CN219810892U - Ultrasonic sensor and ultrasonic flaw detection device for detecting defects of inner wall of central hole - Google Patents
Ultrasonic sensor and ultrasonic flaw detection device for detecting defects of inner wall of central hole Download PDFInfo
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- CN219810892U CN219810892U CN202320722112.2U CN202320722112U CN219810892U CN 219810892 U CN219810892 U CN 219810892U CN 202320722112 U CN202320722112 U CN 202320722112U CN 219810892 U CN219810892 U CN 219810892U
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- 230000007547 defect Effects 0.000 title claims abstract description 30
- 238000001514 detection method Methods 0.000 title claims abstract description 26
- 230000005540 biological transmission Effects 0.000 claims description 4
- 230000035945 sensitivity Effects 0.000 abstract description 4
- 239000000523 sample Substances 0.000 description 7
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 238000002604 ultrasonography Methods 0.000 description 2
- 230000002238 attenuated effect Effects 0.000 description 1
- 230000001808 coupling effect Effects 0.000 description 1
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Abstract
The ultrasonic sensor for detecting the defects of the inner wall of the central hole comprises a sensor shell, and an ultrasonic transmitting piezoelectric wafer and an ultrasonic receiving piezoelectric wafer which are arranged in the sensor shell in a mirror symmetry mode, wherein the ultrasonic transmitting direction of the ultrasonic transmitting piezoelectric wafer is opposite to the ultrasonic receiving direction of the ultrasonic receiving piezoelectric wafer. The utility model can improve the detection efficiency and the detection sensitivity of the defects on the inner wall of the central hole and reduce the detection cost.
Description
Technical Field
The utility model relates to a probe for detecting defects of the inner wall of a central hole, in particular to an ultrasonic sensor and an ultrasonic flaw detection device for detecting the defects of the inner wall of the central hole, and belongs to the technical field of nondestructive detection.
Background
At present, in thermal power generation equipment, defects are easily generated on the inner wall of a plurality of parts such as the inner wall of a thick-wall pipeline, a central hole of a turbine rotor and the like, and the defects of the inner wall are detected according to related regulations, but the conventional ultrasonic detection effect is poor or even impossible, and the inner wall defects are detected by adopting ultrasonic surface waves in the central hole.
Because the contact surface of the conventional common ultrasonic surface wave probe is a straight line, the contact with the inner wall of the central hole of the pipeline or the rotor is poor; also because the ultrasonic surface wave decays fast, if adopt the reflected echo to judge the defect, the sound path will be the defect to the double of the distance of the probe, therefore the defect detection sensitivity exceeding half circumference is inferior to that of the bimorph probe detection; in addition, the single-chip ultrasonic surface wave probe cannot receive the backward incoming wave, and the screen is not displayed when the normal detection is not defective, so that the probe cannot be perceived when the coupling condition is not good, and the defect that the probe is likely to be missed exists.
Disclosure of Invention
In order to overcome the defects of the related art, the utility model provides an ultrasonic sensor and an ultrasonic flaw detection device for detecting defects of the inner wall of a central hole, which can improve the detection efficiency and the detection sensitivity of the defects of the inner wall of the central hole and reduce the detection cost.
The utility model solves the technical problems by adopting a technical scheme that:
the ultrasonic sensor for detecting the defects of the inner wall of the central hole comprises a sensor shell, and an ultrasonic transmitting piezoelectric wafer and an ultrasonic receiving piezoelectric wafer which are arranged in the sensor shell in a mirror symmetry mode, wherein the ultrasonic transmitting direction of the ultrasonic transmitting piezoelectric wafer is opposite to the ultrasonic receiving direction of the ultrasonic receiving piezoelectric wafer.
According to the technical scheme, the ultrasonic wave transmitting piezoelectric wafer and the ultrasonic wave receiving piezoelectric wafer with opposite directions are arranged and are used for transmitting ultrasonic surface waves and receiving ultrasonic surface waves coming in opposite directions, so that a circle of surface waves along the circumferential direction of the inner wall of the central hole is formed, the defect detection of the longitudinal full circle (corresponding to the inner circumferential surface of a certain detection position on the inner wall of the central hole) of the position where the ultrasonic sensor is located is realized, the detection efficiency and the detection sensitivity are improved, and the detection cost is reduced.
Optionally, the transmitting ultrasonic piezoelectric wafer and the receiving ultrasonic piezoelectric wafer are fixed on the sensor shell through a first perspective wedge block and a second perspective wedge block which are oppositely arranged respectively;
the first perspective wedge block and the second perspective wedge block are respectively provided with an arc bottom surface and an inclined side surface, are attached and connected to an arc bottom wall matched with the inner wall of the central hole of the sensor shell through the arc bottom surface, and are connected with the ultrasonic wave emitting piezoelectric wafer or the ultrasonic wave receiving piezoelectric wafer through the inclined side surfaces.
Optionally, the arc radius of the arc bottom surface and the arc bottom wall is 0.8-1 times of the inner radius of the detected center hole.
Optionally, the included angle between the transmitting ultrasonic piezoelectric chip and the tangent line of the bottom surface of the first sound transmission wedge is greater than 75 degrees, and the included angle between the receiving ultrasonic piezoelectric chip and the tangent line of the bottom surface of the second sound transmission wedge is greater than 75 degrees.
The other technical scheme adopted for solving the technical problems is as follows:
an ultrasonic flaw detector comprises an ultrasonic sensor for detecting defects on the inner wall of a central hole and an ultrasonic flaw detector connected with the ultrasonic sensor.
Optionally, the ultrasonic sensor further comprises a loading piece and a moving piece, wherein the loading piece is used for fixing the ultrasonic sensor on the moving piece, and the moving piece is used for generating axial movement along the inner wall of the central hole.
The ultrasonic flaw detector provided by the technical scheme refers to the ultrasonic sensor for detecting the defects of the inner wall of the central hole, so that the ultrasonic flaw detector also has the advantage of the ultrasonic sensor. And then the ultrasonic flaw detector connected with the ultrasonic sensor is used for displaying the detection process in real time, so that the occurrence of missed detection is avoided.
Drawings
The utility model will be further described with reference to the drawings and examples.
Fig. 1 is a front perspective view of an ultrasonic sensor according to an embodiment of the present utility model.
Fig. 2 is a view showing a use state of an ultrasonic sensor according to an embodiment of the present utility model.
The reference numerals in the drawings illustrate: 10-an ultrasonic sensor; a 101-sensor housing; 1011-an arcuate bottom wall; 102-transmitting an ultrasonic piezoelectric wafer; 103-receiving an ultrasonic piezoelectric wafer; 104-a first sound-transmitting wedge; 1041-a first arcuate bottom surface; 1042-a first beveled side; 105-a second perspective wedge; 1051-a second arcuate bottom surface; 1052-second diagonal side; 20-piping or rotors; 201-inner wall of the central bore.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present utility model more apparent, the technical solutions of the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model, and it is apparent that the described embodiments are some embodiments of the present utility model, but not all embodiments of the present utility model. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to fall within the scope of the utility model.
Fig. 1 and 2 are schematic structural views of a preferred embodiment of the present utility model, in which an ultrasonic sensor 10 for detecting defects on an inner wall 201 of a central hole comprises a sensor housing 101, and an ultrasonic transmitting piezoelectric wafer 102 and an ultrasonic receiving piezoelectric wafer 103 which are arranged in the sensor housing 101 in mirror symmetry, wherein an ultrasonic transmitting direction of the ultrasonic transmitting piezoelectric wafer 102 is opposite to an ultrasonic receiving direction of the ultrasonic receiving piezoelectric wafer 103.
In a further alternative implementation of the embodiment of the present utility model, the transmitting ultrasonic piezoelectric wafer 102 and the receiving ultrasonic piezoelectric wafer 103 are fixed on the sensor housing 101 by a first perspective wedge 104 and a second perspective wedge 105, which are disposed opposite to each other, respectively;
the first and second perspective wedges 104 and 105 each have an arc bottom surface and an inclined side surface, and are attached to the arc bottom wall 1011 of the sensor housing 101, which is matched with the inner wall 201 of the central hole, and are connected to the transmitting ultrasonic piezoelectric wafer 102 or the receiving ultrasonic piezoelectric wafer 103 through the inclined side surfaces.
The first arc bottom surface 1041 of the first sound-transmitting wedge 104 and the second arc bottom surface 1051 of the second sound-transmitting wedge 105 are both disposed in contact with the arc bottom wall 1011 of the sensor housing 101, and the arc bottom wall 1011 of the sensor housing 101 is placed on the arc inner surface of the inner wall 201 of the center hole when in use. The transmitting ultrasound piezoelectric wafer 102 is mounted on the first sloped side 1042 of the first acoustically transparent wedge 104 and the receiving ultrasound piezoelectric wafer 103 is mounted on the second sloped side 1052 of the second acoustically transparent wedge.
The first and second perspective wedges 104 and 105 and the contact surfaces thereof with the inner wall of the sensor housing 101 (i.e., the arc bottom wall 1011) are arc-shaped so as to be in arc-fit with the inner wall of the center when mounted, thereby maintaining good coupling.
In a further alternative implementation manner of the embodiment of the present utility model, the arc radii of the arc bottom surface and the arc bottom wall 1011 are both 0.8-1 times of the detected inner radius of the central hole, so as to obtain a better coupling effect.
In a further preferred implementation of the present embodiment, the included angle between the transmitting ultrasonic piezoelectric wafer 102 and the tangent of the bottom surface of the first sound-transmitting wedge 104 is greater than 75 °, and the included angle between the receiving ultrasonic piezoelectric wafer 103 and the tangent of the bottom surface of the second sound-transmitting wedge is greater than 75 °.
The 75 ° angle is a state where the surface wave is preferably generated, and may be 76 °, 77 °, or the like, which is greater than 75 °. The included angle refers to the included angle of a tangent line at the intersection point of the piezoelectric wafer and the arc bottom surface of the wedge, and the intersection point refers to the intersection point of the axis of sound beams generated by the piezoelectric wafer in the wedge and the arc bottom surface of the wedge.
The embodiment of the utility model also provides an ultrasonic flaw detection device, which comprises the ultrasonic sensor 10 for detecting the defects of the inner wall 201 of the central hole and an ultrasonic flaw detector connected with the ultrasonic sensor.
The ultrasonic flaw detection device is placed on the inner wall 201 of the central hole by means of the ultrasonic sensor 10, and is used for detecting inner wall defects of the pipeline or the rotor 20 and the like, and is particularly used for detecting the inner wall of the thick-wall pipeline or the inner wall 201 of the central hole of the turbine rotor; after the ultrasonic flaw detector is started, the ultrasonic flaw detector transmits the ultrasonic wave to the ultrasonic piezoelectric wafer 102 to generate an ultrasonic surface wave, and the ultrasonic surface wave moves along the inner wall 201 of the central hole for one circle in the circumferential direction and is received by the ultrasonic piezoelectric wafer 103; if there is a longitudinal defect in the path of the ultrasonic wave, the advancing surface wave is attenuated or blocked, and displayed on the ultrasonic flaw detector to which the ultrasonic sensor 10 is connected.
In a further alternative implementation of the embodiment of the utility model, it further comprises a loading member for fixing the ultrasonic sensor 10 to the moving member for generating an axial movement along the inner wall 201 of the central hole.
The structure of the loading member is not limited, and the function of clamping and fixing the ultrasonic sensor 10 can be only satisfied, and various existing clamps or fixing structures can be directly selected, while the moving member can satisfy the relative movement of the ultrasonic sensor 10 on the inner wall 201 of the central hole, specifically, the ultrasonic sensor 10 moves along the axial direction of the central hole, so that the detection of the overall defect of the inner wall 201 of the central hole can be completed.
The foregoing description is only a preferred embodiment of the present utility model, and is not intended to limit the utility model in any way, but any simple modification and equivalent variation of the above embodiment according to the technical spirit of the present utility model falls within the scope of the present utility model.
Claims (6)
1. An ultrasonic sensor for detecting defects of the inner wall of a central hole is characterized in that: the ultrasonic sensor comprises a sensor shell, and an ultrasonic transmitting piezoelectric wafer and an ultrasonic receiving piezoelectric wafer which are arranged in the sensor shell in a mirror symmetry mode, wherein the ultrasonic transmitting direction of the ultrasonic transmitting piezoelectric wafer is opposite to the ultrasonic receiving direction of the ultrasonic receiving piezoelectric wafer.
2. The ultrasonic sensor for detecting defects of an inner wall of a center hole according to claim 1, wherein: the ultrasonic wave transmitting piezoelectric wafer and the ultrasonic wave receiving piezoelectric wafer are respectively fixed on the sensor shell through a first sound transmission wedge block and a second sound transmission wedge block which are oppositely arranged;
the first perspective wedge block and the second perspective wedge block are respectively provided with an arc bottom surface and an inclined side surface, are attached and connected to an arc bottom wall matched with the inner wall of the central hole of the sensor shell through the arc bottom surface, and are connected with the ultrasonic wave emitting piezoelectric wafer or the ultrasonic wave receiving piezoelectric wafer through the inclined side surfaces.
3. The ultrasonic sensor for detecting defects of inner walls of center holes according to claim 2, wherein: the arc radiuses of the arc bottom surface and the arc bottom wall are 0.8-1 times of the inner radius of the detected central hole.
4. An ultrasonic sensor for detecting defects on an inner wall of a center hole according to claim 3, wherein: the included angle between the transmitting ultrasonic piezoelectric chip and the tangent line of the bottom surface of the first sound-transmitting wedge block is larger than 75 degrees, and the included angle between the receiving ultrasonic piezoelectric chip and the tangent line of the bottom surface of the second sound-transmitting wedge block is larger than 75 degrees.
5. An ultrasonic flaw detection device is characterized in that: comprising the ultrasonic sensor for detecting defects of inner walls of center holes according to any one of claims 1 to 4 and an ultrasonic flaw detector connected thereto.
6. An ultrasonic testing apparatus according to claim 5, wherein: the ultrasonic sensor further comprises a loading piece and a moving piece, wherein the loading piece is used for fixing the ultrasonic sensor on the moving piece, and the moving piece is used for generating axial movement along the inner wall of the central hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320722112.2U CN219810892U (en) | 2023-04-04 | 2023-04-04 | Ultrasonic sensor and ultrasonic flaw detection device for detecting defects of inner wall of central hole |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320722112.2U CN219810892U (en) | 2023-04-04 | 2023-04-04 | Ultrasonic sensor and ultrasonic flaw detection device for detecting defects of inner wall of central hole |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219810892U true CN219810892U (en) | 2023-10-10 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320722112.2U Active CN219810892U (en) | 2023-04-04 | 2023-04-04 | Ultrasonic sensor and ultrasonic flaw detection device for detecting defects of inner wall of central hole |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219810892U (en) |
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2023
- 2023-04-04 CN CN202320722112.2U patent/CN219810892U/en active Active
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