CN219855384U - Wire saw cutting device with high sheet discharging rate - Google Patents
Wire saw cutting device with high sheet discharging rate Download PDFInfo
- Publication number
- CN219855384U CN219855384U CN202321362500.0U CN202321362500U CN219855384U CN 219855384 U CN219855384 U CN 219855384U CN 202321362500 U CN202321362500 U CN 202321362500U CN 219855384 U CN219855384 U CN 219855384U
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- CN
- China
- Prior art keywords
- square frame
- saw cutting
- wire saw
- limiting
- silicon wafer
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000005520 cutting process Methods 0.000 title claims abstract description 29
- 238000007599 discharging Methods 0.000 title description 3
- 230000008093 supporting effect Effects 0.000 claims abstract description 21
- 230000005540 biological transmission Effects 0.000 claims abstract description 19
- 238000001125 extrusion Methods 0.000 claims abstract description 18
- 239000007788 liquid Substances 0.000 claims description 14
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract description 38
- 229910052710 silicon Inorganic materials 0.000 abstract description 38
- 239000010703 silicon Substances 0.000 abstract description 38
- 238000003825 pressing Methods 0.000 abstract description 9
- 239000002184 metal Substances 0.000 description 6
- 239000000110 cooling liquid Substances 0.000 description 4
- 238000001816 cooling Methods 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000004064 recycling Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working
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- Processing Of Stones Or Stones Resemblance Materials (AREA)
Abstract
The utility model relates to the technical field of wire saw cutting, in particular to a wire saw cutting device with high wafer yield, which comprises a supporting vertical frame, wherein a processing table body is arranged in the middle of the supporting vertical frame, limiting brackets are arranged at the top ends of the processing table body, a group of limiting brackets are provided with workpiece bodies, one ends of the limiting brackets are connected with a combined square frame in a sliding manner, two inner sides of the combined square frame are connected with transmission sleeves in a sliding manner, when the two groups of transmission sleeves carry two groups of extrusion blocks to realize the same-direction stretching, the two groups of extrusion blocks respectively realize the extrusion pre-limiting of silicon wafer workpieces from four corner end positions, and when the silicon wafer workpieces can be prevented from being limited on bracket members, the progress of the pressing limiting operation can be accelerated when the pre-limited silicon wafer workpieces are obtained while the limiting inconvenience is caused by easy slipping.
Description
Technical Field
The utility model relates to the technical field of wire saw cutting, in particular to a wire saw cutting device with high wafer yield.
Background
When the semiconductor materials such as the silicon wafer are cut, the most commonly adopted mechanical equipment is provided with a numerical control line distance cutting machine, compared with the cutting process of a blade, the numerical control line distance cutting machine cuts the silicon wafer workpiece through a metal wire, and meanwhile, cooling liquid is used for cooling the silicon wafer workpiece to assist, so that the silicon wafer workpiece is prevented from being broken when being cut, and the overall wafer yield is higher;
when the actual existing wire saw cutting device with high wafer outlet rate is used for limiting the pressing down of the silicon wafer workpiece, the supporting surface of the bracket component for limiting the silicon wafer workpiece can be gradually wet and easy to slip due to the carrying-out of the cooling liquid, and the silicon wafer is easy to slip on the wet supporting surface when the silicon wafer workpiece is placed on the bracket for supporting and limiting, so that the difficulty in limiting the silicon wafer workpiece in pressing down is increased.
Disclosure of Invention
The utility model aims to provide a wire saw cutting device with high wafer yield, which aims to solve the problem that in the prior art, when a silicon wafer workpiece is pressed down and limited by the wire saw cutting device with high wafer yield, a silicon wafer is easy to slip on a wet supporting surface, so that the difficulty in pressing down and limiting the silicon wafer workpiece is increased.
In order to achieve the above purpose, the present utility model provides the following technical solutions:
the utility model provides a wire saw cutting device that play piece rate is high, includes the support grudging post, the middle part position of support grudging post is equipped with the processing platform body, and the top of processing platform body is equipped with the limit bracket, a set of be equipped with the work piece body between the limit bracket, the one end sliding connection who limits the bracket has the combination square frame, and the inside both sides of combination square frame all sliding connection has transmission sleeve, transmission sleeve's inside threaded connection has double-end lead screw, and the middle part cover of double-end lead screw is equipped with the drive carousel, transmission sleeve's rear end fixedly connected with branch, and the top of branch is equipped with the cassette through integrated into one piece, the top threaded connection of cassette has the extrusion piece.
Preferably, a liquid collecting tank is arranged below the processing table body and fixedly arranged at the middle lower position of the supporting vertical frame, and the liquid collecting tank is arranged in a ladder-shaped structure.
Preferably, the top of supporting the grudging post fixedly connected with limits the top frame, and the one side below that limits the top frame fixedly connected with direction branch, the middle part of direction branch runs through and is equipped with the wire body, one side position of wire body is adjacent to be equipped with the drain pipe, the wire body runs through the square hole that processing bench body top end face was equipped with.
Preferably, the middle part of the top end of the combined square frame is fixedly connected with a screw rod, the outer side of the middle part of the screw rod is connected with a steering bracket, one side end of the steering bracket is connected with an extrusion bolt in a threaded manner, the outer side of the lower part of the screw rod is sleeved with a spring, and the upper end and the lower end of the spring are respectively fixedly connected with one end of the steering bracket and one end of the combined square frame.
Preferably, the limiting bracket and the combined square are respectively provided with a group of sliding grooves in sliding connection with the support rods, the combined square is rotationally connected with the double-head screw rod, the directions of the thread axes arranged on the two sides of the double-head screw rod are opposite, and the double-head screw rod is in transmission connection with the support rods through the transmission sleeve.
Compared with the prior art, the utility model has the beneficial effects that:
according to the utility model, through the limiting bracket, the extrusion blocks, the double-headed screw rod, the transmission sleeve, the supporting rod and the clamping seat, when the two groups of transmission sleeves can carry the two groups of extrusion blocks through the supporting rod and the clamping seat to realize the same-direction stretching, the two groups of extrusion blocks respectively contact with the four corners of the silicon wafer workpiece to realize the extrusion pre-limiting of the silicon wafer workpiece, and the silicon wafer workpiece can be pre-limited before the pressing limiting operation is carried out on the silicon wafer workpiece, so that the silicon wafer workpiece can be prevented from being limited on the bracket member, the limiting inconvenience caused by easy slipping is avoided, the progress of the pressing limiting operation is accelerated, the stability of the whole silicon wafer workpiece after the limiting is improved, and the silicon wafer workpiece limiting device is convenient to solve the technical problems in the background art.
Drawings
FIG. 1 is a schematic diagram of the overall structure of the present utility model;
FIG. 2 is a schematic view of the structure of FIG. 1A according to the present utility model;
fig. 3 is a schematic top view of the processing table according to the present utility model.
In the figure: 1-supporting vertical frame, 2-processing table body, 3-work piece body, 4-limiting bracket, 5-combined square frame, 6-driving turntable, 7-double-head screw rod, 8-driving sleeve, 9-supporting rod, 10-clamping seat, 11-extrusion block, 12-screw rod, 13-steering bracket, 14-extrusion bolt, 15-spring, 16-liquid collecting groove, 17-limiting top frame, 18-guiding supporting rod, 19-wire body and 20-liquid outlet pipe.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
Referring to fig. 1-3, the present utility model provides a technical solution:
the utility model provides a high wire saw cutting device of play piece rate, including supporting grudging post 1, the middle part position of supporting grudging post 1 is equipped with processing platform body 2, and the top of processing platform body 2 is equipped with and prescribes a limit to bracket 4, be equipped with work piece body 3 between a set of prescribing a limit to bracket 4, the one end sliding connection who prescribes a limit to bracket 4 has combination square frame 5, and the inside both sides of combination square frame 5 all sliding connection has transmission sleeve 8, transmission sleeve 8's internal thread has double-end lead screw 7, and double-end lead screw 7's middle part cover is equipped with drive carousel 6, transmission sleeve 8's rear end fixedly connected with branch 9, and the top of branch 9 is equipped with cassette 10 through integrated into one piece, cassette 10's top threaded connection has extrusion piece 11.
As shown in fig. 1, a liquid collecting tank 16 is arranged below the processing table body 2, the liquid collecting tank 16 is fixedly arranged at the middle-lower position of the supporting vertical frame 1, the liquid collecting tank 16 is arranged in a ladder-shaped structure, after the wire saw cutting device with high sheet discharging rate uses cooling liquid to cool silicon wafer workpieces in time, the processed waste liquid can fall into the liquid collecting tank 16 in a concentrated manner, enters into the collection, and then is brought back into a cooling pipeline for recycling after being filtered again; the upper part of the supporting vertical frame 1 is fixedly connected with a limiting top frame 17, one side lower part of the limiting top frame 17 is fixedly connected with a guiding support rod 18, the middle part of the guiding support rod 18 is penetrated and provided with a metal wire body 19, one side position of the metal wire body 19 is adjacently provided with a liquid outlet pipe 20, the metal wire body 19 penetrates through a square hole formed in the top end surface of the processing table body 2, after a silicon wafer needing line spacing cutting processing is fixed between a group of limiting brackets 4, the wire saw cutting device with high sheet outlet rate can cut a silicon wafer workpiece through the continuously moving metal wire body 19 according to a set program.
As shown in fig. 1, 2 and 3, the middle part of the top end of the combined square frame 5 is fixedly connected with a screw rod 12, the outer side of the middle part of the screw rod 12 is connected with a steering bracket 13, one side end of the steering bracket 13 is in threaded connection with a pressing bolt 14, the outer side of the lower part of the screw rod 12 is sleeved with a spring 15, the upper end and the lower end of the spring 15 are respectively fixedly connected with one end of the steering bracket 13 and one end of the combined square frame 5, after a silicon wafer workpiece to be cut is clamped and limited in advance, an operator screws down a limiting nut of the screw rod 12 in advance under the corresponding arrangement of the upper position and the lower position, so that after a group of steering brackets 13 overcoming rebound force can press the silicon wafer workpiece, the pressing bolt 14 is installed on the steering bracket 13, so that the silicon wafer workpiece can be pressed by the pressing bolt 14 penetrating through the steering bracket 13, the silicon wafer workpiece is limited stably, and stability in line distance cutting operation in the later stage is ensured; the inside of the limiting bracket 4 and the combined square frame 5 are respectively provided with a sliding groove which is in sliding connection with a group of supporting rods 9, the combined square frame 5 is rotationally connected with the double-head screw rod 7, the directions of thread axes arranged at two sides of the double-head screw rod 7 are opposite, the double-head screw rod 7 is in transmission connection with the supporting rods 9 through the transmission sleeve 8, when a silicon wafer workpiece is placed on the limiting bracket 4, the two groups of extrusion blocks 11 are in a reverse stretching and unfolding state, after the silicon wafer workpiece to be cut is arranged on the bracket member, under the connection cooperation of the combined square frame 5, a worker simultaneously rotates the double-head screw rod 7 in a rotary mode through the driving turntable 6, and simultaneously carries the two groups of extrusion blocks 11 through the supporting rods 9 and the clamping seats 10 until the two groups of extrusion blocks 11 are respectively in contact with four corner ends of the silicon wafer workpiece, and extrusion pre-limiting is respectively realized.
The working flow is as follows: before the wire saw cutting device with high wafer output rate is used, a control program for cutting a silicon wafer workpiece is led into a main controller of the wire saw cutting device with high wafer output rate, when a silicon wafer needing wire spacing cutting treatment is fixed between a group of limiting brackets 4, under the supporting action of a processing table body 2, the wire saw cutting device with high wafer output rate can cut the silicon wafer workpiece through a continuously moving metal wire body 19 according to a set program, and simultaneously, the cooling liquid carried out from the inside of a liquid outlet pipe 20 can be utilized to cool the silicon wafer workpiece in time, so that the phenomenon that the silicon wafer workpiece is difficult to break easily during cutting is prevented, and the high wafer output rate after the silicon wafer workpiece is cut is ensured.
Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.
Claims (5)
1. The utility model provides a go out wire saw cutting device that piece rate is high, includes support grudging post (1), its characterized in that: the middle part position of support grudging post (1) is equipped with processing platform body (2), and the top of processing platform body (2) is equipped with and prescribes a limit to bracket (4), a set of be equipped with work piece body (3) between prescribing a limit to bracket (4), the one end sliding connection who prescribes a limit to bracket (4) has combination square frame (5), and the inside both sides of combination square frame (5) all sliding connection have transmission sleeve (8), the inside threaded connection of transmission sleeve (8) has double-end lead screw (7), and the middle part cover of double-end lead screw (7) is equipped with drive carousel (6), the rear end fixedly connected with branch (9) of transmission sleeve (8), and the top of branch (9) is equipped with cassette (10) through integrated into one piece, the top threaded connection of cassette (10) has extrusion piece (11).
2. The high-throughput wire saw cutting apparatus according to claim 1, wherein: the processing bench is characterized in that a liquid collecting groove (16) is arranged below the processing bench body (2), the liquid collecting groove (16) is fixedly arranged at the middle lower position of the supporting vertical frame (1), and the shape of the liquid collecting groove (16) is in a ladder-shaped structure.
3. The high-throughput wire saw cutting apparatus according to claim 1, wherein: the top of supporting grudging post (1) fixedly connected with prescribes a limit to top frame (17), and prescribes a limit to one side below fixedly connected with direction branch (18) of top frame (17), the middle part of direction branch (18) is run through and is equipped with wire body (19), one side position of wire body (19) is adjacent to be equipped with drain pipe (20), wire body (19) run through the square hole that processing platform body (2) top face was equipped with.
4. The high-throughput wire saw cutting apparatus according to claim 1, wherein: the novel combined square frame is characterized in that a screw rod (12) is fixedly connected to the middle of the top end of the combined square frame (5), a steering support (13) is connected to the outer side of the middle of the screw rod (12), an extrusion bolt (14) is connected to one side end of the steering support (13) in a threaded mode, a spring (15) is sleeved on the outer side of the lower portion of the screw rod (12), and the upper end and the lower end of the spring (15) are fixedly connected with one end of the steering support (13) and one end of the combined square frame (5) respectively.
5. The high-throughput wire saw cutting apparatus according to claim 1, wherein: the inside of inject bracket (4), combination square frame (5) is equipped with respectively with a set of spout of branch (9) sliding connection, and combination square frame (5) and double-end lead screw (7) rotate to be connected, the screw axis direction that double-end lead screw (7) both sides were equipped with is opposite to be set up, double-end lead screw (7) are connected through transmission sleeve (8) and branch (9) transmission.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321362500.0U CN219855384U (en) | 2023-05-31 | 2023-05-31 | Wire saw cutting device with high sheet discharging rate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321362500.0U CN219855384U (en) | 2023-05-31 | 2023-05-31 | Wire saw cutting device with high sheet discharging rate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219855384U true CN219855384U (en) | 2023-10-20 |
Family
ID=88340029
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321362500.0U Active CN219855384U (en) | 2023-05-31 | 2023-05-31 | Wire saw cutting device with high sheet discharging rate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219855384U (en) |
-
2023
- 2023-05-31 CN CN202321362500.0U patent/CN219855384U/en active Active
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| GR01 | Patent grant | ||
| GR01 | Patent grant |