CN219901853U

CN219901853U - Semiconductor product standing degree measuring clamp device

Info

Publication number: CN219901853U
Application number: CN202321087650.5U
Authority: CN
Inventors: 王翀; 纪往杰; 叶利发; 黄振忠
Original assignee: SHANTOU HUASHAN ELECTRONIC DEVICES CO Ltd
Current assignee: SHANTOU HUASHAN ELECTRONIC DEVICES CO Ltd
Priority date: 2023-05-08
Filing date: 2023-05-08
Publication date: 2023-10-27
Anticipated expiration: 2033-05-08

Abstract

The utility model provides a semiconductor product stands degree measurement fixture device, includes pressure needle, spring and anchor clamps, be equipped with the return channel on the anchor clamps, the pressure needle passes the spring and is pressed in the return channel by it. The pressing pin of the utility model supports and fixes the semiconductor device in the device groove, thereby ensuring the accuracy of measurement and the stability of product quality; the spring provides resilience force to ensure that the pressing needle always abuts against the semiconductor device; the pressing needle passes through the through hole and plays a role in guiding; the diameters of the limiting front section and the limiting rear section are both larger than the diameter of the limiting hole, and the sliding stroke of the pressing needle is limited; the hand-held section is arranged on the limit rear section, so that the operation is convenient; the limiting front section, the limiting middle section and the limiting rear section are detachably connected, so that the pressing needle can conveniently pass through the limiting hole and the through hole.

Description

Semiconductor product standing degree measuring clamp device

Technical Field

The utility model relates to a clamp device, in particular to a clamp device for measuring the standing degree of a semiconductor product, and belongs to the technical field of measuring devices.

Background

The semiconductor is required to measure the standing degree of the product after the rib cutting and forming, if the standing degree of the product exceeds the standard, the process loss and the hidden danger of the product quality can be caused, and all the factors must be monitored in the production process. In the traditional technology, only two small workpieces are used for fixing product positioning when the standing degree of a product is measured, and certain errors exist in the measuring process of the levelness and the verticality of the product, so that errors of measured data are easily caused.

Disclosure of Invention

In order to overcome the problems, the utility model provides a product standing degree measuring clamp device which is accurate in positioning and high in measuring efficiency.

In order to achieve the above purpose, the utility model adopts the following technical scheme: the utility model provides a semiconductor product stands degree measurement fixture device, includes pressure needle, spring and anchor clamps, be equipped with the return channel on the anchor clamps, the pressure needle passes the spring and is pressed in the return channel by it.

Preferably, the clamp is provided with a through hole, the through hole is communicated with the return groove, and the pressing needle penetrates through the through hole.

Preferably, a baffle is arranged on the side face of the clamp, and the pressing needle penetrates through the baffle.

Preferably, the pressure needle is including continuous toper head, spacing anterior segment, spacing middle section and the spacing back end in proper order, the toper head is arranged in the return channel, and spacing anterior segment passes the through-hole, and spacing middle section passes the baffle, and spacing back end is arranged in the baffle outside, and spacing anterior segment, spacing middle section and spacing back end are the detachable connection.

Preferably, the diameter of the conical head is larger than the diameter of the through hole, and the conical head is pressed in the return groove by a spring.

Preferably, the conical head comprises a cone and a conical head, the conical head being spring-pressed into the groove by the cone.

Preferably, the baffle is provided with a limiting hole, the diameter of the limiting middle section is smaller than that of the limiting hole, and the diameters of the limiting front section and the limiting rear section are larger than that of the limiting hole.

Preferably, the side surface of the return groove is provided with a device groove.

Preferably, the baffle is fixed on the side surface of the clamp through a screw.

Preferably, the side of the baffle is provided with a round hole, the side of the clamp is provided with a screw hole, and the screw penetrates through the round hole and is locked with the screw hole.

Preferably, the limit rear section is provided with a hand-held section.

Compared with the prior art, the utility model has the beneficial effects that: the pressing needle supports and fixes the semiconductor device in the device groove, so that the accuracy of measurement and the stability of product quality are ensured; the spring provides resilience force to ensure that the pressing needle always abuts against the semiconductor device; the pressing needle passes through the through hole and plays a role in guiding; the diameters of the limiting front section and the limiting rear section are both larger than the diameter of the limiting hole, and the sliding stroke of the pressing needle is limited; the hand-held section is arranged on the limit rear section, so that the operation is convenient; the limiting front section, the limiting middle section and the limiting rear section are detachably connected, so that the pressing needle can conveniently pass through the limiting hole and the through hole.

Drawings

The utility model is further described below with reference to the drawings and examples.

Fig. 1 is a schematic structural view of the present utility model.

Fig. 2 is an exploded view of the present utility model.

Fig. 3 is a schematic structural view of the press needle of the present utility model.

Fig. 4 is a state of use diagram of the present utility model.

Fig. 5 is a schematic diagram of the operation of the present utility model.

The names corresponding to the reference numerals in the figures are: the device comprises a 1-clamp, a 2-baffle, a 3-screw, a 4-pressing needle, a 5-semiconductor device, a 6-through hole, a 7-screw hole, an 8-device groove, a 9-limit hole, a 10-round hole, a 11-spring, a 12-conical head, a 13-cone, a 14-limit front section, a 15-limit middle section, a 16-limit rear section, a 17-hand-held section and a 18-return groove.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. Based on the embodiments of the present utility model, all other embodiments that may be obtained by a person of ordinary skill in the art without making any inventive effort fall within the scope of the present utility model.

As shown in fig. 1-5: the utility model provides a semiconductor product stands degree measurement fixture device, includes pressure needle 4, spring 11 and anchor clamps 1, be equipped with the return channel 18 on the anchor clamps 1, pressure needle 4 passes spring 11 and is pressed in the return channel 18 by it. The fixture 1 is provided with a through hole 6, the through hole 6 is communicated with a return groove 18, and the press needle 4 passes through the through hole 6. The side of the clamp 1 is provided with a baffle plate 2, and a pressing needle 4 passes through the baffle plate 2. The pressing needle 4 comprises a conical head part, a limiting front section 14, a limiting middle section 15 and a limiting rear section 16 which are sequentially connected, the conical head part is located in a return groove 18, the limiting front section 14 penetrates through the through hole 6 to play a guiding role, the limiting middle section 15 penetrates through the baffle 2, the limiting rear section 16 is located outside the baffle 2, and the limiting front section 14, the limiting middle section 15 and the limiting rear section 16 are detachably connected, so that the pressing needle 4 is convenient to penetrate through the limiting hole 9 and the through hole 6. The diameter of the conical head is larger than the diameter of the through hole 6, and the conical head is pressed in the return groove 18 by the spring 11. The conical head comprises a cone 13 and a conical head 12, the conical head 12 being pressed by a spring 11 through the cone 13 into a return groove 18. The baffle 2 is provided with a limiting hole 9, the diameter of a limiting middle section 15 is smaller than that of the limiting hole 9, and the diameters of a limiting front section 14 and a limiting rear section 16 are larger than that of the limiting hole 9, namely, the limiting middle section 15 is the stroke of the pressing needle 4. The side surface of the return groove 18 is provided with a device groove 8, and the semiconductor device 5 to be tested can be embedded into the device groove 8. The baffle 2 is fixed on the side face of the clamp 1 through the screw 3, a round hole 10 is formed in the side face of the baffle 2, a screw hole 7 is formed in the side face of the clamp 1, and the screw 3 penetrates through the round hole 10 and is locked with the screw hole 7 to fix the baffle 2. The limiting rear section 16 is provided with a handheld section 17 which is convenient for pulling out the pressing needle 4.

When the semiconductor device 5 is not installed, the pressing needle 4 is abutted against the side face of the device groove 8 under the action force of the spring 11; during measurement, the pressing needle 4 is pulled open, the semiconductor device 5 to be measured is placed in the device groove 8, after the pressing needle 4 is loosened, the conical head 12 of the pressing needle 4 props against the semiconductor device 5 under the action of the resilience force of the spring 11, so that the loosening of the semiconductor device 5 is prevented, and the standing degree of the semiconductor device 5 is unchanged at the moment, so that measurement can be performed.

Claims

1. The utility model provides a semiconductor product stands degree measurement anchor clamps device, includes pressure needle and anchor clamps, its characterized in that: the clamp is provided with a return groove, the pressing needle is positioned in the return groove, and one end of the pressing needle is connected with the clamp through a spring.

2. A semiconductor product standup measuring fixture device as defined in claim 1, wherein: the fixture is provided with a through hole, one end of the through hole is connected with the return groove, and the pressing needle is in sliding connection with the through hole.

3. A semiconductor product standing position measuring jig device according to claim 2, wherein: the needle pressing device is characterized in that a conical head is arranged on the needle pressing device and located in the return groove, the diameter of the conical head is larger than that of the through hole, and the conical head is connected with the clamp through a spring.

4. A semiconductor product standing position measuring jig device according to claim 3, wherein: the conical head comprises a cone and a conical head, and the cone is connected with the clamp through a spring.

5. A semiconductor product standing position measuring jig device according to claim 2, wherein: the fixture is characterized in that a baffle is arranged on the side face of the fixture, a limiting hole is formed in the baffle and coaxial with the through hole, the diameter of the limiting hole is smaller than that of the through hole, a limiting front section, a limiting middle section and a limiting rear section are arranged on the pressing needle and are respectively located on two sides of the baffle, the diameter of the limiting front section is between that of the through hole and that of the limiting hole, the diameter of the limiting rear section is larger than that of the limiting hole, and the limiting middle section penetrates through and is in sliding connection with the limiting hole.

6. A semiconductor product standup measuring fixture device as defined in claim 1, wherein: and a device groove is formed in the side face of the return groove.

7. A semiconductor product standup measuring fixture device as defined in claim 5, wherein: the baffle is fixed on the side face of the clamp through screws.

8. A semiconductor product standup measuring fixture device as defined in claim 7, wherein: the baffle side is equipped with the round hole, and the anchor clamps side is equipped with the screw hole, and the screw passes the round hole and locks with the screw hole.

9. A semiconductor product standup measuring fixture device as defined in claim 5, wherein: the limiting rear section is provided with a handheld section.

10. A semiconductor product standup measuring fixture device as defined in claim 5, wherein: the limiting front section, the limiting middle section and the limiting rear section are all detachably connected.