CN219892165U

CN219892165U - Semiconductor wafer washs anchor clamps

Info

Publication number: CN219892165U
Application number: CN202321081947.0U
Authority: CN
Inventors: 廖彬; 张昌文; 周铁军; 曾琪; 王驭辉; 翁吉露
Original assignee: Guangdong Vital Micro Electronics Technology Co Ltd
Current assignee: Guangdong Vital Micro Electronics Technology Co Ltd
Priority date: 2023-05-08
Filing date: 2023-05-08
Publication date: 2023-10-24
Anticipated expiration: 2033-05-08

Abstract

The utility model discloses a semiconductor wafer cleaning clamp, which relates to the technical field of semiconductor processing and comprises a connecting plate and a clamping module; a first connecting structure is arranged at one end position on one side surface of the connecting plate; a second connecting structure is arranged at the other end of one side surface of the connecting plate; the clamping module comprises a module body and two wafer clamping jaws; the module body is provided with a third connecting structure which is detachably connected and matched with the second connecting structure; two movable parts which can be opened or closed and matched are arranged on the module body; the two wafer clamping jaws are detachably connected to the two movable parts in a one-to-one correspondence. The serial connection of the robot and the wafer is realized, the process of clamping, cleaning and carrying the wafer by the robot is ensured to be stable and repeatable, and the problem of low stability of manually cleaning the wafer is effectively solved. In addition, the wafer clamping jaw is detachably matched with the movable part on the module body, the correspondingly-adapted wafer clamping jaw can be replaced according to the wafer size, and the applicability is better.

Description

Semiconductor wafer washs anchor clamps

Technical Field

The utility model relates to the technical field of semiconductor processing, in particular to a semiconductor wafer cleaning clamp.

Background

In the final cleaning process of compound semiconductor wafers, since the surfaces of the compound semiconductor wafers are active, most wafers are manually cleaned, and the stability and repeatability of the wafer cleaning are a challenge, and the requirements on people are not high. In addition, the cleaning of wafers is often performed with some strong acids and strong bases, which is also a challenge for human safety.

Along with the continuous promotion of production level, intelligent manufacturing is for the trend of developing, and intelligent robot gradually is used for replacing manpower production, and robot automation has not only reduced manufacturing cost, improves production efficiency and the quality of product, has also improved safe production level. Therefore, development of robots to replace manual cleaning of wafers is also becoming important, but different industries have different requirements on the use of robots, and currently, for cleaning of semiconductor wafers, a problem still faces how to solve the problem of stability and repeatability of clamping, cleaning and transporting of wafers by using robots.

Disclosure of Invention

Therefore, the utility model aims to provide a semiconductor wafer cleaning clamp, so as to realize the serial connection of a robot and a wafer, ensure that the process of clamping, cleaning and carrying the wafer by the robot is stable and repeatable, and effectively solve the problem of low stability of manually cleaning the wafer.

In order to achieve the technical purpose, the utility model provides a semiconductor wafer cleaning clamp, which comprises a connecting plate and a clamping module;

a first connecting structure is arranged at one end position on one side surface of the connecting plate;

a second connecting structure is arranged at the other end of one side surface of the connecting plate;

the clamping module comprises a module body and two wafer clamping jaws;

the module body is provided with a third connecting structure which is detachably connected and matched with the second connecting structure;

two movable parts which can be opened or closed and matched are arranged on the module body;

the two wafer clamping jaws are detachably connected to the two movable parts in a one-to-one correspondence mode.

Further, the first connection structure includes a flange hole, a plurality of first fixing counter bores disposed around the flange hole, and a plurality of positioning holes disposed around the flange hole.

Further, the second connecting structure comprises a limiting groove and a plurality of first fixing threaded holes;

one end of the limiting groove extends out of the other end of the connecting plate for the movable insertion of the clamping module;

the first fixing threaded hole is formed in the limiting groove;

the third connecting structure comprises a plurality of second fixing threaded holes which are in one-to-one correspondence with the first fixing threaded holes.

Further, the module body is a pneumatic clamping module.

Further, the module body includes a main structure and a pneumatic assembly;

the pneumatic assembly comprises a shell and two telescopic devices;

the shell is mounted on the main body structure;

the two telescopic devices are arranged in the shell, are oppositely arranged along the first linear direction and are also staggered along the second linear direction perpendicular to the first linear direction;

the two telescopic devices comprise a cylinder body, a piston body, a rod body and a connecting piece;

the piston body is slidably arranged in the cylinder body to divide the cylinder body into a first chamber and a second chamber;

one end of the rod body is connected with the piston body, and the other end of the rod body movably extends out of the cylinder body;

one end of the connecting piece is connected with one end of the rod body extending out of the cylinder body, and the other end of the connecting piece extends out of the shell body to form the movable part;

at least two air passages are arranged on the main body structure;

one air passage is communicated with the first chambers of the two cylinders, and the other air passage is communicated with the second chambers of the two cylinders.

Further, the shell is provided with an avoidance hole for the connecting piece to extend out and limiting the movement of the connecting piece.

Further, an opening is formed in one side, away from the main body structure, of the shell;

and the opening is detachably provided with a cover plate.

Further, a second fixed counter bore is formed in the wafer clamping jaw;

and a third fixed threaded hole which is detachably connected and matched with the second fixed counter bore is formed in the movable part.

Further, an anti-slip pad is paved on the clamping surface of the wafer clamping jaw.

Further, the anti-slip pad is a silica gel pad.

According to the technical scheme, the semiconductor wafer cleaning clamp comprises the connecting plate and the clamping module, wherein a first connecting structure for connecting a robot is arranged at one end of one side surface of the connecting plate, and a second connecting structure is arranged at the other end of the connecting plate. The clamping module is designed to comprise a module body and two wafer clamping jaws, wherein the module body is detachably connected with the connecting plate through a third connecting structure which is detachably connected with the second connecting structure, and then the module body is arranged on the robot through the connecting plate, so that the serial connection of the robot and the wafer is realized, the process of clamping, cleaning and carrying the wafer by the robot is ensured to be stable and repeatable, and the problem of low stability of manually cleaning the wafer is effectively solved. In addition, the wafer clamping jaw is detachably matched with the movable part on the module body, the correspondingly-adapted wafer clamping jaw can be replaced according to the wafer size, and the applicability is better.

Drawings

In order to more clearly illustrate the embodiments of the utility model or the technical solutions of the prior art, the drawings which are used in the description of the embodiments or the prior art will be briefly described, it being obvious that the drawings in the description below are only some embodiments of the utility model, and that other drawings can be obtained from these drawings without inventive faculty for a person skilled in the art.

FIG. 1 is an exploded view of a semiconductor wafer cleaning jig according to the present utility model;

FIG. 2 is a schematic view of a connection plate of a semiconductor wafer cleaning jig according to the present utility model;

FIG. 3 is a schematic view of a chuck module of a semiconductor wafer cleaning chuck according to the present utility model;

FIG. 4 is a cross-sectional view of a pneumatic assembly of a semiconductor wafer cleaning jig provided in the present utility model;

in the figure: 100. a connecting plate; 101. a flange hole; 102. a first fixed counterbore; 103. positioning holes; 104. a limit groove; 105. a first fixed threaded hole; 200. a clamping module; 201. a module body; 202. wafer clamping jaws; 2021. a second fixed counterbore; 2022. an anti-slip pad; 1. a main body structure; 11. a second fixed threaded hole; 12. an airway; 2. a pneumatic assembly; 21. a housing; 22. a cover plate; 221. avoidance holes; 3. a telescoping device; 31. a cylinder; 311. a first chamber; 312. a second chamber; 32. a piston; 33. a rod body; 34. and a connecting piece.

Detailed Description

The following description of the embodiments of the present utility model will be made in detail, but not necessarily all embodiments, with reference to the accompanying drawings. All other embodiments, which can be made by one of ordinary skill in the art without undue burden from the present disclosure, are within the scope of the embodiments of the present utility model.

In the description of the embodiments of the present utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," "outer," and the like indicate or are based on the orientation or positional relationship shown in the drawings, merely to facilitate description of the embodiments of the present utility model and to simplify the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the embodiments of the present utility model. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In describing embodiments of the present utility model, it should be noted that, unless explicitly stated and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, interchangeably connected, integrally connected, mechanically connected, electrically connected, directly connected, indirectly connected through an intermediary, or in communication between two elements. The specific meaning of the above terms in embodiments of the present utility model will be understood in detail by those of ordinary skill in the art.

The embodiment of the utility model discloses a semiconductor wafer cleaning clamp.

Referring to fig. 1, an embodiment of a semiconductor wafer cleaning jig according to an embodiment of the present utility model includes:

the web 100 and the clamping module 200.

One end of one side of the connecting plate 100 is provided with a first connecting structure, and the other end of one side of the connecting plate 100 is provided with a second connecting structure. The clamping module 200 comprises a module body 201 and two wafer clamping jaws 202, wherein a third connecting structure which is detachably connected and matched with the second connecting structure is arranged on the module body 201. The module body 201 can be detachably connected with the connecting plate 100 through the third connecting structure which is detachably connected with the second connecting structure, and then the module body is installed on the robot through the connecting plate 100, so that the serial connection of the robot and the wafer is realized, the process of clamping, cleaning and carrying the wafer by the robot is ensured to be stable and repeatable, and the problem of low stability of manually cleaning the wafer is effectively solved.

The module body 201 is provided with two movable parts which can be opened or closed and matched, and it is understood that the two movable parts can move close to or away from each other; two wafer clamping jaws 202 are detachably connected to the two movable portions in a one-to-one correspondence to effect clamping or release of a wafer. The wafer clamping jaw 202 is detachably matched with the movable part on the module body 201, so that the correspondingly adapted wafer clamping jaw 202 can be replaced according to the wafer size, and the applicability is better.

The foregoing is a first embodiment of a semiconductor wafer cleaning jig according to an embodiment of the present utility model, and the following is a second embodiment of a semiconductor wafer cleaning jig according to an embodiment of the present utility model, referring to fig. 1 to fig. 4.

Based on the scheme of the first embodiment:

further, as shown in fig. 2, in the case of the first connection structure design, the flange hole 101, the first fixing counter bores 102 provided around the flange hole 101, and the positioning holes 103 provided around the flange hole 101 are included. The design of the flange hole 101 facilitates the connection plate 100 to be sleeved on the flange of the robot arm, the design of the positioning hole 103 plays a role in positioning when the connection plate 100 is installed on the flange of the robot, the first fixing counter bore 102 plays a role in fixing, and the connection plate 100 is fixed on the robot arm through the first fixing counter bore 102 by using screws.

Further, as shown in fig. 2, in the case of the second connection structure design, the second connection structure design includes a limiting groove 104 and a plurality of first fixing threaded holes 105.

One end of the limiting groove 104 extends out of the other end of the connecting plate 100, the clamping module 200 is movably inserted, the limiting groove 104 is arranged, the module body 201 is positioned when the module body 201 is conveniently installed, and the installation is more reliable.

The first fixing threaded holes 105 are disposed on the limiting groove 104, as shown in fig. 3, and the third connecting structure includes a plurality of second fixing threaded holes 11 corresponding to the first fixing threaded holes 105 one by one. The second fixing threaded hole 11 may be replaced by a through hole, and a screw passes through the second fixing threaded hole 11 and then cooperates with the first fixing threaded hole 105 to fasten the module body 201 on the limiting groove 104.

Further, the module body 201 is preferably a pneumatic clamping module, which is exemplified by:

as shown in fig. 3, the module body 201 includes a main structure 1 and a pneumatic assembly 2, and the second fixing screw hole 11 is provided on the main structure 1.

As shown in fig. 4, the pneumatic assembly 2 comprises a housing 21 and two telescopic devices 3.

The shell 21 is arranged on the main body structure 1, can be detachably matched with the main body structure 1, and is more convenient to maintain; the two telescopic devices 3 are arranged in the shell 21, are oppositely arranged along the first linear direction and are also staggered along the second linear direction perpendicular to the first linear direction; taking the first linear direction as the longitudinal direction of the housing 21 as an example, the longitudinal direction of the housing 21 may be opposite to each other, and may be staggered along the thickness direction of the housing 21; it will be appreciated that the telescopic members 3 are arranged opposite but staggered up and down so that the telescopic movements between the telescopic members 3 do not affect each other.

Both telescopic means 3 comprise a cylinder 31, a piston 32, a rod 33 and a connecting piece 34, which connecting piece 34 may be of a plate or rod construction, without limitation.

The piston 32 is slidably mounted in the cylinder 31 to divide the cylinder 31 into a first chamber 311 and a second chamber 312; one end of the rod body 33 is connected with the piston 32 body, and the other end of the rod body movably extends out of the cylinder body 31; one end of the connecting piece 34 is connected with one end of the rod body 33 extending out of the cylinder body 31, and the other end extends out of the shell 21 to form a movable part.

At least two air passages 12 are arranged on the main body structure 1; one air passage 12 communicates with the first chamber 311 of the two cylinders 31, and the other air passage 12 communicates with the second chamber 312 of the two cylinders 31.

Taking the example that the rod 33 movably extends out of the cylinder 31 through the first chamber 311 and extends to the outside below or above the other cylinder 31, when air is introduced into the first air chamber through one air passage 12, the piston 32 is driven to move in the direction of compressing the second chamber 312, so that the rod 33 is retracted, and the two connecting pieces 34 are driven to move close to each other, so that the two wafer clamping jaws 202 are close to each other to clamp a wafer; when air is introduced into the second chamber 312 through the other air passage 12, the piston 32 is driven to move toward the first chamber 311, so that the rod 33 extends out to drive the two connecting pieces 34 to move away from each other. That is, the clamping and opening of the two wafer clamping jaws 202 may be controlled by controlling the inlet and/or outlet of the gas passage 12. The first chamber 311 and the second chamber 312 may be connected to the air passage 12 through corresponding connection pipes, without limitation.

Further, as shown in fig. 4, the housing 21 is provided with a relief hole 221 for extending the connecting member 34 and limiting the movement of the connecting member 34. The design of the relief hole 221 can make the movement of the connecting member 34 smoother and more reliable.

Further, in order to facilitate maintenance of the internal components of the housing 21, an opening is provided on a side of the housing 21 away from the main body structure 1, and a cover plate 22 is detachably mounted on the opening. The corresponding relief hole 221 may be formed in the cover plate 22.

Further, the wafer clamping jaw 202 is provided with a second fixing counter bore 2021, the movable portion is provided with a third fixing threaded hole (not shown) detachably connected and matched with the second fixing counter bore 2021, and the detachable connection and the matching between the clamping jaw and the movable portion can be realized through screws.

Further, anti-slip pads 2022 are laid on the clamping surface of the wafer clamping jaw 202, so as to increase the friction force of the clamping surface and prevent slipping during wafer grabbing. Slip pad 2022 may be adhered to wafer clamping jaw 202 by an adhesive.

Further, the anti-slip pad 2022 is preferably a silica gel pad, without limitation.

While the present utility model has been described in detail with respect to a semiconductor wafer cleaning jig, those skilled in the art will appreciate that the present utility model is not limited to the specific embodiments and applications described above, based on the concepts of the embodiments of the present utility model.

Claims

1. A semiconductor wafer cleaning jig, characterized by comprising a connection plate (100) and a clamping module (200);

a first connecting structure is arranged at one end position on one side surface of the connecting plate (100);

a second connecting structure is arranged at the other end of one side surface of the connecting plate (100);

the clamping module (200) comprises a module body (201) and two wafer clamping jaws (202);

a third connecting structure which is detachably connected and matched with the second connecting structure is arranged on the module body (201);

two movable parts which can be opened or closed and matched are arranged on the module body (201);

two wafer clamping jaws (202) are detachably connected to the two movable parts in a one-to-one correspondence.

2. A semiconductor wafer cleaning jig according to claim 1, characterized in that the first connection structure comprises a flange hole (101), a number of first fixing counter bores (102) arranged around the flange hole (101) and a number of positioning holes (103) arranged around the flange hole (101).

3. A semiconductor wafer cleaning jig according to claim 1, wherein the second connection structure comprises a limit groove (104) and a plurality of first fixing screw holes (105);

one end of the limiting groove (104) extends out of the other end of the connecting plate (100) for the movable insertion of the clamping module (200);

the first fixing threaded hole (105) is formed in the limiting groove (104);

the third connecting structure comprises a plurality of second fixing threaded holes (11) which are in one-to-one correspondence with the first fixing threaded holes (105).

4. A semiconductor wafer cleaning jig according to claim 1, characterized in that the module body (201) is a pneumatic clamping module.

5. A semiconductor wafer cleaning jig according to claim 4, characterized in that the module body (201) comprises a main structure (1) and a pneumatic assembly (2);

the pneumatic assembly (2) comprises a housing (21) and two telescopic devices (3);

the shell (21) is mounted on the main body structure (1);

the two telescopic devices (3) are arranged in the shell (21) and are oppositely arranged along a first straight line direction and are also staggered along a second straight line direction perpendicular to the first straight line direction;

the two telescopic devices (3) comprise a cylinder body (31), a piston (32), a rod body (33) and a connecting piece (34);

the piston (32) body is slidably mounted in the cylinder (31) to divide the cylinder (31) into a first chamber (311) and a second chamber (312);

one end of the rod body (33) is connected with the piston (32) body, and the other end of the rod body movably extends out of the cylinder body (31);

one end of the connecting piece (34) is connected with one end of the rod body (33) extending out of the cylinder body (31), and the other end of the connecting piece extends out of the shell (21) to form the movable part;

at least two air passages (12) are arranged on the main body structure (1);

one of the air passages (12) is communicated with a first chamber (311) of the two cylinders (31), and the other air passage (12) is communicated with a second chamber (312) of the two cylinders (31).

6. A semiconductor wafer cleaning jig according to claim 5, wherein said housing (21) is provided with a relief hole (221) for the extension of said connector (34) and limiting the movement of said connector (34).

7. A semiconductor wafer cleaning jig according to claim 5, wherein the side of the housing (21) remote from the main body structure (1) is provided with an opening;

a cover plate (22) is detachably arranged on the opening.

8. A semiconductor wafer cleaning jig according to claim 1, wherein said wafer clamping jaw (202) is provided with a second fixture counterbore (2021);

and a third fixed threaded hole which is detachably connected and matched with the second fixed counter bore (2021) is formed in the movable part.

9. A semiconductor wafer cleaning jig according to claim 1, characterized in that a slip-resistant pad (2022) is laid on the clamping surface of the wafer clamping jaw (202).

10. A semiconductor wafer cleaning jig according to claim 9, wherein the anti-slip pad (2022) is a silicone pad.