CN219806077U - Silicon wafer basket caching device - Google Patents

Abstract

The utility model provides a silicon wafer basket caching device, which comprises a base and a bearing table, wherein the base is provided with a plurality of grooves; the bearing table is arranged on the base and used for bearing the silicon wafer flower basket; the base is provided with an inner cavity, the bearing table is provided with a through hole which is right opposite to the hollowed-out area at the bottom of the silicon wafer flower basket, and the through hole is communicated with the inner cavity. According to the silicon wafer flower basket buffer device provided by the embodiment of the utility model, the bearing platform for bearing the silicon wafer flower basket is arranged on the base with the inner cavity, and the through holes which are opposite to the bottom of the silicon wafer flower basket and are communicated with the inner cavity are formed in the bearing platform, so that residual liquid, broken silicon wafers and the like in the silicon wafer flower basket can fall into the inner cavity of the base through the through holes under the action of gravity, and the problems of liquid pollution sites, silicon wafer fragments scattering and the like can be effectively improved.

Description

Silicon wafer basket caching device

Technical Field

The utility model relates to the technical field of photovoltaic assembly production, in particular to a silicon wafer basket caching device.

Background

In the process of solar cell production, silicon wafers often need to be transferred in different processes. In the prior art, the silicon wafer basket is generally used for centralized loading and transferring so as to improve the production efficiency.

The silicon wafer basket is automatically loaded to the silicon wafer basket by the equipment, the situations of silicon wafer breakage, clamping of the basket or equipment shutdown maintenance, fault treatment and the like are avoided, at this time, an operator needs to take the silicon wafer basket off a station of the equipment for adjustment maintenance, the taken silicon wafer basket is randomly placed on the equipment or on the ground and other adjacent positions, and the problems that equipment, the ground is polluted by liquid, silicon wafer fragments are scattered and the like are easily caused by the fact that the silicon wafer in the silicon wafer basket is attached to liquid, the broken silicon wafers and the like are solved, so that the cleanliness of the production environment is affected, the safety is also affected, and the working efficiency is reduced.

Disclosure of Invention

The utility model aims to solve the technical problem of providing a silicon wafer basket buffer device so as to solve the problems of easy storage pollution and silicon wafer fragments falling in the process of transferring silicon wafers by using the existing silicon wafer basket.

In order to solve the problems, the utility model is realized by the following technical scheme:

the utility model provides a silicon wafer basket caching device, which comprises a base and a bearing table; the bearing table is arranged on the base and used for bearing the silicon wafer flower basket; the base is provided with an inner cavity, the bearing table is provided with a through hole which is right opposite to the hollowed-out area at the bottom of the silicon wafer flower basket, and the through hole is communicated with the inner cavity.

Optionally, in the silicon wafer basket caching device, the inner cavity is funnel-shaped.

Optionally, in the silicon wafer basket caching device, a liquid outlet communicated with the inner cavity is formed in the bottom of the base.

Optionally, in the silicon wafer basket caching device, a collection mechanism for collecting broken silicon wafers is arranged in the inner cavity.

Optionally, in the silicon wafer flower basket buffer device, the collection mechanism comprises a support bar and a hollow box body, the support bar is horizontally fixed on the side wall of the inner cavity, a window communicated with the inner cavity is formed in the side edge of the base, and the hollow box body is movably inserted into the inner cavity through the window and is erected on the support bar.

Optionally, in the silicon wafer basket buffer device, a side edge of the base is higher than the bearing table.

Optionally, in the silicon wafer basket caching device, a rib plate for supporting the bearing platform is arranged on the side wall of the inner cavity.

Optionally, the silicon wafer basket buffer device further comprises a positioning component arranged on the bearing table, wherein the positioning component is used for positioning the silicon wafer basket and aligning the bottom of the silicon wafer basket with the through hole.

Optionally, in the silicon wafer basket buffer device, the positioning assembly includes at least two positioning strips, at least two positioning strips are disposed on the bearing platform along two sides of the through hole, and each positioning strip is used for positioning the silicon wafer basket from different lateral directions.

Optionally, in the silicon wafer basket buffer device, the locating strip includes base and standing edge, the base border the edge setting of through-hole and through the bolt fastening in on the plummer, the base is kept away from one side of through-hole upwards extends to form the standing edge, the standing edge with the curb plate adaptation of silicon wafer basket, just be provided with the flange on the curb plate of silicon wafer basket, the standing edge is provided with the bayonet socket, the bayonet socket is used for the joint the flange.

Optionally, in the silicon wafer basket buffer device, the through hole is adapted to a hollowed-out area at the bottom of the silicon wafer basket.

Compared with the prior art, the utility model has the following advantages:

the silicon wafer basket caching device comprises a base and a bearing table; the bearing table is arranged on the base and used for bearing the silicon wafer flower basket; the base is provided with an inner cavity, the bearing table is provided with a through hole which is opposite to the hollowed-out area at the bottom of the silicon wafer flower basket, and the through hole is communicated with the inner cavity; wherein, through setting up the plummer that is used for bearing silicon chip basket of flowers in the base that has the inner chamber, and the plummer is provided with just to silicon chip basket of flowers bottom and with the through-hole of inner chamber intercommunication for the inside remaining liquid of silicon chip basket of flowers, broken silicon chip etc. can fall into the inner chamber of base through above-mentioned through-hole under the action of gravity, can effectively improve the unrestrained scheduling problem of liquid pollution place, silicon chip piece.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the utility model as claimed.

Drawings

Fig. 1 is a schematic diagram of a state of a silicon wafer basket buffer device provided by an embodiment of the present utility model when a silicon wafer basket is placed;

FIG. 2 is a perspective view of a silicon wafer basket buffer device provided by an embodiment of the utility model;

FIG. 3 is a top view of a silicon wafer basket buffer device according to an embodiment of the present utility model;

FIG. 4 is a cross-sectional view taken along the direction A of FIG. 3 in an embodiment of the present utility model _。

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are some, but not all embodiments of the utility model. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

It should be appreciated that reference throughout this specification to "one embodiment" or "an embodiment" means that a particular feature, structure or characteristic described in connection with the embodiment is included in at least one embodiment of the present utility model. Thus, the appearances of the phrases "in one embodiment" or "in an embodiment" in various places throughout this specification are not necessarily all referring to the same embodiment. Furthermore, the particular features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.

In the process of solar cell production, silicon wafers often need to be transferred in different processes. For example, after the finished square bar is sliced and degummed, the silicon wafer is required to be operated to an inserting sheet cleaning procedure for cleaning and drying. In the process of cleaning and transferring, because the silicon wafers are light, thin and fragile, the silicon wafers need to be intensively loaded and transferred by using storage devices such as a silicon wafer basket and the like so as to improve the production efficiency.

When the equipment is utilized to automatically load the silicon chip into the silicon chip basket, the phenomena such as fragments and clamping baskets or the conditions such as equipment shutdown maintenance and fault treatment are inevitably caused, an operator needs to take the silicon chip basket off the equipment station for adjustment maintenance, the taken silicon chip basket is randomly placed on the equipment or on the ground and other adjacent positions, and as broken silicon chips exist in the silicon chip basket and the silicon chip attached liquid, the equipment or the ground is polluted by the liquid and the silicon chip fragments are randomly scattered, so that the cleanliness of the production environment is affected, the secondary cleaning of personnel is caused, the working labor of the personnel is increased, and the production efficiency is reduced.

In order to solve the above problems, a silicon wafer basket buffer device 10 provided in an embodiment of the present utility model, as shown in fig. 1 to 4, includes a base 11 and a bearing table 12; the bearing table 12 is arranged on the base 11 and is used for bearing the silicon wafer basket 20; the base 11 has an inner cavity 111, the carrying platform 12 is provided with a through hole 121 facing the hollowed-out area at the bottom of the silicon wafer basket 20, and the through hole 121 is communicated with the inner cavity 111.

Wherein, the base 11 is in a barrel shape which is opened upwards, and thus has a cavity inside, namely the inner cavity 111, as an internal accommodating space; the carrying platform 12 is disposed on the base 11, and may be specifically disposed on the upper portion of the base 11 in a detachable or welded manner, so as to form the inner cavity 111.

The carrying platform 12 is used for carrying the silicon wafer basket 20, that is, the silicon wafer basket 20 can be placed on the carrying platform 12; meanwhile, the carrying table 12 is provided with a through hole 121 communicated with the inner cavity 111 of the base 11, when the silicon wafer basket 20 is placed on the carrying table 12, the through hole 121 is opposite to the bottom hollow area of the silicon wafer basket 20, and because the bottom of the silicon wafer basket 20 is of a hollow structure, fragments, residual liquid and the like in the silicon wafers loaded in the silicon wafer basket 20 can fall into the inner cavity 111 of the base 11 through the through hole 121 under the action of gravity. Alternatively, the silicon wafer basket 20 can be detachably fixed on the carrying platform 12 by clamping or the like, so that not only can the silicon wafer basket 20 be prevented from toppling, but also the silicon wafer basket 20 can be conveniently detached and transported.

In practical applications, the carrying platform 12 is a hollow platform, the hollow area thereof is the through hole 121, the through hole 121 is rounded, and the bottom of the silicon wafer basket 20 can be erected on the carrying platform 12 along the edge of the hollow area, that is, the external shape of the carrying platform 12 is adapted to the bottom of the silicon wafer basket 20.

Optionally, in the silicon wafer basket buffer device 10 provided in the embodiment of the present utility model, the through hole 121 on the carrying platform 12 is adapted to the bottom hollow area of the silicon wafer basket 20, that is, the shape and size of the through hole 121 are adapted to the bottom hollow area of the silicon wafer basket 20, so that solid impurities such as broken silicon wafers in the silicon wafer basket 20 can more smoothly fall into the inner cavity 111 of the base 11 through the through hole 121.

For example, if the bottom hollow area of the silicon wafer basket 20 is rectangular, the through hole 121 may be a rectangular through hole 121 having a shape and a size equal to those of the bottom hollow area of the silicon wafer basket 20; if the bottom hollow area of the silicon wafer basket 20 is rectangular, the through hole 121 may be a rectangular through hole 121 having the same shape and size as those of the bottom hollow areas of the plurality of silicon wafer baskets 20 placed side by side, so that when the plurality of silicon wafer baskets 20 are placed on the carrying platform 12 at the same time, solid impurities such as broken silicon wafers in each silicon wafer basket 20 can smoothly fall into the inner cavity 111 of the base 11 through the through hole 121.

Optionally, the side edge 112 of the base 11 is higher than the carrying table 12, so that the carrying table 12 is trapped on the base 11, and a water bar structure is formed by using the upper edge of the side edge 112 of the base 11, so that the bottom of the silicon wafer basket 20 is aligned with the carrying table 12, and the liquid oozing from the silicon wafer basket 20 can be blocked, so that the liquid can be prevented from flowing to the side edge 112 of the base 11 along the periphery and then flows to the ground along the side edge 112 of the base 11, and the field is polluted.

Optionally, a rib plate 113 for supporting the carrying platform 12 is disposed on the side wall of the inner cavity 111, that is, a rib plate 113 is disposed at an included angle between the carrying platform 12 and the side wall. Wherein, by providing the rib plates 113 at the side walls of the inner cavity 111 near the bottom side of the carrying platform 12, the carrying platform 12 can be supported forcefully. The rib plate 113 may be triangular, and two right-angle sides of the rib plate 113 respectively abut against the side wall of the inner cavity 111 and the bottom side of the bearing table 12.

According to the silicon wafer flower basket buffer device 10 provided by the utility model, the bearing table 12 for bearing the silicon wafer flower basket 20 is arranged on the base 11 with the inner cavity 111, and the through hole 121 which is opposite to the bottom of the silicon wafer flower basket 20 and is communicated with the inner cavity 111 is arranged on the bearing table 12, so that residual liquid, broken silicon wafers and the like in the silicon wafer flower basket 20 can fall into the inner cavity 111 of the base 11 through the through hole 121 under the action of gravity, and the problems of liquid pollution sites, silicon wafer fragments scattering and the like can be effectively solved.

Optionally, in an embodiment, the silicon wafer basket buffer device 10 provided by the utility model further includes a positioning component 13 disposed on the carrying platform 12, where the positioning component 13 is used to position the silicon wafer basket 20 and align the bottom of the silicon wafer basket 20 with the through hole 121, so that positioning and placement can be realized, and the silicon wafer can be prevented from being damaged due to sliding phenomenon by fixing the positioning component 13.

In practical application, the positioning assembly 13 is designed according to the shape and the characteristics of the silicon wafer basket 20, namely, the positioning assembly 13 is matched with the shape and the direction of the silicon wafer basket 20.

Optionally, in one embodiment, the positioning assembly 13 includes at least two positioning strips 131, where the at least two positioning strips 131 are disposed on the carrying platform 12 along two sides of the through hole 121, and each positioning strip 131 is used to position the silicon wafer basket 20 from different sides, so that the silicon wafer basket 20 is clamped on the carrying platform 12 by the at least two positioning strips 131 and is located at the through hole 121, so that crushed silicon wafers, residual cleaning liquid, and the like in the interior are filtered, and fall into the inner cavity 111 directly under the action of gravity for collection.

In the embodiment of the utility model, the positioning strips 131 are matched and designed according to the appearance characteristics of the silicon wafer basket 20. For example, the silicon wafer basket 20 is in a cuboid shape, and the positioning assembly 13 may include two positioning strips 131, where the two positioning strips 131 respectively position two opposite side plates of the silicon wafer basket 20.

The silicon wafer basket 20 may include two opposite side plates 21, the peripheries of the two side plates 21 are fixed to form a rectangular silicon wafer loading area 23 through a plurality of support rods 22, and a groove structure 24 for conveniently taking and placing silicon wafers is arranged on the side plates 21.

Optionally, the length of the positioning strip 131 is at least twice the width of the side plate 21, so that the positioning assembly 13 can simultaneously position at least two silicon wafer baskets 20. For example, the length of the positioning strip 131 is twice the width of the side plate 21, so that two silicon wafer baskets 20 can be clamped side by the two parallel positioning strips 131 and erected on the through hole 121 of the bearing table 12, thereby realizing the simultaneous positioning of the two silicon wafer baskets 20.

Optionally, in one embodiment, the positioning strip 131 includes a bottom edge 132 and a vertical edge 133, the bottom edge 132 is disposed along the edge of the through hole 121 and is fixed on the carrying platform 12 by a bolt, the bottom edge 132 extends upwards away from the through hole 121 to form the vertical edge 133, and the vertical edge 133 is adapted to the side plate 21 of the silicon flower basket 20.

In this embodiment, the cross section of the positioning strip 131 is in an L-shaped structure, and the internal corner between the bottom edge 132 and the vertical edge 133 faces the silicon wafer basket 20 so as to accommodate the external corner between the side plate 21 of the silicon wafer basket 20 and the bottom thereof, thereby realizing the positioning of the silicon wafer basket 20; meanwhile, since the bottom edges 132 of the positioning strips 131 are disposed on the carrying platform 12 along the two sides of the through hole 121 of the carrying platform 12, when the silicon wafer basket 20 is positioned by the positioning strips 131, the bottom of the silicon wafer basket 20 faces the through hole 121 of the carrying platform 12, so that the broken silicon wafers and residual liquid in the silicon wafer basket 20 can smoothly fall into the inner cavity 111 of the base 11 through the through hole 121.

The standing edge 133 is adapted to the side plate 21 of the silicon wafer basket 20, specifically, the shape of one side of the standing edge 133, which is close to the through hole 121 of the carrying table 12, is adapted to the side plate 21 of the silicon wafer basket 20, so as to better receive and position the silicon wafer basket 20. For example, if the side plate 21 of the silicon wafer basket 20 is convex, the side of the vertical edge 133 near the through hole 121 is concave.

The bottom edge 132 and the vertical edge 133 of the positioning strip 131 may be integrally disposed.

Optionally, in a specific embodiment, the side of the vertical edge 133 near the through hole 121 is inclined, that is, the included angle between the side of the vertical edge 133 near the through hole 121 and the bottom edge 132 is an obtuse angle, which can provide a fault-tolerant space for aligning the bottom of the silicon wafer basket 20 in the area of the positioning strip 131, so as to facilitate the alignment and placement of the silicon wafer basket 20. In addition, the side of the vertical edge 133 near the through hole 121 is vertically disposed, that is, the included angle between the side of the vertical edge 133 near the through hole 121 and the bottom edge 132 is a right angle, so as to facilitate machining and integrated arrangement of the bottom edge 132 and the vertical edge 133.

Optionally, in a specific embodiment, a flange 25 is provided on the side plate 21 of the silicon wafer basket 20, and a bayonet 134 is provided on the standing edge 133, where the bayonet 134 is used to engage the flange 25. The clamping opening 134 on the vertical edge 133 of the positioning strip 131 is clamped with the flange 25 on the side plate 21, so that the silicon wafer basket 20 can be accurately placed conveniently, and the situation that the silicon wafer basket 20 slides is avoided. Wherein the flange 25 on the single side plate 21 may be one or more, the bayonet 134 is adapted to the flange 25.

In practical applications, the flange 25 may be an end portion of the support rod 22 supporting the side plate 21 of the silicon wafer basket 20, and the bayonet 134 may be a circular arc.

In the silicon wafer basket caching device 10 provided by the utility model, the external shape of the base 11 can be barrel-shaped (round barrel or square barrel), T-shaped or funnel-shaped; the height of the base 11 is matched with the working height of the field personnel. The inner cavity 111 of the base 11 is used as a storage place for silicon wafer residual night and broken slag, and has a structure with large top and small bottom, so that broken silicon wafers and silicon wafer adhesion liquid can be collected in a concentrated manner. Optionally, the inner cavity 111 is funnel-shaped, so that crushed silicon chips, residual night and the like are converged at the bottom of the inner cavity 111 in an inclined manner through the side wall of the inner cavity 111, and centralized processing is facilitated.

Optionally, in one embodiment, a drain 114 is disposed at the bottom of the base 11 and is in communication with the cavity 111. The liquid outlet 114 is disposed at the lowest end of the side 112 of the base 11, so as to facilitate the liquid collected by the cavity 111 to be discharged. The drain port 114 may be circular, rectangular, or the like. Optionally, a pluggable waste liquid plug is further disposed at the liquid outlet 114; when liquid discharge is not needed, the liquid discharge port 114 is plugged by the liquid discharge plug; and the waste liquid plug is pulled out when the liquid is needed to be discharged. Wherein, the waste liquid plug can be a cork plug, a rubber plug and the like.

Optionally, in one embodiment, a collection mechanism 14 for collecting the crushed silicon wafers is disposed within the cavity 111. In this embodiment, the collection mechanism 14 is disposed in the inner cavity 111, so that the liquid falling into the inner cavity 111 through the through hole 121 of the carrying table 12 can be separated from the solid such as the broken silicon wafer, so that more broken silicon wafers can be temporarily stored.

Optionally, in one embodiment, the collecting mechanism 14 includes a supporting bar 141 and a hollow box 142, the supporting bar 141 is horizontally fixed on a side wall of the inner cavity 111, a window is formed on a side 112 of the base 11 and is communicated with the inner cavity 111, and the hollow box 142 is movably inserted into the inner cavity 111 through the window and is erected on the supporting bar 141.

In the specific embodiment, the broken silicon chips can be separated from the liquid by arranging the supporting bars 141 on the side edges 112 of the inner cavity 111 and erecting the hollow box body 142 on the supporting bars 141, and the broken silicon chips are trapped on the hollow box body 142 for temporary storage; meanwhile, since the side 112 of the base 11 is provided with a window communicated with the inner cavity 111, the bottom of the window is flush with the supporting bar 141, and the shape and size of the window are matched with those of the hollowed-out box body 142, the hollowed-out box body 142 can be movably inserted into the inner cavity 111 through the window and is arranged on the supporting bar 141, so that broken silicon chips falling into the inner cavity 111 can be trapped, and liquid can continuously fall into the bottom of the inner cavity 111 through the hollowed-out box body 142, so that the solid-liquid separation effect is realized.

Optionally, a handle 143 is disposed on a side of the hollow box 142 facing the window, so that the hollow box 142 can be pulled out from the base 11 through the window, so as to clean broken silicon chips, other solid impurities, chips and the like trapped in the hollow box 142. Wherein the handle 143 may be provided in a circular, arc, semi-circular, or rectangular shape.

In summary, in the present embodiment, the silicon wafer basket buffer device 10 of the present utility model includes a base 11 and a carrying platform 12; the bearing table 12 is arranged on the base 11 and is used for bearing the silicon wafer basket 20; the base 11 is provided with an inner cavity 111, the bearing table 12 is provided with a through hole 121 which is opposite to the bottom of the silicon wafer basket 20, and the through hole 121 is communicated with the inner cavity 111; the carrying table 12 for carrying the silicon wafer flower basket 20 is arranged on the base 11 with the inner cavity 111, and the carrying table 12 is provided with the through hole 121 which is opposite to the bottom of the silicon wafer flower basket 20 and is communicated with the inner cavity 111, so that residual liquid, broken silicon wafers and the like in the silicon wafer flower basket 20 can fall into the inner cavity 111 of the base 11 through the through hole 121 under the action of gravity, and the problems of liquid pollution sites, silicon wafer chip scattering and the like can be effectively improved.

It should be noted that, in the present specification, each embodiment is described in a progressive manner, and each embodiment is mainly described as different from other embodiments, and identical and similar parts between the embodiments are all enough to be referred to each other.

While alternative embodiments of the present utility model have been described, additional variations and modifications in those embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. It is therefore intended that the following appended claims be interpreted as including alternative embodiments and all such alterations and modifications as fall within the scope of the embodiments of the utility model.

Finally, it is further noted that relational terms such as first and second, and the like are used solely to distinguish one entity from another entity without necessarily requiring or implying any actual such relationship or order between such entities. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that an article or terminal that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such article or terminal. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude that an additional identical element is present in an article or terminal device comprising the element.

While the foregoing has been described in some detail by way of illustration of the principles and embodiments of the utility model, and while in accordance with the principles and implementations of the utility model, those skilled in the art will readily recognize that the utility model is not limited thereto.

Claims (10)

1. The silicon wafer basket caching device is characterized by comprising a base and a bearing table; the bearing table is arranged on the base and used for bearing the silicon wafer flower basket; the base is provided with an inner cavity, the bearing table is provided with a through hole which is right opposite to the hollowed-out area at the bottom of the silicon wafer flower basket, and the through hole is communicated with the inner cavity.

2. The silicon wafer basket buffer device according to claim 1, wherein the inner cavity is funnel-shaped.

3. The silicon wafer flower basket buffer device according to claim 1, wherein a liquid outlet communicated with the inner cavity is arranged at the bottom of the base.

4. A silicon wafer basket buffer device according to claim 3, wherein a collection mechanism for collecting crushed silicon wafers is arranged in the inner cavity.

5. The silicon wafer flower basket buffer device according to claim 4, wherein the collecting mechanism comprises a supporting bar and a hollow box body, the supporting bar is horizontally fixed on the side wall of the inner cavity, a window communicated with the inner cavity is formed on the side edge of the base, and the hollow box body is inserted into the inner cavity through the window and is erected on the supporting bar.

6. The silicon wafer basket buffer device according to claim 1, wherein the side edge of the base is higher than the bearing table.

7. The silicon wafer basket buffer device according to claim 6, wherein a rib plate for supporting the bearing table is arranged on the side wall of the inner cavity.

8. The wafer basket buffer device of claim 1 further comprising a positioning assembly disposed on the carrier, the positioning assembly being configured to position the wafer basket and align a bottom of the wafer basket with the through hole.

9. The silicon wafer basket buffer device according to claim 8, wherein the positioning assembly comprises at least two positioning strips, the at least two positioning strips are arranged on the bearing table along two sides of the through hole, and each positioning strip is used for positioning the silicon wafer basket from different lateral directions.

10. The silicon wafer flower basket buffer storage device according to claim 9, wherein the positioning strip comprises a bottom edge and a vertical edge, the bottom edge is arranged at the edge of the through hole and is fixed on the bearing table through bolts, one side of the bottom edge, which is far away from the through hole, extends upwards to form the vertical edge, the vertical edge is matched with the side plate of the silicon wafer flower basket, a flange is arranged on the side plate of the silicon wafer flower basket, and a bayonet is arranged on the vertical edge and is used for being clamped with the flange.