CN219881511U - Cooling device of reflow oven - Google Patents
Cooling device of reflow oven Download PDFInfo
- Publication number
- CN219881511U CN219881511U CN202321362791.3U CN202321362791U CN219881511U CN 219881511 U CN219881511 U CN 219881511U CN 202321362791 U CN202321362791 U CN 202321362791U CN 219881511 U CN219881511 U CN 219881511U
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- Prior art keywords
- reflow oven
- fixedly connected
- reflow
- cooling
- heating
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- 238000001816 cooling Methods 0.000 title claims abstract description 65
- 238000010438 heat treatment Methods 0.000 claims abstract description 53
- 238000005476 soldering Methods 0.000 claims abstract description 41
- 238000003466 welding Methods 0.000 claims abstract description 23
- 238000000605 extraction Methods 0.000 claims description 6
- 238000002844 melting Methods 0.000 description 4
- 230000008018 melting Effects 0.000 description 4
- 239000000110 cooling liquid Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000005086 pumping Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The utility model relates to the technical field of cooling devices and discloses a cooling device of a reflow soldering furnace, which comprises a reflow soldering furnace device, wherein a circular groove is formed in one side of an inner cavity of the reflow soldering furnace device, a fan is fixedly connected in the circular groove on one side of the inner cavity of the reflow soldering furnace device, hanging plates are fixedly connected to two sides, close to the fan, of the inner cavity of the reflow soldering furnace device, a plurality of welding plate devices are arranged on the top of each hanging plate, a heating device is arranged at the bottom of the inner cavity of the reflow soldering furnace device, a circular through hole is formed in the top end of one side of the reflow soldering furnace device, and an air extracting device is fixedly connected in the circular through hole on the top end of one side of the reflow soldering furnace device.
Description
Technical Field
The utility model relates to the technical field of cooling devices, in particular to a cooling device of a reflow soldering furnace.
Background
The reflow oven is used for welding the components on various circuit boards together through a process, firstly placing the components on the circuit boards, then heating and melting the solder on two sides of the components to bond with the main board after the temperature is raised to a certain temperature through an internal heating circuit, and is convenient for controlling the temperature, so that the reflow process technology and equipment which are a part of the mounting technology are correspondingly developed, and the application of the reflow oven is becoming wide.
The cooling device of the reflow oven in the current market has the following defects: 1. after the use of the existing cooling device of the reflow soldering furnace is finished, when the air is pumped by the air pump next time, the air temperature is high, the air pump and the air pumping pipeline thereof are easily damaged, and the service lives of the air pump and the air pumping pipeline are reduced; 2. when the existing cooling device of the reflow oven is used, the manufacturing cost is high, the working efficiency is slower, and the operation and the use are inconvenient.
Disclosure of Invention
In order to overcome the above-mentioned drawbacks of the prior art, the present utility model provides a cooling device for a reflow oven, which solves the above-mentioned problems in the prior art.
The utility model provides the following technical scheme: the utility model provides a cooling device of reflow oven, includes the reflow oven device, circular recess has been seted up to inner chamber one side of reflow oven device, fixedly connected with fan in the circular recess in inner chamber one side of reflow oven device, the inner chamber of reflow oven device is close to the equal fixedly connected with link plate in both sides of fan, every a plurality of welding and melting board devices have all been placed at the top of link plate, the inner chamber bottom of reflow oven device is equipped with heating device, circular through-hole has been seted up on one side top of reflow oven device, fixedly connected with air extraction device in the circular through-hole in one side top of reflow oven device, square recess has been seted up in the middle of one side of reflow oven device, square recess in the middle of one side of reflow oven device fixedly connected with cooling device, simple structure, the installation of being convenient for.
Further, the reflow oven device comprises a reflow oven shell, the bottom of the reflow oven shell is equidistantly arranged around and fixedly connected with supporting blocks, one side bottom of the reflow oven shell is provided with a motor device, one side middle of the reflow oven shell is fixedly connected with a control panel, a top cover is mounted on the top of the reflow oven shell, a lifting handle is fixedly connected in the middle of the top cover, and the supporting blocks support.
Further, the welding plate device comprises a welding plate main body, two sides of the welding plate main body are fixedly connected with side plates, a plurality of circular holes are formed in the bottom of the inner cavity of the welding plate main body in an equidistant arrangement mode, and the welding plate device is used for placing elements and a circuit board.
Further, the heating device comprises a heating pipe, the two ends of the heating pipe are fixedly connected with heating shafts, the back surface of the heating pipe is fixedly connected with a heating plate, and the heating device heats the inside.
Further, the round groove is formed in the bottom end of one side of the inner cavity of the reflow soldering furnace device, the round hole is formed in the bottom end of the other side of the inner cavity of the reflow soldering furnace device, the heating shaft on one side of the heating pipe is located in the round groove in the bottom end of one side of the inner cavity of the reflow soldering furnace device, and the heating shaft on the other side of the heating pipe is located in the round hole in the bottom end of the other side of the inner cavity of the reflow soldering furnace device.
Further, the motor device comprises a motor shell, a motor main body is fixedly connected to the bottom of an inner cavity of the motor shell, a circular small hole is formed in one side of the motor shell, a motor shaft is arranged in the middle of one side of the motor shell, one side of the motor shaft is fixedly connected with the motor main body through the circular small hole in one side of the motor shell, and the motor main body provides a power source.
Further, the other side of the motor shaft is fixedly connected with one side of the heating shaft through a circular hole at the bottom end of the other side of the inner cavity of the reflow furnace device.
Further, the air extractor comprises a connecting pipe, one side of the connecting pipe is fixedly connected with an air extracting assembly, an inner cavity of the air extracting assembly is provided with an air extracting shell, and the air extractor performs air extraction.
Further, the cooling device comprises a cooling pipe, one side of the cooling pipe is fixedly connected with a cooling box, the top of the cooling box is fixedly connected with a bottom plate, and the cooling device is used for internal cooling.
The utility model has the technical effects and advantages that:
1. the cooling device is beneficial to circulating water cooling of the cooling liquid in the cooling box through the cooling pipe, and the cooling device can prolong the service life of the main body of the air extractor after cooling hot gas in the reflow soldering furnace device.
2. The fan is arranged, so that the speed of cooling by the fan is increased, and the working efficiency of the device is improved.
Drawings
FIG. 1 is a schematic cross-sectional view of the overall structure of the present utility model;
FIG. 2 is a schematic diagram of the overall structure of the present utility model;
FIG. 3 is a schematic diagram of a motor apparatus according to the present utility model;
FIG. 4 is a schematic view of a welding plate device according to the present utility model;
FIG. 5 is a schematic view of a heating device according to the present utility model;
FIG. 6 is a schematic cross-sectional view of the furnace shell structure of the present utility model.
The reference numerals are: 1. a reflow oven apparatus; 101. a reflow oven housing; 102. a support block; 103. a motor device; 1031. a motor housing; 1032. a motor main body; 1033. a motor shaft; 104. a control panel; 105. a top cover; 106. a handle; 2. a fan; 3. a hanging plate; 4. a welding plate device; 401. a welding plate main body; 402. a side plate; 5. a heating device; 501. heating pipes; 502. a heating shaft; 503. a heating plate; 6. an air extracting device; 601. a connecting pipe; 602. an air extraction assembly; 603. an air extraction shell; 7. a cooling device; 701. a cooling tube; 702. a cooling box; 703. a bottom plate.
Detailed Description
The embodiments of the present utility model will be clearly and completely described below with reference to the drawings in the present utility model, and the configurations of the structures described in the following embodiments are merely examples, and the cooling device for a reflow oven according to the present utility model is not limited to the structures described in the following embodiments, and all other embodiments obtained by a person skilled in the art without any inventive effort are within the scope of the present utility model.
Referring to fig. 1-6, the utility model provides a cooling device of a reflow soldering furnace, which comprises a reflow soldering furnace device 1, wherein a circular groove is formed in one side of an inner cavity of the reflow soldering furnace device 1, a fan 2 is fixedly connected in the circular groove on one side of the inner cavity of the reflow soldering furnace device 1, hanging plates 3 are fixedly connected to two sides of the inner cavity of the reflow soldering furnace device 1, which are close to the fan 2, a plurality of welding plate devices 4 are arranged on the top of each hanging plate 3, a heating device 5 is arranged at the bottom of the inner cavity of the reflow soldering furnace device 1, a circular through hole is formed in the top end of one side of the reflow soldering furnace device 1, an air extracting device 6 is fixedly connected in the circular through hole on the top end of one side of the reflow soldering furnace device 1, a square groove is formed in the middle of one side of the reflow soldering furnace device 1, a cooling device 7 is fixedly connected in the square groove on the middle of one side of the reflow soldering furnace device 1, and the cooling device is simple in structure and convenient to install.
In a preferred embodiment, the reflow oven device 1 comprises a reflow oven housing 101, wherein supporting blocks 102 are fixedly connected to the periphery of the bottom of the reflow oven housing 101 in an equidistant arrangement manner, a motor device 103 is arranged at the bottom end of one side of the reflow oven housing 101, a control panel 104 is fixedly connected to the middle of one side of the reflow oven housing 101, a top cover 105 is mounted on the top of the reflow oven housing 101, a lifting handle 106 is fixedly connected to the middle of the top cover 105, and the supporting blocks 102 are used for supporting.
In a preferred embodiment, the welding plate device 4 includes a welding plate main body 401, two sides of the welding plate main body 401 are fixedly connected with side plates 402, a plurality of circular holes are arranged at the bottom of the inner cavity of the welding plate main body 401 in an equidistant manner, and the welding plate device 4 is used for placing components and a circuit board.
In a preferred embodiment, the heating device 5 includes a heating tube 501, two ends of the heating tube 501 are fixedly connected with heating shafts 502, a heating plate 503 is fixedly connected to the back surface of the heating tube 501, and the heating device 5 heats the reflow oven apparatus 1.
In a preferred embodiment, a circular groove is formed in the bottom end of one side of the inner cavity of the reflow soldering furnace device 1, a circular hole is formed in the bottom end of the other side of the inner cavity of the reflow soldering furnace device 1, a heating shaft 502 on one side of the heating pipe 501 is located in the circular groove of the bottom end of one side of the inner cavity of the reflow soldering furnace device 1, and a heating shaft 502 on the other side of the heating pipe 501 is located in the circular hole of the bottom end of the other side of the inner cavity of the reflow soldering furnace device 1.
In a preferred embodiment, the motor device 103 includes a motor housing 1031, a motor main body 1032 is fixedly connected to the bottom of the inner cavity of the motor housing 1031, a circular small hole is formed on one side of the motor housing 1031, a motor shaft 1033 is disposed in the middle of one side of the motor housing 1031, one side of the motor shaft 1033 is fixedly connected to the motor main body 1032 through the circular small hole on one side of the motor housing 1031, and the motor main body 1032 provides a power source.
In a preferred embodiment, the other side of motor shaft 1033 is fixedly connected to one side of heating shaft 502 by a circular hole in the bottom end of the other side of the interior cavity of reflow oven apparatus 1.
In a preferred embodiment, the air extractor 6 comprises a connecting pipe 601, one side of the connecting pipe 601 is fixedly connected with an air extracting assembly 602, an inner cavity of the air extracting assembly 602 is provided with an air extracting shell 603, and the air extractor 6 performs air extraction.
In a preferred embodiment, the cooling device 7 comprises a cooling pipe 701, one side of the cooling pipe 701 is fixedly connected with a cooling box 702, the top of the cooling box 702 is fixedly connected with a bottom plate 703, and the cooling device 7 performs internal cooling of the cooling device 1.
The working principle of the utility model is as follows:
when the cooling device 7 of the reflow soldering furnace is used, the handle 106 is firstly grasped to open the top cover 105, then the needed welding elements and the circuit board are placed in each melting plate main body 401, the top cover 105 is closed, the control panel 104 on one side of the reflow soldering furnace shell 101 is operated to enable the device to operate, the air suction shell 603 on the top end of one side of the reflow soldering furnace device 1 can suck air in the reflow soldering furnace device 1, the interior of the reflow soldering furnace device 1 is enabled to be in a vacuum device, the motor main body 1032 in the motor shell 1031 starts to be started, the motor shaft 1033 and the heating shaft 502 are in a fixed connection state, the motor main body 1032 can heat the heating shaft 502 through the motor shaft 1033, the heating shaft 502 can heat the heating pipe 501 and the heating plate 503, heat is generated through the heating pipe 501 and the heating shaft 502 to heat the interior of the reflow soldering furnace device 1, after the element in the melting plate main body 401 is welded, the bottom plate 703 is cooled, the cooling liquid in the cooling box 702 can be cooled in the cooling tube, the cooling tube 701 can be circularly cooled, meanwhile, the fan 2 on the top end of the reflow soldering furnace device 1 can be in the inner cavity 2 can be in a vacuum state, the fan 2 can not be used, the cooling device can be continuously used, and the service life of the cooling device can be prolonged, and the inner cavity of the cooling device can be protected when the fan 2 is not be used, and the inner-safe device can be used, and the inner-cooled, and the inner cavity of the cooling device can be continuously used, and the inner cavity can be guaranteed, and the life can be continuously and the device can be used safely and the life-prolonged.
In the drawings of the disclosed embodiments, only the structures related to the embodiments of the present disclosure are referred to, and other structures can refer to the common design, so that the same embodiment and different embodiments of the present disclosure can be combined with each other under the condition of no conflict; the foregoing description of the preferred embodiments of the utility model is not intended to limit the utility model to the precise form disclosed, and any such modifications, equivalents, and alternatives falling within the spirit and principles of the utility model are intended to be included within the scope of the utility model.
Claims (9)
1. A cooling device for a reflow oven, comprising a reflow oven device (1), characterized in that: the utility model discloses a reflow oven device, including inner chamber, reflow oven device, cooling device, fan (2) and fan (3) are offered to inner chamber one side of reflow oven device (1), circular recess has been offered to inner chamber one side of reflow oven device (1), fixedly connected with fan (2) in the inner chamber one side circular recess of reflow oven device (1), the inner chamber of reflow oven device (1) is close to both sides of fan (2) and all fixedly connected with link plate (3), every a plurality of welding plate device (4) have all been placed at the top of link plate (3), the inner chamber bottom of reflow oven device (1) is equipped with heating device (5), circular through-hole has been offered on one side top of reflow oven device (1), circular through-hole on one side top of reflow oven device (1) is interior fixedly connected with air extraction device (6), square recess has been offered in the middle of one side of reflow oven device (1), square recess in the middle of one side of reflow oven device (1) is interior fixedly connected with cooling device (7).
2. A cooling apparatus of a reflow oven as in claim 1, wherein: reflow oven device (1) is including reflow oven shell (101), fixedly connected with supporting shoe (102) are arranged around the bottom equidistance of reflow oven shell (101), one side bottom of reflow oven shell (101) is equipped with motor device (103), fixedly connected with control panel (104) in the middle of one side of reflow oven shell (101), top cap (105) are installed at the top of reflow oven shell (101), fixedly connected with handle (106) in the middle of the top of top cap (105).
3. A cooling apparatus of a reflow oven as in claim 1, wherein: the welding plate device (4) comprises a welding plate main body (401), two sides of the welding plate main body (401) are fixedly connected with side plates (402), and a plurality of circular holes are formed in the bottom of an inner cavity of the welding plate main body (401) in an equidistant arrangement mode.
4. A cooling apparatus of a reflow oven as in claim 1, wherein: the heating device (5) comprises a heating pipe (501), wherein the two ends of the heating pipe (501) are fixedly connected with heating shafts (502), and the back surface of the heating pipe (501) is fixedly connected with a heating plate (503).
5. A cooling apparatus of a reflow oven in accordance with claim 4, wherein: the novel reflow soldering furnace is characterized in that a circular groove is formed in the bottom end of one side of the inner cavity of the reflow soldering furnace device (1), a circular hole is formed in the bottom end of the other side of the inner cavity of the reflow soldering furnace device (1), a heating shaft (502) on one side of a heating pipe (501) is located in the circular groove of the bottom end of one side of the inner cavity of the reflow soldering furnace device (1), and the heating shaft (502) on the other side of the heating pipe (501) is located in the circular hole of the bottom end of the other side of the inner cavity of the reflow soldering furnace device (1).
6. A cooling apparatus of a reflow oven as in claim 2, wherein: the motor device (103) comprises a motor housing (1031), a motor main body (1032) is fixedly connected to the bottom of an inner cavity of the motor housing (1031), a circular small hole is formed in one side of the motor housing (1031), a motor shaft (1033) is arranged in the middle of one side of the motor housing (1031), and one side of the motor shaft (1033) is fixedly connected with the motor main body (1032) through the circular small hole in one side of the motor housing (1031).
7. A cooling apparatus of a reflow oven as in claim 6, wherein: the other side of the motor shaft (1033) is fixedly connected with one side of the heating shaft (502) through a round hole at the bottom end of the other side of the inner cavity of the reflow furnace device (1).
8. A cooling apparatus of a reflow oven as in claim 1, wherein: the air exhaust device (6) comprises a connecting pipe (601), one side of the connecting pipe (601) is fixedly connected with an air exhaust assembly (602), and an inner cavity of the air exhaust assembly (602) is provided with an air exhaust shell (603).
9. A cooling apparatus of a reflow oven as in claim 1, wherein: the cooling device (7) comprises a cooling pipe (701), one side of the cooling pipe (701) is fixedly connected with a cooling box (702), and the top of the cooling box (702) is fixedly connected with a bottom plate (703).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321362791.3U CN219881511U (en) | 2023-05-31 | 2023-05-31 | Cooling device of reflow oven |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321362791.3U CN219881511U (en) | 2023-05-31 | 2023-05-31 | Cooling device of reflow oven |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219881511U true CN219881511U (en) | 2023-10-24 |
Family
ID=88398284
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321362791.3U Active CN219881511U (en) | 2023-05-31 | 2023-05-31 | Cooling device of reflow oven |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219881511U (en) |
-
2023
- 2023-05-31 CN CN202321362791.3U patent/CN219881511U/en active Active
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