CN219871747U - Semiconductor probe test fixture - Google Patents
Semiconductor probe test fixture Download PDFInfo
- Publication number
- CN219871747U CN219871747U CN202320787443.4U CN202320787443U CN219871747U CN 219871747 U CN219871747 U CN 219871747U CN 202320787443 U CN202320787443 U CN 202320787443U CN 219871747 U CN219871747 U CN 219871747U
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- electric push
- push rod
- fixedly connected
- swing arm
- probe
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- 239000000523 sample Substances 0.000 title claims abstract description 102
- 239000004065 semiconductor Substances 0.000 title claims abstract description 71
- 238000012360 testing method Methods 0.000 title claims abstract description 55
- 230000007246 mechanism Effects 0.000 claims abstract description 19
- 230000002146 bilateral effect Effects 0.000 claims description 3
- 230000001105 regulatory effect Effects 0.000 description 8
- 238000005096 rolling process Methods 0.000 description 5
- 230000005611 electricity Effects 0.000 description 3
- 230000001276 controlling effect Effects 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
Classifications
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
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- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The utility model discloses a semiconductor probe testing jig, which comprises a supporting frame and a probe switching mechanism; a supporting frame: the upper surface of the support frame is fixedly connected with a fixing plate, four corners of the lower surface of the support frame are respectively and threadedly connected with supporting legs, the middle part of the upper surface of the fixing plate is fixedly connected with a test table, a movable table is slidably connected in a sliding groove formed in the upper surface of the test table, the left side of the upper surface of the fixing plate is fixedly connected with a support column, the upper end of the support column is rotatably connected with a swing arm through a pin shaft, and the right side of the upper surface of the fixing plate is provided with a display screen; probe switching mechanism: the semiconductor probe testing jig is arranged in the swing arm, the second electric push rod is arranged on the upper surface of the swing arm, the telescopic end of the second electric push rod is matched with the probe switching mechanism below the second electric push rod, the probe to be tested can be rapidly and accurately switched, the probe can be subjected to multi-angle test, and the semiconductor probe testing jig is convenient to use.
Description
Technical Field
The utility model relates to the technical field of semiconductor probes, in particular to a semiconductor probe testing jig.
Background
The semiconductor probe is also called a test probe, is applied to a function test probe for testing semiconductor components in electronic test, plays a role of connecting conduction and signal transmission, can be widely applied to automobiles, smart phones, tablet personal computers, GSP navigation, televisions and the like as internal connection accessories except for general chip test application, and in the production of the semiconductor probe, the semiconductor probe is often required to be tested, the conventional semiconductor probe test fixture is used for fixing the semiconductor probe on a mounting seat of a telescopic end of an electric push rod, so that an input end point of the semiconductor probe is connected with an output end of an external PLC controller, then a PCB is fixed, an output end point of the PCB is connected with an input end of the PLC controller, then the semiconductor probe which is required to be tested is driven by the electric push rod to be close to the PCB, if information can be transmitted from the PCB to the PCB, the semiconductor probe is qualified, but in the test of the semiconductor probe, personnel are required to continuously replace the semiconductor probe to test, and the test is time-consuming and labor consuming.
Disclosure of Invention
The utility model aims to overcome the existing defects, provides the semiconductor probe testing jig, can rapidly and accurately switch probes to be tested, can perform multi-angle testing on the probes, is convenient to use, and can effectively solve the problems in the background technology.
In order to achieve the above purpose, the present utility model provides the following technical solutions: a semiconductor probe testing fixture comprises a supporting frame and a probe switching mechanism;
a supporting frame: the upper surface of the support frame is fixedly connected with a fixing plate, four corners of the lower surface of the support frame are respectively and threadedly connected with supporting legs, the middle part of the upper surface of the fixing plate is fixedly connected with a test table, a movable table is slidably connected in a sliding groove formed in the upper surface of the test table, the left side of the upper surface of the fixing plate is fixedly connected with a support column, the upper end of the support column is rotatably connected with a swing arm through a pin shaft, and the right side of the upper surface of the fixing plate is provided with a display screen;
probe switching mechanism: the probe switching mechanism is arranged below the swing arm, and the upper surface of the swing arm is provided with a second electric push rod;
wherein: the upper surface left side of fixed plate is provided with the PLC controller, and the output of PLC controller is all connected to the input of second electric putter and display screen electricity, can carry out quick accurate switching to the probe that needs to test, can carry out the multi-angle test to the probe, convenient to use.
Further, probe switching mechanism includes rolling disc, spring, fly leaf and traveller, the rolling disc rotates through the pivot to be connected in the lower surface of swing arm, the lower fixed surface of rolling disc is connected with evenly distributed's traveller, the equal fixedly connected with separation blade in bottom of traveller, equal sliding connection has the fly leaf between the outer cambered surface of two adjacent travellers, equal fixedly connected with rubber circle in the standing groove that one side that the fly leaf upper surface is close to the vertical center of rolling disc was evenly offered, all be provided with the spring between separation blade and the fly leaf, the outer cambered surface of traveller is all located to the spring, the flexible end of second electric putter and the fly leaf cooperation installation that is located its below install the probe that needs to test through the standing groove, the probe reciprocates after driving the installation through the fly leaf.
Further, probe switching mechanism still includes second support, worm wheel, first gear and second gear, first gear passes through the axis of rotation and rotates to be connected in the inside bottom right side of swing arm, and the extrados upper end of pivot is located to the fixed cover of second gear, and first gear is connected with second gear meshing, and the extrados downside of axis of rotation is located to the fixed cover of worm wheel, and the inside bottom fixedly connected with of swing arm two bilateral symmetry's of distribution second supports, is connected with the worm through the bearing rotation between two second supports, and the worm is connected with the worm wheel meshing, drives the rotation of rolling disc through the meshing relationship between worm and the worm wheel and realizes the switching to the probe.
Further, the inside bottom rear side of swing arm is provided with first motor, and the output shaft and the worm fixed connection of first motor, the output of PLC controller is connected to the input electricity of first motor, controls the rotation of worm.
Further, the lower end of the rear side face of the support column is rotationally connected with a first electric push rod through a pin shaft, the telescopic end of the first electric push rod is rotationally connected with the swing arm through a pin shaft, the input end of the first electric push rod is electrically connected with the output end of the PLC controller, and the rotation angle of the probe is controlled.
Further, the middle part of the upper surface of the fixed plate is fixedly connected with two first supports which are distributed in a bilateral symmetry way, an adjusting screw is rotatably connected between the two first supports through a bearing, the adjusting screw is in threaded connection with the movable table, and the movable table is driven to move through rotation of the adjusting screw.
Further, the upper surface right side of fixed plate is provided with the second motor, and the output shaft and the accommodate the lead screw fixed connection of second motor, the output of PLC controller is connected to the input electricity of second motor, controls accommodate the rotation of lead screw.
Compared with the prior art, the utility model has the beneficial effects that: the semiconductor probe testing jig has the following advantages:
the display screen and the second electric push rod are regulated and controlled by the PLC controller to operate, the telescopic end of the second electric push rod extends downwards, the telescopic end of the second electric push rod drives the movable plate positioned at the lower side of the telescopic end of the second electric push rod to slide with the sliding column, the spring is compressed, the movable plate drives the semiconductor probe to be tested to move downwards, the semiconductor probe to be tested contacts with the contact of the PCB, when the output end of the PCB transmits data to the PLC controller, the PLC controller sends qualified information to the display screen, the display screen displays the information, then the PLC controller regulates and controls the first electric push rod to operate, the telescopic end of the first electric push rod is retracted for a certain length, the swing arm and the supporting column rotate, the swing arm drives the semiconductor probe to be tested to incline, the PLC controller regulates and controls the second motor to operate, the output shaft of the second motor drives the adjusting screw rod to rotate, so that the adjusting screw rod drives the movable table to drive the PCB to move, the position of the PCB is adjusted, the PLC is used for regulating and controlling the second electric push rod to move, the telescopic end of the second electric push rod to move is used for pushing, the semiconductor probe to be tested is contacted with the contact point of the PCB again, the semiconductor probe to be tested is contacted with the contact point of the PCB in multiple angles, when the semiconductor probe to be tested is required to be replaced, the PLC is used for regulating and controlling the first motor to rotate, so that the output shaft of the first motor drives the worm to rotate, the worm wheel is further driven to rotate through the meshing relationship between the worm and the worm wheel, the first gear is further driven to rotate through the meshing relationship between the first gear and the second gear, the rotating shaft is further driven to rotate, the rotating disc is rotated by a certain angle, the movable plate below the second electric push rod is switched, the semiconductor probe to be tested is further switched, the testing operation is repeated, the testing of the semiconductor probe is achieved, the self-locking of the first gear is achieved through the meshing relationship between the worm and the worm wheel, the self-locking of the rotating disc is achieved through the meshing relationship between the first gear and the second gear, the rotating disc can be rapidly and stably switched to test the semiconductor probe to be tested, the movable plate below the second electric push rod is pushed downwards through the telescopic end of the second electric push rod, the semiconductor probe to be tested is enabled to be in contact with the PCB downwards, the semiconductor probe to be tested is detected, the semiconductor probe to be tested is controlled to rotate through the first electric push rod, the multi-angle testing can be conducted on the probe to be tested, and the multi-angle testing is convenient to use.
Drawings
FIG. 1 is a schematic diagram of the structure of the present utility model;
FIG. 2 is a schematic view of the internal cross-sectional structure of a swing arm of the present utility model;
fig. 3 is an enlarged schematic view of the structure a of the present utility model.
In the figure: 1 supporting frame, 2 supporting legs, 3 fixed plates, 4 test tables, 5 first supporting seats, 6 adjusting screw rods, 7 movable tables, 8 supporting columns, 9 swing arms, 10 first electric push rods, 11 probe switching mechanisms, 111 second supporting seats, 112 worms, 113 worm wheels, 114 first gears, 115 second gears, 116 rotating discs, 117 springs, 118 movable plates, 119 sliding columns, 12 first motors, 13 second electric push rods, 14 second motors, 15 display screens and 16PLC controllers.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
Referring to fig. 1-3, the present embodiment provides a technical solution: a semiconductor probe testing fixture comprises a supporting frame 1 and a probe switching mechanism 11;
support frame 1: the upper surface of the PCB is fixedly connected with a fixing plate 3, four corners of the lower surface of a supporting frame 1 are respectively and threadedly connected with a supporting leg 2, the middle part of the upper surface of the fixing plate 3 is fixedly connected with a test table 4, a sliding groove formed in the upper surface of the test table 4 is internally and slidably connected with a movable table 7, the left side of the upper surface of the fixing plate 3 is fixedly connected with a support column 8, the upper end of the support column 8 is rotationally connected with a swing arm 9 through a pin shaft, the right side of the upper surface of the fixing plate 3 is provided with a display screen 15, the middle part of the upper surface of the fixing plate 3 is fixedly connected with two first supports 5 which are symmetrically distributed left and right, an adjusting screw rod 6 is rotationally connected between the two first supports 5 through a bearing, and the adjusting screw rod 6 is threadedly connected with the movable table 7, so that the adjusting screw rod 6 drives the movable table 7 to drive the PCB to move, and the position of the PCB is adjusted;
probe switching mechanism 11: the device is arranged in a swing arm 9, a second electric push rod 13 is arranged on the upper surface of the swing arm 9, the telescopic end of the second electric push rod 13 is matched with a probe switching mechanism 11 positioned below the second electric push rod 13, the probe switching mechanism 11 comprises a rotating disc 116, a spring 117, a movable plate 118 and a sliding column 119, the rotating disc 116 is rotationally connected to the lower surface of the swing arm 9 through a rotating shaft, evenly distributed sliding columns 119 are fixedly connected to the lower surface of the rotating disc 116, baffle plates are fixedly connected to the bottom ends of the sliding columns 119, movable plates 118 are fixedly connected between the outer cambered surfaces of two adjacent sliding columns 119 in a sliding manner, rubber rings are fixedly connected in placing grooves uniformly formed in one side, close to the vertical center of the rotating disc 116, of the upper surface of the movable plate 118, springs 117 are respectively arranged between the baffle plates and the movable plates 118, the springs 117 are respectively sleeved on the outer cambered surfaces of the sliding columns 119, the telescopic end of the second electric push rod 13 is matched with the movable plate 118 positioned below the baffle plates, the probe switching mechanism 11 further comprises a second support 111, a worm 112, a worm gear 113, a first gear 114 and a second gear 115, wherein the first gear 114 is rotationally connected to the right side of the inner bottom end of the swing arm 9 through a rotating shaft, the second gear 115 is fixedly sleeved at the upper end of the outer cambered surface of the rotating shaft, the first gear 114 is in meshed connection with the second gear 115, the worm gear 113 is fixedly sleeved at the lower side of the outer cambered surface of the rotating shaft, the inner bottom end of the swing arm 9 is fixedly connected with two second supports 111 which are distributed left and right symmetrically, the two second supports 111 are rotationally connected with the worm 112 through bearings, the worm 112 is in meshed connection with the worm gear 113, a semiconductor probe to be tested is sequentially placed in a placing groove, the friction force of the semiconductor probe to be tested is fixed through a rubber ring arranged in the placing groove, and then the semiconductor probe is meshed with the worm gear 113 through the meshing relation between the worm 112, the worm gear 113 is rotated, the first gear 114 is rotated, the rotating shaft is rotated through the meshing relationship between the first gear 114 and the second gear 115, the rotating shaft drives the rotating disc 116 to rotate, the rotating disc 116 rotates by a certain angle, the movable plate 118 positioned below the second electric push rod 13 is switched, and the semiconductor probe to be replaced is switched;
wherein: the left side of the upper surface of the fixed plate 3 is provided with a PLC (programmable logic controller) 16, the input ends of a second electric push rod 13 and a display screen 15 are electrically connected with the output end of the PLC 16, the rear side of the inner bottom end of a swinging arm 9 is provided with a first motor 12, the output shaft of the first motor 12 is fixedly connected with a worm 112, the input end of the first motor 12 is electrically connected with the output end of the PLC 16, the lower end of the rear side surface of a support column 8 is rotationally connected with a first electric push rod 10 through a pin shaft, the telescopic end of the first electric push rod 10 is rotationally connected with the swinging arm 9 through a pin shaft, the input end of the first electric push rod 10 is electrically connected with the output end of the PLC 16, the right side of the upper surface of the fixed plate 3 is provided with a second motor 14, the output shaft of the second motor 14 is fixedly connected with an adjusting screw 6, the input end of the second motor 14 is electrically connected with the output end of the PLC 16, the PLC controller 16 regulates the normal operation of the display screen 15, the first electric push rod 10, the second electric push rod 13, the first motor 12 and the second motor 14, the input end of the semiconductor probe to be tested is connected with the PLC controller 16, the PCB board is placed on the upper surface of the movable table 7, the PCB board is connected with the movable table 7 through screws, the output end of the PCB board is electrically connected with the input end of the PLC controller 16, the operation of the display screen 15 and the second electric push rod 13 is regulated by the PLC controller 16, the telescopic end of the second electric push rod 13 stretches out downwards, the telescopic end of the second electric push rod 13 drives the movable plate 118 positioned at the lower side of the second electric push rod 13 to slide with the sliding column 119, the spring 117 is compressed, the movable plate 118 drives the semiconductor probe to be tested to move downwards, the semiconductor probe to be tested is contacted with the contact point of the PCB board, when the output end of the PCB board transmits data to the PLC controller 16, the PLC controller 16 sends qualified information to the display screen 15, the information is displayed by the display screen 15, then the first electric push rod 10 is regulated and controlled to operate by the PLC controller 16, the telescopic end of the first electric push rod 10 is retracted for a certain length, the swing arm 9 and the support column 8 rotate, the swing arm 9 drives the semiconductor probe to be tested to incline, the second motor 14 is regulated and controlled by the PLC controller 16 to operate, the output shaft of the second motor 14 drives the adjusting screw rod 6 to rotate, the PLC controller 16 regulates and controls the second electric push rod 13 to operate, the telescopic end of the second electric push rod 13 drives the semiconductor probe to be tested to be contacted with the contact point of the PCB, the semiconductor probe to be tested is contacted with the contact point of the PCB at multiple angles, when the semiconductor probe to be tested needs to be replaced, the PLC controller 16 regulates and controls the first motor 12 to rotate, the output shaft of the first motor 12 drives the worm 112 to rotate, and then the worm gear 113 rotates through the meshing relationship between the worm 112 and the worm gear 113, the first gear 114 rotates, the rotation shaft is driven by the meshing relationship between the first gear 114 and the second gear 115, the rotation shaft 116 rotates, the rotation plate 116 is driven to rotate, and the rotation plate 116 is switched to rotate at a certain angle, and the rotation plate 118 is required to be replaced by the semiconductor probe to be replaced.
The working principle of the semiconductor probe testing jig provided by the utility model is as follows:
when testing the semiconductor probe, the tester puts the semiconductor probe to be tested into the placing groove in turn, fixes the semiconductor probe to be tested by the friction force of the rubber ring arranged in the placing groove, connects the input end of the semiconductor probe to be tested with the PLC controller 16, places the PCB board on the upper surface of the movable table 7, connects the PCB board with the movable table 7 by the screw, connects the output end of the PCB board with the input end of the PLC controller 16, controls the display screen 15 and the second electric push rod 13 to operate by the PLC controller 16, the telescopic end of the second electric push rod 13 stretches out downwards, so that the movable plate 118 and the slide column 119 positioned at the lower side of the second electric push rod 13 are driven to slide by the telescopic end of the second electric push rod 13, the spring 117 is compressed, the movable plate 118 drives the semiconductor probe to be tested to move downwards, when the output end of the PCB transmits data to the PLC 16, the PLC 16 sends qualified information to the display 15, the display 15 displays the information, then the PLC 16 regulates and controls the operation of the first electric push rod 10, the telescopic end of the first electric push rod 10 is retracted by a certain length, the swing arm 9 and the support column 8 rotate, the swing arm 9 drives the semiconductor probe to be tested to incline, the PLC 16 regulates and controls the second motor 14 to operate, the output shaft of the second motor 14 drives the adjusting screw 6 to rotate, the adjusting screw 6 drives the movable table 7 to drive the PCB to move, the position of the PCB is regulated, the PLC 16 regulates and controls the operation of the second electric push rod 13, the telescopic end of the operation of the second electric push rod 13 is pushed, the semiconductor probe to be tested is contacted with the PCB contact again, the semiconductor probe to be tested is subjected to multi-angle contact, when the semiconductor probe to be tested is required to be replaced, the first motor 12 is regulated and controlled to rotate through the PLC controller 16, the output shaft of the first motor 12 drives the worm 112 to rotate, the worm wheel 113 is further rotated through the meshing relationship between the worm 112 and the worm wheel 113, the first gear 114 is further rotated, the rotating shaft is further rotated through the meshing relationship between the first gear 114 and the second gear 115, the rotating shaft is further driven to rotate the rotating disc 116, the rotating disc 116 is rotated by a certain angle, the rotating disc 116 is rotated to rotate a certain angle, then the movable plate 118 positioned below the second electric push rod 13 is switched, the semiconductor probe to be tested is further subjected to switching, then the test operation is repeated, the test of the semiconductor probe is realized, the self-locking of the first gear 114 is realized through the meshing relationship between the worm 112 and the worm wheel 113, the self-locking of the rotating disc 116 is further realized through the meshing relationship between the first gear 114 and the second gear 115, the semiconductor probe to be rapidly and stably switched, the semiconductor probe to be tested is required to be tested, the semiconductor probe to be tested is accurately tested through the second electric push rod 13, the flexible plate 13 is positioned below the second electric push rod 13, the semiconductor probe to be tested is required to be tested, and the semiconductor probe to be tested is subjected to be tested, and the multi-angle contact is required to be tested, and the semiconductor probe to be tested is tested, and the PCB is tested is subjected to be accurately and the test under the test, and the test is subjected to the test and to the test.
It should be noted that, in the above embodiment, the display screen 15 may be an LED display screen, the first electric putter 10 may be a DTP type, the second electric putter 13 may be a DTZ type, the first motor 12 may be an ECMA-C20604RS, the second motor 14 may be an SM3L-042A1BDV servo motor, the PLC controller 16 may be an STM32, and the PLC controller 16 controls the display screen 15, the first electric putter 10, the second electric putter 13, the first motor 12 and the second motor 14 to operate by methods commonly used in the prior art.
The foregoing description is only illustrative of the present utility model and is not intended to limit the scope of the utility model, and all equivalent structures or equivalent processes or direct or indirect application in other related technical fields are included in the scope of the present utility model.
Claims (7)
1. A semiconductor probe test fixture is characterized in that: comprises a supporting frame (1) and a probe switching mechanism (11);
support frame (1): the upper surface of the test bench is fixedly connected with a fixed plate (3), four corners of the lower surface of a support frame (1) are respectively and threadedly connected with a supporting leg (2), the middle part of the upper surface of the fixed plate (3) is fixedly connected with a test bench (4), a movable table (7) is slidably connected in a sliding groove formed in the upper surface of the test bench (4), the left side of the upper surface of the fixed plate (3) is fixedly connected with a support column (8), the upper end of the support column (8) is rotatably connected with a swing arm (9) through a pin shaft, and the right side of the upper surface of the fixed plate (3) is provided with a display screen (15);
probe switching mechanism (11): the device is arranged in the swing arm (9), a second electric push rod (13) is arranged on the upper surface of the swing arm (9), and the telescopic end of the second electric push rod (13) is matched with a probe switching mechanism (11) positioned below the second electric push rod;
wherein: the left side of the upper surface of the fixed plate (3) is provided with a PLC (programmable logic controller) 16, and the input ends of the second electric push rod (13) and the display screen (15) are electrically connected with the output end of the PLC 16.
2. The semiconductor probe test fixture of claim 1, wherein: the probe switching mechanism (11) comprises a rotating disc (116), springs (117), movable plates (118) and sliding columns (119), the rotating disc (116) is rotationally connected to the lower surface of a swing arm (9) through a rotating shaft, the sliding columns (119) which are evenly distributed are fixedly connected to the lower surface of the rotating disc (116), baffle plates are fixedly connected to the bottom ends of the sliding columns (119), movable plates (118) are fixedly connected between the outer cambered surfaces of two adjacent sliding columns (119), rubber rings are fixedly connected in placing grooves which are evenly formed in one sides, close to the vertical centers of the rotating disc (116), of the upper surfaces of the movable plates (118), springs (117) are arranged between the baffle plates and the movable plates (118), the outer cambered surfaces of the sliding columns (119) are sleeved with the telescopic ends of the second electric push rods (13) in a matched mode, and the movable plates (118) located below the telescopic ends of the second electric push rods are arranged in a matched mode.
3. The semiconductor probe test fixture of claim 2, wherein: the probe switching mechanism (11) further comprises a second support (111), a worm (112), a worm wheel (113), a first gear (114) and a second gear (115), wherein the first gear (114) is rotationally connected to the right side of the inner bottom end of the swing arm (9) through a rotating shaft, the second gear (115) is fixedly sleeved at the upper end of the outer cambered surface of the rotating shaft, the first gear (114) is meshed with the second gear (115), the worm wheel (113) is fixedly sleeved at the lower side of the outer cambered surface of the rotating shaft, two second supports (111) distributed in a bilateral symmetry mode are fixedly connected to the inner bottom end of the swing arm (9), the worm (112) is rotationally connected between the two second supports (111) through bearings, and the worm (112) is meshed with the worm wheel (113).
4. The semiconductor probe test fixture of claim 3, wherein: the rear side of the inner bottom end of the swing arm (9) is provided with a first motor (12), an output shaft of the first motor (12) is fixedly connected with a worm (112), and an input end of the first motor (12) is electrically connected with an output end of the PLC (16).
5. The semiconductor probe test fixture of claim 1, wherein: the lower end of the rear side surface of the support column (8) is rotationally connected with a first electric push rod (10) through a pin shaft, the telescopic end of the first electric push rod (10) is rotationally connected with a swing arm (9) through a pin shaft, and the input end of the first electric push rod (10) is electrically connected with the output end of a PLC (programmable logic controller) (16).
6. The semiconductor probe test fixture of claim 1, wherein: the middle part of the upper surface of the fixed plate (3) is fixedly connected with two first supports (5) which are distributed symmetrically left and right, an adjusting screw rod (6) is rotatably connected between the two first supports (5) through a bearing, and the adjusting screw rod (6) is in threaded connection with the movable table (7).
7. The semiconductor probe test fixture of claim 6, wherein: the right side of the upper surface of the fixed plate (3) is provided with a second motor (14), an output shaft of the second motor (14) is fixedly connected with the adjusting screw rod (6), and an input end of the second motor (14) is electrically connected with an output end of the PLC (16).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320787443.4U CN219871747U (en) | 2023-04-11 | 2023-04-11 | Semiconductor probe test fixture |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320787443.4U CN219871747U (en) | 2023-04-11 | 2023-04-11 | Semiconductor probe test fixture |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219871747U true CN219871747U (en) | 2023-10-20 |
Family
ID=88321289
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320787443.4U Active CN219871747U (en) | 2023-04-11 | 2023-04-11 | Semiconductor probe test fixture |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219871747U (en) |
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2023
- 2023-04-11 CN CN202320787443.4U patent/CN219871747U/en active Active
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