CN219856047U

CN219856047U - Hot melting device

Info

Publication number: CN219856047U
Application number: CN202321176860.1U
Authority: CN
Inventors: 请求不公布姓名
Original assignee: Sany Technology Equipment Co Ltd
Current assignee: Sany Technology Equipment Co Ltd
Priority date: 2023-05-16
Filing date: 2023-05-16
Publication date: 2023-10-20
Anticipated expiration: 2033-05-16

Abstract

The utility model provides a hot melting device which is used for hot melting a bottom support sheet and a Mylar film and comprises a frame body, an absorption part and a laser; the adsorption piece is arranged on the frame body and can adsorb the bottom support sheet and the Mylar film; the laser is arranged on the frame body, and the emitted laser can be used for thermally fusing the bottom support sheet and the Mylar film which are positioned on the absorption part. The Mylar film and the bottom support sheet are adsorbed onto the adsorption piece through the adsorption piece, so that the Mylar film and the bottom support sheet are accurately positioned, and the adsorption effect of the adsorption piece on the Mylar film and the bottom support sheet is achieved, so that the welding effect is good when the Mylar and the bottom support sheet are welded and thermally fused by laser.

Description

Hot melting device

Technical Field

The utility model relates to the technical field of battery production, in particular to a hot melting device.

Background

The existing hot melting device for welding Mylar films and bottom support sheets by laser adopts a pressing plate to press the bottom support sheets and the Mylar films on a supporting plate, and because the welding hot melting requirements of the Mylar films and the bottom support sheets are high in precision, the positions of the Mylar films and the bottom support sheets are positioned only by means of the pressing plate, the positioning inaccuracy is possibly caused, and then the hot melting forming effect of the Mylar films and the bottom support sheets is affected.

Disclosure of Invention

In view of the above, the utility model provides a hot melting device which can accurately position Mylar films and bottom support sheets and has high welding hot melting forming quality.

In order to achieve the above purpose, the present utility model provides the following technical solutions:

a hot melt apparatus for hot melt underwire sheets and Mylar film, comprising:

a frame body;

the absorption part is arranged on the frame body and can absorb the bottom support sheet and the Mylar film;

the laser is arranged on the frame body, and the emitted laser can be used for thermally fusing the bottom support piece and the Mylar film which are positioned on the absorption piece.

Preferably, the laser is a semiconductor laser.

Preferably, the hot melting device further comprises a first moving module connected with the frame body, and the laser is driven by the first moving module to move along the length direction of the bottom support sheet.

Preferably, the hot melting device further comprises a second moving module connected to the first moving module, the laser is arranged on the second moving module, and the second moving module moves along the width direction of the bottom bracket sheet.

Preferably, the hot melting device further comprises a dust removing mechanism connected with the second movable module through a connecting piece, and the laser is arranged on the connecting piece, so that the dust removing mechanism can absorb impurities generated during hot melting of the laser.

Preferably, the Mylar film is located on the upper side of the underwire sheet.

Preferably, the hot melting device further comprises an identification component capable of identifying the contour of the bottom bracket piece positioned at the bottom of the Mylar film.

Preferably, the hot melting device further comprises a third moving module arranged on the frame body, and the adsorption piece is arranged on the third moving module and moves relative to the frame body through the third moving module.

Preferably, the bottom support sheet and the Mylar film form a component to be melted, the adsorption piece is provided with a plurality of adsorption positions, each adsorption position is used for adsorbing different components to be melted, and each adsorption position upper side is provided with the laser and the dust removing mechanism.

Preferably, a pressing plate is arranged on the frame body and used for pressing the bottom support sheet and the Mylar film on the absorption piece.

The utility model provides a hot melting device for a hot melting bottom support sheet and a Mylar film, which comprises a frame body, an absorption part and a laser; the adsorption piece is arranged on the frame body and can adsorb the bottom support sheet and the Mylar film; the laser is arranged on the frame body, and the emitted laser can be used for thermally fusing the bottom support sheet and the Mylar film which are positioned on the absorption part. The Mylar film and the bottom support sheet are adsorbed onto the adsorption piece through the adsorption piece, so that the Mylar film and the bottom support sheet are accurately positioned, and the adsorption effect of the adsorption piece on the Mylar film and the bottom support sheet is achieved, so that the welding effect is good when the Mylar and the bottom support sheet are welded and thermally fused by laser.

Drawings

In order to more clearly illustrate the embodiments of the present utility model or the technical solutions in the prior art, the drawings that are required to be used in the embodiments or the description of the prior art will be briefly described below, and it is obvious that the drawings in the following description are only embodiments of the present utility model, and that other drawings can be obtained according to the provided drawings without inventive effort for a person skilled in the art.

FIG. 1 is a three-dimensional view of a heat fusion apparatus according to the present embodiment;

FIG. 2 is a three-dimensional view of a first mobile module, a second mobile module, a dust removal mechanism, and a laser;

FIG. 3 is a three-dimensional view of the first mobile module, the second mobile module, the dust removal mechanism and the laser of FIG. 1 after being hidden;

fig. 4 is a three-dimensional view of the absorbent member, mylar film, and underwire sheet.

In the figure: 1. a Mylar film; 2. a frame body; 3. an absorbing member; 4. a laser; 5. a first mobile module; 6. a second mobile module; 7. a dust removing mechanism; 8. a third mobile module; 9. a pressing plate; 10. a connecting piece; 11. and (5) positioning pins.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

As shown in fig. 1 to 4, the embodiment of the utility model provides a hot melting device, which is used for hot melting a bottom bracket sheet and a Mylar film 1, and comprises a frame body 2, an adsorption piece 3 and a laser 4; the absorption part 3 is arranged on the frame body 2 and can absorb the bottom support sheet and the Mylar film 1; the laser 4 is arranged on the frame body 2, and the emitted laser can thermally fuse the bottom support sheet and the Mylar film 1 on the absorption part 3.

Specifically, the adsorption piece 3 can adsorb the Mylar film 1 and the bottom support piece onto the adsorption piece 3, so that the positions of the Mylar film 1 and the bottom support piece are relatively fixed relative to the adsorption piece 3, and the laser 4 arranged on the frame body 2 welds the Mylar film 1 and the bottom support piece on the adsorption piece 3, so that the welding hot melting of the Mylar film 1 and the bottom support piece is realized.

The suction attachment 3 generates negative pressure through a pump or a vacuum system, and applies suction force to the Mylar film 1 and the bottom support sheet, so that the Mylar film 1 and the bottom support sheet are fixed on the surface of the suction attachment 3; the structural form of the absorbing piece 3 is not unique, the absorbing piece 3 can be a platform absorbing plate, an absorbing block and other structures, so that the absorbing effect on the Mylar film 1 and the bottom support piece can be realized, and the preferential absorbing piece 3 is the platform absorbing plate.

It should be noted that the frame 2 includes both a support for supporting the laser 4 and a support for supporting the absorbing member 3, and these two supports are collectively referred to as the frame 2.

It should be noted that referring to fig. 4, the bottom bracket is located at the lower side of the Mylar film in the dashed line box a in fig. 4. The bottom support sheet is positioned at the bottom of the battery cell and is contacted with the bottom of the battery cell shell, and the Mylar film and the bottom support sheet are fused together in the prior art, and the Mylar film is coated on the battery cell and then the bottom support sheet is adhered to the bottom of the battery cell. In the process of processing and installing the battery, the Mylar film 1 and the bottom support sheet are welded and thermally fused together, then the Mylar film and the bottom support sheet welded together are coated on the battery cell, and the Mylar film is welded at a position to be welded of a top cover of the battery cell after the battery cell is coated, so that the battery cell is coated with the Mylar film and the bottom support sheet simultaneously.

It should be noted that the hot melt device is not only used for hot melting the backing sheet and Mylar film, but also used for welding the backing sheet and polyester-based film.

Still further, the hot melting device further comprises a positioning pin 11 which is arranged on the absorbing piece 3 and can position the bottom support piece, and the positioning pin 11 is in positioning clamping connection with the bottom support piece, so that the positioning precision between the bottom support piece and the absorbing piece 3 is further improved. Meanwhile, the bottom support sheet is also arranged to be of a porous structure, so that the bottom support sheet and the Mylar film can be adsorbed together.

Still further, be provided with the recess that holds Mylar membrane 1 on the absorbing member 3, mylar membrane 1 has certain thickness, puts into the recess on absorbing member 3 with Mylar membrane 1, and absorbing member 3 can be more accurate adsorb Mylar membrane 1 to promote absorbing member 3 to Mylar membrane 1's adsorption efficiency.

The hot melting device with the structure comprises a frame body 2, an adsorption piece 3 and a laser 4; the absorption part 3 is arranged on the frame body 2 and can absorb the bottom support sheet and the Mylar film 1; the laser 4 is arranged on the frame body 2, and the emitted laser can thermally fuse the bottom support sheet and the Mylar film 1 on the absorption part 3. The Mylar film 1 and the bottom support sheet are adsorbed onto the adsorbing piece 3 through the adsorbing piece 3, so that the Mylar film 1 and the bottom support sheet are accurately positioned, and the laser is enabled to have good welding effect and forming effect when the Mylar film 1 and the bottom support sheet are welded and hot-melted due to the adsorption effect of the adsorbing piece 3 on the Mylar film 1 and the bottom support sheet.

In some preferred embodiments, the laser 41 is a semiconductor laser.

The laser here refers specifically to a continuous or pulse laser with a wavelength in the range of 200-11000nm, and the laser can be a semiconductor laser, a solid-state laser, or a fiber laser. Preferably, a semiconductor laser with a wave band from ultraviolet to blue light is adopted, the wavelength range is 300nm-600nm, and the output power is 5W-500W. The output light spot size of the semiconductor laser is 10-300 mu m, and the light spot is round, strip-shaped or irregularly-shaped.

When a semiconductor laser is used for the heat-fusible bottom sheet and the Mylar film 1, it is preferable that the semiconductor laser has a wavelength range of 300nm to 500nm, an output power of 20 to 200W, and a laser irradiation time of 0.7s to 1.5s. Further, the semiconductor laser welding power output power was 20W.

In some embodiments, the hot melting device further includes a first moving module 5 connected to the frame 2, and the laser 4 is driven by the first moving module 5 to move along the length direction of the bottom bracket.

Specifically, the adsorbing piece 3 adsorbs and fixes the Mylar film 1 and the bottom bracket sheet at first, then the laser 4 carries out hot melting on two welding positions of the Mylar film 1 and the bottom bracket sheet, after the first point welding hot melting is completed, the first moving module 5 is moved along the length direction of the bottom bracket sheet, so that the laser 4 is driven by the first moving module 5 to carry out moving welding along the length direction of the bottom bracket sheet, and the bottom bracket sheet and the Mylar film 1 are welded and hot melted together.

The structure of the first moving module 5 may be a rail-slide structure, a telescopic cylinder telescopic rod structure, or a rack-and-pinion structure.

In addition, the movable module can be connected with the adsorption piece 3, the movable module can drive the adsorption piece 3 to move along the length direction of the collet piece, the position of the laser 4 is kept unchanged, and the movable module connected with the adsorption piece 3 can also realize the welding of the Mylar film 1 and the collet piece in the length direction of the collet piece.

In the embodiment, a semiconductor laser is preferably adopted, and since the semiconductor laser is not provided with a galvanometer device, the semiconductor laser is small in size, convenient to install and set and cost-saving. The welding efficiency of the laser 4 to the Mylar film 1 and the bottom bracket sheet can be greatly improved by arranging the first movable module 5 capable of driving the laser 4 to move.

In some embodiments, the thermal melting device further includes a second moving module 6 connected to the first moving module 5, the laser 4 is disposed on the second moving module 6, and the second moving module 6 moves along the width direction of the bottom bracket sheet.

Specifically, the first moving module 5 that can move along the length direction of the collet piece is connected with the frame body 2, the second moving module 6 that can move along the width direction of the collet piece is connected with the first moving module 5, and the laser 4 is arranged on the second moving module 6, so as to realize indirect connection of the laser 4 and the frame body 2, the first moving module 5 can drive the laser 4 to move, and the second moving module 6 can also drive the laser 4 to move, so that the laser 4 can move along the length direction and the width direction of the collet piece.

It should be noted that, correspondingly, the structure of the second moving module 6 may also be a structure such as a rail-slide block structure, a telescopic cylinder telescopic rod structure, or a rack-and-pinion structure.

In the longitudinal direction and the width direction of the bottom support sheet, the Mylar film 1 and the bottom support sheet can be spot-welded at intervals, and the Mylar film 1 and the bottom support sheet can be fully welded.

In addition, the moving directions of the first moving module 5 and the second moving module 6 can be other directions, for example, when the shape of the bottom bracket sheet is rectangular, the first moving module 5 moves along one diagonal direction of the rectangle, and the second moving module 6 moves along the other diagonal direction of the rectangle, so that welding of any overlapping position of the Mylar film 1 and the bottom bracket sheet can be realized; it is necessary to ensure that the first moving module 5 and the second moving module 6 form an included angle of more than 0 ° and less than 180 °.

Here, through setting up the first movable module 5 that can drive laser instrument 4 along collet piece length direction to remove, and can drive the second movable module 6 that laser instrument 4 along collet piece width direction removed to just so can realize realizing the welding hot melt to it in the arbitrary position that collet piece and Mylar film 1 coincide, promote the compatibility that hot melt device welded collet piece and Mylar film 1 coincide, can realize single-row multiple spot, multiple row multiple spot, weld the unusual scheduling demand of seal.

In some embodiments, the thermal melting device further comprises a dust removing mechanism 7 connected to the second moving module 6 through a connecting piece 10, and the laser 4 is disposed on the connecting piece 10, so that the dust removing mechanism 7 can absorb impurities generated during thermal melting of the laser 4.

Specifically, a connecting piece 10 is arranged on the second moving module 6, the laser 4 is arranged on the connecting piece 10, and the second moving module 6 moves along the width direction of the bottom bracket sheet and also indirectly drives the laser 4 to move along the width direction of the bottom bracket sheet; the dust removing mechanism 7 is also arranged on the connecting piece 10, and when the first moving module 5 or the second moving module 6 drives the laser 4 to move, the dust removing mechanism 7 moves along with the laser 4.

It should be noted that, the dust removing mechanism 7 may be a micro dust collector, and preferably, the dust collecting opening of the dust removing mechanism 7 faces the welding position of the laser 4 to the bottom bracket sheet and the Mylar film 1, so as to improve the dust removing effect of the dust removing mechanism 7.

It should be noted that the structure of the connector 10 is not limited, and the connector 10 may be one or a combination of plate-like structures, bar-like structures, or block-like structures.

Here, when the laser 4 welds the collet piece and the Mylar film 1, impurities such as scraps and residues can be generated, the dust removing mechanism 7 and the laser 4 are arranged on the connecting piece 10 together, the dust removing mechanism 7 can move along with the movement of the laser 4, and the impurities generated by welding can be adsorbed by the dust removing mechanism 7 at any time, so that the working environment of the hot melting device is ensured to be clean.

In some embodiments, mylar film 1 is located on the top side of the underwire sheet.

Here, because the Mylar film 1 is a semitransparent film, the Mylar film 1 is disposed on the upper side of the bottom bracket, when the laser 4 welds the bottom bracket and the Mylar film 1, an operator can observe the welding effect in real time through the semitransparent Mylar film 1, and when the welding defect result is found, the processing can be performed in time, thereby ensuring the molding quality of the welded bottom bracket and the Mylar film 1.

And because the thickness of Mylar film 1 is less than the thickness of collet piece, and laser instrument 4 can produce impurity to collet piece and Mylar film 1 welding process, is convenient for dust collector to adsorb the impurity that produces in the welding process with Mylar film 1 being located collet piece upside.

In some embodiments, the hot melt device further comprises an identification component capable of identifying the contour of the underwire sheet located at the bottom of the Mylar film 1.

Specifically, the overlapping positions of the Mylar film 1 and the bottom support sheet need to be welded, although the Mylar film 1 is a semitransparent film, the overlapping positions of the bottom support sheet and the Mylar film 1 cannot be quickly and accurately identified, and by arranging an identification component (not shown in the figure) capable of identifying the outline of the bottom support sheet located at the bottom of the Mylar film 1, the overlapping positions of the Mylar film 1 and the bottom support sheet can be quickly identified.

Here, the identification component can identify the overlapping position of the Mylar film 1 and the bottom support sheet through color difference or transparency, and as a preferred embodiment, the Mylar film 1 and the bottom support sheet have color difference in color, so that the overlapping area of the Mylar film 1 and the bottom support sheet can be quickly identified.

It should be noted that, the identification component may be a shooting device such as a camera, and the identification component may also be a spotlight by identifying the color difference between the overlapping area of the Mylar film 1 and the bottom bracket and other areas, and by identifying the transparency between the overlapping area of the Mylar film 1 and the bottom bracket and other areas.

In some embodiments, the thermal melting device further includes a third moving module 8 disposed on the frame 2, and the adsorbing member 3 is disposed on the third moving module 8 and moves relative to the frame 2 through the third moving module 8.

Specifically, the third moving module 8 is arranged on the frame body 2, after the welding of the Mylar film 1 and the bottom support piece on the absorbing piece 3 is completed by the hot melting device, the third moving module 8 is started to drive the absorbing piece 3 to move, the Mylar film 1 and the bottom support piece which are welded are disassembled, the Mylar film 1 and the bottom support piece to be welded are placed on the absorbing piece 3, then the third moving module 8 is moved to the lower side of the laser 4, the Mylar film 1 and the bottom support piece to be welded are welded, the operation is repeated, continuous welding of the Mylar film 1 and the bottom support piece is realized, and therefore the welding efficiency of the Mylar film 1 and the bottom support piece is improved.

Here, the moving direction of the third moving module 8 is not limited, and the moving direction of the third moving module 8 may be set to move in the length direction of the shoe sheet, and may be set to move in the width direction of the shoe sheet.

In some embodiments, the bottom support sheet and the Mylar film 1 form a component to be melted, the adsorbing member 3 has a plurality of adsorbing positions, each adsorbing position is used for adsorbing a different component to be melted, and the upper side of each adsorbing position is provided with a laser 4 and a dust removing mechanism 7.

Specifically, the collet piece and the Mylar film 1 form a component to be melted, the adsorption piece 3 is provided with a plurality of adsorption positions for adsorbing the collet pieces and the Mylar film 1 in multiple groups, each adsorption position is provided with a laser 4 and a dust removing mechanism 7, the laser 4 and the dust removing mechanism 7 are mutually matched to be divided into a group of heat melting dust removing components, and the heat melting dust removing components in multiple groups are all arranged on the connecting piece 10.

The first moving module 5 can drive the plurality of lasers 4 to move along the length direction of the bottom support sheet, and the plurality of lasers 4 weld the plurality of groups of bottom support sheets positioned on the plurality of adsorption positions and the Mylar film 1 along the length direction of the bottom support sheet; the second moving module 6 can drive the plurality of lasers 4 to move along the width direction of the bottom support sheet, and the plurality of lasers 4 weld a plurality of groups of bottom support sheets positioned on a plurality of adsorption positions and the Mylar film 1 along the width direction of the bottom support sheet; and in the process of moving the laser 4, the plurality of dust removing devices can also move together with the plurality of lasers 4, so that the impurity adsorption of each adsorption position is realized.

In some embodiments, a platen 9 is provided on the frame 2, the platen 9 being used to press the underwire sheet and Mylar film 1 onto the absorbent member 3.

Specifically, the adsorption piece 3 adsorbs the bottom support piece and the Mylar film 1, so that the bottom support piece and the Mylar film 1 are positioned, the area where the bottom support piece and the Mylar film 1 are positioned is pressed through the pressing plate 9, when the laser 4 finishes welding and hot melting the bottom support piece and the Mylar film 1, the pressing plate 9 is moved away, and then the third moving module 8 is moved, so that the adsorption piece 3 is driven to move.

It should be noted that, the pressing plate 9 may be a transparent glass pressing plate 9, or may be a pressing plate 9 with a hollowed middle part, so long as it is ensured that the pressing plate 9 can press the areas of the bottom support sheet and the Mylar film 1, and the laser can weld and fuse the bottom support sheet and the Mylar film 1.

So set up, when absorbing piece 3 carries out spacing fixed to collet piece and Mylar film 1, add clamp plate 9 and further treat welded collet piece and Mylar film 1 and carry out spacing to guarantee that collet piece and Mylar film 1's position is unchangeable when the welding, promote collet piece and Mylar film 1 welding hot melt's shaping quality.

The basic principles of the present utility model have been described above in connection with specific embodiments, however, it should be noted that the advantages, benefits, effects, etc. mentioned in the present utility model are merely examples and not intended to be limiting, and these advantages, benefits, effects, etc. are not to be considered as essential to the various embodiments of the present utility model. Furthermore, the specific details disclosed herein are for purposes of illustration and understanding only, and are not intended to be limiting, as the utility model is not necessarily limited to practice with the above described specific details.

The block diagrams of the devices, apparatuses, devices, systems referred to in the present utility model are only illustrative examples and are not intended to require or imply that the connections, arrangements, configurations must be made in the manner shown in the block diagrams. As will be appreciated by one of skill in the art, the devices, apparatuses, devices, systems may be connected, arranged, configured in any manner. Words such as "including," "comprising," "having," and the like are words of openness and mean "including but not limited to," and are used interchangeably therewith. The terms "or" and "as used herein refer to and are used interchangeably with the term" and/or "unless the context clearly indicates otherwise. The term "such as" as used herein refers to, and is used interchangeably with, the phrase "such as, but not limited to.

It is also noted that in the apparatus, devices and methods of the present utility model, the components or steps may be disassembled and/or assembled. Such decomposition and/or recombination should be considered as equivalent aspects of the present utility model.

The previous description of the disclosed aspects is provided to enable any person skilled in the art to make or use the present utility model. Various modifications to these aspects will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other aspects without departing from the scope of the utility model. Thus, the present utility model is not intended to be limited to the aspects shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

It should be understood that the terms "first", "second", "third", "fourth", "fifth" and "sixth" used in the description of the embodiments of the present utility model are used for more clearly describing the technical solutions, and are not intended to limit the scope of the present utility model.

The foregoing description has been presented for purposes of illustration and description. Furthermore, this description is not intended to limit embodiments of the utility model to the form disclosed herein. Although a number of example aspects and embodiments have been discussed above, a person of ordinary skill in the art will recognize certain variations, modifications, alterations, additions, and subcombinations thereof.

Claims

1. A hot melt apparatus for hot melt backing sheets and Mylar film comprising:

a frame body;

2. The apparatus of claim 1 wherein the laser is a semiconductor laser.

3. The apparatus of claim 1, further comprising a first moving module connected to the frame, wherein the laser is driven by the first moving module to move along a length direction of the bottom bracket.

4. The apparatus of claim 3, further comprising a second moving module coupled to the first moving module, wherein the laser is disposed on the second moving module, and wherein the second moving module moves in a width direction of the shoe.

5. The apparatus according to claim 4, further comprising a dust removing mechanism connected to the second moving module via a connecting member, wherein the laser is provided on the connecting member such that the dust removing mechanism can absorb impurities generated when the laser is thermally melted.

6. The device of claim 1, wherein the Mylar film is located on an upper side of the underwire sheet.

7. The apparatus of claim 6, further comprising an identification component that identifies the contour of the underwire sheet at the bottom of the Mylar film.

8. The apparatus according to claim 1, further comprising a third moving module provided on the frame, wherein the adsorbing member is provided on the third moving module and moves relative to the frame through the third moving module.

9. The device of claim 5, wherein the backing sheet and Mylar film form a component to be melted, the adsorbing member has a plurality of adsorbing sites, each of the adsorbing sites is configured to adsorb a different component to be melted, and the laser and the dust removing mechanism are disposed on the upper side of each of the adsorbing sites.

10. The apparatus of claim 1, wherein the frame is provided with a platen for pressing the underwire sheet and Mylar film onto the absorbent member.