CN219810870U - Multi-layer X-ray detector - Google Patents

Abstract

A multi-layer X-ray detector (10), comprising: a first X-ray converter (20); a first sensor (30); second X-ray a converter (40); second sensor a device (50); and internal protection a scattering device (60). The first X-ray converter forms a first detector pair with the first sensor. The second X-ray converter and the second sensor form a second detector pair. The internal anti-scatter device includes a plurality of X-ray absorbing partition walls. The internal anti-scatter device is positioned between the first detector pair and the second detector pair. The internal anti-scatter device has no structure positioned in any layer of the first detector pair and the anti-scatter device has no structure positioned in any layer of the second detector pair. The plurality of partition walls includes a plurality of substantially parallel first partition walls, and a spacing between the first partition walls in a first direction is equal to an integer multiple of a pixel pitch of the first sensor and/or the detector of the second sensor in the first direction, where n=2, 3,4, … N.

Description

Multi-layer X-ray detector

Technical Field

The present utility model relates to a multi-layer X-ray detector.

Background

Multi-layer radiation X-ray detectors can be affected by (back) scattering of X-rays between the detection layers, which can reduce the performance of the detector. In dual energy X-ray imaging based on a single exposure of a dual layer detector, the amount of scattered X-rays entering the bottom scintillator layer from the top scintillator layer may be so large that they are mainly scattered and not mainly signaled by the bottom sensor. This reduces the spectral discrimination capability of the detector.

In US2007/0114426A1, an X-ray detector system with improved spatial resolution for a computed tomography system is provided. The detector system may include pairs of first and second detector arrays, and each array contains differently designed detector elements. In one embodiment, the first array may include a first, relatively thin and continuous (i.e., monolithic) scintillation layer, with individual diode arrays positioned to receive light generated within the scintillation layer. The second array may include a relatively thick second scintillation layer formed of individual scintillator elements.

US2019/0374182A1 describes a method and apparatus for determining a virtual output of a multi-energy X-ray device. Based on the application of the X-ray device, a general algorithm may be determined or selected. The input received from the X-ray device may be substituted into a generic algorithm to generate a virtual output algorithm for the X-ray apparatus. The virtual output may then be calculated using a virtual output algorithm.

A multi-layer high voltage digital imager is disclosed in US2012/0097858 A1. In one embodiment, the radiation to particle conversion and the particle to electricity conversion are paired as a modular entity. The entities are replicated one above the other as hierarchical units to build imagers with higher resolution and efficiency. Because of such paired copying, the sub-images from each copy pair may be selectively combined and processed to improve the quality of the image.

WO 2017/0074326 A1 describes a dual mode radiation detector comprising: an X-ray detector layer converting incident X-ray radiation into X-ray electronic data, the X-ray detector forming an incident face of the dual mode radiation detector; a collimator disposed below the X-ray detector layer; and a gamma photon detector layer disposed below the collimator to convert incident gamma photons into gamma photon electrical data.

In addition to good spectral discrimination, it is important to obtain pixels that are sufficient to enter the multi-layer radiation X-ray detector. Again, a lower signal-to-noise ratio may be increased by increasing the X-ray dose, but this is not acceptable in current medical X-ray imaging practice. There is a need to address this problem.

Disclosure of Invention

It would be advantageous to have an improved multi-layer X-ray detector. The utility model is defined by the independent claims, wherein further embodiments are defined by the dependent claims.

In a first aspect, there is provided a multi-layered X-ray detector comprising:

a first X-ray converter;

a first sensor;

a second X-ray converter;

a second sensor; and

an internal anti-scatter device.

The first X-ray converter is positioned at the first X-ray conversion layer. The first sensor is positioned at a first sensor layer. The second X-ray converter is positioned at the second X-ray conversion layer. The second sensor is positioned at a second sensor layer. The first X-ray converter and the first sensor form a first detector pair, and the first sensor is configured to detect radiation emitted from the first X-ray converter generated by X-ray conversion in the first X-ray converter. The second X-ray converter and the second sensor form a second detector pair, and the second sensor is configured to detect radiation emitted from the second X-ray converter generated by X-ray conversion in the second X-ray converter. The internal anti-scatter device includes a plurality of X-ray absorbing partition walls. The internal anti-scatter device is positioned between the first detector pair and the second detector pair. The structure without the internal anti-scatter device is positioned in any layer of the first detector pair and the structure without the anti-scatter device is positioned in any layer of the second detector pair. The plurality of partition walls comprises a plurality of first partition walls substantially parallel to each other-thus they are substantially parallel to each other. The spacing between the first partition walls in the first direction is equal to an integer multiple N of the detector pixel pitch of the first sensor and/or the second sensor in the first direction, where N = 2,3,4, … N.

In this way, forward and back scatter within the detector between the detection layers, which would otherwise degrade the performance of the detector, may be mitigated. Thus, by integrating an anti-scatter device or an anti-scatter grid in the detector structure, without any structure in the detection layer plane of the device, the spectral discrimination in a dual-energy detector can be improved. Furthermore, the fill factor of the X-ray conversion can be kept at 100%. With the present utility model, the grid can be used to mitigate backscatter while reducing the negative impact of grid partition walls on primary transmission. This is particularly advantageous for medical X-ray applications requiring high resolution/small pixels and limited X-ray dose to the patient.

In an example, the first partition wall is aligned with a junction between adjacent pixels of the first sensor and/or the second sensor in the first direction. Alignment of the junctions or gaps between the spacer walls and adjacent pixels is advantageous to further limit the negative effects of the walls on primary transmission.

In an example, the first sensor layer is adjacent to the first X-ray conversion layer; and wherein the second sensor layer is adjacent to the second X-ray conversion layer.

In an example, the first sensor layer is adjacent to the internal anti-scatter device.

In an example, the first X-ray conversion layer is adjacent to the internal anti-scatter device.

In an example, the second sensor layer is adjacent to the internal anti-scatter device.

In an example, the second X-ray conversion layer is adjacent to the internal anti-scatter device.

In an example, the plurality of partition walls includes a plurality of second partition walls that are substantially parallel to each other. The spacing between the second partition walls in the second direction is equal to an integer multiple N of the detector pixel pitch of the first sensor and/or the second sensor in the second direction, wherein N = 1,2,3,4,..n, and wherein the second direction is at an angle to the first direction. Such a multi-layer detector comprising an internal two-dimensional anti-scatter device may be particularly suitable for applications such as computed tomography.

In an example, the second partition wall is aligned with a junction between adjacent pixels of the first sensor and/or the second sensor in the first direction.

In an example, the detector pixel pitch of the first sensor and/or the second sensor in the first direction is less than or equal to 200 μm. As mentioned above, the utility model is particularly advantageous for limiting the negative effect of the partition walls on the primary transmission of small pixel sizes, especially in case of dose limitation.

In examples, the detector pixel pitch of the first sensor and/or the second sensor in the first direction is 175 μm, 150 μm, 125 μm, 100 μm, 75 μm, 50 μm, 25 μm, 10 μm or 5 μm.

In an example, the detector pixel pitch of the first sensor and/or the second sensor in the second direction is less than or equal to 200 μm.

In examples, the detector pixel pitch of the first sensor and/or the second sensor in the second direction is 175 μm, 150 μm, 125 μm, 100 μm, 75 μm, 50 μm, 25 μm, 10 μm or 5 μm.

In an example, the detectors are configured such that the internal anti-scatter device is removable from between the first detector pair and the second detector pair.

In this way, the detector may be adapted to the thickness of the patient or a portion of the patient. Thus, for lean patients such as children and for lean body parts where X-rays scatter less, the anti-scatter device may be removed to improve the image quality. However, for thicker patients where X-ray scatter is present, an anti-scatter device (ASD) may be placed within the detector to reduce scatter within the detector that would otherwise degrade detector performance.

In an example, the plurality of X-ray absorbing partition walls comprise at least one high Z material. Materials with high atomic numbers, so-called high Z materials, may be particularly effective in reducing scattering effects in multi-layer detectors with integrated anti-scattering devices.

The foregoing aspects and examples will become apparent from and elucidated with reference to the embodiments described hereinafter.

Drawings

Exemplary embodiments will be described below with reference to the accompanying drawings:

FIG. 1 shows a schematic diagram of an example of a multi-layer X-ray detector;

fig. 2 shows a schematic view of an example of an external anti-scatter device between an object and an X-ray detector in the form of an anti-scatter grid;

FIG. 3 shows a schematic diagram of an example of an anti-scatter device in the form of a 1D anti-scatter grid;

fig. 4 shows a schematic diagram of an example of an anti-scatter device in the form of a 2D anti-scatter grid;

FIG. 5 shows a schematic diagram of an example of a multi-layered X-ray detector with an internal anti-scatter device;

FIG. 6 shows a schematic diagram of an example of a multi-layered X-ray detector with an internal anti-scatter device;

FIG. 7 shows a schematic diagram of an example of a multi-layered X-ray detector with an internal anti-scatter device;

FIG. 8 shows a schematic diagram of an example of a multi-layered X-ray detector with an internal anti-scatter device;

FIG. 9 shows a schematic diagram of an example of a multi-layered X-ray detector with an internal anti-scatter device; and is also provided with

Fig. 10 shows a schematic diagram of an example of a multi-layer X-ray detector with an inner anti-scatter device and an outer anti-scatter device in the form of an anti-scatter grid.

Detailed Description

Fig. 1 shows an example of a multi-layered X-ray detector 10. The detector 10 includes a first X-ray converter 20, a first sensor 30, a second X-ray converter 40, a second sensor 50, and an internal anti-scatter device 60. The first X-ray converter is positioned at the first X-ray conversion layer. The first sensor is positioned at a first sensor layer. The second X-ray converter is positioned at the second X-ray conversion layer. The second sensor is positioned at a second sensor layer. The first X-ray converter and the first sensor form a first detector pair, and the first sensor is configured to detect radiation emitted from the first X-ray converter generated by X-ray conversion in the first X-ray converter. The second X-ray converter and the second sensor form a second detector pair, and the second sensor is configured to detect radiation emitted from the second X-ray converter generated by X-ray conversion in the second X-ray converter. The internal anti-scatter device includes a plurality of X-ray absorbing partition walls. The internal anti-scatter device is positioned between the first detector pair and the second detector pair. The internal anti-scatter device has no structure positioned in any layer of the first detector pair and the anti-scatter device has no structure positioned in any layer of the second detector pair.

In an example, the plurality of X-ray absorbing partition walls comprise at least one high Z material.

In an example, the internal anti-scatter device may be a 1D device having a plurality of X-ray absorbing separation walls substantially parallel to each other.

In an example, the internal anti-scatter device may be a 2D device having a plurality of first X-ray absorbing partition walls substantially parallel in a first direction and a plurality of second X-ray absorbing partition walls parallel to each other in a second direction, the second direction being angled with respect to the first direction. The second direction may be orthogonal to the first direction, suitable for square or rectangular pixels, or may be at a 60 degree angle, suitable for hexagonal pixels. Other angles are also possible.

According to an example, the first sensor layer is adjacent to the first X-ray conversion layer; and the second sensor layer is adjacent to the second X-ray conversion layer.

According to an example, the first sensor layer is adjacent to the internal anti-scatter device.

According to an example, the first X-ray conversion layer is adjacent to the internal anti-scatter device.

According to an example, the second sensor layer is adjacent to the internal anti-scatter device.

According to an example, the second X-ray conversion layer is adjacent to the internal anti-scatter device.

The plurality of partition walls includes a plurality of first partition walls that are substantially parallel to each other. The spacing between the first separating walls in the first direction is equal to an integer multiple N of the detector spacing of the first sensor and/or the second sensor in the first direction, wherein n=, 2,3,4, … N.

According to an example, the first partition wall is aligned with a junction between adjacent pixels.

According to one example, the plurality of partition walls includes a plurality of second partition walls that are substantially parallel to each other. The spacing between the second partition walls in the second direction is equal to an integer multiple N of the detector pitch of the first sensor and/or the second sensor in the second direction, wherein N = 1,2,3,4, … N, and wherein the second direction is at an angle to the first direction.

In an example, the second direction is orthogonal to the first direction.

According to an example, the second partition wall is aligned with a junction between adjacent pixels.

According to an example, the detector pitch of the first sensor and/or the second sensor in the first direction is less than or equal to 200 μm.

According to an example, the detector pitch of the first sensor and/or the second sensor in the first direction is 175 μm, 150 μm, 125 μm, 100 μm, 75 μm, 50 μm, 25 μm, 10 μm or 5 μm.

According to an example, the detector pitch of the first sensor and/or the second sensor in the second direction is less than or equal to 200 μm.

According to an example, the detector pitch of the first sensor and/or the second sensor in the second direction is 175 μm, 150 μm, 125 μm, 100 μm, 75 μm, 50 μm, 25 μm, 10 μm or 5 μm.

According to an example, the detectors are configured such that the internal anti-scatter device is removable from between the first detector pair and the second detector pair.

In an example, as shown in fig. 9, for example, the multi-layered X-ray detector 10 includes: a third X-ray converter 80; a third sensor 90; and a further internal anti-scatter device 60. The third X-ray converter is positioned at the third X-ray conversion layer. The third sensor is positioned at a third sensor layer. The third X-ray converter and the third sensor form a third detector pair. The third sensor is configured to detect radiation emitted from the third X-ray converter generated by X-ray conversion in the third X-ray converter. The further internal anti-scatter device comprises a plurality of X-ray absorbing partition walls. The further internal anti-scatter device is positioned between the second detector pair and the third detector pair. The further internal anti-scatter device has no structure positioned within any one of the second detector pairs and the further internal anti-scatter device has no structure positioned within any one of the third detector pairs.

In an example, the plurality of X-ray absorbing partition walls of the further internal anti-scatter device comprises at least one high Z material.

In an example, the internal anti-scatter device may be a 1D device having a plurality of X-ray absorbing separation walls substantially parallel to each other.

In an example, the further internal anti-scatter device may be a 2D device having a plurality of first X-ray absorbing partition walls substantially parallel in a first direction and a plurality of second X-ray absorbing partition walls parallel to each other in a second direction, the second direction being at an angle to the first direction. The second direction may be orthogonal to the first direction, suitable for square or rectangular pixels, or may be at a 60 degree angle, suitable for hexagonal pixels. Other angles are also possible.

In an example, the third sensor layer is adjacent to a third X-ray conversion layer.

In an example, the second sensor layer is adjacent to the further internal anti-scatter device.

In an example, the second X-ray conversion layer is adjacent to the further internal anti-scatter device.

In an example, the plurality of partition walls of the further internal anti-scatter device comprises a plurality of first partition walls substantially parallel to each other. The spacing between the first dividing walls in the first direction is equal to an integer multiple N of the detector pitch of the second and/or third sensors in the first direction, where n=1, 2,3,4, … N.

In an example, the first partition walls of the further internal anti-scatter grid are aligned with junctions between adjacent pixels.

In an example, the plurality of partition walls of the further internal anti-scatter-grid comprises a plurality of second partition walls substantially parallel to each other. The spacing between the second partition walls in the second direction is equal to an integer multiple N of the detector pitch of the second and/or third sensors in the second direction, wherein N = 1,2,3,4, … N, and wherein the second direction is angled to the first direction.

In an example, the second direction is orthogonal to the first direction.

In an example, the second partition wall is aligned with a junction between adjacent pixels.

In an example, the third sensor has a detector pitch in the first direction of less than or equal to 200 μm.

In examples, the detector pitch of the third sensor in the first direction is 175 μm, 150 μm, 125 μm, 100 μm, 75 μm, 50 μm, 25 μm, 10 μm, or 5 μm.

In an example, the detector pitch of the third sensor in the second direction is less than or equal to 200 μm.

In examples, the detector pitch of the third sensor in the second direction is 175 μm, 150 μm, 125 μm, 100 μm, 75 μm, 50 μm, 25 μm, 10 μm or 5 μm.

In an example, the detectors are configured such that the further internal anti-scatter device is removable from between the first detector pair and the second detector pair.

In an example, the outer anti-scatter device 70 is positioned adjacent to the first detector pair opposite the inner anti-scatter grid 60. The external anti-scatter device includes a plurality of X-ray absorbing partition walls. This is shown in fig. 10.

In an example, the plurality of X-ray absorbing partition walls comprise at least one high Z material.

In an example, the internal anti-scatter device may be a 1D device having a plurality of X-ray absorbing separation walls substantially parallel to each other.

In an example, the external anti-scatter device may be a 2D device having a plurality of first X-ray absorbing partition walls substantially parallel in a first direction and a plurality of second X-ray absorbing partition walls parallel to each other in a second direction, the second direction being angled with respect to the first direction. The second direction may be orthogonal to the first direction, or may be at a 60 degree angle. Other angles are also possible.

In an example, the plurality of dividing walls of the outer anti-scatter grid are aligned with the plurality of dividing walls of the anti-scatter grid.

The current resolution of anti-scatter grids used in medical X-ray imaging is typically in the range of 25 to 80lp/cm (per centimetre line pair), corresponding to a grid spacing in the range of 125-400 μm. In general, as the resolution (i.e., the number of walls per unit length) of the grid increases, the primary X-ray transmission of the grid decreases. This is because the wall absorbs not only scattered X-rays but also primary X-rays. Therefore, the Q factor of a so-called "image improvement factor" or grid, which is proportional to the square of its primary X-ray transmission, will drop drastically at a higher grid resolution. Furthermore, from a grid manufacturing point of view, it becomes increasingly difficult to produce grids with a resolution exceeding 80lp/cm and at the same time with sufficient quality and uniformity over the whole grid surface area.

At the same time, there is a clear trend towards reduced pixel pitch (pixel pitch. Ltoreq.100 μm) for X-ray detectors, driven by the clinical need for higher spatial resolution in many X-ray imaging applications.

The combination of a high resolution X-ray detector with a standard anti-scatter device will reduce the number of X-ray quanta reaching the detector and thus its signal. This will result in a lower X-ray quantum detection efficiency (DQE), i.e. an X-ray image with an increased noise level. This lower signal-to-noise ratio may be increased again by increasing the X-ray dose, but this is not acceptable in current medical X-ray imaging practice.

The utility model proposes to combine high resolution X-ray detectors with anti-scatter devices with a grid pitch equal to an integer multiple of the detector pixel pitch and optionally by accurately aligning the grid spacers with inactive areas between the detector pixels.

Thus, it is possible to integrate an internal anti-scatter device (ASD), or indeed to have a plurality of internal anti-scatter devices, such as an anti-scatter grid (ASG), inside the X-ray detector.

In this way, the high resolution capability of the X-ray detector and the high Q factor of the grid, i.e. excellent anti-scatter performance, can be maintained. Furthermore, during X-ray image acquisition, pixel binning may be chosen, which is advantageous in certain imaging applications. For an integrated 2D ASG, for example, in the case of binning, all pixels may be chosen to be the same (e.g. 3x3 pixels, n=3), this will reduce aliasing effects and simplify the required image processing to reduce image artifacts caused by the grid partition walls. Alternatively, it may be chosen not to binning (e.g. 1X1 pixels, n=3), which will simplify the X-ray scatter correction model, since there are only a few types of detector pixels.

The multi-layered X-ray detector will now be described in specific detail with reference to fig. 2-10.

When scattered X-rays from a patient are collected by the imaging detector, they do not provide any additional information about the patient anatomy, but they can degrade image quality by reducing image contrast. Therefore, external anti-scatter grids (ASGs) have been used in medical X-ray and CT imaging for decades to absorb scattered X-rays, thereby improving image quality. This is schematically shown in fig. 2, where the left side shows the object and the detector and the right side shows the external ASG placed between the object and the X-ray detector. In fig. 2, primary X-rays are denoted by "a", objects are denoted by "B", external ASG is denoted by "C", X-ray conversion layers are denoted by "D", sensors are denoted by "E", and scattered X-rays are denoted by "F".

For illustration, fig. 3 shows a large area 1D ASG used in an X-ray system, and fig. 4 shows an example of a 2D ASG used in a CT system.

The multi-layer radiation detector may enable spectral imaging (e.g., dual energy X-ray imaging, high-volt spectral imaging) and/or improve detector performance (e.g., higher DQE). However, most of the X-rays entering the standard multi-layer detector are scattered by the first detection layer and captured by the second detection layer. This reduces the performance of the detector, since scattered X-rays do not contain useful information. These scattered X-rays may generate unwanted image signals in the second detection layer which may be superimposed on the image signals of the primary X-rays captured by the second detection layer. Furthermore, the scattered X-rays are partially scattered back from the second detection layer into the first detection layer, thereby deteriorating the image signal of the primary X-rays captured by the first detection layer. Finally, the K-fluorescence signal from the first detection layer may enter the second detection layer. Similar (back) scattering and K-fluorescence phenomena occur in all successive layers of a standard multi-layer detector. Thus, the image quality parameters (MTF, DQE, contrast to noise ratio, signal to noise ratio) of each detection layer are reduced to some extent, depending on exposure conditions, detector configuration, clinical application, etc. In spectral X-ray imaging, this can lead to a severe reduction in the spectral discrimination capability of the detection layer, leading to various disadvantages, such as inaccurate material decomposition, low quality virtual monochromatic images, and Cone Beam CT (CBCT) image reconstruction artifacts. In particular, in dual energy X-ray imaging based on a single exposure of a dual layer detector, the amount of scattered X-rays from the top scintillator layer to the bottom scintillator layer may be so large that it dominates the X-ray signals acquired by the X-bottom sensor.

It has been determined that an anti-scatter device located inside the X-ray detector and spatially located apart from the first and second detection layers solves the above-mentioned problems.

It has been determined that by implementing ASD between one or more detection layers, the (back) scatter between detection layers in a multi-layer radiation detector can be reduced, thereby improving detector performance. For an ASD interposed between two detection layers of a dual layer detector, this is schematically illustrated in fig. 5. Such an integrated ASD may be very similar in physical terms to a standard 1D ASG or 2D ASG, but the spacing between the separating walls is much smaller than the ASG for a CT detector. In fig. 5, primary X-rays are denoted by "a", scattered X-rays are denoted by "B", X-ray conversion layer 1 is denoted by "20", sensor 1 is denoted by "30", X-ray conversion layer 2 is denoted by "40", sensor 2 is denoted by "50", and internal ASD is denoted by "60". The ASD may be integrated but may also be removed, but in both cases it is located inside the X-ray detector structure and separated from the detection layer when present.

The ASD may take the form of a patterned layer of high Z material, such as a (stacked) tungsten foil, with pixel openings aligned with the sensor pixels, as shown in fig. 6. In fig. 6, primary X-rays are denoted by "a", X-ray conversion layer 1 is denoted by "20", sensor 1 is denoted by "30", X-ray conversion layer 2 is denoted by "40", sensor 2 is denoted by "50", and internal ASD is denoted by "60". The ASD may again be integrated but may also be removable.

For further explanation, fig. 7, 8 and 9 show examples of how an internal ASD may be integrated into three different multi-layer detector designs.

Fig. 7 shows a symmetrical sandwich of two detection layers on both sides of an ASD. In fig. 7, primary X-rays are denoted by "a", X-ray conversion layer 1 is denoted by "20", sensor 1 is denoted by "30", X-ray conversion layer 2 is denoted by "40", sensor 2 is denoted by "50", and internal ASD is denoted by "60". The ASD may again be integrated but may also be removable.

Fig. 8 shows a foil based three layer dual sensor detector with bottom sensor 2 (50) receiving scintillator light from the top and bottom. In fig. 8, primary X-rays are denoted by "a", X-ray conversion layer 1 is denoted by "20", sensor 1 is denoted by "30", X-ray conversion layer 2 is denoted by "40", sensor 2 is denoted by "50", X-ray conversion layer 3 is denoted by "80", and internal ASD is denoted by "60". The ASD may again be integrated but may also be removable.

Figure 9 shows a three-layer detector with two ASDs. In fig. 9, primary X-rays are denoted by "a", X-ray conversion layer 1 by "20", sensor 1 by "30", X-ray conversion layer 2 by "40", sensor 2 by "50", X-ray conversion layer 3 by "80", sensor 3 by "90", and two internal ASDs by "60".

As explained in the initial discussion, an external ASG (or ASD) may provide benefits along with the internal ASD newly developed and described herein. Fig. 10 illustrates an example of a multi-layer probe that uses an external ASG in combination with an internal ASD to maximize the probing performance. A feature of alignment of the positions between the internal ASD and the external ASG and/or the pixel structure of the sensor 1 may be added in order to maximize the transmission of primary X-rays to the sensor 2. In fig. 10, primary X-rays are denoted by "a", objects are denoted by "B", X-ray conversion layers 1 are denoted by "20", sensors 1 are denoted by "30", X-ray conversion layers 2 are denoted by "40", sensors 2 are denoted by "50", internal ASD is denoted by "60", and external ASG is denoted by "70".

It is noted that the pixel pitch of the X-ray detector may be of the order of 5 μm to 200 μm, and the inter-ASD spacer pitch is equal to d+d, which may be 1D or 2D, as shown in fig. 3, and may be equal to 5 μm to 200 μm.

There are many options to configure the best integrated ASD for a particular multi-layer radiation detector and its intended primary imaging application(s).

Options:

imaging applications include X-ray, CT, cone beam CT nondestructive testing (CBCT NDT), radiation therapy systems, and electron beam imaging devices (EPID) (MV radiation).

The detector may be a large area device (e.g. an X-ray detector) or a small module (e.g. a CT tile)

The detector is composed of multiple layers of indirect and/or direct X-ray conversion material, each layer coupled to a pixelated image sensor.

The X-ray image acquisition is based on energy integration or photon counting.

When the detector has 3 or more sensor layers, multiple ASDs may be used.

The ASD is a focused 1D or 2D ASG comprising a plurality of walls separated by spacer material.

The spacer material may include a high Z element (Pb, W, bi, ta, etc.).

The spacer material includes air or X-ray absorbing (filtering) materials (carbon, silicon, glass, polymers, aluminum, copper, tin, etc.).

An example: lead fiber 1D ASG, lead aluminum or lead carbon 1D ASG, DMLS tungsten 2D ASG, RIE graphic silicon trench fill CsI,

ASD is a patterned high-Z material layer with pixel openings aligned with sensor pixels.

The high Z layer may be treated with an X-ray conversion material or a sensor substrate.

An example: the thick (stacked) metal foil is directly bonded to the X-ray converting material or the sensor substrate, or may be free-standing.

An example: a thin tungsten foil with an array of square pixel openings is separated by a spacer wall.

ASD may also act as an X-ray absorbing filter. Thus, the spacer walls may also comprise a low Z element, such as tin, copper or aluminum.

The ASD spacer walls are aligned with and (partially) overlap the spacer walls of the external ASG to maximize transmission of primary X-rays (most relevant to CT).

The ASD spacer walls are aligned with and (partially) overlap the inactive areas between the sensor pixels to maximize the transmission of primary X-rays (most relevant to CT).

ASD may be flat or curved.

The ASD may be removed (and reinserted) from the multi-layer probe.

While the utility model has been illustrated and described in detail in the drawings and foregoing description, such illustration and description are to be considered illustrative or exemplary and not restrictive. The utility model is not limited to the disclosed embodiments. Other variations to the disclosed embodiments can be understood and effected by those skilled in the art in practicing the claimed utility model, from a study of the drawings, the disclosure, and the dependent claims.

In the claims, the word "comprising" does not exclude other elements or steps, and the word "a" or "an" does not exclude a plurality. Any reference signs in the claims shall not be construed as limiting the scope.

Claims (10)

1. A multi-layer X-ray detector (10), comprising:

a first X-ray converter (20);

a first sensor (30);

a second X-ray converter (40);

a second sensor (50);

an internal anti-scatter device (60);

wherein the first X-ray converter is positioned at a first X-ray conversion layer;

wherein the first sensor is positioned at a first sensor layer;

wherein the second X-ray converter is positioned at a second X-ray conversion layer;

wherein the second sensor is positioned at a second sensor layer;

wherein the first X-ray converter and the first sensor form a first detector pair, wherein the first sensor is configured to detect radiation emitted from the first X-ray converter generated by X-ray conversion in the first X-ray converter;

wherein the second X-ray converter forms a second detector pair with the second sensor, wherein the second sensor is configured to detect radiation emitted from the second X-ray converter generated by X-ray conversion in the second X-ray converter;

wherein the internal anti-scatter device comprises a plurality of X-ray absorbing partition walls;

wherein the internal anti-scatter device is positioned between the first detector pair and the second detector pair;

wherein the internal anti-scatter device has no structure positioned within any layer of the first detector pair and the anti-scatter device has no structure positioned within any layer of the second detector pair; and is also provided with

Wherein the plurality of partition walls comprises a plurality of first partition walls substantially parallel to each other, and wherein a spacing between the first partition walls in a first direction is equal to an integer multiple N of a detector pixel pitch of the first sensor and/or the second sensor in the first direction, wherein N = 2,3,4, … N.

2. The detector of claim 1, wherein the first separation wall is aligned in the first direction with a junction between adjacent pixels of the first sensor and/or the second sensor.

3. The detector of claim 1 or 2, wherein the plurality of partition walls comprises a plurality of second partition walls that are substantially parallel to each other, wherein a spacing between the second partition walls in a second direction is equal to an integer multiple N of a detector pixel pitch of the first sensor and/or the second sensor in the second direction, wherein N = 1,2,3,4, … N, and wherein the second direction is angled with respect to the first direction.

4. A detector according to claim 3, wherein the second partition wall is aligned in the first direction with a junction between adjacent pixels of the first sensor and/or the second sensor.

5. The detector of any of claims 1 or 2, wherein the detector pixel pitch of the first sensor and/or the second sensor in the first direction is less than or equal to 200 μιη.

6. The detector of claim 5, wherein the detector pixel pitch of the first sensor and/or the second sensor in the first direction is 175 μιη, 150 μιη, 125 μιη, 100 μιη, 75 μιη, 50 μιη, 25 μιη, 10 μιη, or 5 μιη.

7. The detector of claim 3, wherein the detector pixel pitch of the first sensor and/or the second sensor in the second direction is less than or equal to 200 μιη.

8. The detector of claim 7, wherein the detector pixel pitch of the first sensor and/or the second sensor in the second direction is 175 μιη, 150 μιη, 125 μιη, 100 μιη, 75 μιη, 50 μιη, 25 μιη, 10 μιη, or 5 μιη.

9. The detector of claim 1 or 2, wherein the detector is configured such that the internal anti-scatter device is removable from between the first detector pair and the second detector pair.

10. The detector of claim 1 or 2, wherein the plurality of X-ray absorbing separation walls comprise at least one high Z material.