CN219881096U - Convenient refrigerated mould - Google Patents
Convenient refrigerated mould Download PDFInfo
- Publication number
- CN219881096U CN219881096U CN202321069338.3U CN202321069338U CN219881096U CN 219881096 U CN219881096 U CN 219881096U CN 202321069338 U CN202321069338 U CN 202321069338U CN 219881096 U CN219881096 U CN 219881096U
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- groove
- plate
- air inlet
- block
- head
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- 239000004065 semiconductor Substances 0.000 claims abstract description 32
- 238000009792 diffusion process Methods 0.000 claims abstract description 27
- 238000004080 punching Methods 0.000 claims abstract description 18
- 238000001816 cooling Methods 0.000 claims description 7
- 238000004378 air conditioning Methods 0.000 claims description 2
- 230000002146 bilateral effect Effects 0.000 claims description 2
- 238000009434 installation Methods 0.000 claims 1
- 238000005057 refrigeration Methods 0.000 claims 1
- 230000009286 beneficial effect Effects 0.000 abstract description 2
- 238000007789 sealing Methods 0.000 description 12
- 239000000463 material Substances 0.000 description 5
- 230000000149 penetrating effect Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 230000000903 blocking effect Effects 0.000 description 1
- 238000005242 forging Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
The utility model relates to the technical field of dies, in particular to a die convenient to cool, which comprises: the die comprises a die body, wherein a mounting plate is fixedly arranged in the die body, and a stamping head is fixedly connected to the bottom of the mounting plate; the fixing block is positioned at the bottom of the mounting plate, a semiconductor piece is arranged in the fixing block, a heat outlet is formed in the outer side of the semiconductor piece, and a fan is arranged in the inner side of the semiconductor piece; the air inlet, the air inlet is located punching press head bottom, and the air inlet inboard is provided with the diffusion hole, and the air inlet outside is provided with the shutoff board, and the shutoff inboard is provided with the guiding groove, and the shutoff inboard is provided with the venthole, and shutoff board upper end is provided with the constant head tank, and beneficial effect is: according to the utility model, the fan arranged in the die convenient to cool is matched with the heat outlet, so that the contact surface at the bottom of the stamping head can be cooled conveniently, the heat generated by the stamping head after long-time working is prevented from exceeding the tolerance limit, and the stamping head is prevented from being replaced by stopping.
Description
Technical Field
The utility model relates to the field of dies, in particular to a die convenient to cool.
Background
The die means a die which finally obtains a required product through injection molding, extrusion, forging, stamping and the like, and the die used in the stamping is generally called a stamping die which is composed of an upper die part and a lower die part.
When in punching, firstly, a material plate is placed on a die cavity of a lower die part, a press machine pushes a punching head in a punching die to enable the punching head to move downwards, and the die head is matched with the die cavity to extrude the material plate, so that a part with a required shape is obtained.
When the stamping head is in contact extrusion with the material plate, certain heat is generated, and when the stamping time is too long, the heat of the stamping head exceeds the born range, deformation of the stamping head is caused, in the prior art, the whole machine is stopped before the heat-resistant limit of the stamping head, the stamping head is replaced, but the whole processing efficiency is reduced, the production income is influenced, and further improvement and optimization are needed.
Disclosure of Invention
The utility model aims to provide a die convenient to cool, which solves the problems that in the prior art, the whole machine is stopped before the heat-resistant limit of the punching head, the punching head is replaced, the whole processing efficiency is reduced when the whole machine is stopped, and the production income is influenced.
In order to achieve the above purpose, the present utility model provides the following technical solutions: a mold for facilitating cooling, comprising:
the die comprises a die body, wherein a mounting plate is fixedly arranged in the die body, and a stamping head is fixedly connected to the bottom of the mounting plate;
the fixing block is positioned at the bottom of the mounting plate, a semiconductor piece is arranged in the fixing block, a heat outlet is formed in the outer side of the semiconductor piece, and a fan is arranged in the inner side of the semiconductor piece;
the air inlet is positioned at the bottom of the stamping head, diffusion holes are formed in the inner side of the air inlet, a plugging plate is arranged on the outer side of the air inlet, a guide groove is formed in the plugging plate, an air outlet hole is formed in the plugging plate, and a positioning groove is formed in the upper end of the plugging plate; a kind of electronic device with high-pressure air-conditioning system
The limiting groove is located inside the mounting plate, the spring is arranged inside the limiting groove, the abutting block is arranged at the bottom of the spring, the rotating groove is arranged on the outer side of the limiting groove, the rotating plate is arranged inside the rotating groove, and the positioning block is arranged at the bottom of the rotating plate.
Preferably, two groups of fixing blocks are symmetrically and fixedly arranged at the bottom of the mounting plate, the fixing blocks are of block structures with inclined surfaces on the inner sides, and the inclined surfaces on the inner sides of the fixing blocks are aligned with the bottom of the stamping head.
Preferably, the semiconductor sheets are fixedly installed inside the fixing blocks and are obliquely installed, the semiconductor sheets are parallel to the inclined planes of the fixing blocks, and the refrigerating surfaces of the semiconductor sheets are located on the inclined planes.
Preferably, the semiconductor wafer outside all is provided with out the hot mouth, and it runs through the fixed block all to go out the hot mouth outside, and the radiating surface of semiconductor wafer is located out hot mouth one side, and the inboard end of semiconductor wafer all is provided with the fan, fan outside and fixed block fixed connection, fan and fixed block inclined plane are parallel.
Preferably, the bottom of the stamping head is symmetrically provided with two groups of air inlets corresponding to the fixed blocks, the outer sides of the air inlets penetrate the stamping head, the inner sides of the air inlets are communicated with two groups of diffusion holes, the diffusion holes are arranged into C-shaped penetrating grooves in cross section, and the other sides of the diffusion holes penetrate the stamping head.
Preferably, the shutoff board sets up to annular platelike structure, and the shutoff board movable sleeve is located the punching press head outside, and the inside all corresponding air inlet of shutoff board is provided with the guiding groove, and the guiding groove all aligns with the air inlet, and the shutoff board all corresponds the diffusion hole and is provided with the venthole, and the venthole all aligns with the diffusion hole, and the shutoff board upper end is annular equidistance and is provided with the multiunit constant head tank, and the constant head tank upper end all runs through the shutoff board.
Preferably, the inside bilateral symmetry of punching press head is provided with two sets of spacing grooves, and the spacing groove sets up to the rectangular channel, and equal fixed mounting in spacing inslot has the spring, and the equal fixed connection in spring bottom supports the piece, supports the piece and sets up to rectangular block structure, supports the piece outside and all runs through the spacing groove and extend to the change groove.
Preferably, the rotary groove is arranged as an annular groove, the rotary plate is arranged as an annular plate-shaped structure, the rotary groove height is larger than that of the rotary plate, the inner sides of the rotary plate are fixedly connected with the supporting blocks, an annular inner groove with an arc-shaped cross section is arranged in the middle of the outer side of the rotary plate, a plurality of groups of positioning blocks are arranged at the bottom of the rotary plate at equal intervals in an annular mode, the positioning blocks are smaller than the distance between the top surface of the rotary groove and the rotary plate in height, and the positioning blocks are located inside the positioning grooves.
Compared with the prior art, the utility model has the beneficial effects that:
according to the utility model, the cooling of the contact surface at the bottom of the stamping head can be conveniently realized through the fan matched with the heat outlet arranged in the die convenient to cool, the heat generated after the stamping head works for a long time is prevented from exceeding the tolerance limit, the stamping head is prevented from being replaced by stopping, the whole processing efficiency is improved, the cooling air blown by the fan is conveniently introduced into the stamping head through the air inlet matched with the diffusion hole, the heat dissipation and cooling effects are more, the air inlet and the diffusion hole can be conveniently plugged through the plugging plate, the sundries entering the air inlet and the diffusion hole when the stamping head is not used are prevented from being plugged through the locating slot matched with the locating block, the plugging plate can be conveniently limited, and the movement of the plugging plate is prevented.
Drawings
The utility model is further described below with reference to the accompanying drawings:
FIG. 1 is a schematic diagram of the structure of the present utility model;
FIG. 2 is a schematic cross-sectional view of the structure of the present utility model;
FIG. 3 is an enlarged schematic view of the structure shown in FIG. 2A;
FIG. 4 is a bottom cross-sectional view of the punch head of the present utility model;
FIG. 5 is a schematic block diagram of the present utility model.
In the figure: the die comprises a die body 1, a mounting plate 2, a stamping head 3, a fixed block 4, a semiconductor piece 5, a heat outlet 6, a fan 7, an air inlet 8, a diffusion hole 9, a plugging plate 10, a guide groove 11, an air outlet 12, a positioning groove 13, a limiting groove 14, a spring 15, a supporting block 16, a rotating groove 17, a rotating plate 18 and a positioning block 19
Detailed Description
In order to more clearly illustrate the general inventive concept, reference will be made in the following detailed description, by way of example, to the accompanying drawings.
It should be noted that in the following description, numerous specific details are set forth in order to provide a thorough understanding of the present utility model, however, the present utility model may be practiced in other ways than as described herein, and therefore the scope of the present utility model is not limited by the specific embodiments disclosed below.
In addition, in the description of the present utility model, it should be understood that the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "axial", "radial", "circumferential", etc. indicate orientations or positional relationships based on the drawings, are merely for convenience in describing the present utility model and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present utility model.
In the present utility model, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. However, it is noted that a direct connection indicates that two bodies connected together do not form a connection relationship by an excessive structure, but are connected to form a whole by a connection structure. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances.
In the present utility model, unless expressly stated or limited otherwise, a first feature "up" or "down" a second feature may be the first and second features in direct contact, or the first and second features in indirect contact via an intervening medium. In the description of the present specification, a description referring to terms "one embodiment," "some embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present utility model. In this specification, schematic representations of the above terms are not necessarily directed to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
Example 1
Referring to fig. 1 to 5, the present utility model provides a technical solution: a mold for facilitating cooling, comprising: the die comprises a die body 1, wherein a mounting plate 2 is fixedly arranged in the die body 1, and a stamping head 3 is fixedly connected to the bottom of the mounting plate 2; the fixing block 4 is positioned at the bottom of the mounting plate 2, a semiconductor piece 5 is arranged in the fixing block 4, a heat outlet 6 is formed in the outer side of the semiconductor piece 5, and a fan 7 is arranged in the inner side of the semiconductor piece 5; the air inlet 8 is positioned at the bottom of the stamping head 3, diffusion holes 9 are formed in the inner side of the air inlet 8, a plugging plate 10 is arranged on the outer side of the air inlet 8, a guide groove 11 is formed in the plugging plate 10, an air outlet hole 12 is formed in the plugging plate 10, and a positioning groove 13 is formed in the upper end of the plugging plate 10; and the limiting groove 14 is positioned in the mounting plate 2, a spring 15 is arranged in the limiting groove 14, a supporting block 16 is arranged at the bottom of the spring 15, a rotating groove 17 is arranged at the outer side of the limiting groove 14, a rotating plate 18 is arranged in the rotating groove 17, and a positioning block 19 is arranged at the bottom of the rotating plate 18.
Example two
On the basis of the second embodiment, two groups of fixing blocks 4 are symmetrically and fixedly installed at the bottom of the mounting plate 2, the fixing blocks 4 are of block structures with inclined planes on the inner sides, the inclined planes on the inner sides of the fixing blocks 4 are aligned with the bottom of the stamping head 3, semiconductor chips 5 are fixedly installed inside the fixing blocks 4, the semiconductor chips 5 are obliquely installed and are parallel to the inclined planes on the fixing blocks 4, the refrigerating surfaces of the semiconductor chips 5 are located on the inclined planes, heat outlets 6 are formed in the outer sides of the semiconductor chips 5, the outer sides of the heat outlets 6 penetrate through the fixing blocks 4, the heat radiating surfaces of the semiconductor chips 5 are located on the heat outlets 6, fans 7 are arranged at the inner sides of the semiconductor chips 5, the outer sides of the fans 7 are fixedly connected with the fixing blocks 4, the fans 7 are parallel to the inclined planes of the fixing blocks 4, cold air emitted by the heat outlets 6 can be conveniently conveyed to the stamping head 3 through the fans 7, and the two groups of the fans 7 and the heat outlets 6 can be better cooled by the stamping head 3.
Example III
On the basis of the second embodiment, two groups of air inlets 8 are symmetrically formed in the bottom of the stamping head 3 corresponding to the fixing block 4, two groups of diffusion holes 9 are formed in the outer side of the air inlets 8 in a penetrating mode, two groups of diffusion holes 9 are formed in the inner side of the air inlets 8 in a communicating mode, the diffusion holes 9 are formed in C-shaped penetrating grooves in the cross section, the other sides of the diffusion holes 9 penetrate the stamping head 3, the sealing plate 10 is of an annular plate-shaped structure, the sealing plate 10 is movably sleeved on the outer side of the stamping head 3, guide grooves 11 are formed in the inner portion of the sealing plate 10 corresponding to the air inlets 8, the guide grooves 11 are aligned with the air inlets 8, air outlets 12 are formed in the sealing plate 10 corresponding to the diffusion holes 9, a plurality of positioning grooves 13 are formed in the upper end of the sealing plate 10 at equal intervals in an annular mode, the upper ends of the positioning grooves 13 penetrate the sealing plate 10, and cold air can conveniently enter and discharge the stamping head 3 through the arranged guide grooves 11 and the air outlets 12.
Example IV
On the basis of the third embodiment, two groups of limiting grooves 14 are symmetrically arranged inside the stamping head 3, the limiting grooves 14 are rectangular grooves, springs 15 are fixedly installed inside the limiting grooves 14, the bottoms of the springs 15 are fixedly connected with abutting blocks 16, the abutting blocks 16 are of rectangular block structures, the outer sides of the abutting blocks 16 penetrate through the limiting grooves 14 and extend to the rotating grooves 17, the rotating grooves 17 are annular grooves, the rotating plates 18 are of annular plate structures, the height of the rotating grooves 17 is larger than that of the rotating plates 18, the inner sides of the rotating plates 18 are fixedly connected with the abutting blocks 16, annular inner grooves with arc-shaped sections are formed in the middle of the outer sides of the rotating plates 18, a plurality of groups of positioning blocks 19 are arranged at equal intervals in an annular mode at the bottoms of the rotating plates 18, the positioning blocks 19 are smaller than the distance between the top surfaces of the rotating grooves 17 and the rotating plates 18, the positioning blocks 19 are located inside the positioning grooves 13, the limiting grooves 14 arranged in a matched mode through the rectangular limiting grooves 14 are matched with the abutting blocks 16, the rotating plates 18 can be convenient to limit the rotating plates 18, and movement of the sealing plates 10 is avoided.
When the utility model is used, the heat outlet 6 and the fan 7 are started, the cold air is generated on the surface attached to the fan 7 by the self characteristic of the heat outlet 6, the generated cold air is conveyed to the punching head 3 by the fan 7, the punching head 3 is cooled, part of the cold air enters the air inlet 8 from the guide groove 11, and the punching head 3 is cooled by contact with the inner wall of the punching head 3 through the diffusion hole 9, so that the cooling effect is improved;
when the air inlet and air outlet sealing device is not used, the rotating plate 18 is held and lifted, the rotating plate 18 drives the positioning block 19 to move, the positioning block 19 leaves the inside of the positioning groove 13, the sealing plate 10 is not limited, the sealing plate 10 is rotated, the guide groove 11 is not aligned with the air inlet 8, the air outlet hole 12 is not aligned with the diffusion hole 9, the sealing plate 10 seals the air inlet 8 and the diffusion hole 9, the rotating plate 18 is loosened, the spring 15 pushes the abutting block 16 to drive the rotating plate 18 to move through self elasticity, the positioning block 19 is clamped into the corresponding positioning groove 13, the sealing plate 10 is fixed, and blocking caused by sundries entering the air inlet 8 and the diffusion hole 9 is avoided.
Those of ordinary skill in the art will appreciate that: the discussion of any of the embodiments above is merely exemplary and is not intended to suggest that the scope of the utility model (including the claims) is limited to these examples; the technical features of the above embodiments or in the different embodiments may also be combined within the idea of the utility model, the steps may be implemented in any order and there are many other variations of the different aspects of the utility model as described above, which are not provided in detail for the sake of brevity.
The present utility model is intended to embrace all such alternatives, modifications and variances which fall within the broad scope of the appended claims. Therefore, any omission, modification, equivalent replacement, improvement, etc. of the present utility model should be included in the scope of the present utility model.
Claims (8)
1. A mold convenient for cooling, comprising:
the die comprises a die body, wherein a mounting plate is fixedly arranged in the die body, and a stamping head is fixedly connected to the bottom of the mounting plate;
the fixing block is positioned at the bottom of the mounting plate, a semiconductor piece is arranged in the fixing block, a heat outlet is formed in the outer side of the semiconductor piece, and a fan is arranged in the inner side of the semiconductor piece;
the air inlet is positioned at the bottom of the stamping head, diffusion holes are formed in the inner side of the air inlet, a plugging plate is arranged on the outer side of the air inlet, a guide groove is formed in the plugging plate, an air outlet hole is formed in the plugging plate, and a positioning groove is formed in the upper end of the plugging plate; a kind of electronic device with high-pressure air-conditioning system
The limiting groove is located inside the mounting plate, the spring is arranged inside the limiting groove, the abutting block is arranged at the bottom of the spring, the rotating groove is arranged on the outer side of the limiting groove, the rotating plate is arranged inside the rotating groove, and the positioning block is arranged at the bottom of the rotating plate.
2. A cooling-facilitating mold according to claim 1, wherein: two groups of fixing blocks are symmetrically and fixedly arranged at the bottom of the mounting plate, the fixing blocks are of block structures with inclined surfaces on the inner sides, and the inclined surfaces on the inner sides of the fixing blocks are aligned with the bottom of the stamping head.
3. A cooling-facilitating mold according to claim 1, wherein: the inside equal fixed mounting of fixed block has the semiconductor piece, and the semiconductor piece sets up to slope installation, and the semiconductor piece is all parallel with the fixed block inclined plane, and the refrigeration face of semiconductor piece is located the inclined plane side.
4. A cooling-facilitating mold according to claim 1, wherein: the semiconductor wafer outside all is provided with the play hot mouth, and the play hot mouth outside all runs through the fixed block, and the radiating surface of semiconductor wafer is located play hot mouth one side, and the inboard end of semiconductor wafer all is provided with the fan, fan outside and fixed block fixed connection, fan and fixed block inclined plane parallel.
5. A cooling-facilitating mold according to claim 1, wherein: the punching press head bottom corresponds the fixed block symmetry and is provided with two sets of air inlets, and the punching press head is all run through in the air inlet outside, and the air inlet inboard all communicates two sets of diffusion holes, and the diffusion hole sets up to the cross-section and runs through the groove for the C shape, and the diffusion hole opposite side all runs through the punching press head.
6. A cooling-facilitating mold according to claim 1, wherein: the shutoff board sets up to annular platelike structure, and the shutoff board movable sleeve is located the punching press head outside, and the inside air inlet that corresponds of shutoff board is provided with the guiding groove, and the guiding groove all aligns with the air inlet, and the shutoff board all corresponds the diffusion hole and is provided with the venthole, and the venthole all aligns with the diffusion hole, and the shutoff board upper end is annular equidistance and is provided with the multiunit constant head tank, and the constant head tank upper end all runs through the shutoff board.
7. A cooling-facilitating mold according to claim 1, wherein: the inside bilateral symmetry of punching press head is provided with two sets of spacing grooves, and the spacing groove sets up to the rectangular channel, and the equal fixed mounting in spacing inslot has the spring, and the equal fixed connection in spring bottom supports the piece, supports the piece and sets up to rectangular block structure, supports the piece outside and all runs through the spacing groove and extend to the commentaries on classics groove.
8. A cooling-facilitating mold according to claim 1, wherein: the rotary groove is arranged into an annular groove, the rotary plate is arranged into an annular plate-shaped structure, the rotary groove height is larger than that of the rotary plate, the inner sides of the rotary plate are fixedly connected with the supporting blocks, an annular inner groove with an arc-shaped cross section is arranged in the middle of the outer sides of the rotary plate, a plurality of groups of positioning blocks are arranged at the bottom of the rotary plate at equal intervals in an annular mode, the height of each positioning block is smaller than the distance between the top surface of the rotary groove and the rotary plate, and the positioning blocks are located inside the positioning groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321069338.3U CN219881096U (en) | 2023-05-06 | 2023-05-06 | Convenient refrigerated mould |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321069338.3U CN219881096U (en) | 2023-05-06 | 2023-05-06 | Convenient refrigerated mould |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219881096U true CN219881096U (en) | 2023-10-24 |
Family
ID=88410226
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321069338.3U Active CN219881096U (en) | 2023-05-06 | 2023-05-06 | Convenient refrigerated mould |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219881096U (en) |
-
2023
- 2023-05-06 CN CN202321069338.3U patent/CN219881096U/en active Active
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