CN219900021U - Electronic element pin bending device and processing equipment - Google Patents

Abstract

The utility model discloses an electronic element pin bending device and processing equipment, which are used for electronic elements and components, and comprise a frame, a fixed lower die, a fixed upper die and a stamping part, wherein the fixed lower die is arranged on the frame, and the upper surface of the fixed lower die is used for bearing an element body; the fixed upper die is movably arranged at the upper end of the fixed lower die, the fixed upper die comprises an upper die body, a pressing piece and an elastic piece, the pressing piece is arranged at the lower side of the upper die body, the elastic piece is arranged between the pressing piece and the upper die body, and the pressing piece is matched with the fixed lower die to press the first section of the pin; the stamping part is movably arranged on one side of the fixed lower die, and the stamping part is stamped to bend the second section of the pin. According to the electronic element pin bending device provided by the embodiment of the utility model, the compression piece can compress the first section of the pin, the component body is not influenced by the tensile stress when the second section of the pin is bent, the damage to the component body can be avoided, and the reliability of the electronic element in use can be ensured.

Description

Electronic element pin bending device and processing equipment

Technical Field

The utility model relates to the technical field of electronic element application, in particular to an electronic element pin bending device and processing equipment.

Background

In the related art, when the pins of the electronic component are bent and formed, the device body of the electronic component is generally used as a fixing surface, and in the bending and forming process, the pressure applied by the stamping part to the pins can bring damage risk to the internal structure of the electronic component, and in the heating process of the electronic component, the electronic component has failure risk.

Disclosure of Invention

The present utility model aims to solve at least one of the technical problems existing in the prior art. Therefore, an object of the present utility model is to provide an electronic component pin bending device, in which a pressing member for fixing an upper die can press a first section of a pin of an electronic component, and when a stamping part presses a second section of the pin to bend, a component body is not affected by a tensile stress when the second section of the pin is bent, so that damage to the component body can be avoided, and reliability of the electronic component in use can be ensured.

According to the embodiment of the utility model, the electronic element pin bending device is used for electronic elements and devices and comprises: a frame; the fixed lower die is arranged on the rack, and the upper surface of the fixed lower die is used for bearing the component body; the fixed upper die is movably arranged at the upper end of the fixed lower die and comprises an upper die body, a pressing piece and an elastic piece, wherein the pressing piece is arranged at the lower side of the upper die body, the elastic piece is arranged between the pressing piece and the upper die body, and the pressing piece is suitable for being matched with the fixed lower die to press the first section of the pin; and the stamping part is movably arranged on one side of the fixed lower die and is suitable for stamping the second section of the bending pin.

According to the electronic element pin bending device provided by the embodiment of the utility model, the first section of the pin of the electronic element can be pressed by the combined action of the pressing piece, the elastic piece and the fixed lower die of the fixed upper die, and when the second section of the pin is bent by stamping the stamping piece, the element body is not influenced by the tensile stress when the second section of the pin is bent, so that the element body is prevented from being damaged, and the reliability of the electronic element in use can be ensured.

According to some embodiments of the utility model, a positioning groove for accommodating the component body is formed in the upper surface of the fixed lower die, and the shape of the positioning groove is matched with that of the component body.

According to some embodiments of the utility model, a positioning column is arranged in the positioning groove, and a positioning hole matched with the positioning column is formed on the component body.

According to some embodiments of the utility model, at least one side of the positioning groove is provided with a buckling groove communicated with the positioning groove.

According to some embodiments of the utility model, the upper surface of the fixed lower die comprises a first table top and a second table top arranged on one side of the first table top, the second table top is positioned on the lower side of the first table top, the positioning groove is positioned on one side of the first table top adjacent to the second table top, the first section is positioned on the second table top, and the pressing piece is matched with the second table top to press the first section.

According to some embodiments of the utility model, the second table has a first region and a second region on a side of the first region remote from the first table, the first region being opposite the hold-down member, a lower region of a side of the stamping toward the fixed lower die being recessed in a direction remote from the fixed lower die to construct a third table opposite the second region, a pressing surface opposite the side of the fixed lower die toward the stamping.

According to some embodiments of the utility model, at least part of the pressing surface is inclined in a top-down direction towards a direction away from the fixed lower die.

According to some embodiments of the utility model, a partial region of the lower surface of the pressing element, which is remote from the stamping part, has an upwardly concave relief groove, which is opposite to the positioning groove.

According to some embodiments of the utility model, the positioning grooves are provided in plurality, and the positioning grooves are spaced apart along the direction perpendicular to the pins.

According to some embodiments of the utility model, a partial region of the lower surface of the upper die body facing one side of the stamping is recessed toward the upper side to construct a mounting groove accommodating the pressing member, the elastic member is connected between a bottom wall of the mounting groove and a top wall of the pressing member, and the lower surface of the upper die body is adapted to abut against the upper surface of the fixed lower die to press the elastic member.

A processing apparatus according to an embodiment of the second aspect of the present utility model includes an electronic component pin bending device according to the embodiment of the first aspect of the present utility model.

According to the processing equipment provided by the embodiment of the utility model, by arranging the electronic element pin bending device, when the second section of the pin is bent by stamping, the component body is not influenced by the tensile stress when the second section is bent, so that the damage to the component body can be avoided, and the reliability of the electronic component in use can be ensured.

Additional aspects and advantages of the utility model will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the utility model.

Drawings

The foregoing and/or additional aspects and advantages of the utility model will become apparent and may be better understood from the following description of embodiments taken in conjunction with the accompanying drawings in which:

FIG. 1 is a perspective view of an electronic component pin bending device bending pins according to some embodiments of the present utility model;

FIG. 2 is an exploded view of the electronic component pin bending device of FIG. 1 when bending pins;

FIG. 3 is a perspective view of the electronic component pin bending apparatus of FIG. 1 with the stamping not stamping pins;

fig. 4 is a schematic diagram of the electronic component pin bending device in fig. 1 when bending pins.

Reference numerals:

100. a pin bending device for electronic components;

10. fixing a lower die; 11. a positioning groove; 111. positioning columns; 12. a first mesa; 13. a second mesa; 14. a second mounting hole;

20. fixing an upper die; 21. an upper die body; 211. a mounting groove; 22. a pressing member; 221. an avoidance groove; 23. an elastic member; 24. a first mounting hole;

30. stamping parts; 31. a third mesa; 32. extruding the surface;

40. an electronic component; 41. a component body; 411. positioning holes; 42. pins; 421. a first section; 422. and a second section.

Detailed Description

Embodiments of the present utility model are described in detail below, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functions throughout. The embodiments described below by referring to the drawings are illustrative only and are not to be construed as limiting the utility model.

An electronic component pin bending apparatus 100 according to an embodiment of the present utility model is described below with reference to fig. 1-4.

Referring to fig. 1 to 4, an electronic component pin bending apparatus 100 is used for an electronic component 40, the electronic component 40 includes a component body 41 and pins 42, the pins 42 are connected to one side of the component body 41, and the electronic component pin bending apparatus 100 is used for bending the pins 42. The electronic component 40 may include a plurality of pins 42, and the plurality of pins 42 may be connected to one side of the component body 41 at intervals. The electronic component pin bending apparatus 100 includes a frame, a fixed lower die 10, a fixed upper die 20, and a stamping 30, the fixed lower die 10 being mounted on the frame, for example, a first mounting hole 24 may be formed on the fixed upper die 20, a second mounting hole 14 may be formed on the fixed lower die 10, and the fixed lower die 10 and the fixed upper die 20 may be mounted on the frame through the first mounting hole 24 and the second mounting hole 14.

The upper surface of the fixed lower die 10 is used for bearing the component body 41, and the component body 41 can be placed on the upper surface of the fixed lower die 10. The pin 42 of the electronic component 40 includes a first section 421 and a second section 422, the first section 421 is adjacent to the component body 41, and the second section 422 is connected to one end of the first section 421 far away from the component body 41, the first section 421 is located on the fixed lower die 10 of the electronic component pin bending device 100, and the second section 422 is located outside the fixed lower die 10. The fixed upper die 20 is disposed at an upper end of the fixed lower die 10, and the fixed upper die 20 is movable with respect to the fixed lower die 10. The fixed upper die 20 includes an upper die body 21, a pressing member 22, and an elastic member 23, the pressing member 22 is disposed at the lower side of the upper die body 21, the elastic member 23 is disposed between the pressing member 22 and the upper die body 21, and the pressing member 22 is adapted to cooperate with the fixed lower die 10 to press the first section 421 of the pin 42. The electronic component 40 may include a plurality of pins 42, where the thicknesses of the pins 42 may be different, and when the pressing member 22 is matched with the fixed lower die 10 to press the first sections 421 of the pins 42, the elastic action of the elastic member 23 may enable the pressing member 22 to press the first sections 421 of each pin 42. For example, the elastic member 23 may be a spring.

Stamping 30 is movably mounted to one side of fixed lower die 10, and stamping 30 is adapted to stamp second section 422 of bent pin 42. When the electronic component 40 is mounted, the stamping 30 may be moved downward to stamp the second section 422 of the pin 42 and bend the second section 422 of the pin 42.

When the electronic component pin bending device 100 is required to punch and bend the pins 42 of the electronic component 40, the electronic component 40 can be placed on the upper surface of the fixed lower die 10, the fixed upper die 20 can move downwards, the pressing piece 22 of the fixed upper die 20 is matched with the fixed lower die 10 to press the first sections 421 of the pins 42, the pressing piece 22 can only generate acting force on the first sections 421 of the pins 42, the pressing piece 22 does not rigidly and fixedly support the component body 41, when the stamping piece 30 punches to bend the second sections 422 of the pins 42, the component body 41 is not influenced by the tensile stress when the second sections 422 of the pins 42 are bent, damage to the component body 41 can be avoided, and the reliability of the electronic component 40 in use can be ensured.

According to the electronic component pin bending device 100 of the embodiment of the utility model, the pressing member 22 and the elastic member 23 of the fixed upper die 20 and the fixed lower die 10 cooperate to press the first section 421 of the pin 42 of the electronic component 40, and when the second section 422 of the pin 42 is bent by punching part 30, the component body 41 is not affected by the tensile stress when the second section 422 of the pin 42 is bent, so that damage to the component body 41 can be avoided, and the reliability of the electronic component 40 in use can be ensured.

According to some embodiments of the present utility model, referring to fig. 1 to 4, a positioning groove 11 is provided on an upper surface of a fixed lower mold 10, and a component body 41 may be accommodated in the positioning groove 11, and a shape of the positioning groove 11 is adapted to a shape of the component body 41. When the electronic component pin bending device 100 is required to bend the second section 422 of the pin 42 of the electronic component 40, the component body 41 of the electronic component 40 can be placed in the positioning groove 11, the positioning groove 11 can accurately position the component body 41, and then the electronic component 40 can be accurately positioned, namely, the second section 422 of the pin 42 can be accurately positioned, so that the stamping part 30 can accurately stamp the second section 422 of the pin 42.

According to some embodiments of the present utility model, referring to fig. 1-4, a positioning column 111 is disposed in the positioning slot 11, a positioning hole 411 is formed on the component body 41, and the positioning column 111 is matched with the positioning hole 411, so that the component body 41 can be further precisely positioned, and further, the electronic component 40 can be precisely positioned, that is, the second section 422 of the pin 42 can be precisely positioned.

According to some embodiments of the present utility model, referring to fig. 1 to 4, at least one side of the positioning groove 11 is provided with a fastening groove, the fastening groove is communicated with the positioning groove 11, one side of the positioning groove 11 may be provided with a fastening groove, or both sides of the positioning groove 11 may be provided with fastening grooves, the fastening groove may facilitate an operator or an operation tool to place or remove the electronic component 40, so that the operator or the operation tool may place or remove the electronic component 40 quickly and conveniently.

According to some embodiments of the present utility model, referring to fig. 1-4, the upper surface of the fixed lower die 10 includes a first mesa 12 and a second mesa 13, the second mesa 13 is disposed at one side of the first mesa 12, and the second mesa 13 is disposed at the lower side of the first mesa 12, so that the mounting of the electronic component 40 can be facilitated. The positioning groove 11 is located on one side of the first table top 12 adjacent to the second table top 13, the component body 41 can be accommodated in the positioning groove 11, the first section 421 of the pin 42 is located on the second table top 13, and the pressing piece 22 is matched with the second table top 13 to press the first section 421 of the pin 42, so that the stamping part 30 can press the second section 422 of the bent pin 42.

According to some embodiments of the utility model, referring to fig. 1-4, the second table 13 has a first region and a second region, the second region being located on a side of the first region remote from the first table 12, the first region being opposite the hold-down member 22. The lower region of the side of the stamping 30 facing the fixed lower die 10 is recessed away from the fixed lower die 10 to form a third land 31 opposite the second region to form a pressing surface 32 opposite the side of the fixed lower die 10 facing the stamping 30, the pressing surface 32 being capable of pressing and bending the second segment 422 of the pin 42.

According to some embodiments of the present utility model, referring to fig. 1-4, at least a portion of the pressing surface 32 of the stamping 30 is inclined in a direction away from the fixed lower die 10 in a top-down direction, and a portion of the pressing surface 32 may be inclined in a direction away from the fixed lower die 10. As the stamping 30 presses down on the second section 422 of the pin 42, a portion of the pressing surface 32 is inclined away from the fixed lower die 10, which may facilitate the stamping 30 pressing down on the second section 422 of the pin 42.

According to some embodiments of the present utility model, referring to fig. 1 to 4, a partial area of the lower surface of the pressing member 22 away from the stamping part 30 has an upwardly concave avoidance groove 221, where the avoidance groove 221 is vertically opposite to the positioning groove 11, the avoidance groove 221 may be used to avoid the component body 41, and the avoidance groove 221 and the positioning groove 11 define an avoidance space for avoiding the component body 41, so that the lower surface of the pressing member 22 presses the component body 41, and damage to the component body 41 may be avoided.

According to some embodiments of the present utility model, referring to fig. 1-4, the positioning slots 11 are provided in a plurality, the positioning slots 11 are spaced apart along a direction perpendicular to the pins 42, the component bodies 41 of the plurality of electronic components 40 may be accommodated in the positioning slots 11, and the electronic component pin bending device 100 may bend the pins 42 of the plurality of electronic components 40 at the same time, so as to improve the bending efficiency of the pins 42 of the electronic components 40.

According to some embodiments of the present utility model, referring to fig. 1 to 4, a partial region of the lower surface of the upper die body 21 toward one side of the stamping 30 is recessed toward the upper side to construct a mounting groove 211 accommodating the pressing member 22, the elastic member 23 is connected between the bottom wall of the mounting groove 211 and the top wall of the pressing member 22, the lower surface of the upper die body 21 is adapted to abut against the upper surface of the fixed lower die 10 to press the elastic member 23, and the elastic member 23 may press the pressing member 22 downward. By disposing the elastic member 23 between the bottom wall of the mounting groove 211 and the top wall of the pressing member 22, the elastic member 23 can enable the pressing member 22 to elastically press the second section 422 of the pin 42, so as to avoid that the pressing member 22 cannot press the second section 422 of the pin 42 due to different thicknesses of the second section 422 of the pin 42.

An electronic component pin bending apparatus 100 according to one embodiment of the present utility model is described below with reference to fig. 1-4.

In this embodiment, the electronic component pin bending apparatus 100 is used for the electronic component 40, the electronic component 40 includes a component body 41 and pins 42, and the electronic component pin bending apparatus 100 is used for bending the pins 42 of the electronic component 40. The electronic component pin bending apparatus 100 includes a frame, a fixed lower die 10, a fixed upper die 20, and a stamping 30, wherein a first mounting hole 24 may be formed in the fixed upper die 20, a second mounting hole 14 may be formed in the fixed lower die 10, and the fixed lower die 10 and the fixed upper die 20 may be mounted to the frame through the first mounting hole 24 and the second mounting hole 14. Stamping 30 is adapted to be stamped to bend pin 42.

The pin 42 includes a first section 421 and a second section 422, the first section 421 is adjacent to the component body 41, and the second section 422 is connected to an end of the first section 421 away from the component body 41, the first section 421 is located on the fixed lower die 10 of the pin bending device 100, and the second section 422 is located outside the fixed lower die 10. The fixed upper die 20 includes an upper die body 21, a pressing member 22, and an elastic member 23, the pressing member 22 is disposed at the lower side of the upper die body 21, the elastic member 23 is disposed between the pressing member 22 and the upper die body 21, and the pressing member 22 can be engaged with the fixed lower die 10 to press the first section 421 of the pin 42.

The stamping 30 is movably mounted on one side of the fixed lower die 10, and when the electronic component 40 is mounted, the stamping 30 can move downward to stamp the second section 422 of the pin 42, and the second section 422 of the pin 42 is bent.

The upper surface of the fixed lower die 10 includes a first mesa 12 and a second mesa 13, the second mesa 13 is disposed on one side of the first mesa 12, and the second mesa 13 is disposed on the lower side of the first mesa 12, which can facilitate the installation of the electronic component 40. The first section 421 of the pin 42 is located on the second land 13 and the compression member 22 cooperates with the second land 13 to compress the first section 421 of the pin 42 to facilitate stamping the second section 422 of the bent pin 42 by the stamping 30.

The second table top 13 has a first region and a second region, the second region being located on a side of the first region remote from the first table top 12, the first region being opposite the hold-down member 22. A lower region of the side of the stamping part 30 facing the fixed lower die 10 is recessed in a direction away from the fixed lower die 10 to construct a third land 31 opposite to the second region to construct a pressing surface 32 opposite to the side of the fixed lower die 10 facing the stamping part 30. A portion of the pressing surface 32 is inclined away from the fixed lower die 10, so that the pressing surface 32 can press the second segment 422 of the bent pin 42 when the pressing member 30 presses the second segment 422 of the pin 42 downward, which can facilitate the pressing of the second segment 422 of the pin 42 downward by the pressing member 30.

The upper surface of one side of first mesa 12 near second mesa 13 sets up a plurality of constant head tanks 11, and a plurality of constant head tanks 11 are along the direction interval setting of perpendicular to pin 42, and the shape of constant head tank 11 and the shape looks adaptation of components and parts body 41, and the components and parts body 41 of a plurality of electronic components 40 can hold in a plurality of constant head tanks 11, and pin bending device 100 can bend the pin 42 of a plurality of electronic components 40 simultaneously, can improve the efficiency that the pin 42 of electronic components 40 was bent. The component body 41 of the electronic component 40 can be placed in the positioning groove 11, and the positioning groove 11 can accurately position the component body 41, so that the electronic component 40 can be accurately positioned. The positioning column 111 is arranged in the positioning groove 11, the positioning hole 411 is formed on the component body 41, and the positioning column 111 is matched with the positioning hole 411, so that the component body 41 can be further positioned accurately. Both sides of the positioning groove 11 are provided with buckling grooves, which can facilitate the placement or removal of the electronic component 40 by an operator or an operating tool.

The partial area of the lower surface of the pressing member 22 far away from the stamping part 30 is provided with an upward concave avoidance groove 221, the avoidance groove 221 is opposite to the positioning groove 11 up and down, the avoidance groove 221 can be used for avoiding the component body 41, the avoidance groove 221 and the positioning groove 11 define an avoidance space for avoiding the component body 41, and the lower surface of the pressing member 22 can be prevented from pressing the component body 41.

The lower surface of the upper die body 21 is recessed toward the upper side toward a partial region of one side of the pressing member 30 to construct a mounting groove 211 accommodating the pressing member 22, the elastic member 23 is connected between the bottom wall of the mounting groove 211 and the top wall of the pressing member 22, the lower surface of the upper die body 21 is adapted to abut against the upper surface of the fixed lower die 10 to press the elastic member 23, and the elastic member 23 can press the pressing member 22 downward. The elastic member 23 can enable the pressing member 22 to elastically press the second section 422 of the pin 42, so as to avoid that the pressing member 22 cannot press the second section 422 of the pin 42 due to different thicknesses of the second section 422 of the pin 42.

When the electronic component pin bending device 100 is required to press and bend the second section 422 of the pin 42 of the electronic component 40, the electronic component 40 may be placed in the positioning slot 11 of the fixed lower die 10, the fixed upper die 20 may be moved downward, the pressing member 22 of the fixed upper die 20 cooperates with the fixed lower die 10 to press the first section 421 of the pin 42, and then the pressing member 30 is pressed and moved downward to bend the second section 422 of the pin 42. After the pin 42 is bent, the stamping part 30 can move upwards, the fixed lower die 10 can move upwards, and the bent electronic component 40 can be taken out from the positioning groove 11.

A processing apparatus according to an embodiment of the second aspect of the present utility model includes the electronic component pin bending apparatus 100 according to the embodiment of the first aspect of the present utility model described above.

According to the processing equipment provided by the embodiment of the utility model, by arranging the electronic element pin bending device 100, when the second section 422 of the pin 42 is bent by punching, the component body 41 is not affected by the tensile stress when the second section 422 is bent, so that the component body 41 is prevented from being damaged, and the reliability of the electronic element 40 in use can be ensured.

In the description of the present utility model, it should be understood that the directions or positional relationships indicated by the terms "upper", "lower", "front", "rear", "left", "right", etc., are based on the directions or positional relationships shown in the drawings, are merely for convenience of describing the present utility model and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the present utility model. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present utility model, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.

In the description of the present utility model, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances.

In the description of the present specification, reference to the terms "some embodiments," "optionally," "further," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the utility model. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

While embodiments of the present utility model have been shown and described, it will be understood by those of ordinary skill in the art that: many changes, modifications, substitutions and variations may be made to the embodiments without departing from the spirit and principles of the utility model, the scope of which is defined by the claims and their equivalents.

Claims (11)

1. An electronic component pin bending device for an electronic component, comprising:

a frame;

the fixed lower die is arranged on the rack, and the upper surface of the fixed lower die is used for bearing the component body;

the fixed upper die is movably arranged at the upper end of the fixed lower die and comprises an upper die body, a pressing piece and an elastic piece, wherein the pressing piece is arranged at the lower side of the upper die body, the elastic piece is arranged between the pressing piece and the upper die body, and the pressing piece is suitable for being matched with the fixed lower die to press the first section of the pin;

and the stamping part is movably arranged on one side of the fixed lower die and is suitable for stamping the second section of the bending pin.

2. The electronic component pin bending device according to claim 1, wherein a positioning groove for accommodating the component body is formed in the upper surface of the fixed lower die, and the shape of the positioning groove is adapted to the shape of the component body.

3. The electronic component pin bending device according to claim 2, wherein a positioning column is arranged in the positioning groove, and a positioning hole matched with the positioning column is formed in the component body.

4. The electronic component pin bending device according to claim 2, wherein at least one side of the positioning groove is provided with a buckling groove communicated with the positioning groove.

5. The electronic component pin bending device according to claim 2, wherein the upper surface of the fixed lower die comprises a first table top and a second table top arranged on one side of the first table top, the second table top is positioned on the lower side of the first table top, the positioning groove is positioned on one side of the first table top adjacent to the second table top, the first section is positioned on the second table top, and the pressing piece is matched with the second table top to press the first section.

6. The electronic component pin bending apparatus according to claim 5, wherein the second land has a first region and a second region located on a side of the first region away from the first land, the first region being opposite to the pressing member, and a lower region of a side of the pressing member facing the fixed lower die is recessed in a direction away from the fixed lower die to construct a third land opposite to the second region, a pressing surface opposite to a side of the fixed lower die facing the pressing member.

7. The electronic component pin bending apparatus according to claim 6, wherein at least part of the pressing surface is inclined in a direction away from the fixed lower die in a top-down direction.

8. The electronic component pin bending device according to claim 6, wherein a partial region of the lower surface of the pressing member away from the pressing member has an upwardly recessed escape groove, the escape groove being vertically opposed to the positioning groove.

9. The electronic component pin bending apparatus according to claim 2, wherein a plurality of the positioning grooves are provided, and a plurality of the positioning grooves are provided at intervals in a direction perpendicular to the pins.

10. The electronic component pin bending apparatus according to claim 1, wherein a partial region of a lower surface of the upper die body facing one side of the pressing member is recessed toward an upper side to construct a mounting groove accommodating the pressing member, the elastic member is connected between a bottom wall of the mounting groove and a top wall of the pressing member, and the lower surface of the upper die body is adapted to abut against an upper surface of the fixed lower die to press the elastic member.

11. A processing apparatus comprising an electronic component pin bending device according to any one of claims 1-10.