CN219881654U - Bonding wire pressing plate for packaging laser - Google Patents
Bonding wire pressing plate for packaging laser Download PDFInfo
- Publication number
- CN219881654U CN219881654U CN202320542941.2U CN202320542941U CN219881654U CN 219881654 U CN219881654 U CN 219881654U CN 202320542941 U CN202320542941 U CN 202320542941U CN 219881654 U CN219881654 U CN 219881654U
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- CN
- China
- Prior art keywords
- groove
- clamp plate
- pressing plate
- sliding
- supporting seat
- Prior art date
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Links
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 10
- 230000002146 bilateral effect Effects 0.000 claims abstract 2
- 230000001681 protective effect Effects 0.000 claims description 10
- 239000011248 coating agent Substances 0.000 claims description 6
- 238000000576 coating method Methods 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 6
- 244000309464 bull Species 0.000 claims description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 3
- 239000000741 silica gel Substances 0.000 claims description 3
- 229910002027 silica gel Inorganic materials 0.000 claims description 3
- 230000006835 compression Effects 0.000 claims 1
- 238000007906 compression Methods 0.000 claims 1
- 230000002457 bidirectional effect Effects 0.000 abstract description 10
- 230000000712 assembly Effects 0.000 abstract description 9
- 238000000429 assembly Methods 0.000 abstract description 9
- 238000003466 welding Methods 0.000 description 8
- 239000011241 protective layer Substances 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000002035 prolonged effect Effects 0.000 description 2
- 229920000459 Nitrile rubber Polymers 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Landscapes
- Laser Beam Processing (AREA)
Abstract
The utility model relates to the field of bonding wire pressing plates, and discloses a bonding wire pressing plate for packaging a laser, which comprises a pressing plate body, wherein a placing groove is formed in the pressing plate body, a front groove and a rear groove are formed in the bottom of the placing groove, the front groove and the rear groove are arranged in parallel front and back, two front sliding blocks are connected in the front groove in a sliding manner, two rear sliding blocks are connected in the rear groove in a sliding manner, a connecting plate is arranged above the front sliding block and the rear sliding block which correspond front and back, two pressing plate assemblies are symmetrically arranged on the two connecting plates in a bilateral symmetry manner, a bidirectional threaded rod is arranged in the front groove, two sections of threads of the bidirectional threaded rod are respectively connected with the two front sliding blocks in a threaded manner, a sliding rod is arranged in the rear groove, the sliding rod is connected with the two rear sliding blocks in a sliding manner, and a protection pad is arranged in the placing groove, so that circuit boards with different sizes can be stably fixed in the pressing plate, and the circuit boards can be conveniently welded by the post-packaged laser.
Description
Technical Field
The utility model relates to the technical field of bonding wire pressing plates, in particular to a bonding wire pressing plate for packaging a laser.
Background
The packaging laser welding is to utilize high-energy laser pulse to locally heat the material in a micro-area, the energy of laser radiation is led to the internal diffusion of the material through heat transfer, a specific molten pool is formed after the material is melted, and then a circuit is welded, and a bonding wire pressing plate is one of parts of a bonding wire machine.
However, the size of the groove is fixed, when different circuit boards are replaced, the groove cannot be well fixed due to the change of the size of the circuit boards, and different pressing plates are required to be replaced, so that the application range of the bonding wire pressing plate is small, and therefore, the bonding wire pressing plate for packaging the laser is provided
Disclosure of Invention
(one) solving the technical problems
Aiming at the defects in the prior art, the utility model provides a bonding wire pressing plate for packaging a laser, which can effectively solve the problems in the prior art.
(II) technical scheme
In order to achieve the above purpose, the utility model is realized by the following technical scheme:
the utility model discloses a welding wire pressing plate for packaging a laser, which comprises a pressing plate body, wherein a placing groove is formed in the pressing plate body, a front groove and a rear groove are formed in the bottom of the placing groove, the front groove and the rear groove are arranged in parallel front and back, two front sliding blocks are connected in the front groove in a sliding manner, two rear sliding blocks are connected in the rear groove in a sliding manner, a connecting plate is arranged above the front sliding blocks and the rear sliding blocks, two pressing plate assemblies are symmetrically arranged on the two connecting plates in a left-right manner, a bidirectional threaded rod is arranged in the front groove, two sections of threads of the bidirectional threaded rod are respectively connected with the two front sliding blocks in a threaded manner, a sliding rod is arranged in the rear groove, the sliding rod is connected with the two rear sliding blocks in a sliding manner, the pressing plate assemblies comprise supporting seats on the connecting plates, a sleeve piece is connected on the supporting seats in a sliding manner, one end of each spring is connected with the lower part of the supporting seat in a sliding manner, the other end of each spring is connected with the bottom of the corresponding sleeve piece in a sliding manner, two pressing plate assemblies are fixedly connected with the pressing plate assemblies in the sliding manner, two pressing plate assemblies are connected with the supporting plates in a sliding manner, two pressing plate assemblies are connected with the supporting plates in a sliding manner, and the supporting plates are connected with the supporting plates are in a sliding manner, and the supporting plate assembly is connected with the supporting plate is in a sliding manner, and the supporting plate is fixedly connected with the supporting plate is provided with the supporting plate.
Furthermore, a protective pad is arranged in the placing groove, and anti-skid lines are arranged on the protective pad.
Still further, the bottom of clamp plate spare is provided with the inoxidizing coating, the inoxidizing coating is the silica gel material, the bottom of inoxidizing coating is through dull polish processing.
(III) beneficial effects
Compared with the known public technology, the technical scheme provided by the utility model has the following beneficial effects:
according to the utility model, the circuit board is placed in the placing groove, the protection pad supports and protects the circuit board, a user rotates the bidirectional threaded rod, so that the front sliding block moves in the front groove, the rear sliding block slides on the sliding rod, the position of the connecting plate is changed, the position of the pressing plate assembly is changed, circuit boards with different sizes are stably fixed in the placing groove, and the laser welding wire device is used for stably welding the circuit board.
Through the structure setting of clamp plate subassembly, be applicable to the circuit board with different thickness and stabilize fixed in the standing groove, be convenient for later stage encapsulation laser carries out welding treatment to the circuit board.
Drawings
In order to more clearly illustrate the embodiments of the present utility model or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below. It is evident that the drawings in the following description are only some embodiments of the present utility model and that other drawings may be obtained from these drawings without inventive effort for a person of ordinary skill in the art.
FIG. 1 is a perspective view of the present utility model;
FIG. 2 is a top view of the present utility model;
FIG. 3 is an enlarged view of FIG. 2 at A;
fig. 4 is a perspective view of a platen assembly.
Reference numerals in the drawings represent respectively: 1. a platen body; 2. a placement groove; 3. a front groove; 4. a rear groove; 5. a front slider; 6. a rear slider; 7. a connecting plate; 8. a two-way threaded rod; 9. a slide bar; 10. a protective pad; 11. a support base; 12. a kit; 13. a spring; 14. a platen member; 15. a support plate; 16. an adjustment tank; 17. abutting blocks; 18. and (5) rotating the rod.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present utility model more clear, the technical solutions of the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model. It will be apparent that the described embodiments are some, but not all, embodiments of the utility model. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
The utility model is further described below with reference to examples.
Examples
The bonding wire pressing plate for packaging the laser in this embodiment, as shown in fig. 1-4, comprises a pressing plate body 1, the pressing plate body 1 is made of stainless steel, the pressing plate has better oxidation resistance and corrosion resistance, the service life of the pressing plate body 1 is prolonged, a placing groove 2 is formed in the pressing plate body 1, the placing groove 2 is used for placing a circuit board for performing laser welding, a front groove 3 and a rear groove 4 are formed in the bottom of the placing groove 2, the front groove 3 and the rear groove 4 are arranged in parallel, two front sliding blocks 5 are slidingly connected in the front groove 3, two rear sliding blocks 6 are slidingly connected in the rear groove 4, connecting plates 7 are arranged above the front sliding blocks 5 and the rear sliding blocks 6 which correspond to each other in front and rear, a group of pressing plate assemblies are symmetrically arranged on the two connecting plates 7 in left and right directions, the pressing plate assemblies are used for stably fixing circuit boards with different thicknesses in the placing groove 2, and further enabling the laser to perform stable welding treatment on the circuit boards, the front groove 3 is provided with a bidirectional threaded rod 8, two sections of threads of the bidirectional threaded rod 8 are respectively in threaded connection with two front sliding blocks 5, the rear groove 4 is provided with a sliding rod 9, the sliding rod 9 is in sliding connection with two rear sliding blocks 6, the right side of the pressing plate body 1 is provided with a rotating handle, the rotating handle is fixedly connected with the right end of the bidirectional threaded rod 8, a user can conveniently rotate the bidirectional threaded rod 8, the front sliding block 5 moves in the front groove 3, the rear sliding block 6 slides on the sliding rod 9, the position of the connecting plate 7 is changed, the position of the pressing plate assembly is changed, circuit boards with different sizes and thicknesses are stably fixed in the placing groove 2, the laser can stably weld the circuit boards, the pressing plate assembly comprises a supporting seat 11 on the connecting plate 7, a sleeve 12 is in sliding connection with the supporting seat 11, the cover is equipped with spring 13 on the outside of supporting seat 11, the one end of spring 13 links to each other with the below of supporting seat 11, the other end of spring 13 links to each other with the bottom of external member 12, fixedly connected with clamp plate piece 14 on the external member 12, the top of supporting seat 11 is provided with adjusting part, support clamp plate piece 14 through spring 13, make clamp plate piece 14's inclined plane can laminate with the bottom surface of supporting block 17 all the time, adjusting part includes the backup pad 15 at the top fixed connection of supporting seat 11, the adjustment tank 16 has been seted up on the backup pad 15, sliding connection has supporting block 17 on the adjustment tank 16, be provided with bull stick 18 in the adjustment tank 16, be provided with the twist grip on the backup pad 15, the twist grip links to each other with the one end of bull stick 18, be convenient for rotate bull stick 18, and then make supporting block 17 remove in adjustment tank 16, make the position of supporting block 17 change, support block 17 support and put clamp plate piece 14, and then make clamp plate piece 14 carry out gradual downward movement, make the bottom of clamp plate piece 14 and the circuit board placed in place recess 2 carry out laminating plate 15, the stable backup plate piece 15, the circuit board 15 carries out supporting plate piece 15, the stable top of circuit board that is suitable for carrying out the bottom of circuit board that carries out the stable circuit board in place in support plate piece 11, the bottom of clamp plate piece 14 carries out the triangle-down, and the bottom of the clamp plate piece 14 is suitable for carrying out the downward movement.
As shown in fig. 1 and 2, the protective pad 10 is arranged in the placing groove 2, the protective pad 10 is provided with anti-slip grains, the protective pad 10 is made of nitrile rubber, the material has good ageing resistance and corrosion resistance, the service life of the protective pad 10 is prolonged, and the circuit board placed in the placing groove 2 is more stable due to the anti-slip grains.
As shown in fig. 4, a protective layer is disposed at the bottom of the platen member 14, the protective layer is made of silica gel, and the bottom of the protective layer is frosted to prevent the circuit board from being damaged when the platen member 14 supports and fixes the circuit board.
When the embodiment is specifically implemented, a user places a circuit board in the placing groove 2, the protection pad 10 supports and protects the circuit board, the user rotates the bidirectional threaded rod 8, and then the front sliding block 5 moves in the front groove 3, the rear sliding block 6 slides on the sliding rod 9, the position of the connecting plate 7 changes, and then the position of the pressing plate component is changed, the circuit boards with different sizes and thicknesses are stably fixed in the placing groove 2, and then the laser welding wire device stably welds the circuit board, the structure setting of the pressing plate component is used for stably fixing the circuit boards with different thicknesses, the rotating rod 18 rotates, and then the pressing block 17 moves in the adjusting groove 16, the position of the pressing block 17 changes, the pressing block 14 is supported by the spring 13, the inclined plane of the pressing block 14 can be always attached to the bottom surface of the pressing block 17, the pressing block 14 is pressed against the inclined plane of the pressing block 17, the bottom of the pressing block 17 moves downwards, the pressing block 14 is gradually moved downwards, and the bottom of the pressing block 14 is not stably fixed in the placing groove 2.
The above embodiments are only for illustrating the technical solution of the present utility model, and are not limiting; although the utility model has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present utility model.
Claims (3)
1. The utility model provides a packaging laser bonding wire clamp plate, includes clamp plate body (1), its characterized in that: the utility model discloses a compression plate, including clamp plate body (1), clamp plate body (1) is gone up and has been seted up standing groove (2), standing groove (3) and back groove (4) have been seted up to the bottom of standing groove (2), parallel arrangement around preceding groove (3) and back groove (4), sliding connection has two preceding slider (5) in preceding groove (3), sliding connection has two back slider (6) in back groove (4), the front and back correspondence the top of preceding slider (5) and back slider (6) is provided with connecting plate (7), two bilateral symmetry is provided with a set of clamp plate subassembly in connecting plate (7), be provided with bi-directional threaded rod (8) in preceding groove (3), two sections screw threads of bi-directional threaded rod (8) respectively with two preceding slider (5) threaded connection, be provided with slide bar (9) in back groove (4), sliding connection with two back slider (6), clamp plate subassembly includes supporting seat (11) on connecting plate (7), supporting seat (11) on the supporting seat (11) sliding connection has, the outside of spring sleeve (13) is equipped with the outside of supporting seat (13), the outside (13) is equipped with the threaded rod (13), the utility model discloses a clamp plate spare (14) is fixed connection on external member (12), the top of supporting seat (11) is provided with adjusting part, adjusting part is including supporting plate (15) of the top fixed connection of supporting seat (11), adjustment groove (16) have been seted up on supporting plate (15), sliding connection has support piece (17) on adjustment groove (16), be provided with bull stick (18) in adjustment groove (16), bull stick (18) with support piece (17) threaded connection, the longitudinal section layer triangle-shaped of clamp plate spare (14), support the bottom of piece (17) with the inclined plane sliding connection of clamp plate spare (14).
2. The packaged laser wire bond platen of claim 1, wherein: the anti-slip protective device is characterized in that a protective pad (10) is arranged in the placing groove (2), and anti-slip lines are arranged on the protective pad (10).
3. The packaged laser wire bond platen of claim 1, wherein: the bottom of clamp plate spare (14) is provided with the inoxidizing coating, the inoxidizing coating is the silica gel material, the bottom of inoxidizing coating is through dull polish processing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320542941.2U CN219881654U (en) | 2023-03-20 | 2023-03-20 | Bonding wire pressing plate for packaging laser |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320542941.2U CN219881654U (en) | 2023-03-20 | 2023-03-20 | Bonding wire pressing plate for packaging laser |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219881654U true CN219881654U (en) | 2023-10-24 |
Family
ID=88399811
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320542941.2U Active CN219881654U (en) | 2023-03-20 | 2023-03-20 | Bonding wire pressing plate for packaging laser |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219881654U (en) |
-
2023
- 2023-03-20 CN CN202320542941.2U patent/CN219881654U/en active Active
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| Date | Code | Title | Description |
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| GR01 | Patent grant | ||
| GR01 | Patent grant |