the carrying end surface.

Further, a plurality of third exhaust holes 210 are formed, and the plurality of third exhaust holes 210 are arranged around the center of the support table 200; and/or, the first exhaust holes 110 are formed in plurality, and the plurality of first exhaust holes 110 are arranged at intervals along the circumferential direction of the support table 200.

As shown in fig. 2 and 3, a plurality of third exhaust holes 210 may be formed on the support table 200 to facilitate the exhaust of air from different areas of the carrier film 600. In addition, a plurality of first exhaust holes 110 can be formed, the plurality of first exhaust holes 110 are uniformly arranged at intervals along the circumferential direction of the support table 200, and by arranging the plurality of first exhaust holes 110, the speed of air discharge during adsorption of the carrier film 600 can be increased, which is favorable for increasing the attaching speed of the carrier film 600.

The utility model also provides a chip detection mechanism, which comprises:

the embodiment can be referred to for a specific structure of the wafer carrying platform, and the wafer carrying platform is used for adsorbing the chip to be detected; a kind of electronic device with high-pressure air-conditioning system

The detection probe is arranged above the wafer carrying platform and is used for detecting the chip to be detected on the wafer carrying platform.

The chip detection mechanism adopts all the technical schemes of all the embodiments, so that the chip detection mechanism has at least all the beneficial effects brought by the technical schemes of the embodiments, and is not described in detail herein.

The foregoing description is only of the optional embodiments of the present utility model, and is not intended to limit the scope of the utility model, and all the equivalent structural changes made by the description of the present utility model and the accompanying drawings or the direct/indirect application in other related technical fields are included in the scope of the utility model.

Claims (10)

1. The chip carrier is characterized by comprising a carrier end face and a ring groove, wherein the carrier end face is used for attaching a chip carrier film, the ring groove is formed in the carrier end face and surrounds a circle along the peripheral edge of the carrier end face, the carrier end face is provided with a first exhaust hole, the first exhaust hole is communicated with the ring groove and used for exhausting gas in the ring groove when the chip carrier film is attached to the carrier end face.

2. The wafer carrier of claim 1, wherein the side walls of the ring grooves are perpendicular to the load-bearing end surface.

3. The carrier as recited in claim 1 wherein the carrier comprises:

the base station is provided with a first exhaust hole;

the supporting table is arranged on the base table, the top surface of the supporting table is used as the bearing end surface, and the side wall of the supporting table is perpendicular to the bearing end surface; and

the first annular body is arranged on the base table, is arranged at intervals with the supporting table, and surrounds the supporting table along the circumferential direction of the supporting table for a circle, and the annular groove is formed by the first annular body, the supporting table and the base table together.

4. The wafer carrier of claim 3, wherein the first vent communicates with a bottom of the annular groove.

5. The carrier as recited in claim 4 further comprising a second annular body disposed about the annular groove and surrounding the support table for positioning the support table.

6. The wafer carrier of claim 5, wherein the inner side wall of the second annular body has a gap with the outer side wall of the support table, the second annular body is provided with a second vent hole, one end of the second vent hole is communicated with the first vent hole, and the other end of the second vent hole extends to the inner side wall of the first annular body.

7. The wafer carrier of claim 3, wherein a top surface of the support table is higher than a top surface of the first annular body; and/or the bearing piece platform comprises a gasket, wherein the gasket is embedded in the annular groove and surrounds the annular groove along the circumferential direction of the annular groove for adjusting the volume of the annular groove.

8. A wafer carrier as claimed in claim 3 wherein the support platform is provided with a third vent hole extending through the top and bottom surfaces of the support platform.

9. The wafer carrier of claim 8, wherein a plurality of third vent holes are provided, the plurality of third vent holes being disposed around a center of the support table; and/or the first exhaust holes are formed in a plurality, and the first exhaust holes are arranged at intervals along the circumferential direction of the supporting table.

10. A chip inspection mechanism, the chip inspection mechanism comprising:

a wafer carrying platform, wherein the wafer carrying platform is as set forth in any one of claims 1 to 9, and is used for adsorbing a chip to be detected; a kind of electronic device with high-pressure air-conditioning system

The detection probe is arranged above the chip bearing table and is used for detecting the chip to be detected on the chip bearing table.