CN219874989U - Mechanism for active refrigeration of bus duct - Google Patents
Mechanism for active refrigeration of bus duct Download PDFInfo
- Publication number
- CN219874989U CN219874989U CN202223558356.6U CN202223558356U CN219874989U CN 219874989 U CN219874989 U CN 219874989U CN 202223558356 U CN202223558356 U CN 202223558356U CN 219874989 U CN219874989 U CN 219874989U
- Authority
- CN
- China
- Prior art keywords
- bus duct
- side cover
- fan
- semiconductor refrigerating
- bus
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 238000005057 refrigeration Methods 0.000 title abstract description 12
- 239000004065 semiconductor Substances 0.000 claims abstract description 30
- 238000001816 cooling Methods 0.000 claims description 12
- 230000017525 heat dissipation Effects 0.000 abstract description 10
- 238000010586 diagram Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000009423 ventilation Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model provides a mechanism for bus duct initiative refrigeration, the bus duct include port case and/or jack box, the mechanism package set up in the semiconductor refrigeration spare of bus duct surface and fix the fan on the semiconductor refrigeration spare. The utility model has the advantages that the heat of the bus duct is actively taken away by utilizing the combination of the semiconductor refrigerating piece and the fan by utilizing the heat dissipation structure similar to the heat dissipation structure arranged on the CPU of the computer, and the temperature of the bus duct is reduced.
Description
Technical Field
The utility model provides a cooling mechanism with a bus duct comprising a port box and/or an inserting box, and particularly relates to a mechanism for actively cooling the bus duct.
Background
At present, the power of electric equipment at the tail end of a machine room is higher and higher, the power consumption of a cabinet is continuously increased, the bus configuration specification is developed to be more than 630A, rated currents of a port box and an inserting box are larger and larger, the heat dissipation efficiency of an original air self-cooling mode cannot be kept up, the heat productivity is correspondingly increased, the equipment trips due to heat accumulation, and the operation of the cabinet is affected.
For example, a reinforced heat dissipation bus duct (patent number: 202021524626. X), a reinforced heat dissipation bus duct comprises a lower bottom plate, an air supply pipe and pipe clamps, wherein the upper end of the lower bottom plate is connected with a side plate, the inner side of the side plate is fixedly provided with a bus shelf, the upper surface of the bus shelf is fixedly provided with a partition plate, the side plate is connected with a cover plate through a bolt, the cover plate is positioned at the upper end of the side plate, wing plates are arranged on two sides of the cover plate, a heat dissipation hole is arranged on the upper side of the side plate, the end part of the side plate is connected with a flange, the air supply pipe is attached to the upper surface of the lower bottom plate, an air outlet is arranged on the upper end of the air supply pipe, the pipe clamps are attached to the outer wall of the air supply pipe, fixing plates are distributed on two sides of the pipe clamps, the upper surface of the cover plate is provided with a groove, and the upper end of the groove is attached with a heat dissipation fin, and the cooling is mainly carried out by natural wind.
The utility model provides a self-radiating high-protection intensive bus duct (patent number: 202111607951.1), bus duct body, bus connector, connector cover and connector side guard board, bus duct body be assembled, bus duct body both sides all are equipped with the heat dissipation shell, bus duct body's upper and lower both sides all are equipped with bus duct clamp plate, heat dissipation shell both ends all vertically be equipped with the connection curb plate, bus duct clamp plate inboard both ends all be equipped with the end connection piece, the connection curb plate link to each other with the bus connector, the bus connector include copper bar connector and connector fixed plate, the connector fixed plate link to each other with the connection curb plate, bus connector both sides be equipped with connector side guard board, connector side guard board shape be the rectangle, connector side guard board both sides are equipped with the installation hem, the installation hem link to each other with the connector curb plate, the end connection piece top be equipped with the connector cover, the connector cover's bottom plate inboard link to each other with the end connection piece, the both sides board outside of connector cover and connector cover are equipped with the T type that the bottom is equipped with the main outside of using the heat dissipation tooth that is of the bottom of the connection to cool down nature.
Disclosure of Invention
The utility model provides a mechanism for actively refrigerating a bus duct, which utilizes a radiating structure similar to that arranged on a CPU of a computer to actively take away heat of the bus duct by using a combination of a semiconductor refrigerating piece and a fan, so as to reduce the temperature of the bus duct.
The utility model aims at providing a mechanism for actively refrigerating a bus duct, wherein the bus duct comprises a port box and/or an inserting box, and the mechanism comprises a semiconductor refrigerating piece arranged on the surface of the bus duct and a fan fixed on the semiconductor refrigerating piece.
Further, the mechanism further comprises a side cover, a ventilation port is arranged on the side cover, the side cover is connected with the surface of the bus duct, a gap is reserved between the inner surface of the side cover and the surface of the bus duct, and the semiconductor refrigerating piece and the fan are arranged in the gap;
the semiconductor refrigerating piece is directly fixed on the surface of the bus duct or is stuck to the surface of the bus duct under the pressure action of the side cover.
Further, the side cover is provided with a magnet or the side cover part is made of a magnet, and the side cover is adsorbed on the surface of the bus duct through the magnetic force of the magnet.
Further, a fan fixing part is arranged on the inner surface of the side cover, and the fan is fixed on the inner surface of the side cover through the fan fixing part.
Further, a vent is arranged on the surface of the bus duct, and the semiconductor refrigerating piece at least partially covers the vent.
The utility model has the advantages that: 1) The semiconductor refrigerating piece absorbs heat in the bus duct and discharges the heat in the bus duct through the fan.
2) The inner part of the side cover and the surface of the bus duct form a gap, the semiconductor refrigerating piece and the fan are arranged by the gap, the structure for fixing the semiconductor refrigerating piece can be arranged on the bus duct, the structure of the semiconductor refrigerating piece can be omitted, the pressure of the inner surface of the side cover can be directly used for generating pressure to the semiconductor refrigerating piece through the fan, and the semiconductor refrigerating piece is pressed on the surface of the bus duct.
3) The side cover is provided with the magnet or part of the side cover is made of the magnet, so that the side cover can be conveniently fixed on the surface of the bus duct (a metal plate can be arranged on the surface of the bus duct for convenient fixation, the heat conduction efficiency is high, and the side cover can be installed without punching).
Drawings
FIG. 1 is a schematic diagram of the structure of the present utility model.
Fig. 2 is an exploded view of the semiconductor refrigeration unit with the fan and the side cover.
Fig. 3 is a schematic diagram of the bus duct, semiconductor refrigeration member and fan, side cover connection.
Fig. 4 shows a schematic view of a preferred structure of the side cover.
As shown in the figure, bus duct 1, semiconductor refrigeration unit 2, fan 3, side cover 4, air exchanging port 5, fan fixing unit 6, and air vent 7.
Detailed Description
In fig. 1, 2 and 3, a mechanism for active cooling of a bus duct, the bus duct 1 includes a port box and/or an inserting box, the mechanism includes a semiconductor cooling member 2 disposed on the surface of the bus duct 1 and a fan 3 fixed on the semiconductor cooling member 2, when the mechanism works, the semiconductor cooling member 2 is attached to the surface of the bus duct 1, and the fan 3 blows air to take away heat of the semiconductor cooling member 2.
Preferably, the mechanism further comprises a side cover 4, a heat exchange air port 5 is arranged on the side cover 4, the side cover 4 is connected with the surface of the bus duct 1 through the heat exchange air port 5, a gap is reserved between the inner surface of the side cover 4 and the surface of the bus duct 1, and the semiconductor refrigerating piece 2 and the fan 3 are arranged in the gap;
the semiconductor refrigeration piece 2 is directly fixed (fixed by a fixing piece) on the surface of the bus duct 1 or is tightly attached to the surface of the bus duct 1 under the pressure action of the side cover 4 as shown in fig. 2.
Preferably, the side cover 4 is provided with a magnet or the side cover 4 is partially made of a magnet, and the side cover 4 is adsorbed on the surface of the bus duct 1 through the magnetic force of the magnet.
As shown in fig. 4, preferably, a fan fixing member 6 is disposed on the inner surface of the side cover 4, the fan fixing member 6 is a symmetrically disposed elastic clamping plate, and the fan 3 is fixed on the inner surface of the side cover 4 through the fan fixing member 6, that is, the fan 3 is clamped in the side cover 4 through deformation of the elastic clamping plate.
Preferably, a vent 7 is provided on the surface of the bus duct 1, the semiconductor refrigeration unit 1 at least partially covers the vent 7, and by providing the vent 7, the air flow in the bus duct 1 can be accelerated, especially under the real-time refrigeration effect of the semiconductor refrigeration unit 1.
Claims (3)
1. A mechanism for active cooling of a bus duct, the bus duct comprising a port box and/or a jack box, characterized by: the mechanism comprises a semiconductor refrigerating piece arranged on the surface of the bus duct and a fan fixed on the semiconductor refrigerating piece;
the mechanism further comprises a side cover, a change air port is arranged on the side cover, the side cover is connected with the surface of the bus duct, a gap is reserved between the inner surface of the side cover and the surface of the bus duct, and the semiconductor refrigerating piece and the fan are arranged in the gap;
the bus duct is stuck to the surface of the bus duct under the pressure action of the side cover;
the side cover is provided with a magnet or is made of a magnet, and the side cover is adsorbed on the surface of the bus duct through the magnetic force of the magnet.
2. The mechanism for active cooling of bus duct of claim 1, wherein: the fan fixing piece is arranged on the inner surface of the side cover, and the fan is fixed on the inner surface of the side cover through the fan fixing piece.
3. The mechanism for active cooling of bus duct of claim 1, wherein: and a vent is arranged on the surface of the bus duct, and the semiconductor refrigerating piece at least partially covers the vent.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223558356.6U CN219874989U (en) | 2022-12-30 | 2022-12-30 | Mechanism for active refrigeration of bus duct |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223558356.6U CN219874989U (en) | 2022-12-30 | 2022-12-30 | Mechanism for active refrigeration of bus duct |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219874989U true CN219874989U (en) | 2023-10-20 |
Family
ID=88337039
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202223558356.6U Active CN219874989U (en) | 2022-12-30 | 2022-12-30 | Mechanism for active refrigeration of bus duct |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219874989U (en) |
-
2022
- 2022-12-30 CN CN202223558356.6U patent/CN219874989U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |