CN219843799U - Multilayer circuit board welding jig and multilayer circuit board automatic clamping mechanism - Google Patents

Multilayer circuit board welding jig and multilayer circuit board automatic clamping mechanism Download PDF

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Publication number
CN219843799U
CN219843799U CN202320189258.5U CN202320189258U CN219843799U CN 219843799 U CN219843799 U CN 219843799U CN 202320189258 U CN202320189258 U CN 202320189258U CN 219843799 U CN219843799 U CN 219843799U
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China
Prior art keywords
clamping
circuit board
clip
bottom plate
main body
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Active
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CN202320189258.5U
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Chinese (zh)
Inventor
邱国良
宋先玖
周霖
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Dongguan Kaige Precision Machinery Co ltd
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Dongguan Kaige Precision Machinery Co ltd
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Abstract

The utility model relates to the technical field of clamping of multilayer circuit boards, and discloses a multilayer circuit board welding fixture and an automatic clamping mechanism of the multilayer circuit board, wherein the multilayer circuit board welding fixture comprises a bottom plate and a gland; the bottom plate is used for bearing at least two circuit boards which are vertically stacked in sequence; the gland comprises a cover plate main body, a clip and a plurality of elastic ejector pins, wherein the clip is respectively and movably connected with the cover plate main body, the clip has a closed posture for clamping the bottom plate and an open posture capable of being mutually separated from the bottom plate when moving relative to the cover plate main body, and the elastic ejector pins extend towards the bottom plate and elastically stretch relative to the cover plate main body; when the clip is in the closed posture, the bottom plate and the elastic ejector pins jointly clamp a plurality of circuit boards; when the clip is in the open position, the base plate and the gland can be separated from each other. The utility model mainly solves the technical problem that the multilayer circuit board needs to be clamped before welding.

Description

Multilayer circuit board welding jig and multilayer circuit board automatic clamping mechanism
Technical Field
The utility model relates to the technical field of clamping of multilayer circuit boards, in particular to a multilayer circuit board welding fixture and an automatic clamping mechanism of the multilayer circuit board.
Background
The common circuit module in the prior art integrates all electronic devices on one circuit board, for certain circuit modules, specific electronic devices are required to be integrated on corresponding circuit boards, then a plurality of circuit boards are sequentially welded into a whole, and before welding, the circuit boards are required to be clamped into a whole, so that certain interaction force can be kept all the time in the welding process of the circuit boards, higher reliability of the circuit boards after being mutually welded is ensured, and meanwhile, the problem that the circuit boards deviate during welding is also avoided. In the prior art, a plurality of circuit boards are rigidly fastened into a whole by screwing the screws by hand, on one hand, the rigid fixing mode can damage the surface of the circuit boards, the requirement of the circuit boards on the intact appearance surface is not met, and on the other hand, the clamping structure by screwing the screws by hand has the defects of low clamping efficiency and inconvenience in realizing automatic clamping, so that the welding efficiency of the multi-layer circuit boards is reduced, and the requirement of the multi-layer circuit boards on high-efficiency high-quality welding is not met.
Disclosure of Invention
The utility model aims to provide a multilayer circuit board welding fixture and an automatic clamping mechanism for a multilayer circuit board, which mainly solve the technical problem that the multilayer circuit board needs to be clamped before welding.
To achieve the purpose, the utility model adopts the following technical scheme:
a welding fixture for a multilayer circuit board comprises a bottom plate and a gland;
the bottom plate is used for bearing at least two circuit boards which are vertically stacked in sequence;
the gland comprises a cover plate main body, a clip and a plurality of elastic ejector pins, wherein the clip is respectively and movably connected with the cover plate main body, the clip has a closed posture for clamping the bottom plate and an open posture capable of being mutually separated from the bottom plate when moving relative to the cover plate main body, and the elastic ejector pins extend towards the bottom plate and elastically stretch relative to the cover plate main body;
when the clip is in the closed posture, the bottom plate and the elastic ejector pins jointly clamp a plurality of circuit boards; when the clip is in the open position, the base plate and the gland can be separated from each other.
In one embodiment, a rotating shaft is connected between the clip and the cover plate main body, and an elastic piece is installed on the cover plate main body and is used for driving the clip to rotate around the rotating shaft, so that the clip has a movement tendency of automatically switching from the open posture to the closed posture.
In one embodiment, the bottom plate is provided with a positioning hole, one surface of the cover plate main body facing the bottom plate is convexly provided with a positioning column, and the positioning column is used for being matched and inserted with the positioning hole.
In one embodiment, the bottom plate is provided with a through avoidance hole, and when the clip is in the closed posture, the clip is arranged in the avoidance hole in a penetrating manner and is abutted to the bottom surface of the bottom plate.
The utility model also provides an automatic clamping mechanism for the multilayer circuit board, which comprises the multilayer circuit board welding fixture according to any one of the technical schemes, and further comprises a driving module and a clamping module which are connected, wherein the driving module is used for driving the clamping module to ascend or descend, and the clamping module is used for clamping the clamping buckle and enabling the clamping buckle to be switched from the closed posture to the open posture.
In one embodiment, the clamping module comprises a base, a power assembly and a clamping jaw assembly, wherein the power assembly is connected with the base and the clamping jaw assembly and used for driving the clamping jaw assembly to move above the clamping buckle, and the clamping jaw assembly clamps the clamping buckle and is used for enabling the clamping buckle to be switched from the closed posture to the open posture.
In one embodiment, the power assembly comprises a screw and a nut in threaded connection with the screw, the screw is rotatably connected to the base, the clamping jaw assembly is fixedly connected with the nut, the clamping jaw assembly is in sliding connection with the base, and the sliding direction of the clamping jaw assembly relative to the base is the same as the axial direction of the screw.
In one embodiment, the jaw assembly includes a mount, a driver, and a jaw;
the clamping jaw is connected with the driving piece, the driving piece is arranged on the mounting seat and used for driving the clamping jaw to move, and the movement of the clamping jaw is used for clamping the clip and enabling the clip to be switched from the closed posture to the open posture.
In one embodiment, the clamping jaw assembly further comprises a pressing block and a spring, one end of the spring is abutted to the mounting seat, the other end of the spring is abutted to the pressing block, the spring applies downward acting force to the pressing block, and the pressing block is used for pressing down the cover plate main body.
In one embodiment, the jaw assembly further comprises a sensor mounted on the mount for determining whether the compact reaches a preset position relative to the mount.
Compared with the prior art, the welding fixture for the multilayer circuit board has the following beneficial effects:
when the welding device is used, the plurality of circuit boards are placed on the bottom plate in advance, then the bottom plate and the gland are mutually assembled, and the clamp on the gland is switched from the open posture to the closed posture, so that the bottom plate and the gland can be fixed into a whole, at the moment, the plurality of circuit boards are clamped by the bottom plate and the plurality of elastic ejector pins together, a certain interaction force is formed between the plurality of circuit boards, the plurality of circuit boards are ensured to have higher reliability after welding, and the problem that the circuit boards deviate in the welding process is avoided. According to the technical scheme, the elastic thimble is used for clamping the circuit board, the elastic force of the elastic thimble is always constant, the appearance surface of the circuit board is not damaged due to the fact that artificial excessive force application does not exist, in addition, the clip is easier to match with an external automatic mechanism to realize automatic switching between an open posture and a closed posture, the automatic clamping device has the advantage of being easy to realize, the welding efficiency of the multilayer circuit board can be greatly improved, and the requirement of the multilayer circuit board on high-efficiency high-quality welding is met.
Drawings
In order to more clearly illustrate the embodiments of the utility model or the technical solutions of the prior art, the drawings which are used in the description of the embodiments or the prior art will be briefly described, it being obvious that the drawings in the description below are only some embodiments of the utility model, and that other drawings can be obtained from these drawings without inventive faculty for a person skilled in the art.
Fig. 1 is an exploded view of a multi-layered circuit board soldering fixture according to a first embodiment of the present utility model;
FIG. 2 is an enlarged view of a portion of FIG. 1 at A;
fig. 3 is a bottom view of a multi-layer circuit board soldering fixture according to a first embodiment of the present utility model;
FIG. 4 is a partial enlarged view at B in FIG. 3;
fig. 5 is a schematic structural diagram of an automatic clamping mechanism for a multi-layer circuit board according to a second embodiment of the present utility model;
fig. 6 is a schematic structural diagram of a clamping module according to a second embodiment of the present utility model;
fig. 7 is a schematic structural diagram of a clamping jaw assembly according to a second embodiment of the present utility model;
fig. 8 is a schematic structural diagram of a multi-layer circuit board automatic clamping mechanism after a clamping module opens a clamp according to a second embodiment of the present utility model;
fig. 9 is a schematic structural diagram of a multi-layer circuit board automatic clamping mechanism according to a second embodiment of the present utility model after a clamping module takes out a gland upwards;
fig. 10 is a schematic structural diagram of a multi-layer circuit board automatic clamping mechanism according to a second embodiment of the present utility model after a circuit board is replaced on a bottom plate;
fig. 11 is a schematic structural diagram of a multi-layer circuit board automatic clamping mechanism according to a second embodiment of the present utility model, in which a clamping module reassembles a gland onto a base plate.
Wherein, each reference sign in the figure:
1. welding a clamp; 11. a bottom plate; 111. avoidance holes; 112. positioning holes; 12. a gland; 121. a cover plate main body; 1211. positioning columns; 122. a clip; 123. an elastic ejector pin; 124. a rotating shaft; 125. an elastic member;
2. clamping the module; 21. a base; 22. a power assembly; 221. a screw; 23. a jaw assembly; 24. a guide rail; 231. a mounting base; 232. a driving member; 233. a clamping jaw; 234. briquetting; 235. a spring; 236. a sensor; 3. a circuit board.
Detailed Description
In order to make the technical problems, technical schemes and beneficial effects to be solved more clear, the utility model is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the utility model.
It will be understood that when an element is referred to as being "mounted" or "disposed" on another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or be indirectly connected to the other element.
It is to be understood that the terms "upper," "lower," "top," "bottom," "inner," "outer," and the like are used in an orientation or positional relationship based on that shown in the drawings, merely to facilitate describing the present utility model and to simplify the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the present utility model.
In the description of the present utility model, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.
The present utility model will be described in further detail with reference to the drawings and examples, in order to make the objects, technical solutions and advantages of the present utility model more apparent.
Example 1
Referring to fig. 1 to 4, the present embodiment provides a multi-layer circuit board soldering fixture, which includes a base plate 11 and a pressing cover 12.
Wherein the upper surface of the base plate 11 is used for carrying at least two circuit boards which are vertically stacked.
The gland 12 specifically includes a cover main body 121, two sets of clips 122 and a plurality of elastic ejector pins 123, specifically, a rotating shaft 124 is connected between the cover main body 121 and the clips 122, the clips 122 can rotate around the rotating shaft 124, the clips 122 have a closed gesture for clamping the bottom plate 11 and an open gesture separated from the bottom plate 11 in a rotating process of the cover main body 121, an elastic member 125 is installed on the cover main body 121, the elastic member 125 is used for driving the clips 122 to rotate around the rotating shaft 124, so that the clips 122 can be automatically switched from the open gesture to the closed gesture, and the elastic member 125 can be a spring or a torsion spring. In addition, the elastic thimble 123 is movably connected with the cover main body 121, and the elastic thimble 123 extends toward the bottom plate 11 and can elastically stretch and retract relative to the cover main body 121.
During clamping, a plurality of circuit boards can be placed on the bottom plate 11 through manual or automatic equipment, then the bottom plate 11 and the gland 12 are mutually assembled, the clamp 122 is switched from an open posture to a closed posture, the clamp 122 is abutted against the bottom surface of the bottom plate 11 under the action force of the elastic ejector pins 123 at the moment, the bottom plate 11 and the gland 12 can be fixed into a whole, and the bottom plate 11 and the plurality of elastic ejector pins 123 clamp the circuit boards together at the moment, so that a certain interaction force exists between the circuit boards, the reliability of the circuit boards after welding is guaranteed to be high, and the problem that the circuit boards deviate in the welding process is avoided. According to the technical scheme, the elastic thimble 123 is used for clamping the circuit board, the elastic force of the clamping is always constant, the appearance surface of the circuit board is not damaged due to the fact that artificial excessive force application does not exist, in addition, the clamp 122 is easier to match with an external automatic mechanism to realize automatic switching between an open posture and a closed posture, the automatic clamping device has the advantage of being easy to realize, the welding efficiency of the multilayer circuit board can be greatly improved, and the requirement of the multilayer circuit board on high-efficiency and high-quality welding is met.
Preferably, the bottom plate 11 is provided with a through avoidance hole 111, and the avoidance hole 111 is used for avoiding the clip 122, so that the clip 122 can pass through the avoidance hole 111 and be abutted against the bottom surface of the bottom plate 11.
Preferably, the bottom plate 11 is provided with a positioning hole 112, and a surface of the cover plate body 121 facing the bottom plate 11 is convexly provided with a positioning post 1211, and the clamping precision between the bottom plate 11 and the gland 12 can be improved by inserting the positioning post 1211 into the corresponding positioning hole 112.
Example two
Referring to fig. 5 to 7 together, the present embodiment provides an automatic clamping mechanism for a multi-layer circuit board, which includes a driving module (not shown), a clamping module 2 and the multi-layer circuit board welding fixture 1 in the first embodiment.
Specifically, the driving module is used for driving the clamping module 2 to ascend or descend in the vertical direction, and the clamping module 2 is used for enabling the clamping buckle 122 to be switched from the closed posture to the open posture, so that the gland 12 and the bottom plate 11 can be separated from each other.
More specifically, the clamping module 2 includes a base 21, two power assemblies 22 and two groups of clamping jaw assemblies 23, the base 21 is connected with the driving module, the driving module drives the base 21 to ascend or descend in a vertical direction, one power assembly 22 is connected with the base 21 and one group of clamping jaw assemblies 23, the other power assembly 22 is connected with the base 21 and the other group of clamping jaw assemblies 23, the power assemblies 22 are used for driving the clamping jaw assemblies 23 to move transversely, so that the clamping jaw assemblies 23 can move to a position right above a corresponding group of clamping buckles 122, and the clamping jaw assemblies 23 are used for enabling the clamping buckles 122 to switch from a closed position to an open position. For clamping circuit boards with different width sizes, the sizes of the bottom plate 11 and the gland 12 are different, correspondingly, the positions of the clips 122 of the gland 12 are also different, and the clamping jaw assembly 23 can always move to the position right above the corresponding group of clips 122 by arranging the power assembly 22, so that the disassembly or clamping of circuit boards with different width sizes is compatible.
Referring to fig. 6, the power assembly 22 includes a screw 221 and a nut (not shown in the drawing), the screw 221 is rotatably connected with the base 21 by a sleeve bearing, the axial direction of the screw 221 is horizontally arranged, the nut is in threaded connection with the screw 221, the clamping jaw assembly 23 is fixedly connected with the nut, a guide rail 24 is fixed on the base 21, the clamping jaw assembly 23 is slidably connected with the guide rail 24 through a sliding block, the length direction of the guide rail 24 is the same as the axial direction of the screw 221, and the guide rail 24 is used for improving the rectilinear motion precision of the clamping jaw assembly 23. In other embodiments, the power assembly 22 may be a linear motor or a synchronous belt module.
Referring to fig. 7, the jaw assembly 23 includes a mount 231, a driver 232, two jaws 233, a press block 234, a spring 235, and a sensor 236. The mounting seat 231 is slidably connected with the guide rail 24, the driving member 232 is fixed on the mounting seat 231, the clamping jaw 233 is mounted on the driving member 232, the driving member 232 is used for driving the two clamping jaws 233 to move, the two clamping jaws 233 move to jointly clamp the clamping buckle 122, the clamping buckle 122 can be switched from a closed posture to an open posture, and the driving member 232 is preferably a clamping jaw cylinder. While one end of the spring 235 abuts against the mounting seat 231, the other end of the spring 235 abuts against the pressing block 234, the pressing block 234 is subject to the elastic force of the spring 235 to have a downward movement tendency, and the pressing block 234 is used for pressing the cover plate main body 121. The sensor 236 is fixed on the mounting seat 231, and the sensor 236 is used for judging whether the pressing block 234 rises to a preset position relative to the mounting seat 231. By providing the spring 235 so that the pressing block 234 is elastically contacted with the cover body 121, the pressing down of the cover body 121 can be protected from overload.
The specific working principle of the automatic clamping mechanism for the multilayer circuit board in the embodiment can be referred to as follows:
referring to fig. 5, the base plate 11 and the press cover 12 jointly clamp the circuit boards 3, wherein the circuit boards 3 are welded, waiting to be taken out, the clamping module 2 is located right above the press cover 12, and two groups of clamping jaw assemblies 23 on the clamping module 2 are adjusted to face the corresponding two groups of clamping buckles 122 on the press cover 12;
next, referring to fig. 8, as shown in fig. 8, the clamping module 2 is driven by the driving module to descend to a preset position, at this time, the pressing block 234 of the clamping module 2 is elastically abutted against the upper surface of the cover plate main body 121 of the pressing cover 12 under the action of the spring 235, the pressing cover 12 will descend for a small distance under the action of the pressing block 234, then the driving piece 232 in each clamping jaw assembly 23 drives the two clamping jaws 233 to approach each other, and the two clamping jaws 233 switch the corresponding clamping buckle 122 from the closed posture to the open posture;
next, referring to fig. 9, the clamping module 2 and the pressing cover 12 are driven by the driving module to gradually move upwards together, so that the pressing cover 12 and the bottom plate 11 are separated from each other, and the welded multilayer circuit board can be taken out;
then, referring to fig. 10, the stacked and unwelded integrated multilayer circuit board 3 is replaced on the base plate 11 by manual or automated equipment;
finally, referring to fig. 11, the clamping module 2 and the pressing cover 12 gradually move downwards under the driving of the driving module, when the pressing cover 12 descends to a certain position, each driving member 232 in the clamping module 2 drives the two clamping jaws 233 to move away from each other, and at this time, the clamping buckle 122 is automatically switched from the open posture to the closed posture under the acting force of the elastic member 125, so that the bottom plate 11 and the pressing cover 12 clamp a plurality of circuit boards to be welded again.
In summary, the automatic clamping mechanism for the multilayer circuit board of the embodiment can automatically assemble the bottom plate 11 and the pressing cover 12 into a whole or separate from each other, so that the clamping operation of the multilayer circuit board is automatically realized, the welding efficiency of the multilayer circuit board is greatly improved, and the requirement of the multilayer circuit board on efficient high-quality welding is met.
The foregoing description of the preferred embodiments of the present utility model has been provided for the purpose of illustrating the general principles of the present utility model and is not to be construed as limiting the scope of the utility model in any way. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present utility model, and other embodiments of the present utility model as will occur to those skilled in the art without the exercise of inventive faculty, are intended to be included within the scope of the present utility model.

Claims (10)

1. A welding fixture for a multilayer circuit board is characterized by comprising a bottom plate and a gland;
the bottom plate is used for bearing at least two circuit boards which are vertically stacked in sequence;
the gland comprises a cover plate main body, a clip and a plurality of elastic ejector pins, wherein the clip is respectively and movably connected with the cover plate main body, the clip has a closed posture for clamping the bottom plate and an open posture capable of being mutually separated from the bottom plate when moving relative to the cover plate main body, and the elastic ejector pins extend towards the bottom plate and elastically stretch relative to the cover plate main body;
when the clip is in the closed posture, the bottom plate and the elastic ejector pins jointly clamp a plurality of circuit boards; when the clip is in the open position, the base plate and the gland can be separated from each other.
2. The multi-layered circuit board welding jig according to claim 1, wherein a rotation shaft is connected between the clip and the cover main body, and an elastic member is mounted on the cover main body, the elastic member being for driving the clip to rotate around the rotation shaft so that the clip has a movement tendency of being automatically switched from the open posture to the closed posture.
3. The fixture for soldering a multi-layer circuit board according to claim 1, wherein the base plate is provided with a positioning hole, and a positioning column is convexly arranged on one surface of the cover plate main body facing the base plate, and the positioning column is used for being matched and inserted with the positioning hole.
4. The multi-layer circuit board welding jig according to claim 1, wherein the bottom plate is provided with a through avoidance hole, and when the clip is in the closed position, the clip is inserted into the avoidance hole and abuts against the bottom surface of the bottom plate.
5. The automatic clamping mechanism for the multilayer circuit board is characterized by comprising the welding fixture for the multilayer circuit board, which is characterized by further comprising a driving module and a clamping module, wherein the driving module and the clamping module are connected, the driving module is used for driving the clamping module to ascend or descend, and the clamping module is used for clamping the clamping buckle and enabling the clamping buckle to be switched from the closed posture to the open posture.
6. The automated multi-layered circuit board clamping mechanism of claim 5, wherein the clamping module comprises a base, a power assembly and a jaw assembly, the power assembly connecting the base and the jaw assembly and being configured to drive the jaw assembly to move over the clip, the jaw assembly being configured to clamp the clip and switch the clip from the closed position to the open position.
7. The automated multi-layer circuit board clamping mechanism of claim 6, wherein the power assembly comprises a screw and a nut in threaded connection with the screw, the screw is rotatably connected to the base, the jaw assembly is fixedly connected to the nut, the jaw assembly is slidably connected to the base, and the jaw assembly slides in the same direction relative to the base as the axial direction of the screw.
8. The automated multi-layered circuit board clamping mechanism of claim 6, wherein the jaw assembly comprises a mounting base, a driving member, and a jaw;
the clamping jaw is connected with the driving piece, the driving piece is arranged on the mounting seat and used for driving the clamping jaw to move, and the movement of the clamping jaw is used for clamping the clip and enabling the clip to be switched from the closed posture to the open posture.
9. The automated multi-layer circuit board clamping mechanism of claim 8, wherein the jaw assembly further comprises a press block and a spring, one end of the spring is abutted to the mounting base, the other end of the spring is abutted to the press block, the spring applies a downward force to the press block, and the press block is used for pressing down the cover plate body.
10. The automated multi-layered circuit board clamping mechanism of claim 9, wherein the jaw assembly further comprises a sensor mounted to the mount for determining whether the press block reaches a predetermined position relative to the mount.
CN202320189258.5U 2023-02-08 2023-02-08 Multilayer circuit board welding jig and multilayer circuit board automatic clamping mechanism Active CN219843799U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202320189258.5U CN219843799U (en) 2023-02-08 2023-02-08 Multilayer circuit board welding jig and multilayer circuit board automatic clamping mechanism

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202320189258.5U CN219843799U (en) 2023-02-08 2023-02-08 Multilayer circuit board welding jig and multilayer circuit board automatic clamping mechanism

Publications (1)

Publication Number Publication Date
CN219843799U true CN219843799U (en) 2023-10-17

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN202320189258.5U Active CN219843799U (en) 2023-02-08 2023-02-08 Multilayer circuit board welding jig and multilayer circuit board automatic clamping mechanism

Country Status (1)

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