CN219891879U - Display driving device, display panel and display device - Google Patents
Display driving device, display panel and display device Download PDFInfo
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- CN219891879U CN219891879U CN202321166593.XU CN202321166593U CN219891879U CN 219891879 U CN219891879 U CN 219891879U CN 202321166593 U CN202321166593 U CN 202321166593U CN 219891879 U CN219891879 U CN 219891879U
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
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- 239000010409 thin film Substances 0.000 description 10
- 230000009471 action Effects 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 5
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- 239000004973 liquid crystal related substance Substances 0.000 description 2
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- 238000004806 packaging method and process Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
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- 229910052710 silicon Inorganic materials 0.000 description 1
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Abstract
The utility model discloses a display driving device, a display panel and a display device, comprising: the semiconductor device comprises a first semiconductor structure, a second semiconductor structure, an intermediate connecting piece and a first semiconductor structure, wherein bonding pads are respectively arranged on opposite surfaces of the first semiconductor structure and the second semiconductor structure, at least one bonding pad of the first semiconductor structure is electrically connected with the second semiconductor structure, and the intermediate connecting piece is electrically connected with a corresponding bonding pad of at least one of the first semiconductor structure and the second semiconductor structure; and the flexible circuit board is used for being electrically connected with the middle connecting piece, so that the first semiconductor structure and the second semiconductor structure are connected with an external control circuit, the total resistance in the signal transmission process is reduced, and the signal transmission is faster.
Description
Technical Field
The present utility model relates to the field of display technologies, and in particular, to a display driving device, a display panel, and a display device.
Background
The liquid crystal display device (Liquid Crystal Display, LCD) and the Organic Light-Emitting Diode (OLED) display device have advantages of stable picture, vivid image, radiation elimination, space saving, energy saving, etc., and occupy the dominant position in the field of flat panel display.
In the field of micro-display, as shown in fig. 1, the conventional packaging scheme of the driving chip is mostly a single chip packaging scheme, i.e., the pixel array circuit, the row-column scanning circuit, and the bonding region are designed on the same chip substrate. However, in order to seek a larger display area (FOV), the pixel array circuit area is made as large as possible, thereby providing a larger display area. The pixel array circuit area is enlarged, a huge data stream is required to be processed, and the timing control circuit and the interface thereof are required to meet the requirement by using an advanced process. If a single chip scheme is still used, the pixel array circuit area of the most occupied area is manufactured by using an advanced process, and the yield requirement is obviously not satisfied. There is thus a need to provide a dual chip package solution where portions of the driver chip are separately designed on two chip substrates to form a micro display driver device to increase the area of the display area and to achieve better display driver device performance.
Disclosure of Invention
In view of the above, an object of the present utility model is to provide a display driving device, a display panel, and a display device, whereby the area of a display region is increased, and better display driving device performance is desired.
According to an aspect of the present utility model, there is provided a display driving apparatus including: a first semiconductor structure and a second semiconductor structure, opposite surfaces of the first semiconductor structure and the second semiconductor structure being provided with bonding pads, respectively, at least one bonding pad of the first semiconductor structure being electrically connected to the second semiconductor structure, and an intermediate connection member electrically connected to a corresponding bonding pad of at least one of the first semiconductor structure and the second semiconductor structure; and a flexible circuit board for electrically connecting the intermediate connection member, thereby connecting the first semiconductor structure and the second semiconductor structure with an external control circuit, wherein a process size of at least a portion of the transistors in the second semiconductor structure is smaller than a process size of at least a portion of the transistors in the first semiconductor structure.
Optionally, the flexible circuit board includes a high-speed signal trace electrically connected to the second semiconductor structure.
Optionally, the first semiconductor structure comprises a switching tube array structure layer, and the second semiconductor structure comprises a row scanning circuit and a column scanning circuit, wherein the row scanning circuit is used for generating a plurality of row scanning signals; the column scanning circuit is used for generating a plurality of driving signals corresponding to the plurality of row scanning signals according to driving data so as to control the switching-off of the switching tubes in the switching tube array structure layer.
Optionally, a pad electrode is further included between the pads of the first semiconductor structure and the second semiconductor structure, and the first semiconductor structure and the second semiconductor structure are electrically connected through the pad electrode.
Optionally, one side of the intermediate connector is soldered with a pad of the first semiconductor structure or with a pad of the second semiconductor structure, and the other side of the intermediate connector is soldered with the flexible circuit board.
Optionally, one side of the intermediate connection member is soldered with the pad of the first semiconductor structure, and the other side is soldered with the second semiconductor structure.
Optionally, the flexible circuit board is provided with a through hole to accommodate and electrically connect with the intermediate connector.
Optionally, the intermediate connection is one or a combination of a plurality of microcontacts, copper pillars, solder balls, and controlled collapse chip connection structures.
According to another aspect of the present utility model, there is provided a display panel including the display driving apparatus, wherein the display panel further includes an organic light emitting diode layer on the switching tube array structure layer, the organic light emitting diode layer including a plurality of organic light emitting diodes.
According to another aspect of the present utility model, there is provided a display device including the display panel, wherein the display panel is any one of an OLED display panel, an LCD display panel, a micro OLED display panel, and an AMOLED display panel.
The display driving device provided by the utility model has the advantages that the manufacturing process of the switch tube array structure layer with higher cost performance is manufactured into the independent chip, in addition, the high-speed requirement such as a row scanning circuit, a column scanning circuit or other modules with high-speed requirement is adopted, the manufacturing process of a high-order is adopted to manufacture the independent chip, the economic large-scale mass production is facilitated, and meanwhile, the bonding pads of the two semiconductor structures are arranged oppositely and are connected with an external circuit through the flexible circuit board.
In one embodiment, the first semiconductor structure can be directly connected with the flexible circuit board through the intermediate connecting piece, and in another embodiment, the second semiconductor structure can be directly connected with the flexible circuit board through the intermediate connecting piece, so that the total resistance in the signal transmission process is reduced, the signal transmission is higher in speed, and meanwhile, the current requirement is met.
In yet another embodiment, the first semiconductor structure and the second semiconductor structure are directly connected to the flexible circuit board through the intermediate connection member at the same time, so that the data transmission requirements of the two semiconductor structures are considered.
Drawings
The above and other objects, features and advantages of the present utility model will become more apparent from the following description of embodiments of the present utility model with reference to the accompanying drawings, in which:
FIG. 1 is a schematic view of a display panel of the prior art;
fig. 2a is a top view showing the structure of a display panel according to a first embodiment of the present utility model;
fig. 2b is a left side view of the structure of the display panel according to the first embodiment of the present utility model;
FIG. 3a is a top view showing a structure of a display panel according to a second embodiment of the present utility model;
fig. 3b is a left side view of a display panel according to a second embodiment of the present utility model;
FIG. 4a is a top view showing a structure of a display panel according to a third embodiment of the present utility model;
fig. 4b is a left side view of a structure of a display panel according to a third embodiment of the present utility model.
Detailed Description
Various embodiments of the present utility model will be described in more detail below with reference to the accompanying drawings. The same elements or modules are denoted by the same or similar reference numerals in the various figures. For clarity, the various features of the drawings are not drawn to scale.
It should be appreciated that in the following description, a "circuit" may include a single or multiple combined hardware circuits, programmable circuits, state machine circuits, and/or elements capable of storing instructions for execution by the programmable circuits. When an element or circuit is referred to as being "connected to" another element or circuit is "connected between" two nodes, it can be directly coupled or connected to the other element or intervening elements may be present, the connection between the elements may be physical, logical, or a combination thereof. In contrast, when an element is referred to as being "directly coupled to" or "directly connected to" another element, it means that there are no intervening elements present between the two.
Also, certain terms are used throughout the description and claims to refer to particular components. It will be appreciated by those of ordinary skill in the art that a hardware manufacturer may refer to the same component by different names. The present patent specification and claims do not take the form of an element or components as a functional element or components as a rule.
In the present utility model, the term "semiconductor structure" refers to a generic term for the entire semiconductor structure formed in the various steps of fabricating a memory device, including all layers or regions that have been formed. Numerous specific details of the utility model, such as device structures, materials, dimensions, processing techniques and technologies, are set forth in the following description in order to provide a thorough understanding of the utility model. However, as will be understood by those skilled in the art, the present utility model may be practiced without these specific details.
Furthermore, it should be noted that relational terms such as first and second are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.
Fig. 2a is a top view showing the structure of a display panel according to a first embodiment of the present utility model.
As shown in fig. 2a, the display panel includes a display area 40 and a non-display area, and the display panel is, for example, an LCD display panel, an OLED display panel, an LED display panel, a micro OLED display panel, an AMOLED display panel, or the like. The non-display area is located at an edge or boundary of the display panel after the display area 40 is divided. In this example, the display area 40 is rectangular and the non-display areas are distributed along the edges of the display area 40. For example, the non-display area is a rectangular frame distributed along the entire boundary of the display area 40. However, the present utility model is not limited thereto, and the non-display area may be distributed on one or both edges of the display area 40.
A plurality of pixels (not shown) are formed on the display area 40, and the plurality of pixels form a pixel array. The plurality of pixels are connected to the gate line and the data line, respectively, to receive the gate signal and the data signal, respectively. However, the present utility model is not limited thereto, and a plurality of pixels may also have touch sensing lines.
In addition, the display driving device in the display panel is structurally divided into a first semiconductor structure 10 and a second semiconductor structure 20, and a flexible circuit board 30.
In one embodiment, the first semiconductor structure 10 comprises, for example, a switching transistor array structure layer comprising a plurality of thin film transistors (Thin Film Transistor, TFTs). Each thin film transistor includes a gate electrode, a source electrode, and a drain electrode (when applied to a silicon-based OLED, the thin film transistor is correspondingly configured as a CMOS transistor), and an organic light emitting diode layer is formed on the switching transistor array structure layer, and the organic light emitting diode layer includes a plurality of organic light emitting diodes, i.e., corresponding display regions 40. The first surface of the first semiconductor structure 10 is provided with a plurality of pads 11 forming interconnect metal connection leads to expose metal leads for ILB (inner wire bonding, inner Lead Bonding).
The second semiconductor structure 20 includes, for example, a row scanning circuit for generating a plurality of row scanning signals, a column scanning circuit, or other modules requiring high speed; the column scanning circuit is used for generating a plurality of driving signals corresponding to the plurality of row scanning signals according to driving data so as to control the switching-off of the switching tubes in the switching tube array structure layer. The second surface of the second semiconductor structure 20 is also provided with a plurality of pads 21, at least one pad of the first semiconductor structure 10 is electrically connected to the second semiconductor structure 20, and the plurality of pads 21 in the second semiconductor structure 20 include a plurality of general purpose input/output ports, and a high speed interface.
Fig. 2b is a left side view of the structure of the display panel according to the first embodiment of the present utility model.
As shown in fig. 2b, the above-mentioned first semiconductor structure 10 and second semiconductor structure 20 are connected to an external circuit, such as a driving circuit or a control circuit, through a flexible circuit board 30 to form a display system.
Specifically, the flexible circuit board 30 includes a plurality of signal traces electrically connected to the first semiconductor structure 10 and the second semiconductor structure 20. The traces may be classified into high-speed signal traces, low-speed signal traces, power traces, etc. according to the type of the transmission signal, and in the preferred embodiment, the flexible circuit board 30 includes the high-speed signal traces electrically connected to the second semiconductor structure 20, and the example is also applicable to other embodiments.
The second semiconductor structure 20 is electrically connected to the first semiconductor structure 10 via a pad electrode 61, and a first surface of the first semiconductor structure 10 and a second surface of the second semiconductor structure 20 are opposed to each other.
In the left side view of the structure of the display panel shown in fig. 2b, the flexible circuit board 30 is located above the first semiconductor structure 10, and one side of the intermediate connection member 50 is soldered to the pad of the first semiconductor structure 10, and the other side is soldered to the flexible circuit board 30, so that the second semiconductor structure 20 and the first semiconductor structure 10 share the intermediate connection member 50 on the pad of the first semiconductor structure 10 to be connected to the flexible circuit board 30 and further to be connected to an external circuit. In this embodiment, the process size of at least some of the transistors in the second semiconductor structure 20 is smaller than that of at least some of the transistors in the first semiconductor structure 10, i.e. the switching transistor array structure layer is fabricated into individual chips by using a relatively high cost performance process, and in addition, high-speed requirements such as a row scan circuit, a column scan circuit or other modules with high-speed requirements (i.e. chips with high-speed signal traces on the flexible circuit board) are fabricated into additional individual chips by using a high-order process, which is more beneficial to economical mass production.
And the first semiconductor structure can be directly connected with the flexible circuit board through the intermediate connecting piece, so that the total resistance in the signal transmission process is reduced, the signal transmission is higher in speed, and the current requirement is met.
Fig. 3a is a top view illustrating a structure of a display panel according to a second embodiment of the present utility model.
As shown in fig. 3a, the display panel includes a display area 40 and a non-display area, and the display panel is, for example, an LCD display panel, an OLED display panel, an LED display panel, a micro OLED display panel, an AMOLED display panel, or the like. The non-display area is located at an edge or boundary of the display panel after the display area 40 is divided. In this example, the display area 40 is rectangular and the non-display areas are distributed along the edges of the display area 40. For example, the non-display area is a rectangular frame distributed along the entire boundary of the display area 40. However, the present utility model is not limited thereto, and the non-display area may be distributed on one or both edges of the display area 40.
A plurality of pixels (not shown) are formed on the display area 40, and the plurality of pixels form a pixel array. The plurality of pixels are connected to the gate line and the data line, respectively, to receive the gate signal and the data signal, respectively. However, the present utility model is not limited thereto, and a plurality of pixels may also have touch sensing lines.
In addition, the display driving device of the display panel further includes a first semiconductor structure 10, a second semiconductor structure 20, and a flexible circuit board 30.
In one embodiment, the first semiconductor structure 10 comprises, for example, a switching transistor array structure layer comprising a plurality of thin film transistors (Thin Film Transistor, TFTs). Each thin film transistor includes a gate electrode, a source electrode, and a drain electrode. An organic light emitting diode layer including a plurality of organic light emitting diodes, i.e., corresponding display regions 40, is formed on the switching tube array structure layer. The first surface of the first semiconductor structure 10 is provided with a plurality of pads 11 forming interconnect metal connection leads to expose metal leads for ILB (inner wire bonding, inner Lead Bonding).
The second semiconductor structure 20 includes, for example, a row scan circuit, a column scan circuit, or other modules requiring high speed. The second surface of the second semiconductor structure 20 is also provided with a plurality of pads 21, and the plurality of pads 21 in the second semiconductor structure 20 include a plurality of general purpose input/output ports, and a high-speed interface.
Fig. 3b is a left side view of the structure of the display panel according to the first embodiment of the present utility model.
As shown in fig. 3b, the first semiconductor structure 10 and the second semiconductor structure 20 are connected to an external circuit, such as a driving circuit or a control circuit, through a flexible circuit board 30 to form a display system.
The second semiconductor structure 20 is electrically connected to the first semiconductor structure 10 via a pad electrode 61, and a first surface of the first semiconductor structure 10 and a second surface of the second semiconductor structure 20 are opposed to each other.
In the left side view of the structure of the display panel shown in fig. 3b, the flexible circuit board 30 is located under the second semiconductor structure 20, and one side of the intermediate connection member 50 is soldered to the pad of the second semiconductor structure 20, and the other side is soldered to the flexible circuit board 30, so that the first semiconductor structure 10 and the second semiconductor structure 20 share the intermediate connection member 50 on the pad of the second semiconductor structure 20 to be connected to the flexible circuit board 30 and further to be connected to an external circuit.
In this embodiment, the second semiconductor structure may be directly connected to the flexible circuit board through the intermediate connection member, so that the total resistance in the signal transmission process is reduced, the signal transmission is faster, and the current requirement is satisfied.
FIG. 4a is a top view showing a structure of a display panel according to a third embodiment of the present utility model;
as shown in fig. 4a, the display panel includes a display area 40 and a non-display area, and the display panel is, for example, an LCD display panel, an OLED display panel, an LED display panel, a micro OLED display panel, an AMOLED display panel, or the like. The non-display area is located at an edge or boundary of the display panel after the display area 40 is divided. In this example, the display area 40 is rectangular and the non-display areas are distributed along the edges of the display area 40. For example, the non-display area is a rectangular frame distributed along the entire boundary of the display area 40. However, the present utility model is not limited thereto, and the non-display area may be distributed on one or both edges of the display area 40.
A plurality of pixels (not shown) are formed on the display area 40, and the plurality of pixels form a pixel array. The plurality of pixels are connected to the gate line and the data line, respectively, to receive the gate signal and the data signal, respectively. However, the present utility model is not limited thereto, and a plurality of pixels may also have touch sensing lines.
In addition, the display driving device of the display panel further includes a first semiconductor structure 10, a second semiconductor structure 20, and a flexible circuit board 30.
In one embodiment, the first semiconductor structure 10 comprises, for example, a switching transistor array structure layer comprising a plurality of thin film transistors (Thin Film Transistor, TFTs). Each thin film transistor includes a gate electrode, a source electrode, and a drain electrode. An organic light emitting diode layer including a plurality of organic light emitting diodes, i.e., corresponding display regions 40, is formed on the switching tube array structure layer. The first surface of the first semiconductor structure 10 is provided with a plurality of pads 11 forming interconnect metal connection leads to expose metal leads for ILB (inner wire bonding, inner Lead Bonding).
The second semiconductor structure 20 includes, for example, a row scan circuit, a column scan circuit, or other modules requiring high speed. The second surface of the second semiconductor structure 20 is provided with a plurality of pads 21, and the plurality of pads 21 in the second semiconductor structure 20 include a plurality of general purpose input/output ports and a high-speed interface.
Fig. 4b is a left side view showing the structure of a display panel according to a third embodiment of the present utility model;
as shown in fig. 4b, the above-mentioned first semiconductor structure 10 and second semiconductor structure 20 are connected to an external circuit, such as a driving circuit or a control circuit, through a flexible circuit board 30 to form a display system.
Specifically, the second semiconductor structure 20 is electrically connected to the first semiconductor structure 10 via the pad electrode 61, and the first surface of the first semiconductor structure 10 and the second surface of the second semiconductor structure 20 are opposed to each other.
In the left side view of the structure of the display panel shown in fig. 4b, the flexible circuit board 30 is located between the first semiconductor structure 10 and the second semiconductor structure 20, and is provided with a longitudinal through hole to receive and electrically connect the intermediate connection member 50 between the pads, and is further connected to the pads of the first semiconductor structure 10 and the second semiconductor structure 20, respectively, through the intermediate connection member 50.
In the embodiment, the first semiconductor structure and the second semiconductor structure are directly connected with the flexible circuit board through the intermediate connecting piece, so that the data transmission requirements of the two semiconductor structures are met, the total resistance in the signal transmission process is reduced, the signal transmission is higher in speed, and the current requirement is met.
It should be noted that, the circuits included in the first semiconductor structure and the second semiconductor structure may be interchanged, so that the corresponding interfaces also change the connection relationship, and finally, the circuits are electrically connected with the flexible circuit board through the top-most metal of the first semiconductor structure and the second semiconductor structure, i.e. the ILB region in the corresponding drawing.
In one embodiment, the intermediate connection 50 is one or a combination of a microcontact, a copper pillar, a solder ball, and a controllable collapse chip connection structure, and in the display driving device provided in the present utility model, the first semiconductor structure is a die or a chip, and the second semiconductor structure is a die or a chip, and the two semiconductor structures are stacked inside to form a package or a separate chip.
In an embodiment of the present utility model, a display device is further disclosed, which includes the display panel in any of the foregoing embodiments, and as described above for the display panel, the display panel may be any one of an OLED display panel, a microOLED display panel, an LED display panel, an AMOLED display panel, and an LCD display panel.
It should be noted that the words "during", "when" and "when … …" as used herein in relation to circuit operation are not strict terms indicating an action that occurs immediately upon the start of a start-up action, but rather there may be some small but reasonable delay or delays between it and the reaction action (reaction) initiated by the start-up action, such as various transmission delays and the like, as will be appreciated by those of ordinary skill in the art. The word "about" or "substantially" is used herein to mean that an element value (element) has a parameter that is expected to be close to the stated value or position. However, as is well known in the art, there is always a slight deviation such that the value or position is difficult to strictly assume the stated value. It has been well established in the art that deviations of at least ten percent (10%) (at least twenty percent (20%)) for semiconductor doping concentrations are reasonable deviations from the exact ideal targets described. When used in connection with a signal state, the actual voltage value or logic state of the signal (e.g., "1" or "0") depends on whether positive or negative logic is used.
Embodiments in accordance with the present utility model, as described above, are not intended to be exhaustive or to limit the utility model to the precise embodiments disclosed. Obviously, many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to best explain the principles of the utility model and the practical application, to thereby enable others skilled in the art to best utilize the utility model and various modifications as are suited to the particular use contemplated. The scope of the utility model should be determined by the appended claims and their equivalents.
Claims (11)
1. A display driving apparatus comprising: a first semiconductor structure and a second semiconductor structure,
the opposite surfaces of the first semiconductor structure and the second semiconductor structure are respectively provided with bonding pads, at least one bonding pad of the first semiconductor structure is electrically connected with the second semiconductor structure, and,
an intermediate connection electrically connected to a respective one of the pads of at least one of the first and second semiconductor structures; and
and the flexible circuit board is used for being electrically connected with the intermediate connecting piece, so that the first semiconductor structure and the second semiconductor structure are connected with an external control circuit.
2. The display driver device of claim 1, wherein a process size of at least a portion of the transistors in the second semiconductor structure is smaller than a process size of at least a portion of the transistors in the first semiconductor structure.
3. The display driver device of claim 2, wherein the flexible circuit board includes high-speed signal traces therein electrically connected to the second semiconductor structure.
4. The display driving device according to claim 3, wherein the first semiconductor structure comprises a switching transistor array structure layer, and the second semiconductor structure comprises a row scanning circuit and a column scanning circuit, wherein the row scanning circuit is configured to generate a plurality of row scanning signals; the column scanning circuit is used for generating a plurality of driving signals corresponding to the plurality of row scanning signals according to driving data so as to control the switching-off of the switching tubes in the switching tube array structure layer.
5. A display driving device according to claim 3, wherein a pad electrode is further included between pads of the first semiconductor structure and the second semiconductor structure, the first semiconductor structure and the second semiconductor structure being electrically connected through the pad electrode.
6. The display driving device according to claim 5, wherein one side of the intermediate connection member is soldered with a pad of the first semiconductor structure or with a pad of the second semiconductor structure, and the other side of the intermediate connection member is soldered with the flexible circuit board.
7. The display driving device according to claim 1, wherein the intermediate connection member is soldered with the pad of the first semiconductor structure on one side and with the second semiconductor structure on the other side.
8. The display driving apparatus according to claim 7, wherein the flexible circuit board is provided with a through hole to receive and electrically connect with the intermediate connection member.
9. The display driver device of claim 1, wherein the intermediate connection is a combination of one or more of microcontacts, copper pillars, solder balls, controlled collapse chip connection structures.
10. A display panel comprising the display driving device of any one of claims 1-9, wherein the display panel further comprises an organic light emitting diode layer on the switching tube array structure layer, the organic light emitting diode layer comprising a plurality of organic light emitting diodes.
11. A display device comprising the display panel of claim 10, wherein the display panel is any one of an OLED display panel, an LCD display panel, an LED display panel, a microOLED display panel, an AMOLED display panel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321166593.XU CN219891879U (en) | 2023-05-15 | 2023-05-15 | Display driving device, display panel and display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321166593.XU CN219891879U (en) | 2023-05-15 | 2023-05-15 | Display driving device, display panel and display device |
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| Publication Number | Publication Date |
|---|---|
| CN219891879U true CN219891879U (en) | 2023-10-24 |
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| CN202321166593.XU Active CN219891879U (en) | 2023-05-15 | 2023-05-15 | Display driving device, display panel and display device |
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| CN (1) | CN219891879U (en) |
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- 2023-05-15 CN CN202321166593.XU patent/CN219891879U/en active Active
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