CN219832605U - Defect detection device of semiconductor chip - Google Patents

Abstract

The utility model relates to the technical field of semiconductor chips and discloses a defect detection device of a semiconductor chip, which comprises a fixed plate, four supporting legs fixedly arranged at the bottom of the fixed plate, detection equipment fixedly arranged at the top of the fixed plate and a processing assembly arranged at the top of the fixed plate, wherein the processing assembly comprises an adjusting mechanism arranged at the top of the fixed plate, a conveying mechanism is arranged at the top of the fixed plate, the side walls of the conveying mechanism are connected with the side walls of the adjusting mechanism, the number of the four supporting legs is four, and the shapes and the sizes of the four supporting legs are equal. The utility model solves the problems that one end of the spring is extruded when the existing device rotates through the plectrum, the spring is extruded once when the plectrum drives the gear to rotate each time, the spring is extruded for a long time, the elasticity coefficient is changed, and the service life of the device is further influenced.

Description

Defect detection device of semiconductor chip

Technical Field

The utility model relates to the technical field of semiconductor chips, in particular to a defect detection device of a semiconductor chip.

Background

And (3) a semiconductor chip: etching and wiring are carried out on the semiconductor sheet material, and the semiconductor device which can realize certain functions is manufactured by semiconductor materials such as gallium arsenide (gallium arsenide is toxic and therefore, some inferior circuit boards do not need to decompose the gallium arsenide) and germanium, besides silicon chips;

when a semiconductor chip is produced, defect detection is an important link of the production of the semiconductor chip, the appearance integrity of the chip is ensured through detection, and meanwhile, the chip function defect caused by the chip appearance defect can be avoided, so the defect detection is an unavoidable step;

as disclosed in chinese patent CN216698284U, the device is abutted against a gear by a pulling sheet to drive the gear to roll, thereby driving a gear belt, a conveyor belt and a tray to move, and when the pulling sheet is no longer in contact with the gear, the tray is stopped just under a detection device, so as to detect defects;

but there is certain defect in this patent, and the device can extrude the one end of spring through the plectrum when carrying out the pivoted, and the plectrum drives the gear at every turn and rotates, and the spring can all be once extruded, and the long-time extrusion of spring, elasticity coefficient can appear changing, further influences the life of device.

Disclosure of Invention

The present utility model is directed to a defect detecting device for a semiconductor chip, which solves the above-mentioned problems in the prior art.

In order to achieve the above purpose, the present utility model provides the following technical solutions: a defect detecting device of semiconductor chip comprises a fixing plate,

the support legs are fixedly arranged at the bottom of the fixed plate;

the detection equipment is fixedly arranged at the top of the fixed plate;

and a processing assembly disposed at a top position of the fixing plate;

the processing assembly comprises an adjusting mechanism arranged at the top of the fixed plate;

the top position of the fixed plate is provided with a conveying mechanism, and the side wall of the conveying mechanism is connected with the side wall of the adjusting mechanism.

Preferably, the number of the supporting legs is four, the shapes and the sizes of the four supporting legs are equal, the four supporting legs are respectively and fixedly arranged at the four corners of the bottom of the fixing plate, and the whole position of the device can be effectively supported through the supporting legs.

Preferably, the adjusting mechanism comprises a supporting block, a motor is fixedly arranged at the top of the supporting block, a rotary table is arranged on the motor through a rotary shaft of an output end in a transmission mode, a clamping block is arranged on the inner wall of a groove formed in the side wall of the rotary table, and a tooth block I is fixedly arranged on the side wall of the clamping block.

Preferably, the lateral wall of joint piece and the inner wall sliding connection of carousel, the lateral wall of tooth piece one and the lateral wall sliding connection of carousel, when operating personnel moved the position of joint piece, the inside that the joint piece can effectually break away from the carousel.

Preferably, the transportation mechanism comprises a base and a connecting block, the base is fixedly arranged at the top of the fixed plate, a rotating roller is rotatably arranged between the bases, a transportation belt is arranged on the surface of the rotating roller in a transmission manner, and the rotating roller can effectively drive the position of the transportation belt to move when rotating.

Preferably, the connecting block is rotatably arranged on the side wall of the base, the other end of the connecting block is fixedly connected with the side wall of the rotating roller at the left side, the top of the connecting block is fixedly provided with a rotating block, and the surface of the rotating block is fixedly provided with a tooth block II.

Preferably, the side wall of the second tooth block is meshed with the side wall of the first tooth block, and the first tooth block can effectively drive the second tooth block to rotate when rotating.

The utility model provides a defect detection device of a semiconductor chip. The beneficial effects are as follows:

(1) According to the utility model, when an operator starts the motor, the motor extrudes the tooth block II under the combined action of the rotary table and the tooth block I, so that the position of the semiconductor chip is effectively driven to move, the position of the rotating roller can be kept unchanged when the tooth block I is not contacted with the tooth block II, the semiconductor chip is conveniently detected, the whole service life of the device is effectively prolonged, the problem that one end of a spring is extruded when the existing device rotates through a pulling piece, the spring is extruded once when the pulling piece drives a gear to rotate each time, the spring is extruded for a long time, and the elastic coefficient is changed, so that the service life of the device is further influenced is solved.

(2) According to the utility model, the clamping blocks and the tooth blocks are installed according to the requirements by operators, the positions of the clamping blocks are moved, the clamping blocks effectively slide into the grooves, the tooth blocks are installed effectively, the number of the tooth blocks is increased, the rotating angle of the rotating roller is increased, the moving speed of the semiconductor chip is increased, the practicability of the device is improved effectively, and the device is convenient for the operators to use.

Drawings

FIG. 1 is a schematic view of the appearance structure of the present utility model;

FIG. 2 is a schematic diagram of a front cross-sectional structure of the present utility model;

FIG. 3 is a schematic view of the structure of the adjustment mechanism and the transport mechanism of the present utility model;

FIG. 4 is a schematic view of a part of the structure of the adjusting mechanism of the present utility model;

fig. 5 is a schematic diagram of the connection of the first tooth block and the clamping block 416 according to the present utility model.

In the figure: 1. a fixing plate; 2. support legs; 3. a detection device; 4. processing the assembly; 41. an adjusting mechanism; 411. a support block; 412. a motor; 413. a turntable; 414. tooth block I; 415. a groove; 416. a clamping block; 42. a transport mechanism; 421. a base; 422. a rotating block; 423. tooth block II; 424. a connecting block; 425. a conveyor belt; 426. and (5) rotating the roller.

Detailed Description

Example 1

As shown in fig. 1-5, the present utility model provides a technical solution: a defect detecting device for a semiconductor chip includes a fixing plate 1,

the four support legs 2 are fixedly arranged at the bottom of the fixed plate 1, the number of the support legs 2 is four, the shapes and the sizes of the four support legs 2 are equal, the four support legs 2 are respectively and fixedly arranged at four corners of the bottom of the fixed plate 1, and the position of the whole device can be effectively supported through the support legs 2;

the detection device 3 is fixedly arranged on the top of the fixed plate 1, (the detection device 3 is used for detecting the existing real objects in the comparison file);

and a processing assembly 4 disposed at a top position of the fixing plate 1;

the processing assembly 4 comprises an adjusting mechanism 41 arranged at the top of the fixed plate 1, the adjusting mechanism 41 comprises a supporting block 411, a motor 412 is fixedly arranged at the top of the supporting block 411, a rotary table 413 is arranged at the motor 412 through the transmission of a rotary shaft at the output end, a clamping block 416 is arranged on the inner wall of a groove 415 formed in the side wall of the rotary table 413, a certain friction force exists between the clamping block 416 and the inner wall of the groove 415, when an operator does not push the side wall of the clamping block 416, the position of the clamping block 416 is always kept unchanged, a tooth block I414 is fixedly arranged on the side wall of the clamping block 416, the operator installs the clamping block 416 and the tooth block I414 according to the requirement, the clamping block 416 moves to the position of the clamping block 416, the clamping block 416 effectively slides into the groove 415, the tooth block I414 is effectively installed at the position, the more the tooth block I414 is installed, the larger the rotating roller 426 rotates at a larger angle, the faster the moving speed of the semiconductor chip can be, the practicality of the device can be effectively improved, the purpose of using the device is convenient for operators, the side wall of the clamping block 416 is in sliding connection with the inner wall of the rotary disc 413, the side wall of the tooth block I414 is in sliding connection with the side wall of the rotary disc 413, when the operators move the position of the clamping block 416, the clamping block 416 can be effectively separated from the inside of the rotary disc 413, when the operators open the motor 412, the motor 412 extrudes the tooth block II 423 under the combined action of the rotary disc 413 and the tooth block I414, the position of the rotating roller 426 can be kept unchanged when the tooth block I414 is not contacted with the tooth block II 423, the semiconductor chip is convenient to detect, the purpose of effectively improving the service life of the whole device is achieved when the device rotates through the shifting sheet, one end of the spring can be extruded, the spring can be extruded once when the poking piece drives the gear to rotate each time, the spring is extruded for a long time, the elastic coefficient can be changed, and the service life of the device is further influenced;

an operator moves the positions of the clamping block 416 and the first tooth block 414 according to the requirement, a proper number of first tooth blocks 414 are installed, then when the operator starts the motor 412, the motor 412 drives the rotary table 413 to rotate through a rotary shaft at the output end, the rotary table 413 extrudes the second tooth block 423 through the first tooth block 414 on the surface, and when the first tooth block 414 is not contacted with the second tooth block 423, the position of the rotary roller 426 is kept unchanged, so that the semiconductor chip is convenient to detect;

example 2

On the basis of embodiment 1, a transport mechanism 42 is installed at the top position of a fixed plate 1, the side wall of the transport mechanism 42 is connected with the side wall of an adjusting mechanism 41, the transport mechanism 42 comprises a base 421 and a connecting block 424, the base 421 is fixedly installed at the top of the fixed plate 1, a rotating roller 426 is rotatably installed between the bases 421, a transport belt 425 is installed on the surface of the rotating roller 426 in a transmission manner, the rotating roller 426 can effectively drive the position of the transport belt 425 to move when rotating, the connecting block 424 is rotatably installed on the side wall of the base 421, the other end of the connecting block 424 is fixedly connected with the side wall of the rotating roller 426 at the left side position, a rotating block 422 is fixedly installed at the top of the connecting block 424, a second tooth block 423 is fixedly installed on the surface of the rotating block 422, the side wall of the second tooth block 423 is meshed with the side wall of the first tooth block 414, and the first tooth block 414 can effectively drive the position of the second tooth block 423 to rotate when rotating;

the operator places the semiconductor chip that needs to detect to the upper surface of conveyer belt 425, and then tooth piece one 414 is when clockwise rotating, and effective tooth piece two 423 rotates anticlockwise, and tooth piece two 423 effectively drives rotatory piece 422 and rotate anticlockwise, and rotatory piece 422 effectively drives the rotor 426 and rotates under the effect of connecting block 424, and the rotor 426 moves through the position of conveyer belt 425 on surface, and conveyer belt 425 is to effectively impel the semiconductor chip to reach the below position of check out test set 3.

Claims (4)

1. A defect detecting device of a semiconductor chip includes a fixing plate (1),

the support legs (2) are fixedly arranged at the bottom of the fixed plate (1);

a detection device (3) fixedly mounted on top of the fixed plate (1);

and a processing assembly (4) arranged at the top of the fixed plate (1); the method is characterized in that:

the machining assembly (4) comprises an adjusting mechanism (41) arranged at the top of the fixed plate (1), the adjusting mechanism (41) comprises a supporting block (411), a motor (412) is fixedly arranged at the top of the supporting block (411), a rotary table (413) is arranged on the motor (412) through a rotary shaft transmission of an output end, a clamping block (416) is arranged on the inner wall of a groove (415) formed in the side wall of the rotary table (413), a tooth block I (414) is fixedly arranged on the side wall of the clamping block (416), the side wall of the clamping block (416) is in sliding connection with the inner wall of the rotary table (413), and the side wall of the tooth block I (414) is in sliding connection with the side wall of the rotary table (413);

transport mechanism (42) are installed at the top position of fixed plate (1), the lateral wall of transport mechanism (42) is connected with the lateral wall of adjustment mechanism (41), transport mechanism (42) are including base (421) and connecting block (424), base (421) fixed mounting is at the top of fixed plate (1), rotate between base (421) and install live-rollers (426), conveyer belt (425) are installed in the surface transmission of live-rollers (426).

2. The defect detecting apparatus of a semiconductor chip according to claim 1, wherein: the number of the supporting legs (2) is four, the shapes and the sizes of the four supporting legs (2) are equal, and the four supporting legs (2) are respectively and fixedly arranged at the four corners of the bottom of the fixed plate (1).

3. The defect detecting apparatus of a semiconductor chip according to claim 1, wherein: the connecting block (424) is rotatably arranged on the side wall of the base (421), the other end of the connecting block (424) is fixedly connected with the side wall of the rotating roller (426) at the left side, a rotating block (422) is fixedly arranged at the top of the connecting block (424), and a tooth block II (423) is fixedly arranged on the surface of the rotating block (422).

4. A defect detecting apparatus of a semiconductor chip according to claim 3, wherein:

the side wall of the second tooth block (423) is meshed with the side wall of the first tooth block (414).