CN219834755U

CN219834755U - Ultrasonic equipment, circuit board assembly thereof and heat dissipation assembly of circuit board

Info

Publication number: CN219834755U
Application number: CN202320785495.8U
Authority: CN
Inventors: 余健; 易巍; 潘大志
Original assignee: Shenzhen Mindray Bio Medical Electronics Co Ltd
Current assignee: Shenzhen Mindray Bio Medical Electronics Co Ltd
Priority date: 2023-03-31
Filing date: 2023-03-31
Publication date: 2023-10-13
Anticipated expiration: 2033-03-31

Abstract

The utility model relates to the technical field of electronic element heat dissipation devices, in particular to a heat dissipation structure of a circuit board of ultrasonic equipment. The utility model aims to provide ultrasonic equipment, a circuit board assembly thereof and a heat dissipation assembly of a circuit board. The heating element of the circuit board adopts a heat pipe assembly and a heat dissipation part to conduct heat dissipation, wherein the soaking part of the heat pipe assembly is in heat conduction contact with the corresponding heating element, the heat generated by the heating element is transferred to the soaking part, then the heat is absorbed by the evaporation end of the heat pipe on the soaking part, and after the heat is absorbed by the heat pipe, the condensation end of the heat pipe is cooled by the heat dissipation part. The heat pipe can enable the arrangement position of the radiating piece to be more flexible, limit on the volume of the radiating piece is reduced, meanwhile, the heat pipe has higher cooling efficiency, so that the heat radiating efficiency of the heating element in the ultrasonic equipment can be improved, and the technical problem of low heat radiating efficiency of the heating element in the existing ultrasonic equipment is solved.

Description

Ultrasonic equipment, circuit board assembly thereof and heat dissipation assembly of circuit board

Technical Field

The utility model relates to the technical field of electronic element heat dissipation devices, in particular to a heat dissipation structure of a circuit board of ultrasonic equipment.

Background

Ultrasonic devices typically include an ultrasonic probe having a transducer capable of converting an electrical signal into an ultrasonic signal and an ultrasonic host. The ultrasonic host is responsible for controlling the electric pulse to excite the transducer to emit ultrasonic waves, receiving echo signals acquired by the ultrasonic probe, and detecting and processing the signals.

The ultrasonic main machine is provided with a circuit board, and the circuit board is provided with electronic components such as a chip, a capacitor, a resistor, a transformer coil and the like. Because the ultrasonic host needs to process a large amount of data, the electronic components in the ultrasonic host can generate more heat during operation. In order to dissipate heat generated by electronic components, a heat sink in heat-conducting contact with the electronic components is usually installed, and a fan is used in combination to timely dissipate the heat. With the increase of the operation speed of electronic components, the heat generated by the electronic components increases dramatically. In order to meet the heat dissipation requirement, the heat dissipation performance of the heat sink is generally improved by increasing the total heat dissipation area of the heat sink, but the heat sink has a limited space around the electronic component, so that the heat sink has a larger size, which results in a low heat dissipation efficiency of the current heat sink to the electronic component.

Disclosure of Invention

The utility model provides ultrasonic equipment, which is used for solving the technical problem of low heat dissipation efficiency of electronic elements in the existing ultrasonic equipment;

in addition, the utility model also aims to provide a circuit board assembly which is used for solving the technical problem of low heat dissipation efficiency of electronic elements on a circuit board of the current ultrasonic equipment;

in addition, the utility model also aims to provide a heat dissipation assembly of the circuit board used for the circuit board assembly of the ultrasonic equipment.

In a first aspect, an embodiment provides an ultrasound apparatus, including an ultrasound host, the ultrasound host including a host housing and a circuit board assembly within the host housing, the circuit board assembly including a circuit board and at least one set of heat dissipation assemblies, the circuit board having at least two heat generating elements, the heat dissipation assemblies including a heat sink and at least two heat pipe assemblies, one of the heat pipe assemblies corresponding to dissipate heat from at least one of the heat generating elements, the heat pipe assemblies comprising:

the soaking piece is in heat conduction contact with the corresponding heating element;

the elastic piece is used for applying elastic force to the soaking piece, and the elastic force can drive the soaking piece to form floating contact with the corresponding heating element;

And a heat pipe having an evaporation end and a condensation end; the evaporation end is in heat conduction contact with the soaking piece and is used for absorbing heat of the soaking piece; the condensing end is in heat conduction contact with the heat dissipation piece and is used for enabling the heat dissipation piece to cool the condensing end.

In one embodiment, the heat dissipation assembly includes a mounting base secured to the circuit board; in the same heat dissipation assembly, the evaporation end and the soaking piece of each heat pipe assembly are floatingly arranged on the same mounting base.

In one embodiment, the soaking piece is provided with a soaking piece stopping part, and the soaking piece stopping part is used for being abutted against the mounting base under the elastic force of the elastic piece before the heat dissipation assembly and the circuit board are assembled.

In one embodiment, the protruding height of at least one heating element is larger than the protruding height of another heating element in the board thickness direction of the circuit board.

In one embodiment, the circuit board is vertically disposed in the main housing, and at least one group of the heat dissipation assemblies is a first heat dissipation assembly, where the first heat dissipation assembly is vertically disposed; in the heat pipe assembly of the first heat dissipation assembly, the evaporation end of the heat pipe is higher than the condensation end of the heat pipe, and the soaking piece is positioned above the corresponding heat dissipation piece.

In one embodiment, the heating elements are at least divided into a first heating element and a second heating element which are arranged vertically, and the first heating element is located above the second heating element; in the first heat dissipation assembly, at least one heat pipe assembly is a first heat pipe assembly, at least one heat pipe assembly is a second heat pipe assembly, a heat pipe in the first heat pipe assembly is a first heat pipe, a heat pipe in the second heat pipe assembly is a second heat pipe, the first heat pipe assembly is in heat conduction contact with the first heating element, and the second heat pipe assembly is in heat conduction contact with the second heating element, wherein an evaporation end of the first heat pipe extends to a position above an evaporation end of the second heat pipe, so that the height of the evaporation end of the first heat pipe is larger than that of the evaporation end of the second heat pipe.

In one embodiment, the soaking piece of the first heat pipe assembly is a first soaking piece, the first soaking piece is provided with a radiating fin, and the radiating fin is located on one surface of the first soaking piece, which is away from the first heating element.

In a further embodiment, the soaking element of the second heat pipe assembly is a second soaking element, and the second soaking element is a soaking plate.

In one embodiment, the first heat pipe is inserted into the heat dissipation fins of the first soaking piece from below obliquely upwards, so as to increase the contact surface between the first heat pipe and the first soaking piece.

In an embodiment, the soaking piece of the second heat pipe assembly is a second soaking piece, the first heat pipe and the second heat pipe are both provided with a vertical section and a thermal contact section, the thermal contact section of the first heat pipe is obliquely arranged upwards from the vertical section of the first heat pipe, at least a part of the thermal contact section of the first heat pipe is inserted into the radiating fin of the first soaking piece, the thermal contact section of the second heat pipe is bent from the vertical section of the second heat pipe to the position where the second soaking piece is located, wherein an included angle between the vertical section and the thermal contact section of the first heat pipe is an obtuse angle, an included angle between the vertical section and the thermal contact section of the second heat pipe is a right angle or an obtuse angle, and an included angle between the vertical section and the thermal contact section of the first heat pipe is larger than an included angle between the vertical section and the thermal contact section of the second heat pipe.

In one embodiment, the heating elements at least comprise a third heating element and a fourth heating element which are transversely arranged, and at least one group of the heat dissipation components is a second heat dissipation component; at least one heat pipe assembly in the second heat dissipation assembly is a third heat pipe assembly, and at least one heat pipe assembly is a fourth heat pipe assembly; the third heat pipe assembly is in heat conduction contact with the third heating element, and the fourth heat pipe assembly is in heat conduction contact with the fourth heating element.

In one embodiment, the circuit board is provided with a plurality of shielding pieces, the shielding pieces are surrounded on the circuit board to form a vertical heating element area and a horizontal heating element area, the first heating element and the second heating element are positioned in the vertical heating element area, the third heating element and the fourth heating element are positioned in the horizontal heating element area, and the lower end of the vertical heating element area is communicated with the horizontal heating element area.

In a further embodiment, the heat sink of the first heat sink assembly and the heat sink of the second heat sink assembly are both on the underside of the lateral heat generating element region;

the at least two shielding pieces are a first shielding piece and a second shielding piece which are positioned at the lower side of the transverse heating element area, the first shielding piece and the second shielding piece are transversely arranged at intervals, and the heat pipes in the first heat dissipation assembly and the heat pipes in the second heat dissipation assembly enter the corresponding transverse heating element area and vertical heating element area from the intervals between the first shielding piece and the second shielding piece.

In one embodiment, in the first heat dissipation assembly: the soaking piece in at least one heat pipe assembly comprises a soaking plate and radiating fins on the soaking plate.

In an embodiment, the circuit board assembly further includes a heat dissipation fan, the heat dissipation fan is located below the circuit board, and the heat dissipation fan is used for exhausting air to form a heat dissipation air path from top to bottom of the air flow at the position of the circuit board.

In a second aspect, an embodiment provides an ultrasonic device, including an ultrasonic host, where the ultrasonic host includes a host housing and a circuit board assembly in the host housing, the circuit board assembly includes a circuit board and at least one set of heat dissipation assemblies, and the circuit board is vertically disposed in the host housing;

the circuit board is provided with heating elements, the heat dissipation assembly comprises a heat pipe assembly and a heat dissipation piece, one heat pipe assembly correspondingly dissipates heat of at least one heating element, and the heat pipe assembly comprises:

and a heat pipe having an evaporation end and a condensation end; the evaporation end is in heat conduction contact with the soaking piece and is used for absorbing heat of the soaking piece; the condensing end is in heat conduction contact with the heat dissipation piece and is used for enabling the heat dissipation piece to cool the condensing end;

at least one group of heat dissipation components are first heat dissipation components, the first heat dissipation components are vertically arranged, in the heat pipe components of the first heat dissipation components, the evaporation end of the heat pipe is higher than the condensation end of the heat pipe, and the soaking piece is positioned above the corresponding heat dissipation piece.

In a third aspect, an embodiment provides a circuit board assembly of an ultrasonic device, the circuit board assembly including a circuit board and at least one group of heat dissipation assemblies, the circuit board being configured to be disposed vertically in a main chassis of the ultrasonic device, the circuit board having at least two heat generating elements, the heat dissipation assemblies including a heat sink and at least two heat pipe assemblies, one of the heat pipe assemblies being configured to dissipate heat from at least one of the heat generating elements, the heat pipe assemblies comprising:

In one embodiment, at least one group of the heat dissipation assemblies is a first heat dissipation assembly, and the first heat dissipation assembly is vertically arranged; in the heat pipe assembly of the first heat dissipation assembly, the evaporation end of the heat pipe is higher than the condensation end of the heat pipe, and the soaking piece is positioned above the corresponding heat dissipation piece.

In a fourth aspect, in one embodiment, a heat dissipation assembly of an ultrasonic device circuit board is provided, where the heat dissipation assembly includes a heat dissipation element and at least two heat pipe assemblies, and the heat dissipation assembly is configured to be disposed vertically; one heat pipe component is used for radiating heat corresponding to at least one heating element on the circuit board; the heat pipe assembly includes:

the soaking piece is used for forming heat conduction contact with the corresponding heating element;

In one embodiment, the heat dissipation assembly includes a mounting base for securing with the circuit board; in the same heat dissipation assembly, the evaporation end and the soaking piece of each heat pipe assembly are floatingly arranged on the same mounting base.

In one embodiment, the evaporating end of the heat pipe is higher than the condensing end of the heat pipe, and the soaking piece is located above the corresponding heat dissipation piece.

In one embodiment, at least one of the heat pipe assemblies is a first heat pipe assembly, at least one of the heat pipe assemblies is a second heat pipe assembly, the heat pipes in the first heat pipe assembly are first heat pipes, the heat pipes in the second heat pipe assembly are second heat pipes, and the evaporation ends of the first heat pipes extend above the evaporation ends of the second heat pipes, so that the height of the evaporation ends of the first heat pipes is greater than the height of the evaporation ends of the second heat pipes.

According to the ultrasonic equipment of the first aspect, the heating element of the circuit board in the ultrasonic host machine dissipates heat by adopting the heat pipe assembly and the heat dissipation piece, wherein the soaking piece of the heat pipe assembly is in heat conduction contact with the corresponding heating element, the heat generated by the heating element is transferred to the soaking piece, then the heat is absorbed by the evaporation end of the heat pipe on the soaking piece, and after the heat is absorbed by the heat pipe, the condensation end of the heat pipe is cooled by the heat dissipation piece. The heat pipe can enable the arrangement position of the radiating piece to be more flexible, limit on the volume of the radiating piece is reduced, meanwhile, the heat pipe has higher cooling efficiency, so that the heat radiating efficiency of the heating element in the ultrasonic equipment can be improved, and the technical problem of low heat radiating efficiency of the heating element in the existing ultrasonic equipment is solved. In addition, the elastic force of the elastic piece can drive the soaking piece and the corresponding heating element to form floating contact, and when the thicknesses of the two heating elements are different, the corresponding soaking piece can also be in heat conduction contact with the corresponding heating element, so that the heat dissipation assembly can be simultaneously matched with more than two heating elements.

According to the ultrasonic equipment of the second aspect, the heat-generating element of the circuit board in the ultrasonic host machine dissipates heat by adopting the heat pipe assembly and the heat-dissipating member, wherein the soaking member of the heat pipe assembly is in heat conduction contact with the corresponding heat-generating element, the heat generated by the heat-generating element is transferred to the soaking member, then the heat is absorbed by the evaporation end of the heat pipe on the soaking member, and after the heat is absorbed by the heat pipe, the condensation end of the heat pipe is cooled by the heat-dissipating member. The heat pipe can enable the arrangement position of the radiating piece to be more flexible, limit on the volume of the radiating piece is reduced, meanwhile, the heat pipe has higher cooling efficiency, so that the heat radiating efficiency of the heating element in the ultrasonic equipment can be improved, and the technical problem of low heat radiating efficiency of the heating element in the existing ultrasonic equipment is solved. In addition, in the heat pipe assembly of the first heat dissipation assembly, the evaporation end of the heat pipe is positioned at the upper side of the condensation end, and the heat pipe is arranged against gravity, so that the heat dissipation part in heat conduction contact with the heat pipe can be arranged at the lower side of the soaking part, the space at the upper side of the circuit board is not occupied, and enough space can be vacated at the upper side of the circuit board, so that the circuit board can be smoothly installed in the ultrasonic host.

According to the circuit board assembly of the ultrasonic equipment of the third aspect and the heat dissipation assembly of the circuit board of the ultrasonic equipment of the fourth aspect, the heat-generating element of the circuit board of the ultrasonic equipment dissipates heat by adopting the heat pipe assembly and the heat dissipation member, wherein the soaking member of the heat pipe assembly is in heat conduction contact with the corresponding heat-generating element, the heat generated by the heat-generating element is transferred to the soaking member, then the heat is absorbed by the evaporation end of the heat pipe on the soaking member, and after the heat is absorbed by the heat pipe, the condensation end of the heat pipe is cooled by the heat dissipation member. The heat pipe can enable the arrangement position of the radiating piece to be more flexible, limit on the volume of the radiating piece is reduced, meanwhile, the heat pipe has higher cooling efficiency, the radiating efficiency of the heating element can be improved, and the technical problem of low radiating efficiency of the heating element at present is solved. In addition, the elastic force of the elastic piece can drive the soaking piece and the corresponding heating element to form floating contact, and when the thicknesses of the two heating elements are different, the corresponding soaking piece can also be in heat conduction contact with the corresponding heating element, so that the heat dissipation assembly can be simultaneously matched with more than two heating elements.

Drawings

FIG. 1 is a schematic illustration of the structure of an ultrasound device in one embodiment;

FIG. 2 is a front view of a circuit board assembly in one embodiment;

FIG. 3 is an isometric view of a circuit board assembly in one embodiment;

FIG. 4 is a front view of an embodiment with a chassis removed from the circuit board assembly;

FIG. 5 is a layout of a shield and heat generating components in a circuit board assembly in one embodiment;

FIG. 6 is a schematic diagram of a heat dissipating assembly of a circuit board according to an embodiment;

FIG. 7 is an exploded view of a heat dissipating assembly of a circuit board in one embodiment;

FIG. 8 is a schematic diagram illustrating a heat dissipation assembly of a circuit board according to another embodiment;

FIG. 9 is a cross-sectional view of a heat dissipation assembly of a circuit board in one embodiment;

list of feature names corresponding to reference numerals in the figure: 100. an ultrasonic host; 101. a main housing; 102. a circuit board assembly; 1021. a circuit board; 1022. a heat dissipation assembly; 1022a, a first heat sink assembly; 1022b, a second heat sink assembly; 200. a display device; 300. a control panel; 1. a heating element; 11. a first heating element; 12. a second heating element; 13. a third heating element; 14. a fourth heating element; 2. a heat sink; 3. a heat pipe assembly; 31. a soaking member; 311. soaking the contact plate; 312. a soaking member stopping portion; 313. a heat radiation fin; 314. a first soaking member; 3141. a protruding portion; 315. a second soaking member; 316. a receiving groove; 32. an elastic member; 33. a heat pipe; 331. an evaporation end; 332. a condensing end; 333. a first heat pipe; 334. a second heat pipe; 335. a vertical section; 336. a thermal contact section; 337. an insertion section; 338. a third heat pipe; 339. a fourth heat pipe; 340. a connection section; 34. a threaded fastener; 341. a clamping groove; 35. a first heat pipe assembly; 36. a second heat pipe assembly; 37. a third heat pipe assembly; 38. a fourth heat pipe assembly; 4. a mounting base; 41. a soaking piece mounting hole; 5. a split retainer ring; 6. a shield; 61. a first shield; 62. a second shield; 63. a third shield; 64. a fourth shield; 65. a fifth shield; 66. a sixth shield; 71. a vertical heating element region; 72. a lateral heating element region; 8. a heat radiation fan; 9. a chassis; 10. and (5) mounting a frame.

Description of bracketed reference numerals in the drawings: in the bracketed reference numerals in the drawings, features indicated by the reference numerals are features indicated by both numerals in the brackets and numerals outside the brackets. In general, such reference numerals refer to a plurality of features, and numerals in parentheses are used to distinguish the plurality of features for convenience of description. Such as: 1022 denotes a heat sink, and a plurality of heat sinks, one of which is a first heat sink and one of which is a second heat sink, the first heat sink being designated 1022a and the second heat sink being designated 1022b in fig. 2 in order to distinguish the first heat sink from the second heat sink. Reference numeral 1022 (1022 a) indicates that the feature indicated by the reference numeral is a heat sink assembly, and is also a first heat sink assembly; similarly, 1022b indicates that the feature indicated by the reference numeral is a heat sink assembly, and is also a second heat sink assembly.

Detailed Description

The utility model will be described in further detail below with reference to the drawings by means of specific embodiments. Wherein like elements in different embodiments are numbered alike in association. In the following embodiments, numerous specific details are set forth in order to provide a better understanding of the present utility model. However, one skilled in the art will readily recognize that some of the features may be omitted, or replaced by other elements, materials, or methods in different situations. In some instances, related operations of the present utility model have not been shown or described in the specification in order to avoid obscuring the core portions of the present utility model, and may be unnecessary to persons skilled in the art from a detailed description of the related operations, which may be presented in the description and general knowledge of one skilled in the art.

Furthermore, the described features, operations, or characteristics of the description may be combined in any suitable manner in various embodiments. Also, various steps or acts in the method descriptions may be interchanged or modified in a manner apparent to those of ordinary skill in the art. Thus, the various orders in the description and drawings are for clarity of description of only certain embodiments, and are not meant to be required orders unless otherwise indicated.

The numbering of the components itself, e.g. "first", "second", etc., is used herein merely to distinguish between the described objects and does not have any sequential or technical meaning. The term "coupled" as used herein includes both direct and indirect coupling (coupling), unless otherwise indicated.

In some embodiments, an ultrasonic apparatus is provided, where the ultrasonic apparatus may be an ultrasonic diagnostic apparatus, and the ultrasonic diagnostic apparatus uses echo characteristics of ultrasonic waves to obtain physical characteristics, morphological structures, and functional states of human tissues by performing analysis processing on ultrasonic transmission, reception, and conversion data.

Referring to fig. 1 and 2, in some embodiments, an ultrasound apparatus includes an ultrasound host 100, an ultrasound probe (not shown), a display device 200, a control panel 300, and the like. The ultrasonic probe comprises a transducer, the ultrasonic host supplies power to the transducer and processes the obtained ultrasonic data, and the ultrasonic host sends the processed data to the display device 200 for display. The operation mode of the ultrasonic host can be controlled by the control panel 300.

The ultrasound host 100 includes a host housing 101 and a circuit board assembly 102 within the host housing 101.

Referring to fig. 2 and 5, the circuit board assembly 102 includes a circuit board 1021 (e.g., a PCB board) and at least one heat dissipation assembly 1022, and the circuit board 1021 has at least two heat generating components 1. The heating element 1 may be any element that needs heat dissipation on the circuit board 1021, such as a chip, a power module, and the like. For example, referring to fig. 5, in one embodiment, the heat generating element 1 is a chip.

The heat dissipation assembly 1022 includes a heat dissipation element 2 and at least two heat pipe assemblies 3, and one heat pipe assembly 3 dissipates heat corresponding to at least one heating element 1.

The heat sink 2 may be in any feasible form, such as a fin radiator, a water cooled radiator, etc. One heat pipe assembly 3 can radiate heat from any number of heating elements 1, such as one, two, three or more.

Referring to fig. 2, 3 and 7, a heat pipe assembly 3 includes a soaking member 31, an elastic member 32 (refer to fig. 7) and a heat pipe 33. Referring to fig. 5, the soaking members 31 are in heat-conducting contact with the corresponding heating elements 1, so that the heat of the heating elements 1 can be transferred to the soaking members 31, and the soaking members 31 can conveniently conduct the heat to the heat pipes 33.

The term "heat-conducting contact" in the present application is defined as heat transfer by physical contact, and includes direct contact, and also includes indirect contact by other parts or media, such as heat-conducting oil or grease between the soaking member 31 and the heating element 1, and further, for example, a heat-conducting pad is disposed between the soaking member 31 and the heating element 1.

Referring to fig. 3, 5 and 7, the heat pipe 33 has an evaporation end 331 and a condensation end 332, wherein the evaporation end 331 is in heat-conducting contact with the soaking member 31 for absorbing heat of the soaking member 31. The condensing end 332 is in heat conductive contact with the heat sink 2 for cooling the heat sink 2 to the condensing end 332.

In the present application, the evaporation end 331 of the heat pipe 33 should not be limited to the end of the heat pipe 33, the evaporation end 331 is used for absorbing heat, and the evaporation end 331 refers to a portion in heat-conducting contact with the heating element 1 requiring heat dissipation; similarly, the condensing end 332 of the heat pipe 33 refers to the portion of the heat pipe that is used to contact the heat sink 2.

The elastic member 32 is used for applying elastic force to the soaking member 31, and the elastic force can drive the soaking member 31 to form floating contact with the corresponding heating element 1. The floating contact of the present application is understood to be: the soaking piece can float in its own position, and the elastic piece can elastically deform to adapt to the position change of the soaking piece, and the soaking piece always keeps heat conduction contact relation with the heating element 1.

For example, in some embodiments, the floating contact may accommodate heating elements 1 of different thicknesses. In some embodiments, the heat generating element 1 is at least divided into a first heat generating element 11 and a second heat generating element 12, where the thicknesses of the first heat generating element 11 and the second heat generating element 12 are different, for example, the height of the first heat generating element 11 protruding from the circuit board 1021 in the thickness direction of the circuit board 1021 is greater than or less than the height of the second heat generating element 12 protruding from the circuit board 1021 in the thickness direction of the circuit board 1021. In one heat dissipation assembly 1022, the soaking member 31 in heat conduction contact with the first heat generating element 11 is a first soaking member 314, and the soaking member 31 in heat conduction contact with the second heat generating element 12 is a second soaking member 315. The deformation amount of the elastic member 32 applying the elastic force to the first soaking member 314 is larger than that of the elastic member 42 applying the elastic force to the second soaking member 315, so that the second soaking member 315 and the second heating element 12 can be bonded while the first soaking member 314 and the first heating element 11 are bonded.

In other embodiments, the floating contact can also accommodate variations in the position of the heating element 1. After the heating element 1 is assembled on the circuit board 1021, when the position of the heating element 1 changes along with the reasons of shaking, vibration, displacement and the like of the circuit board 1021, the elastic piece 32 can generate elastic deformation, so that the soaking piece 31 can float to self-adaptively adjust the position, always keep the fitting relation with the heating element 1, and realize good heat conduction contact with the heating element 1. This occurs not only when the thickness of each heating element 1 is the same, but also when the thicknesses of the heating elements 1 are different.

Naturally, besides the two typical situations, the floating structure can also be suitable for other situations where the soaking piece 31 is required to be in floating contact with the heating element 1, for example, when there is a design deviation between the positions of the single heating element 1 and the single soaking piece 31, the heating element 1 and the soaking piece 31 can also be kept in fit by the elastic deformation of the elastic piece 32.

Further, in one embodiment, referring to fig. 2, 3 and 7, the heat dissipation assembly 1022 includes a mounting base 4 fixed to the circuit board 1021. Referring to fig. 7, in the same heat dissipation assembly 1022, the evaporation end 331 and the soaking member 31 of each heat pipe assembly 3 are both floatingly mounted on the same mounting base 4. The heat pipe assemblies 3 have more than two, the evaporation end 331 of the heat pipe 33 is always in heat conduction contact with the soaking piece 31, through installing the soaking piece 31 of each heat pipe assembly 3 on the same installation base 4, in the process of transporting the heat dissipation assembly 1022, the evaporation end 331 of a plurality of heat pipes 33 forms a whole by means of the installation base 4 and the soaking piece 31, and is less prone to deformation and damage. In this embodiment, in addition to the floating contact case described in the above embodiments, the floating structure can also provide good thermal conduction between the heating element and the soaking member.

In one embodiment, referring to fig. 2, 8 and 9, in order to make the evaporation end 331 of the heat pipe 33 more stable during the transportation of the heat dissipation component 1022, the soaking member 31 is used to be abutted against the mounting base 4 under the action of the elastic member 32. Referring to fig. 9, the soaking member 31 has a soaking member blocking portion 312, and the soaking member blocking portion 312 is used to abut against the mounting base 4 under the elastic force of the elastic member 32 before the heat dissipating assembly is assembled with the circuit board 1021.

During the material transportation of the heat dissipation component 1022, the soaking piece 31 is abutted against the mounting base 4 under the elastic force of the elastic piece 32, and after the heat dissipation component 1022 and the circuit board 1021 are assembled together, the soaking piece 31 is separated from the mounting base 4 by the acting force between the soaking piece 31 and the heating element 1, and at this time, the soaking piece 31 is in a floating state, so that the electronic components with different thicknesses can be adapted.

Specifically, referring to fig. 7, the mounting base 4 has a soaking member mounting hole 41, referring to fig. 8 and 9, the soaking member 31 includes a soaking contact plate 311 for contacting the heating element 1, and the soaking member blocking portion 312 is a soaking baffle plate at an outer periphery of the soaking contact plate 311, wherein the soaking contact plate 311 passes through the soaking member mounting hole 41, and an outer peripheral surface of the soaking contact plate 311 is in guiding fit with a hole wall of the soaking member mounting hole 41 in a thickness direction of the circuit board. Since the soaking contact plate 311 is in guiding fit with the soaking piece mounting hole 41, the soaking piece 31 moves more stably in the floating process. In some other embodiments, the soaking stop 312 may also be a plurality of stops on the contact pads.

The soaking piece stopper portion 312 is adapted to be in stopper engagement with the mounting base 4, and can restrict the soaking contact plate 311 from being detached from the soaking piece mounting hole 41. In addition, before the heat dissipation component 1022 is assembled on the circuit board 1021, the soaking piece blocking portion 312 is always in a pressed state, and under the action of the elastic member 32, the soaking piece blocking portion 312 is in blocking fit with the mounting base 4, so that shaking is less likely to occur.

Further, referring to fig. 9, the evaporation end 331 of the heat pipe 33 is assembled with the soaking member 31. The evaporating end 331 of the heat pipe 33 is connected to the soaking member 31 in direct contact. Specifically, the evaporation end 331 of the heat pipe 33 and the soaking piece 31 are fixed together by adopting a welding manner, so that the evaporation end 331 of the heat pipe 33 and the soaking piece 31 have good heat conduction effect, and the welding manner ensures that the evaporation end 331 and the soaking piece 31 have high connection strength and are not easy to separate.

In order to increase the contact area between the heat pipe 33 and the soaking member 31, in one embodiment, the heat pipe 33 is a flat pipe, and a flat surface on the heat pipe 33 is welded to the soaking member 31.

Further, in one embodiment, referring to fig. 9, in order to further increase the contact area between the heat pipe 33 and the soaking member 31, the soaking member 31 has a receiving groove 316, and the heat pipe 33 is welded in the receiving groove 316.

In some other embodiments, the evaporation end 331 of the heat pipe 33 may be assembled with the soaking member 31 in any other feasible manner, for example, the evaporation end 331 of the heat pipe 33 is clamped to the soaking member 31 by a clip; for another example, the soaking member 31 may include two clamping plates, by which the heat pipe 33 is clamped and fixed; for another example, a clamping groove is provided on the soaking member 31, and the evaporation end 331 of the heat pipe 33 is directly clamped in the clamping groove of the soaking member 31.

Regarding the mounting manner of the soaking member 31 and the elastic member 32, in one embodiment, referring to fig. 7 to 9, the heat pipe assembly 3 includes a threaded fixing member 34, the threaded fixing member 34 is fixed to the mounting base 4 through the soaking member 31, and the elastic member 32 acts between the threaded fixing member 34 and the soaking member 31 to adjust the elastic force of the elastic member 32 to the soaking member 31 by screwing the threaded fixing member 34. When the heat dissipation assembly is installed, the elastic force of the elastic piece 32 to the soaking piece 31 can be adjusted through the threaded fixing piece 34, so that the interaction force between the soaking piece 31 and the heating element 1 is at a proper level.

Specifically, the elastic member 32 is a coil spring. In some other embodiments, the elastic member 32 may take the form of a spring sheet, an elastic rubber block, or the like, in addition to the coil spring.

Referring to fig. 3 and 4, the mounting base 4 is a mounting plate, the mounting base 4 is fixed on the circuit board 1021 by screws, a spacing column for limiting the distance between the mounting base 4 and the circuit board 1021 is arranged between the mounting base 4 and the circuit board 1021, and the screws for fixing the mounting base 4 are screwed into the spacing column.

Specifically, in one embodiment, referring to fig. 6, 7 and 9, the threaded fixing member 34 is a screw, and the elastic member 32 is a coil spring sleeved on the screw. One end of the elastic member 32 abuts against the screw head of the screw fixing member 34, and the other end abuts against the soaking member 31. In order to make it possible to float the soaking member 31 more smoothly, one soaking member 31 is installed using a plurality of screw fixtures 34.

Further, in one embodiment, referring to fig. 7, in order to avoid the elastic member 32 applying excessive elastic force to the soaking member 31, the diameter of the threaded section of the threaded fixing member 34 in threaded connection with the mounting base 4 is smaller than that of other parts of the threaded fixing member 34, so that the threaded fixing member 34 can be in stop fit with the mounting base 4 after being screwed into the mounting base 4, limiting the screwing depth, avoiding the elastic member 32 from being excessively compressed, and preventing the soaking member 31 from crushing the heating element 1.

In addition, the thread fixing member 34 is provided with a clamping groove 341, the clamping groove 341 is provided with a split ring 5, the split ring 5 is in stop fit with the soaking member 31, and the elastic member 32 and the split ring 5 are respectively positioned on two sides of the soaking member 31, so that the elastic member 32 and the thread fixing member 34 can be prevented from scattering after the thread fixing member 34 is mistakenly detached from the mounting base 4.

In other embodiments, other possible manners besides the screw fixing member 34 may be adopted, for example, the soaking member 31 is guided and slidably mounted on the mounting base along the thickness direction of the circuit board, and the elastic member 32 is mounted between the soaking member and the mounting base 4, specifically for example: a base baffle plate is provided on the mounting base 4 in place of the screw fixing member 34, the base baffle plate being fixed to the mounting base with a certain interval from the mounting base 4 in the thickness direction of the circuit board 1021, the interval being for mounting the elastic member 32, the elastic member 32 being between the base baffle plate and the soaking member 31; the base baffle plate can be detachably fixed with the mounting base 4, and can also be integrally formed with the mounting base 4.

In some other embodiments, the screw fixing member 34 of the heat dissipation assembly 1022 is directly fixed to the circuit board 1021, and the soaking member 31 can float relative to the circuit board 1021, so that the mounting base 4 is not required.

In order to obtain a larger installation space above and on the upper side of the circuit board 1021, and facilitate the arrangement of the components in the ultrasound host 100, in one embodiment, referring to fig. 1 to 3, the circuit board 1021 is vertically disposed in the host housing 101, and at least one group of heat dissipation components 1022 is a first heat dissipation component 1022a, where the first heat dissipation component 1022a is vertically disposed. In the heat pipe assembly 3 of the first heat dissipation assembly 1022a, as shown in fig. 7 and 9, the evaporation end 331 of the heat pipe 33 is higher than the condensation end 332 thereof, and the soaking member 31 is located above the corresponding heat dissipation member 2.

The heat pipes 33 are distributed by the counter gravity, so that the heat dissipation member 2 is disposed below the heat spreader 31, and a large space can be made above and above the side surface of the circuit board 1021. In this regard, the number of heat dissipation assemblies 1022 and the number of heat pipe assemblies 3 may be any feasible manner, such as having only one heat pipe assembly 3 and only one heat dissipation assembly 1022; for another example, more than two heat pipe assemblies 3 are provided, and only one heat dissipation assembly 1022 is provided; for another example, the heat pipe assembly 3 is provided with two or more heat dissipation assemblies 1022. In some other embodiments, the soaking member 31 in the heat pipe assembly 3 may be directly fixed on the circuit board 1021 or the mounting substrate, and the specific fixing manner may be welding, fastening, or the like, besides the floating assembly manner in the above embodiments.

It should be noted that, the vertical direction in the present application is not equivalent to the vertical up-down direction, but includes an inclined up-down direction, for example, the circuit board 1021 is arranged vertically, and includes both the vertical up-down direction and the inclined arrangement. Similarly, the transverse direction is not equal to the horizontal direction, and the transverse direction also comprises the oblique direction with uneven height. In general, the transverse and vertical explanations are not limited to a particular direction when the effects described in the present application can be achieved.

In some other embodiments, in the case that the space above the circuit board 1021 is required, the evaporation end 331 of the heat pipe 33 may also be located below the condensation end 332, where the heat dissipation element 2 is located above the soaking element 31, and the air flows from bottom to top in the heat dissipation air path where the circuit board 1021 is located.

Further, in an embodiment, referring to fig. 5, the heating element 1 is at least divided into a first heating element 11 and a second heating element 12 disposed vertically, and the first heating element 11 is located above the second heating element 12.

Referring to fig. 2, 3, 7 and 9, in the first heat dissipation component 1022a, at least one heat pipe component 3 is a first heat pipe component 35, and at least one heat pipe component 3 is a second heat pipe component 36. The heat pipes 33 in the first heat pipe assembly 35 are first heat pipes 333, and the heat pipes 33 in the second heat pipe assembly 36 are second heat pipes 334. The first heat pipe assembly 35 is in heat conductive contact with the first heating element 11 and the second heat pipe assembly 36 is in heat conductive contact with the second heating element 12. As shown in fig. 9, the evaporation end 331 of the first heat pipe 333 extends above the evaporation end 331 of the second heat pipe 334, so that the height of the evaporation end 331 of the first heat pipe 333 is greater than the height of the evaporation end 331 of the second heat pipe 334. The height of the evaporation end 331 of the first heat pipe 333 is greater than the height of the evaporation end 331 of the second heat pipe 334, so that the first heating element 11 and the second heating element 12 which are arranged above each other can be better adapted.

Because the evaporation end 331 of the first heat pipe 333 is higher, the first heat pipe 333 is longer in length than the second heat pipe 334. The longer the length of the heat pipe, the lower the heat transfer efficiency of the evaporation end, especially, when the heat pipe is arranged against gravity in the manner of fig. 2, 3, 7 and 9, the heat transfer efficiency of the evaporation end is further weakened under the influence of gravity of the heat conducting medium in the heat pipe, and in order to meet the heat dissipation requirement, the specification of the first heat pipe 333 needs to be increased, for example, the pipe diameter of the first heat pipe 333 is increased or the power of the first heat pipe 333 is increased, but this will necessarily result in a great increase in cost. In order to reduce the cost, in a further embodiment, referring to fig. 3, 6 and 7, the soaking member 31 of the first heat pipe assembly 35 is a first soaking member 314, the first soaking member 314 has a heat dissipation fin 313, and the heat dissipation fin 313 is located on a side of the first soaking member 314 facing away from the first heat generating element 11. By arranging the heat dissipation fins 313 on the first soaking piece 314, the heat dissipation fins 313 can enable the first soaking piece 314 to have higher heat dissipation efficiency, reduce the temperature of the first soaking piece 314, further reduce the requirement on the heat transfer efficiency of the heat pipe 33, and reduce the cost.

Specifically, in one embodiment, referring to fig. 2, one first heat dissipation component 1022a is provided, and the first heat dissipation component 1022a includes two heat pipe components 3, where the two heat pipe components 3 are a first heat pipe component 35 and a second heat pipe component 36 respectively.

Further, in one embodiment, referring to fig. 2, the soaking member 31 of the second heat pipe assembly 36 is a second soaking member 315, and the second soaking member 315 is a soaking plate. Referring to fig. 5, since the second heating element 12 is lower, the requirement can be satisfied by only adopting the plate-shaped soaking member 31, the structure of the second soaking member 315 is simplified, and the processing is convenient.

In this regard, the form of the soaking element 31 may be modified as desired, for example, in some other embodiments, the second soaking element 315 also includes heat dissipating fins 313, thereby reducing the cost of the second heat pipe 334. Since the heat dissipation fins 313 have a certain requirement on the installation space, in some other embodiments, when the space where the evaporation end 331 of the first heat pipe 333 is located does not meet the requirement, the first soaking member 314 may also have a plate-like structure, and the heat dissipation fins 313 are not required. In other embodiments, the soaking member 31 of at least one heat pipe assembly 3 of the first heat dissipation assembly 1022a includes a soaking plate and heat dissipation fins 313 on the soaking plate to improve the heat dissipation efficiency of the soaking member 31. Of course, the arrangement of the heat dissipation fins 313 is based on the first soaking element 314 and the second soaking element 315, and in some other embodiments, when the number of the soaking elements 31 is changed, whether the heat dissipation fins 313 are disposed on the soaking elements 31 may be selected according to the need, for example, one, two or any number of soaking elements 31 may be disposed; specifically, when there are three heat pipe assemblies 3 in one heat dissipation assembly 1022, there are three soaking members 31, and at this time, whether or not the heat dissipation fins 313 are provided on the three soaking members 31 may be selected as required. In some other embodiments, whether to add the heat dissipation fins 313 in the soaking member may be selected according to the heat generation condition of the heating element 1, when the heat generation amount of the heating element 1 is high, the heat dissipation fins 313 may be added to meet the heat dissipation requirement of the heating element when the heat transfer capability of the heat pipe 33 cannot meet the requirement.

Further, in order to improve the heat exchange efficiency between the first heat pipe 333 and the first soaking element 314, in one embodiment, referring to fig. 6, the first heat pipe 333 is inserted into the heat dissipation fins 313 of the first soaking element 314 from below obliquely upwards, so as to increase the contact surface between the first heat pipe 333 and the first soaking element 314. Since the first heat pipe 333 is inserted into the heat dissipation fins 313 in an obliquely upward manner, the contact surface between the first heat pipe 333 and the first soaking piece 314 is increased, so as to improve the heat exchange efficiency between the first heat pipe 333 and the first soaking piece 314. In some other embodiments, the first heat pipe 333 may be inserted into the heat dissipating fin 313 from bottom to top. In some other embodiments, the first heat pipe 333 and the heat dissipation fins 313 may be disposed separately, such as the heat dissipation fins 313 on the upper side of the first heat pipe 333, or on the lower side of the first heat pipe 333, or on one lateral side of the first heat pipe 333.

Specifically, in order to further improve the heat dissipation efficiency of the first soaking member 314, referring to fig. 6 and 8, the first soaking member 314 includes a protruding portion 3141 protruding from the mounting base 4. The protruding portion 3141 increases the volume of the first soaking member, and increases the heat dissipation area, thereby improving the heat dissipation efficiency. In one embodiment, referring to fig. 6 and 8, the protruding portion 3141 is on the upper side of the mounting base 4. In some other embodiments, the first soaking element 314 may also extend out of the mounting base 4 in the lateral direction of the mounting base 4. Of course, in some other embodiments, the first soaking element 314 may not extend out of the mounting base 4.

In an embodiment, referring to fig. 2 and fig. 3, each of the first heat pipe 333 and the second heat pipe 334 has a vertical section 335 and a thermal contact section 336, the thermal contact section 336 of the first heat pipe 333 is disposed obliquely upward from the vertical section 335, at least a portion of the thermal contact section 336 of the first heat pipe 333 is inserted into the heat dissipation fin 313 of the first heat spreader 314, the thermal contact section 336 of the second heat pipe 334 is bent from the vertical section 335 to the position where the second heat spreader 315 is located, wherein an included angle between the vertical section 335 and the thermal contact section 336 of the first heat pipe 333 is an obtuse angle, an included angle between the vertical section 335 and the thermal contact section 336 of the second heat pipe 334 is a right angle or an obtuse angle, and an included angle between the vertical section 335 and the thermal contact section 336 of the first heat pipe 333 is larger than an included angle between the vertical section 335 and the thermal contact section 336 of the second heat pipe 334. The vapor ends 331 of the first and second heat pipes 333, 334 are on the thermal contact section 336. Because the included angle between the thermal contact section 336 and the vertical section 335 of the first heat pipe 333 is an obtuse angle, compared with the right angle, the heat transfer resistance of the first heat pipe 333 in this embodiment is smaller, and the heat transfer capability is higher. In some other embodiments, the vertical sections 335 and the thermal contact sections 336 of the first heat pipe 333 and the second heat pipe 334 may be arranged in a straight line where the spatial position meets the requirements; the thermal contact section 336 of the first heat pipe section 333 may also be at right angles to the vertical section 335.

Specifically, referring to fig. 2 and 3, the first heat pipe assembly 35 and the second heat pipe assembly 36 share one heat sink 2. The first heat pipe 333 and the second heat pipe 334 are each inserted into the common heat sink 2. Referring to fig. 7, each of the first heat pipe 333 and the second heat pipe 334 further has an insertion section 337, and each of the insertion sections 337 of the first heat pipe 333 and the second heat pipe 334 is inserted into the heat sink 2. The second heat pipe 334 is arranged in a U-shape, the insertion section 337 of the first heat pipe 333 is arranged perpendicular to the vertical section 335 of the first heat pipe 333, the insertion section 337 of the second heat pipe 334 is perpendicular to the vertical section 335 of the second heat pipe 334, and the insertion section 337 of the second heat pipe 334 is parallel to the thermal contact section 336 of the second heat pipe 334. To reduce the number of bent sections of the first heat pipe 333, the first heat pipe assembly 35 and the second heat pipe assembly 36 are arranged in the lateral direction. In some other embodiments, the first heat pipe assembly 35 and the second heat pipe assembly 36 may each independently use one heat sink 2.

Further, in one embodiment, referring to fig. 2 and 5, at least one group of heat dissipation components 1022 is a second heat dissipation component 1022b. At least one heat pipe assembly 3 of the second heat dissipation assembly 1022b is a third heat pipe assembly 37, and at least one heat pipe assembly 3 is a fourth heat pipe assembly 38. The heating element 1 comprises at least a third heating element 13 and a fourth heating element 14 arranged transversely, a third heat pipe assembly 37 in heat conducting contact with the third heating element 13, and a fourth heat pipe assembly 38 in heat conducting contact with the fourth heating element 14. The heat dissipation of the heating element 1 arranged transversely is performed by the third heat pipe assembly 37 and the fourth heat pipe assembly 38 arranged transversely, so that the heat dissipation device can be suitable for different arrangement modes of the heating element 1.

Specifically, in one embodiment, referring to fig. 2 and 3, one second heat dissipation component 1022b is provided, and the second heat dissipation component 1022b includes two heat pipe assemblies 3, namely, a third heat pipe assembly 37 and a fourth heat pipe assembly 38. The third heat pipe assembly 37 and the fourth heat pipe assembly 38 also share the heat sink 2.

The heat pipe 33 of the third heat pipe assembly 37 is the third heat pipe 338 and the heat pipe 33 of the fourth heat pipe assembly 38 is the fourth heat pipe 339. The third heat pipe 338 and the fourth heat pipe 339 are inserted into the heat sink 2. The third heat pipe 338 and the fourth heat pipe 339 are each arranged in a U shape, but the third heat pipe 338 and the fourth heat pipe 339 are arranged side by side in the thickness direction of the circuit board 1021.

In some other embodiments, the number and layout of the heating elements 1 on the circuit board 1021 may be changed according to practical needs, for example, besides those in the above embodiments, the heating element 1 may be disposed only one, where the evaporation end 331 of the heat pipe 33 is located above the condensation end 332.

Further, in an embodiment, referring to fig. 3 and 5, a plurality of shielding members 6 are mounted on a circuit board 1021, the plurality of shielding members 6 are surrounded on the circuit board 1021 to form a vertical heating element area 71 and a lateral heating element area 72, the first heating element 11 and the second heating element 12 are located in the vertical heating element area 71, the third heating element 13 and the fourth heating element 14 are located in the lateral heating element area 72, and the lower end of the vertical heating element area 71 is communicated with the lateral heating element area 72. The heating element 1 is arranged in the heating element area surrounded by the shielding member 6, and the different heating element areas are communicated, so that the interference between the shielding member 6 and the heat dissipation component 1022 is reduced.

Still further, in one embodiment, referring to fig. 5, at least two shielding members 6 are a first shielding member 61 and a second shielding member 62 disposed at the lower side of the lateral heat generating element region 72, and the first shielding member 61 is laterally spaced from the second shielding member 62. The first shield 61 and the second shield 62 are at the bottom of the circuit board 1021, both extending in the lateral direction and being laterally spaced apart. Referring to fig. 2 and 3, the heat dissipation member 2 of the first heat dissipation member 1022a and the heat dissipation member 2 of the second heat dissipation member 1022b are both located at the lower side of the lateral heat generating element region 72. The heat pipes 33 in the first heat dissipation assembly 1022a and the heat pipes 33 in the second heat dissipation assembly 1022b each enter the corresponding lateral heat generating element region 72 and vertical heat generating element region 71 from the space between the first shield 61 and the second shield 62. The heat dissipation assembly 1022 thus fully utilizes the spacing between the shielding members 6 to arrange the heat pipes 33, and the layout is more compact.

Referring to fig. 2 and 3, the third heat pipe 338 and the fourth heat pipe 339 each have parallel sections parallel to each other and a connecting section 340 connecting the two parallel sections, wherein the connecting section 340 passes through the space between the first shield 61 and the second shield 62. The connection section 340 of the third heat pipe 33 and the connection section 340 of the fourth heat pipe 33 are arranged in the thickness direction of the circuit board 1021. Specifically, the first heat pipe 333 and the second heat pipe 334 each enter the vertical heating element area 71 from bottom to top, and since the vertical section 335 of the first heat pipe 333, the vertical section 335 of the second heat pipe 334, and the connecting section 340 of the third heat pipe 33 are arranged side by side in the lateral direction.

Specifically, referring to fig. 3 and 5, the shielding member 6 is a shielding case. There are six of the shielding members 6, each shielding member 6 has an elongated shape, three of the shielding members 6 extend in the lateral direction, and three of the shielding members 6 extend in the vertical direction.

The third shield 63 is located at an upper side of the first shield 61, the third shield 63 extends laterally, the fourth shield 64 extends vertically, the fourth shield 64 is perpendicular to the third shield 63, and a lower end of the fourth shield 64 is located at a side of a lateral end of the third shield 63. The fifth shield 65 is vertically spaced from the sixth shield 66. Wherein the vertical heating element region 71 is surrounded by the fourth shield 64, the fifth shield 65 and the sixth shield 66. The lateral heat generating element region 72 is surrounded by the first shield 61, the second shield 62, and the third shield 63.

Specifically, in this embodiment, the areas covered by the first shielding member 61, the second shielding member 62, the fifth shielding member 65 and the sixth shielding member 66 are power control chips, and the power control chips have strong electromagnetic radiation, so that the radiation is shielded by the shielding member 6, and interference to other electronic components is avoided. The areas covered by the third shielding member 63 and the fourth shielding member 64 are pin pins of the sensitive chip, and the pins are shielded by the third shielding member 63 and the fourth shielding member 64, so that external electromagnetic waves are prevented from affecting the pins.

To avoid interference of the first heat pipe 333 with the fourth shield 64, a portion of the first heat pipe 333 is wound to the upper side of the fourth shield 64 into the vertical heating element region 71.

In some other embodiments, the number and layout of the shields 6 may be any feasible manner, such as according to actual needs, the shields 6 comprising only at least one of the six shields 6 described above. The arrangement of the shielding members 6 may also be changed according to practical needs, for example, six shielding members are all arranged at the edge of the circuit board, and the heating element areas are no longer distinguished between the transverse heating element areas and the vertical heating element areas. In some other embodiments, the heat dissipating component on the circuit board may not be on the same side of the circuit board as the shield, and the layout of the heat dissipating component does not need to consider the position of the shield. In some other embodiments, the circuit board may even be devoid of shields.

Further, in an embodiment, referring to fig. 2 and 3, the circuit board assembly 102 further includes a heat dissipation fan 8, the heat dissipation fan 8 is located below the circuit board 1021, and the heat dissipation fan 8 is used for exhausting air to form a heat dissipation air path with air flow from top to bottom at the position of the circuit board 1021. Specifically, the circuit board assembly 102 in this embodiment includes a chassis 9, and the circuit board 1021 and the heat sink 2 are both disposed in the chassis 9. The heat radiation fan 8 is located outside the cabinet 9 and fixed to the lower side plate of the cabinet 9. The radiator 2 is fixed to the rear side plate of the cabinet 9 by a mounting bracket 10. The mounting bracket 10 is U-shaped, and the both ends of mounting bracket 10 pass through the fastener to be fixed on the posterior lateral plate of quick-witted case 9, compress tightly heat dissipation piece 2 and the posterior lateral plate of quick-witted case 9.

In an embodiment, a circuit board assembly of an ultrasonic device is provided, and a specific structure of the circuit board assembly is the same as that of the circuit board assembly described in any of the foregoing embodiments, and will not be described again.

In an embodiment, a heat dissipation assembly of a circuit board of an ultrasonic device is provided, and a specific structure of the heat dissipation assembly of the circuit board is the same as that of the first heat dissipation assembly in any one of the above embodiments, and will not be described again.

The foregoing description of the utility model has been presented for purposes of illustration and description, and is not intended to be limiting. Several simple deductions, modifications or substitutions may also be made by a person skilled in the art to which the utility model pertains, based on the idea of the utility model.

Claims

1. An ultrasonic device comprising an ultrasonic host including a host housing and a circuit board assembly within the host housing, the circuit board assembly including a circuit board and at least one set of heat dissipation assemblies, the circuit board having at least two heat generating elements, the heat dissipation assemblies including a heat sink and at least two heat pipe assemblies, one of the heat pipe assemblies corresponding to dissipate heat from at least one of the heat generating elements, the heat pipe assemblies comprising:

2. The ultrasonic apparatus of claim 1, wherein the heat sink assembly comprises a mounting base secured to the circuit board; in the same heat dissipation assembly, the evaporation end and the soaking piece of each heat pipe assembly are floatingly arranged on the same mounting base.

3. The ultrasonic apparatus of claim 2, wherein the soaking member has a soaking member stopping portion for abutting against the mounting base under the elastic force of the elastic member before the heat dissipating assembly is assembled with the circuit board.

4. The ultrasonic apparatus according to claim 1, wherein a projected height of at least one heat generating element is larger than a projected height of another heat generating element in the board thickness direction.

5. The ultrasonic device of claim 1, wherein the circuit board is disposed vertically within the main housing, at least one group of the heat dissipation assemblies being a first heat dissipation assembly disposed vertically; in the heat pipe assembly of the first heat dissipation assembly, the evaporation end of the heat pipe is higher than the condensation end of the heat pipe, and the soaking piece is positioned above the corresponding heat dissipation piece.

6. The ultrasonic equipment is characterized by comprising an ultrasonic host, wherein the ultrasonic host comprises a host shell and a circuit board assembly positioned in the host shell, the circuit board assembly comprises a circuit board and at least one group of heat dissipation assemblies, and the circuit board is vertically arranged in the host shell;

7. The ultrasonic apparatus according to claim 5 or 6, wherein the heat generating element is divided into at least a first heat generating element and a second heat generating element disposed vertically, the first heat generating element being located above the second heat generating element; in the first heat dissipation assembly, at least one heat pipe assembly is a first heat pipe assembly, at least one heat pipe assembly is a second heat pipe assembly, a heat pipe in the first heat pipe assembly is a first heat pipe, a heat pipe in the second heat pipe assembly is a second heat pipe, the first heat pipe assembly is in heat conduction contact with the first heating element, and the second heat pipe assembly is in heat conduction contact with the second heating element, wherein an evaporation end of the first heat pipe extends to a position above an evaporation end of the second heat pipe, so that the height of the evaporation end of the first heat pipe is larger than that of the evaporation end of the second heat pipe.

8. The ultrasonic apparatus of claim 7, wherein the heat spreader of the first heat pipe assembly is a first heat spreader having a heat sink fin located on a side of the first heat spreader facing away from the first heating element.

9. The ultrasonic apparatus of claim 8, wherein the soaking member of the second heat pipe assembly is a second soaking member, the second soaking member being a soaking plate.

10. The ultrasonic apparatus of claim 8, wherein the first heat pipe is inserted into the heat radiating fin of the first soaking member obliquely upward from below to increase a contact surface of the first heat pipe with the first soaking member.

11. The ultrasonic apparatus of claim 10, wherein the soaking piece of the second heat pipe assembly is a second soaking piece, the first heat pipe and the second heat pipe each have a vertical section and a thermal contact section, the thermal contact section of the first heat pipe is disposed obliquely upward from the vertical section, at least a portion of the thermal contact section of the first heat pipe is inserted into the heat dissipation fin of the first soaking piece, the thermal contact section of the second heat pipe is bent from the vertical section to the position where the second soaking piece is located, wherein an included angle between the vertical section and the thermal contact section of the first heat pipe is an obtuse angle, an included angle between the vertical section and the thermal contact section of the second heat pipe is a right angle or an obtuse angle, and an included angle between the vertical section and the thermal contact section of the first heat pipe is larger than an included angle between the vertical section and the thermal contact section of the second heat pipe.

12. The ultrasonic apparatus of claim 7, wherein the heat generating elements comprise at least a third heat generating element and a fourth heat generating element disposed laterally, at least one group of the heat dissipating components being a second heat dissipating component; at least one heat pipe assembly in the second heat dissipation assembly is a third heat pipe assembly, and at least one heat pipe assembly is a fourth heat pipe assembly; the third heat pipe assembly is in heat conduction contact with the third heating element, and the fourth heat pipe assembly is in heat conduction contact with the fourth heating element.

13. The ultrasonic apparatus of claim 12 wherein a plurality of shields are mounted on said circuit board, a plurality of said shields defining a vertical heating element region and a lateral heating element region on said circuit board, said first heating element and said second heating element being located within said vertical heating element region, said third heating element and said fourth heating element being located within said lateral heating element region, a lower end of said vertical heating element region being in communication with said lateral heating element region.

14. The ultrasonic apparatus of claim 13, wherein the heat sink of the first heat sink assembly and the heat sink of the second heat sink assembly are both on an underside of the lateral heat generating element region;

15. The ultrasonic device of claim 5 or 6, wherein in the first heat sink assembly: the soaking piece in at least one heat pipe assembly comprises a soaking plate and radiating fins on the soaking plate.

16. The ultrasonic apparatus of claim 5 or 6, wherein the circuit board assembly further comprises a heat dissipation fan, the heat dissipation fan being located below the circuit board, the heat dissipation fan being configured to draw air to form a heat dissipation air path from top to bottom of the air flow at the location of the circuit board.

17. A circuit board assembly of an ultrasonic device, the circuit board assembly comprising a circuit board and at least one set of heat dissipation assemblies, the circuit board being configured to be disposed vertically within a main chassis of the ultrasonic device, the circuit board having at least two heat generating elements, the heat dissipation assemblies comprising a heat sink and at least two heat pipe assemblies, one of the heat pipe assemblies being configured to dissipate heat from at least one of the heat generating elements, the heat pipe assemblies comprising:

18. The circuit board assembly of claim 17, wherein the heat sink assembly comprises a mounting base secured to the circuit board; in the same heat dissipation assembly, the evaporation end and the soaking piece of each heat pipe assembly are floatingly arranged on the same mounting base.

19. The circuit board assembly of claim 17, wherein at least one group of the heat dissipation assemblies is a first heat dissipation assembly, the first heat dissipation assembly being disposed vertically; in the heat pipe assembly of the first heat dissipation assembly, the evaporation end of the heat pipe is higher than the condensation end of the heat pipe, and the soaking piece is positioned above the corresponding heat dissipation piece.

20. The circuit board assembly of any one of claims 17-19, wherein the heat generating element is divided into at least a first heat generating element and a second heat generating element disposed vertically, the first heat generating element being located above the second heat generating element; in the first heat dissipation assembly, at least one heat pipe assembly is a first heat pipe assembly, at least one heat pipe assembly is a second heat pipe assembly, a heat pipe in the first heat pipe assembly is a first heat pipe, a heat pipe in the second heat pipe assembly is a second heat pipe, the first heat pipe assembly is in heat conduction contact with the first heating element, and the second heat pipe assembly is in heat conduction contact with the second heating element, wherein an evaporation end of the first heat pipe extends to a position above an evaporation end of the second heat pipe, so that the height of the evaporation end of the first heat pipe is larger than that of the evaporation end of the second heat pipe.

21. The circuit board assembly of claim 20, wherein the heat spreader of the first heat pipe assembly is a first heat spreader having a heat sink fin on a side of the first heat spreader facing away from the first heat generating element.

22. The circuit board assembly according to any one of claims 17-19, wherein the protruding height of at least one heat generating element is greater than the protruding height of another heat generating element in the board thickness direction.

23. A heat dissipation assembly for an ultrasonic device circuit board, wherein the heat dissipation assembly comprises a heat dissipation piece and at least two heat pipe assemblies, and the heat dissipation assembly is used for being arranged vertically; one heat pipe component is used for radiating heat corresponding to at least one heating element on the circuit board; the heat pipe assembly includes:

24. The circuit board heat dissipation assembly of claim 23, wherein the heat dissipation assembly comprises a mounting base for securing with the circuit board; in the same heat dissipation assembly, the evaporation end and the soaking piece of each heat pipe assembly are floatingly arranged on the same mounting base.

25. The circuit board heat dissipating assembly of claim 23, wherein the evaporating end of the heat pipe is higher than the condensing end thereof, and the soaking member is above the corresponding heat dissipating member.

26. The heat dissipating assembly of any of claims 23-25, wherein at least one of said heat pipe assemblies is a first heat pipe assembly and at least one of said heat pipe assemblies is a second heat pipe assembly, wherein the heat pipe in said first heat pipe assembly is a first heat pipe and the heat pipe in said second heat pipe assembly is a second heat pipe, and wherein the evaporating end of said first heat pipe extends above the evaporating end of said second heat pipe such that the height of the evaporating end of said first heat pipe is greater than the height of the evaporating end of said second heat pipe.

27. The heat dissipating assembly of claim 26, wherein the heat spreader of the first heat pipe assembly is a first heat spreader having heat dissipating fins on a side of the first heat spreader facing away from the first heat generating element.